Monocrystalline silicon wafer texturing equipment

Abstract

The invention discloses monocrystalline silicon wafer texturing equipment, and relates to the field of silicon wafer preparation, the monocrystalline silicon wafer texturing equipment comprises a texturing groove body and a silicon wafer texturing rotating drum, the silicon wafer texturing rotating drum is rotatably installed above the texturing groove body through a rotating shaft, and the silicon wafer texturing rotating drum adopts a cylindrical structure body which is formed by combining a core shaft and an outer drum and is provided with two open ends; a plurality of silicon wafer clamping frames are distributed on the silicon wafer texturing rotary drum in an annular array mode, the silicon wafer clamping frames are movably inserted between the core shaft and the outer drum, and monocrystalline silicon wafers are detachably installed on the inner sides of the silicon wafer clamping frames. The device is suitable for silicon wafer production, and can realize continuous texturing of the monocrystalline silicon wafer, that is, after the texturing operation of one monocrystalline silicon wafer is completed, the monocrystalline silicon wafer after texturing is completed is taken down and replaced with a new monocrystalline silicon wafer through a manipulator matched with the device for use according to the stepping rotation stopping time of the silicon wafer texturing rotary drum, and the process is repeated, so that the production efficiency is improved, and the production cost is reduced. The continuous wafer texturing operation is realized, and the texturing efficiency of the monocrystalline silicon wafer is improved.

Description

Technical Field

[0001] The invention relates to the field of single crystal silicon wafer production, and in particular to a single crystal silicon wafer texturing device. Background Art

[0002] As is known, monocrystalline silicon wafers are single crystals of silicon, which are crystals with a basically complete lattice structure and are used to manufacture semiconductor devices, solar cells, etc. They are made by pulling high-purity polycrystalline silicon in a single crystal furnace, and silicon wafer texturing is a process for processing silicon wafers, which can improve the light trapping effect of silicon wafers. It is the first step in the production of silicon solar cells. Specifically, it uses the principle that monocrystalline silicon wafers are anisotropic when corroded in alkaline solutions within a certain concentration range, and the corrosion rates in different crystal directions are different. When monocrystalline silicon wafers with a specific crystal direction are placed in an alkaline solution for corrosion, many tiny pyramid-shaped appearances can be produced on the surface of the silicon wafer. This process is called single crystal alkali texturing;

[0003] For example, the authorization announcement number is CN107988628B, the authorization announcement date is 2020.01.03, and the name is silicon wafer texturing tank, which includes a tank body and a heating controller; a water inlet tank is provided at one end of the tank body, and a water outlet tank is provided at the other end; one end of the water inlet tank is connected to the tank body through a first flow equalizer, and a water inlet tank is provided above the other end; a horizontal heating resistor, a vertical heating resistor and a stirring device are provided in sequence from one end to the other end of the water inlet tank; the horizontal heating resistor is located below the water inlet tank; and is evenly distributed in the vertical direction; the vertical heating resistor is evenly distributed in the horizontal direction; one end of the water outlet tank is connected to the tank body through a second flow equalizer, and a water outlet is provided at the other end...;

[0004] Similar to the above application, in the existing silicon wafer texturing equipment, most of its silicon wafer texturing grooves adopt a similar groove structure as a whole. In the process of silicon wafer texturing, in order to improve the efficiency of silicon wafer texturing, most of them adopt a similar stacking type loading device, that is, multiple silicon wafers are placed in an open assembly rack, and then the entire assembly rack is assisted by a robot or other traction device to be placed in the silicon wafer texturing groove. After the texturing is completed, it is taken out as a whole. Such intermittent texturing equipment cannot achieve the effect of continuous texturing, so there will be certain texturing gaps, which affects the efficiency of texturing. Summary of the invention

[0005] The purpose of the present invention is to propose a single crystal silicon wafer texturing equipment to realize continuous and uninterrupted texturing of single crystal silicon wafers. That is, after the texturing operation of a single crystal silicon wafer is completed, the single crystal silicon wafer on which the texturing is completed is removed and replaced with a new single crystal silicon wafer by a robot arm used in conjunction with the equipment during the time when the silicon wafer texturing drum steps and stops, and the cycle is repeated to realize continuous and uninterrupted wafer texturing operation and improve the texturing efficiency of single crystal silicon wafers.

[0006] The present invention provides a single crystal silicon wafer texturing device, which comprises a texturing tank body, in which a texturing solution is filled; a silicon wafer texturing drum, which is rotatably installed above the texturing tank body through a rotating shaft, and the texturing solution in the texturing tank body is immersed to the 1 / 2 position of the silicon wafer texturing drum, so that when the silicon wafer enters the texturing tank body, the single crystal silicon wafer can be horizontally immersed in contact with the texturing solution, thereby ensuring the consistency of the single crystal silicon wafer during texturing;

[0007] Among them, the silicon wafer texturing drum adopts a cylindrical structure with open two ends formed by the combination of a core shaft and an outer cylinder. A plurality of silicon wafer racks are distributed in a ring array on the silicon wafer texturing drum. The silicon wafer racks are movably inserted between the core shaft and the outer cylinder. A single crystal silicon wafer is detachably installed on the inside of the silicon wafer rack, so that the single crystal silicon wafer can be gradually immersed in the texturing solution inside the texturing tank as the silicon wafer texturing drum rotates.

[0008] As a further description of the above technical solution: the core shaft and the end of the outer cylinder are connected by a connecting plate, and the connecting plates are distributed in an array. The lateral occupied area of ​​the connecting plates is not higher than 1 / 10 of the cross-sectional area of ​​the silicon wafer texturing drum, so as to avoid the connecting plates affecting the texturing solution entering the silicon wafer texturing drum and ensure the texturing effect.

[0009] As a further description of the above technical solution: the surface of the core shaft is distributed with a plurality of grooves in a circular array along the axial direction, the surface of the outer cylinder is provided with assembly slots corresponding to the grooves one by one, and the silicon wafer holder is inserted into the corresponding grooves on the core shaft through the assembly slots.

[0010] As a further description of the above technical solution: a plurality of guide rods are arranged between the core shaft and the outer cylinder, and each guide rod is provided with two guide rods, which are respectively located at the corresponding assembly slots and two ends of the flower groove;

[0011] A limit block is arranged on the inner side of the guide rod at the position of the assembly slot, and guide slide grooves adapted to the limit block are opened on both sides of the silicon wafer holder, and the limit block is slidably engaged with the guide slide groove.

[0012] As a further description of the above technical solution: an anti-slip block is detachably mounted on the bottom of the guide slot by bolts, so that when the bottom of the silicon wafer holder moves to the edge position of the assembly slot, the anti-slip block contacts the limit block.

[0013] As a further description of the above technical solution: ear pieces are installed at both ends of the silicon wafer holder, and ear holes are opened on the ear pieces.

[0014] As a further description of the above technical solution: the ear piece adopts an inverted U-shaped structure, and a magnetic sheet is embedded and installed at the end of the ear piece;

[0015] The outer walls at both ends of the silicon wafer texturing drum are provided with magnetic ring assembly grooves, in which magnetic rings are clamped. When the silicon wafer holder is fully clamped in the silicon wafer texturing drum, the magnetic sheet contacts the magnetic ring, and the magnetic poles of the contact surfaces of the magnetic sheet and the magnetic ring are in opposite directions, so that the magnetic sheet and the magnetic ring are attracted to each other.

[0016] As a further description of the above technical solution: it is characterized in that a card slot is opened on the surface of the silicon wafer holder, the single crystal silicon wafer is mounted in the card slot, and stable pressure plates are arranged on both sides of the card slot in the silicon wafer holder.

[0017] As a further description of the above technical solution: installation grooves are provided at both ends of the card slot, and the stabilizing pressure plate is rotatably installed in the installation grooves through a rotating connecting piece.

[0018] As a further description of the above technical solution: it also includes a servo drive component, which is used to control the silicon wafer texturing drum to rotate in steps according to a preset speed, and the servo drive component includes a servo motor and a linkage gear group, wherein the servo motor is connected to the rotating shaft on the silicon wafer texturing drum through the linkage gear group.

[0019] As a further description of the above technical solution: assembly edge plates are provided on both sides of the texturing tank body, which are used to assist in assembling the texturing tank body onto the single crystal silicon wafer production line; a drain valve is provided at the lower side of the texturing tank body, and a protective enclosure is installed at the upper edge of the texturing tank body. The protective enclosure adopts a trumpet-shaped structure with an opening that gradually increases from bottom to top. The protective enclosure is used to facilitate the reflux of the texturing solution and at the same time protect the environment surrounding the equipment.

[0020] In the above technical scheme, a single crystal silicon wafer texturing device provided by the present invention can realize continuous and uninterrupted texturing of single crystal silicon wafers through the device, that is, after the texturing operation of a single crystal silicon wafer is completed, the silicon wafer texturing drum steps and stops during the time, and the single crystal silicon wafer that has been texturized is removed and replaced with a new single crystal silicon wafer by a manipulator used in conjunction with the equipment, and the cycle is repeated to realize continuous and uninterrupted wafer texturing operation, thereby improving the texturing efficiency of single crystal silicon wafers, and this rotating dynamic texturing, that is, during the texturing process, the silicon wafer texturing drum will step and rotate continuously, so that the contact between the texturing solution and the surface of the single crystal silicon wafer is higher, thereby improving the texturing quality of the single crystal silicon wafer;

[0021] In this device, the single crystal silicon wafer is fixed by utilizing the useless area at the edge of the single crystal silicon wafer. Therefore, the effective area of ​​the single crystal silicon wafer will not be blocked during the texturing process of the single crystal silicon wafer, thereby ensuring that the single crystal silicon wafer can be fully texturized at one time, thereby improving the texturizing efficiency of the single crystal silicon wafer. In addition, through the structural design of the silicon wafer holder that fixes the single crystal silicon wafer, the single crystal silicon wafer is stable and reliable during the disassembly and assembly process and the texturing process. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0023] Figure 1 A schematic diagram of the overall structure of a single crystal silicon wafer texturing device provided by the present invention;

[0024] Figure 2 A schematic structural diagram of another viewing angle of a single crystal silicon wafer texturing device provided by the present invention;

[0025] Figure 3 A cross-sectional view of the interior of a texturing tank of a single crystal silicon wafer texturing device provided by the present invention;

[0026] Figure 4 A schematic diagram of the overall structure of a silicon wafer texturing drum in a single crystal silicon wafer texturing device provided by the present invention;

[0027] Figure 5 A schematic diagram of the main structure of a silicon wafer texturing drum in a single crystal silicon wafer texturing device provided by the present invention;

[0028] Figure 6 A schematic diagram of the cross-sectional structure of a silicon wafer texturing drum in a single crystal silicon wafer texturing device provided by the present invention;

[0029] Figure 7 A schematic diagram of the structure of a silicon wafer holder in a single crystal silicon wafer texturing device provided by the present invention;

[0030] Figure 8 The present invention provides a schematic diagram of the silicon wafer holder installation structure in a single crystal silicon wafer texturing device.

[0031] Description of the drawings: 1. Texturing trough body; 10. Assembly edge plate; 11. Drain valve; 12. Protective enclosure; 2. Silicon wafer texturing drum; 20. Mandrel; 21. Outer cylinder; 22. Connecting plate; 23. Magnetic ring; 24. Assembly slot; 25. Guide rod; 26. Flower groove; 27. Magnetic ring assembly slot; 28. Limit block; 3. Servo drive assembly; 30. Rotating shaft; 31. Interlocking gear set; 32. Servo motor; 4. Silicon wafer holder; 40. Slot; 41. Stabilizing pressure plate; 42. Rotating connector; 43. Guide slide; 44. Ear piece; 45. Ear hole; 46. Magnetic sheet; 47. Mounting slot; 48. Anti-slip block; 5. Monocrystalline silicon wafer. DETAILED DESCRIPTION

[0032] The following description is merely exemplary in nature and is not intended to limit the present disclosure, application, and use. It should be understood that in all of these figures, the same or similar reference numerals indicate the same or similar parts and features. The various drawings only schematically represent the concepts and principles of the embodiments of the present disclosure, and do not necessarily show the specific dimensions and proportions of the various embodiments of the present disclosure. Specific parts in specific drawings may be exaggerated to illustrate the relevant details or structures of the embodiments of the present disclosure.

[0033] Reference Figure 1-8 : This embodiment provides a technical solution: a single crystal silicon wafer texturing device, comprising a texturing tank 1, in which a texturing solution is filled;

[0034] The silicon wafer texturing drum 2 is rotatably mounted on the top of the texturing tank 1 via a rotating shaft 30, and the texturing solution in the texturing tank 1 is immersed to the 1 / 2 position of the silicon wafer texturing drum 2;

[0035] Among them, the silicon wafer texturing drum 2 adopts a cylindrical structure with open ends formed by a core shaft 20 and an outer cylinder 21. A plurality of silicon wafer racks 4 are distributed in a ring array on the silicon wafer texturing drum 2. The silicon wafer racks 4 are movably inserted between the core shaft 20 and the outer cylinder 21. A single crystal silicon wafer 5 is detachably installed on the inner side of the silicon wafer rack 4, so that the single crystal silicon wafer 5 can be gradually immersed in the texturing solution inside the texturing tank 1 as the silicon wafer texturing drum 2 rotates.

[0036] It should be noted that when the device is in use, the single crystal silicon wafer 5 to be textured is first clamped on the silicon wafer clamping rack 4, and the silicon wafer clamping rack 4 is inserted into the silicon wafer textured drum 2. Therefore, when the silicon wafer textured drum 2 rotates, the single crystal silicon wafer 5 can gradually follow the rotation of the silicon wafer textured drum 2 and be immersed in the textured solution inside the textured tank body 1, and the wafer textured operation is realized during the immersion process. Such a structural design abandons the inefficient method of uniformly textured multiple silicon wafers and then uniformly removed in the prior art. The device can realize continuous and uninterrupted texture of the single crystal silicon wafer 5, that is, after the textured operation of a single crystal silicon wafer 5 is completed, the silicon wafer textured drum 2 is stepped and stopped during the time, and the textured solution is removed by the manipulator used in conjunction with the equipment. The single crystal silicon wafer 5 that has been texturized is removed and replaced with a new single crystal silicon wafer 5, and this cycle is repeated to achieve continuous and uninterrupted wafer texturizing operations, thereby improving the texturizing efficiency of the single crystal silicon wafer 5. In addition, this rotating dynamic texturizing, that is, during the texturizing process, the silicon wafer texturizing drum 2 will continuously step and rotate, so that the contact between the texturizing solution and the surface of the single crystal silicon wafer 5 is higher, thereby improving the texturizing quality of the single crystal silicon wafer 5. The core shaft 20 and the end of the outer cylinder 21 are connected by a connecting plate 22, and the connecting plate 22 is distributed in an array. The lateral occupied area of ​​the connecting plate 22 is not higher than 1 / 10 of the inner cross-sectional area of ​​the silicon wafer texturizing drum 2, so as to avoid the connecting plate 22 affecting the texturizing solution from entering the silicon wafer texturizing drum 2, thereby ensuring the texturizing effect.

[0037] The present embodiment provides a single crystal silicon wafer texturing device. Specifically, the surface of the core shaft 20 is provided with a plurality of flower grooves 26 in a circular array along the axial direction, and the surface of the outer cylinder 21 is provided with assembly slots 24 corresponding to the flower grooves 26 one by one. The silicon wafer holder 4 is inserted into the corresponding flower grooves 26 on the core shaft 20 through the assembly slots 24. Such a structural arrangement enables the silicon wafer holder 4 to be installed and disassembled by only needing to be pulled out or inserted from the top of the silicon wafer holder 4 by a robot connected to the device, thereby reducing the cumbersome procedures of taking and placing the single crystal silicon wafer 5, making it more convenient to disassemble and assemble, and improving the texturing efficiency of the single crystal silicon wafer 5.

[0038] This embodiment provides a single crystal silicon wafer texturing device. Specifically, multiple groups of guide rods 25 are arranged between the mandrel 20 and the outer cylinder 21. Each group of guide rods 25 is provided with two guide rods, which are respectively located at the two ends of the one-to-one corresponding assembly slot 24 and the flower groove 26.

[0039] Furthermore, a limit block 28 is provided on the inner side of the guide rod 25 at the position of the assembly slot 24, and guide grooves 43 adapted to the limit block 28 are provided on both sides of the silicon wafer holder 4. The limit block 28 and the guide groove 43 are slidably engaged. Such a structural arrangement enables the bottom of the silicon wafer holder 4 to be smoothly slid and engaged into the flower groove 26 through the coordinated limiting and guiding effect of the limit block 28 and the guide groove 43 when the silicon wafer holder 4 is inserted into the flower groove 26 from the assembly slot 24, thereby ensuring smooth assembly of the silicon wafer holder 4 without any "stuck board" situation.

[0040] The present embodiment provides a single crystal silicon wafer texturing device. Specifically, the bottom of the guide slide groove 43 is detachably installed with an anti-slip block 48 through bolts, so that when the bottom of the silicon wafer holder 4 moves to the edge position of the assembly slot 24, the anti-slip block 48 contacts the limit block 28, thereby preventing the silicon wafer holder 4 from completely separating from the silicon wafer texturing drum 2 during insertion and withdrawal, making subsequent wafer loading operations more convenient, and at this time, the single crystal silicon wafer 5 assembled in the silicon wafer holder 4 is completely moved out to the outside of the silicon wafer texturing drum 2, which will not affect the disassembly and assembly of the single crystal silicon wafer 5.

[0041] The present embodiment provides a single crystal silicon wafer texturing device. Specifically, ear pieces 44 are installed at both ends of the silicon wafer holder 4. Ear holes 45 are opened on the ear pieces 44. The ear holes 45 are provided to assist the disassembly and assembly of the silicon wafer holder 4. Specifically, when the device is in use, the ear holes 45 are used to assist a robot arm matched with the device to grab and remove or install the silicon wafer holder 4 from the silicon wafer texturing drum 2.

[0042] The present embodiment provides a single crystal silicon wafer texturing equipment. Specifically, the ear piece 44 adopts an inverted U-shaped structure, and a magnetic piece 46 is embedded and installed at the end of the ear piece 44. Magnetic ring assembly grooves 27 are opened on the outer walls of both ends of the silicon wafer texturing drum 2, and a magnetic ring 23 is clamped in the magnetic ring assembly groove 27. When the silicon wafer holder 4 is fully engaged in the silicon wafer texturing drum 2, the magnetic piece 46 contacts the magnetic ring 23, and the magnetic poles of the contact surfaces of the magnetic piece 46 and the magnetic ring 23 are in opposite directions, so that the magnetic piece 46 and the magnetic ring 23 are attracted to each other, thereby fixing the silicon wafer holder 4. When the silicon wafer holder 4 is disassembled, when the force of the robot arm to pull out the silicon wafer holder 4 is greater than the attraction force between the magnetic piece 46 and the magnetic ring 23, the magnetic piece 46 is separated from the magnetic ring 23, and the disassembly of the silicon wafer holder 4 is achieved.

[0043] The present embodiment provides a single crystal silicon wafer texturing device. Specifically, a slot 40 is provided on the surface of the silicon wafer holder 4, and the single crystal silicon wafer 5 is mounted in the slot 40. Stabilizing pressure plates 41 are provided on both sides of the slot 40 in the silicon wafer holder 4, and the edges of the silicon wafer holder 4 are pressed and fixed by the stabilizing pressure plates 41. Such a structural setting enables the silicon wafer holder 4 to maintain the pressing effect on the single crystal silicon wafer 5 when rotating, thereby improving the stability of the entire texturing process. In addition, such edge pressing and fixing method makes good use of the useless area at the edge of the single crystal silicon wafer 5. Therefore, in the process of texturing the single crystal silicon wafer 5, the effective area of ​​the single crystal silicon wafer 5 will not be blocked, thereby ensuring that the single crystal silicon wafer 5 can be fully texturized at one time.

[0044] The present embodiment provides a single crystal silicon wafer texturing device. Specifically, installation grooves 47 are opened at both ends of the card slot 40. The stabilizing pressure plate 41 is rotatably installed in the installation groove 47 through a rotating connection piece 42. The rotating connection piece 42 is composed of a rotating shaft and a spring that provides torsion force to the rotating shaft (not shown in the figure), so that the rotating connection piece 42 always has a driving force to flip inward, which is convenient for the stabilizing pressure plate 41 to automatically press the edge of the single crystal silicon wafer 5 after installation. The surface of the rotating connection piece 42 is also provided with a protruding structure. When the stabilizing pressure plate 41 presses the single crystal silicon wafer 5, the protruding structure is flush with the surface of the silicon wafer holder 4. In this way, after the silicon wafer holder 4 is inserted into the assembly slot 24, the stabilizing pressure plate 41 can clamp the single crystal silicon wafer 5 with the cooperation of the assembly slot 24, thereby further improving the stability of the single crystal silicon wafer 5 during the texturing process.

[0045] The present embodiment provides a single crystal silicon wafer texturing device, specifically, also includes a servo drive component 3, which is used to control the silicon wafer texturing drum 2 to rotate in steps according to a preset speed. The servo drive component 3 includes a servo motor 32 and a linkage gear set 31, wherein the servo motor 32 is connected to the rotating shaft 30 on the silicon wafer texturing drum 2 through the linkage gear set 31. When the servo motor 32 is running, the linkage of the linkage gear set 31 drives the rotating shaft 30 to rotate, thereby driving the silicon wafer texturing drum 2 to rotate in steps according to the preset speed.

[0046] The present embodiment provides a single crystal silicon wafer texturing equipment. Specifically, assembly edge plates 10 are provided on both sides of the texturing tank body 1, which are used to assist in assembling the texturing tank body 1 onto the single crystal silicon wafer production line. A drain valve 11 is provided at the lower side of the texturing tank body 1, which is used to assist in clearing and replacing the reaction solution inside the texturing tank body 1. A protective enclosure 12 is installed at the upper edge of the texturing tank body 1. The protective enclosure 12 adopts a trumpet-shaped structure with an opening that gradually increases from bottom to top. The protective enclosure 12 is used to facilitate the reflux of the texturing solution and at the same time protect the environment around the equipment (to prevent the texturing solution from splashing).

[0047] The exemplary implementation scheme of the present disclosure is described in detail above with reference to the preferred embodiments. However, it can be understood by those skilled in the art that, without departing from the concept of the present disclosure, various modifications and variations can be made to the above-mentioned specific embodiments, and various technical features and structures proposed in the present disclosure can be combined in various ways without exceeding the protection scope of the present disclosure, which is determined by the attached claims.

Claims

1. A single crystal silicon wafer texturing device, characterized in that: It includes: A texturing tank (1) containing a texturing solution; A silicon wafer texturing drum (2) is rotatably mounted above the texturing tank (1) via a rotating shaft (30), and the texturing solution inside the texturing tank (1) is immersed to a position 1 / 2 of the silicon wafer texturing drum (2); The silicon wafer texturing drum (2) is a cylindrical structure with open ends formed by a combination of a core shaft (20) and an outer cylinder (21). A plurality of silicon wafer holders (4) are distributed in a ring array on the silicon wafer texturing drum (2). The silicon wafer holders (4) are movably inserted between the core shaft (20) and the outer cylinder (21). A single crystal silicon wafer (5) is detachably installed on the inner side of the silicon wafer holders (4), so that the single crystal silicon wafer (5) can be gradually immersed in the texturing solution inside the texturing tank (1) as the silicon wafer texturing drum (2) rotates.

2. The single crystal silicon wafer texturing equipment according to claim 1, characterized in that: The surface of the core shaft (20) is provided with a plurality of flower grooves (26) distributed in a circular array along the axial direction, the surface of the outer cylinder (21) is provided with assembly slots (24) corresponding one to one with the flower grooves (26), and the silicon wafer holder (4) is inserted into the corresponding flower grooves (26) on the core shaft (20) through the assembly slots (24).

3. The single crystal silicon wafer texturing equipment according to claim 2, characterized in that: A plurality of guide rods (25) are arranged between the core shaft (20) and the outer cylinder (21), and each guide rod (25) is provided with two guide rods, which are respectively located at the two ends of the corresponding assembly slot (24) and the flower groove (26); A limit block (28) is arranged on the inner side of the guide rod (25) at the position of the assembly slot (24), and guide slide grooves (43) adapted to the limit block (28) are arranged on both sides of the silicon wafer holder (4), and the limit block (28) is slidably engaged with the guide slide grooves (43).

4. The single crystal silicon wafer texturing equipment according to claim 3, characterized in that: An anti-slip stopper (48) is detachably mounted on the bottom of the guide slide groove (43) via bolts, so that when the bottom of the silicon wafer holder (4) moves to the edge position of the assembly slot (24), the anti-slip stopper (48) contacts the limit block (28).

5. A single crystal silicon wafer texturing device according to any one of claims 1 to 4, characterized in that: Ear pieces (44) are installed at both ends of the silicon wafer holder (4), and ear holes (45) are provided on the ear pieces (44).

6. The single crystal silicon wafer texturing equipment according to claim 5, characterized in that: The ear piece (44) adopts an inverted U-shaped structure, and a magnetic sheet (46) is embedded and installed at the end of the ear piece (44); The outer walls at both ends of the silicon wafer texturing drum (2) are provided with magnetic ring assembly grooves (27), and a magnetic ring (23) is clamped in the magnetic ring assembly groove (27). When the silicon wafer holder (4) is completely clamped in the silicon wafer texturing drum (2), the magnetic sheet (46) contacts the magnetic ring (23), and the magnetic poles of the contact surfaces of the magnetic sheet (46) and the magnetic ring (23) are in opposite directions, so that the magnetic sheet (46) and the magnetic ring (23) are attracted to each other.

7. A single crystal silicon wafer texturing device according to any one of claims 1 to 4, characterized in that: A card slot (40) is provided on the surface of the silicon wafer holder (4), the single crystal silicon wafer (5) is mounted in the card slot (40), and stabilizing pressure plates (41) are provided on both sides of the card slot (40) in the silicon wafer holder (4).

8. The single crystal silicon wafer texturing equipment according to claim 7, characterized in that: Mounting grooves (47) are provided at both ends of the clamping groove (40), and the stabilizing pressing plate (41) is rotatably mounted in the mounting grooves (47) via a rotating connecting member (42).

9. The single crystal silicon wafer texturing equipment according to claim 1, characterized in that: It also includes a servo drive component (3) for controlling the silicon wafer texturing drum (2) to rotate step by step according to a preset speed, and the servo drive component (3) includes a servo motor (32) and a linkage gear set (31), wherein the servo motor (32) is connected to the rotating shaft (30) on the silicon wafer texturing drum (2) through the linkage gear set (31).

10. The single crystal silicon wafer texturing equipment according to claim 1, characterized in that: The two sides of the texturing trough body (1) are provided with assembly edge plates (10), which are used to assist in assembling the texturing trough body (1) on a single crystal silicon wafer production line. A drain valve (11) is provided at the lower side of the texturing trough body (1), and a protective enclosure plate (12) is installed at the upper edge of the texturing trough body (1).

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