Apparatus for processing substrate

Abstract

Disclosed is an apparatus for processing a substrate, the apparatus comprising: an outer cup having a processing space with an open top; a support unit for supporting a substrate in the processing space; a guide cup provided in the processing space and arranged to surround the support unit; a liquid supply unit for supplying a processing liquid to the top surface of the substrate supported by the support unit; and a trap ring disposed in a gap between the guide cup and the outer cup to trap the processing liquid flowing through the gap, in which the trap ring is formed with a vent hole through which a gas flowing through the gap passes, and the trapping ring has a trapping space for trapping the processing liquid on a top surface thereof.

Description

Technical Field

[0001] The present invention relates to an apparatus for processing a substrate, and more particularly, to an apparatus for liquid processing a substrate. Background Art

[0002] In order to manufacture a semiconductor device or a flat panel display panel, various processes such as deposition, photographing, etching and cleaning are required. Among these processes, the photographing process includes a coating process in which a photosensitive liquid (such as a photoresist) is applied to a substrate surface to form a film, an exposure process in which a circuit pattern is transferred to the film formed on the substrate, and a development process in which the film formed on the substrate is selectively removed from an exposure area or an area opposite to the exposure area. In addition, a heat treatment process is performed before and after the coating process, the exposure process and the development process.

[0003] Recently, high viscosity photoresists have been used as photoresists. High viscosity photoresists have a high evaporation rate and may be included in the exhaust gas in the form of solid particles (fumes). These particles accumulate in the chamber area or duct that provides the exhaust path, blocking the duct and preventing the gas from escaping. Summary of the invention

[0004] In order to solve the above problems, the present invention provides a substrate processing apparatus capable of improving the capture efficiency of a processing liquid when processing a substrate.

[0005] In order to solve the above problems, the present invention also provides a substrate processing apparatus, which is capable of preventing a processing liquid from reducing exhaust efficiency when processing a substrate.

[0006] The objects of the present invention are not limited thereto, and other objects not mentioned will be clearly understood from the following description by those skilled in the art.

[0007] An exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: an outer cup having a processing space with an open top; a support unit for supporting the substrate in the processing space; a guide cup disposed in the processing space and arranged to surround the support unit; a liquid supply unit for supplying processing liquid to the top surface of the substrate supported by the support unit; and a capture ring disposed in a gap between the guide cup and the outer cup to capture the processing liquid flowing through the gap, wherein the capture ring is formed with an exhaust hole through which gas flowing through the gap passes, and the capture ring has a capture space on its top surface for capturing the processing liquid.

[0008] According to an exemplary embodiment, the catch ring may include: a first side wall; and a second side wall, and the first side wall is positioned closer to the outer cup than the second side wall, and the capture space is provided as a space between the first side wall and the second side wall.

[0009] According to an exemplary embodiment, the first side wall may be disposed away from the outer cup as the first side wall goes downward.

[0010] According to an exemplary embodiment, the second side wall may be disposed away from the guide cup as the second side wall goes downward.

[0011] According to an exemplary embodiment, the first side wall may be provided with a downward slope in a direction away from the outer cup, and the second side wall may be provided with a downward slope in a direction away from the guide cup.

[0012] According to an exemplary embodiment, a bottom end of the first side wall and a bottom end of the second side wall may contact each other.

[0013] According to an exemplary embodiment, at least one of the first sidewall and the second sidewall may be formed with an exhaust hole.

[0014] According to an exemplary embodiment, the device may further include: an external protrusion extending from the top end of the first side wall in a direction toward the outer cup and connected to the outer cup; and an internal protrusion extending from the top end of the second side wall in a direction toward the guide cup and connected to the guide cup.

[0015] According to an exemplary embodiment, an inclination angle of the first side wall and an inclination angle of the second side wall relative to an axis perpendicular to the ground may be the same.

[0016] According to an exemplary embodiment, the apparatus may further include a ring cleaning unit for supplying a cleaning liquid to clean the catch ring.

[0017] According to an exemplary embodiment, the guide cup may include: a top wall, which is provided with a downward slope in a direction toward the outer cup; and an outer wall, which extends downward from the top wall, the outer cup may include a side wall arranged parallel to the vertical direction, the capture ring may be located between the outer wall and the side wall, and the ring cleaning unit may also include a ring cleaning nozzle for supplying cleaning liquid to the top wall.

[0018] According to an exemplary embodiment, the outer cup may include: a bottom wall extending inwardly from the side wall to provide a discharge space for the liquid at a lower portion of the guide cup; and a discharge hole connected to the discharge space to discharge the liquid, and the outer wall may be disposed at a position opposite to the discharge hole.

[0019] According to an exemplary embodiment, the processing liquid may be a photosensitive liquid, and the cleaning liquid may be a diluent.

[0020] According to an exemplary embodiment, the photosensitive liquid may have a viscosity of 1000 cP or more.

[0021] Another exemplary embodiment of the present invention provides an apparatus for applying an anti-etching liquid to a substrate, the apparatus comprising: an outer cup having a processing space with an open top; a support unit for supporting and rotating the substrate in the processing space; a guide cup disposed in the processing space and arranged to surround the support unit; a liquid supply unit for supplying the anti-etching liquid to the top surface of the substrate supported by the support unit; a capture ring disposed in a gap between the guide cup and the outer cup to capture the processing liquid flowing through the gap; and a ring cleaning unit for supplying a cleaning liquid to clean the capture ring, wherein the capture ring comprises: a first side wall having a downward slope in a direction away from the outer cup; and a second side wall having a downward slope in a direction away from the guide cup, a capture space being formed between the first side wall and the second side wall to capture the anti-etching liquid that has been scattered from the substrate, and an exhaust hole being formed in at least one of the first side wall and the second side wall, and a gas flowing through the gap passes through the exhaust hole.

[0022] According to an exemplary embodiment, the cleaning liquid may be a diluent.

[0023] According to an exemplary embodiment, the guide cup may include: a top wall, which is provided with a downward slope in a direction toward the outer cup; and an outer wall, which extends downward from the top wall, and the capture ring may be located between the outer wall and the side wall, and the ring cleaning unit may include an intermediate nozzle for supplying cleaning liquid directly to the top wall.

[0024] According to an exemplary embodiment, the outer cup may include: a bottom wall extending from the side wall in a direction toward the guide cup to form a liquid discharge space in the lower portion of the guide cup; and a discharge hole for discharging liquid from the discharge space, and the outer wall may be arranged at a position opposite to the discharge hole, and the bottom wall may be provided with a downward slope toward the discharge hole.

[0025] Yet another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: an outer cup having a processing space with an open top; a support unit for supporting the substrate in the processing space; a guide cup disposed in the processing space and arranged to surround the support unit; a liquid supply unit for supplying a processing liquid to a top surface of the substrate supported by the support unit; a capture ring disposed in a gap between the guide cup and the outer cup to capture the processing liquid flowing through the gap; and a ring cleaning unit for supplying a cleaning liquid for cleaning the capture ring, wherein the guide cup comprises: a top wall provided with a downwardly inclined surface in a direction toward the outer cup; and an outer wall extending downward from the top wall, and The outer cup may include: a side wall, which is arranged parallel to the outer wall; and a bottom wall, which extends from the side wall in a direction toward the guide cup, the bottom wall is formed with a discharge pipe for discharging the processing liquid and the cleaning liquid and an exhaust pipe for emptying the processing space, the outer wall is arranged at a position opposite to the discharge hole, and the bottom wall is provided with a downward slope toward the discharge hole, the capture ring may include: a first side wall; and a second side wall, the first side wall is positioned closer to the outer cup than the second side wall, and the bottom end of the first side wall and the bottom end of the second side wall are in contact with each other to provide a capture space for capturing the processing liquid, and each of the first side wall and the second side wall is formed with an exhaust hole, and the gas flowing through the gap passes through the exhaust hole.

[0026] According to an exemplary embodiment, the top wall can form a limiting groove, which is defined by a first wall, a second wall spaced apart from the first wall in a direction from the guide cup toward the outer cup, and a bottom surface extending from the first wall and the second wall. The height of the first wall can be set to be higher than the height of the second wall. A plurality of limiting grooves can be set in an annular shape along the circumferential direction of the top wall. The limiting grooves may include: a first limiting groove; and a second limiting groove spaced apart from the first limiting groove in a direction from the first limiting groove toward the outer cup. The bottom surface of the first limiting groove can be set at a higher position than the bottom surface of the second limiting groove, and the outer surface of the outer wall can be provided with at least two guide grooves formed downward from the bottom end of the top wall.

[0027] According to an exemplary embodiment of the present invention, when a substrate is treated with a high-viscosity treating liquid, the efficiency of capturing the treating liquid may be improved.

[0028] According to an exemplary embodiment of the present invention, when a substrate is treated with a high-viscosity treatment liquid, the treatment liquid can be prevented from reducing exhaust efficiency.

[0029] The effects of the present invention are not limited to the aforementioned effects, and those skilled in the art can clearly understand unmentioned effects from the present specification and the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The various features and advantages of the non-limiting exemplary embodiments of the present specification will become apparent upon reading the detailed description in conjunction with the accompanying drawings. The drawings are for illustration purposes only and should not be construed as limiting the scope of the claims. Unless explicitly stated, the drawings are not to be considered drawn to scale. Various dimensions in the drawings may be exaggerated for clarity.

[0031] Figure 1 is a perspective view schematically illustrating a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0032] Figure 2 yes Figure 1 Front view of a substrate processing apparatus.

[0033] Figure 3 yes Figure 1 A top plan view of a coating block in a substrate processing apparatus.

[0034] Figure 4 yes Figure 1 A top plan view of a developing block in a substrate processing apparatus.

[0035] Figure 5 It is schematically shown Figure 3 Top view of a delivery robot.

[0036] Figure 6 It is schematically shown Figure 3 A top plan view of an example of a thermal processing chamber.

[0037] Figure 7 yes Figure 6 Front view of the heat treatment chamber.

[0038] Figure 8 It is a schematic diagram showing the Figure 3 0026] A cross-sectional view of an example of a liquid processing chamber according to an exemplary embodiment of the present invention.

[0039] Fig. 9 is a perspective view schematically showing an example of a catch ring according to an exemplary embodiment of the present invention.

[0040] Fig.10 It is installed Figure 8 Magnified view of the cross section of the capture ring.

[0041] Fig.11 is a schematic diagram of a nozzle provided in a ring cleaning unit according to an exemplary embodiment of the present invention.

[0042] Figure 12 to Figure 14 is a flow chart illustrating a process for cleaning a photoresist solution using a catch ring.

[0043] Fig.15is a cross-sectional view schematically showing an example of a liquid processing chamber according to another exemplary embodiment of the present invention.

[0044] Fig.16 yes Fig.15 Perspective view of the guide cup in FIG.

[0045] Fig.17 It is shown Fig.15 Cross-sectional view of the top wall of the guide cup. DETAILED DESCRIPTION

[0046] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. Exemplary embodiments are provided so that the present disclosure will be thorough and will fully convey the scope to those skilled in the art. Many specific details, such as examples of specific components, devices, and methods, are set forth to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be employed, that exemplary embodiments may be embodied in many different forms, and that neither should be construed as limiting the scope of the present disclosure. In some exemplary embodiments, well-known processes, well-known device structures, and well-known techniques are not described in detail.

[0047] The terms used herein are only used for the purpose of describing specific exemplary embodiments, and are not restrictive. As used herein, unless the context clearly indicates otherwise, when the quantity is not specified, "said" may also be intended to include plural forms. The terms "include", "comprise" and "have" are inclusive, and therefore specify the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or their groups. Unless specifically identified as an execution order, the method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or described. It should also be understood that additional or alternative steps may be adopted.

[0048] When an element or layer is referred to as being "on," "engaged," "connected," or "coupled" to another element or layer, it may be directly "on," "engaged," "connected," or "coupled" to the other element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," or "directly coupled to" another element or layer, there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0049] Although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer and / or section from another region, layer or section. Unless the context clearly indicates, the terms such as "first", "second" and other numerical terms used herein do not imply sequence or order. Therefore, without departing from the teaching of the exemplary embodiment, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section.

[0050] For ease of description of the relationship of one element or feature to another element or feature as shown in the figure, spatial relative terms such as "inside", "outside", "below", "below", "below", "above", and "above" may be used herein. In addition to the orientations described in the figures, spatial relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the accompanying drawings is flipped, elements described as "below" or "below" other elements or features will be oriented "above" the other elements or features. Therefore, the exemplary term "below" can cover both above and below orientations. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein are interpreted accordingly.

[0051] When the terms "same" or "equivalent" are used in the description of exemplary embodiments, it should be understood that some imprecision may exist. Therefore, when one element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within a manufacturing or operating tolerance range (e.g., ±10%).

[0052] When the term "about" or "substantially" is used in conjunction with a numerical value, it should be understood that the relevant numerical value includes a manufacturing or operating tolerance (e.g., ±10%) around the numerical value. In addition, when the words "generally" and "substantially" are used in conjunction with geometric shapes, it should be understood that the accuracy of the geometric shape is not required, but the latitude of the shape is within the scope of the present disclosure.

[0053] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present exemplary embodiments belong. It should also be understood that terms (including those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined in this article.

[0054] In the present exemplary embodiment, a wafer will be described as an example of an object to be processed. However, the technical spirit of the present invention can also be applied to an apparatus used for processing other types of substrates in addition to the wafer.

[0055] Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

[0056] Figure 1 is a perspective view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention, and Figure 2 yes Figure 1 Front view of a substrate processing apparatus. Figure 3 yes Figure 1 A top plan view of a coating block in a substrate processing apparatus, and Figure 4 yes Figure 1 A top plan view of a developing block in a substrate processing apparatus.

[0057] refer to Figures 1 to 4 , the substrate processing device 10 includes an indexing module 100, a processing module 300, and an interface module 500. According to an exemplary embodiment, the indexing module 100, the processing module 300, and the interface module 500 are arranged in a row in sequence. Hereinafter, the arrangement direction of the indexing module 100, the processing module 300, and the interface module 500 is defined as a first direction 12, a direction perpendicular to the first direction 12 when viewed from above is defined as a second direction 14, and a direction perpendicular to both the first direction 12 and the second direction 14 is defined as a third direction 16.

[0058] The index module 100 is provided to transfer the substrate W between the container F containing the substrate W therein and the process module 300. The longitudinal direction of the index module 100 is provided in the second direction 14. The index module 100 includes a loading port 110 and an index frame 130. The container F containing the substrate W is placed on the loading port 110. The loading port 110 is located at an opposite side of the process module 300 with respect to the index frame 130. A plurality of loading ports 110 may be provided, and the plurality of loading ports 110 may be provided along the second direction 14.

[0059] In an example, an airtight container F such as a front opening pod (FOUP) may be used as the container F. The container F may be placed on the load port 110 by a transfer tool (not shown) such as an overhead transfer device, an overhead conveyor, or an automated guided vehicle or by an operator.

[0060] The indexing robot 132 is disposed inside the indexing frame 130. Inside the indexing frame 130, a guide rail 136 is disposed. The longitudinal direction of the guide rail 136 is disposed in the second direction 14. The indexing robot 132 is mounted on the guide rail 136 so as to be movable along the guide rail 136. The indexing robot 132 includes a hand 132a on which the substrate W is placed. The hand 132a may be disposed to be movable forward and backward, linearly movable along the third direction, and rotatably movable around an axis in the third direction 16.

[0061] The process module 300 performs a coating process and a developing process on the substrate W. The process module 300 includes a coating block (COT) 300a and a developing block (DEV) 300b.

[0062] Before the exposure process, the coating block 300a performs a coating process on the substrate W. After the exposure process, the developing block 300b performs a developing process on the substrate W. A plurality of coating blocks 300a are provided. A plurality of coating blocks 300a can be provided while being stacked on top of each other. A plurality of developing blocks 300b are provided. A plurality of developing blocks 300b can be provided to be stacked with each other. In one example, two coating blocks 300a are provided, and two developing blocks 300b are provided. A plurality of coating blocks 300a can be positioned below the developing block 300b.

[0063] In one example, a plurality of coating blocks 300a may be provided with structures identical to each other. The film applied to the substrate W in each of the plurality of coating blocks 300a may be a film of the same type. Alternatively, the film applied to the substrate W by each coating block 300a may be a film of a different type. The film applied to the substrate W includes a photoresist film. The film applied to the substrate W may also include an antireflection film. Alternatively, the film applied to the substrate W may also include a protective film.

[0064] In addition, the two developing blocks 300b may be provided with the same structure as each other. The developer supplied to the substrate W in the plurality of developing blocks 300b may be the same type of liquid. Alternatively, the developer supplied to the substrate W may be a different type of developer, depending on the developing block 300b. For example, a process for removing the light irradiated area in the area of ​​the registration film on the substrate W may be performed in one of the two developing blocks 300b, and a process for removing the non-irradiated area may be performed in the other of the two developing blocks 300b.

[0065] refer to Figure 3 , the coating block 300 a includes a buffer unit 310 , a cooling unit 320 , a hydrophobizing chamber 340 , a transfer chamber 350 , a heat treatment chamber 360 , and a liquid treatment chamber 380 .

[0066] The buffer unit 310, the cooling unit 320, and the hydrophobizing chamber 340 are disposed adjacent to the index block 100. The hydrophobizing chamber 340 and the buffer unit 310 may be disposed sequentially along the second direction 14. In addition, the cooling unit 320 and the buffer unit 310 may be disposed to be stacked on top of each other in a vertical direction.

[0067] The buffer unit 310 includes one or more buffers 312. When multiple buffers 312 are provided, the multiple buffers 312 may be arranged to be stacked on top of each other. The buffer 312 provides a space for the substrate W to stay when the substrate W is transferred between the indexing module 100 and the processing module 300. The hydrophobic chamber 340 provides a hydrophobic treatment to the surface of the substrate W. The hydrophobic treatment may be performed before the coating process is performed on the substrate W. The hydrophobic treatment may be completed by supplying a hydrophobic gas to the substrate W when the substrate W is heated. The cooling unit 320 cools the substrate W. The cooling unit 320 includes one or more cooling plates. When multiple cooling plates are provided, the multiple cooling plates may be arranged to be stacked on top of each other. In one example, the cooling unit 320 may be provided below the buffer unit 310. The cooling plate may have a flow path through which a coolant flows. The substrate W after the hydrophobic treatment may be cooled on the cooling plate.

[0068] The transfer mechanism 330 is disposed between the hydrophobizing chamber 340 and the buffer unit 310 and between the hydrophobizing chamber 340 and the cooling unit 320. The transfer mechanism 330 is provided for transferring the substrate W between the buffer unit 310, the hydrophobizing chamber 340, and the cooling unit 320.

[0069] The conveying mechanism 330 includes a hand 332 on which the substrate W is placed, and the hand 332 can be arranged to be movable forward and backward, rotatable around the third direction 16, and movable along the third direction 16. In one example, the conveying mechanism 330 moves in the third direction 16 along the guide rail 334. The guide rail 334 extends from the coating block located at the lowest one of the coating blocks 300a to the developing block located at the highest one of the developing blocks 300b. This allows the conveying mechanism 330 to convey the substrate W between the blocks 300a and 300b arranged on different layers. For example, the conveying mechanism 330 can convey the substrate W between the coating blocks 300a and 300b arranged on different layers. The conveying mechanism 330 can also convey the substrate W between the coating block 300a and the developing block 300b.

[0070] In addition, another transfer unit 331 may be further provided on a side opposite to the side where the hydrophobizing chamber 340 is provided with respect to the buffer unit 310. Another transfer unit 331 may be provided to transfer the substrate W between the buffer unit 310 and the cooling unit 320 provided in the same blocks 300a and 300b. In addition, another transfer unit 331 may be provided to transfer the substrate W between the buffer unit 310 and the cooling unit 320 provided in different blocks 300a and 300b.

[0071] The transfer chamber 350 is disposed such that its longitudinal direction is parallel to the first direction 12. One end of the transfer chamber 350 may be located near the buffer unit 310 and / or the cooling unit 320. The other end of the transfer chamber 350 may be located adjacent to the interface module 500.

[0072] A plurality of heat treatment chambers 360 are provided. Some of the heat treatment chambers 360 are arranged along the first direction 12. In addition, some of the heat treatment chambers 360 may be stacked along the third direction 16. The heat treatment chambers 360 may all be located on one side of the transfer chamber 350.

[0073] The liquid treatment chamber 380 performs a liquid film forming process to form a liquid film on the substrate W. In one example, the liquid film forming process includes an anti-reagent film forming process. The liquid film forming process may include an anti-reflective film forming process. Optionally, the liquid film forming process may also include a protective film forming process. A plurality of liquid treatment chambers 380 are provided. The liquid treatment chambers 380 may be located on opposite sides of the thermal treatment chamber 360. For example, all thermal treatment chambers 380 may be located on the other side of the transfer chamber 350. The liquid treatment chambers 380 are arranged side by side along the first direction 12. Optionally, some of the liquid treatment chambers 360 may be stacked along the third direction 16.

[0074] In one example, the liquid processing chamber 380 includes a front-end liquid processing chamber 380 a and a rear-end liquid processing chamber 380 b . The front-end liquid processing chamber 380 a is disposed relatively close to the index module 100 , and the rear-end liquid processing chamber 380 b is disposed further close to the interface module 500 .

[0075] The front-end liquid processing chamber 380a applies the first liquid to the substrate W, and the rear-end liquid processing chamber 380b applies the second liquid to the substrate W. The first liquid and the second liquid may be different types of liquids. In an embodiment, the first liquid may be a liquid for forming an anti-reflection layer, and the second liquid may be a liquid for forming a photoresist film. The photoresist film may be formed on a substrate W to which an anti-reflection film has been applied. Alternatively, the first liquid may be a liquid for forming a photoresist film, and the second liquid may be a liquid for forming an anti-reflection film. In this case, the anti-reflection film may be formed on a substrate W on which a photoresist is formed. Alternatively, the first liquid and the second liquid may be the same liquid, and they may both be liquids for forming a photoresist film.

[0076] refer to Figure 4 , the developing block 300B includes a buffer unit 310, a cooling unit 320, a conveying chamber 350, a heat treatment chamber 360, and a liquid treatment chamber 380. The arrangement of the buffer unit 310, the cooling unit 320, the conveying chamber 350, the heat treatment chamber 360, and the liquid treatment chamber 380 in the developing block 300b may be the same as the arrangement of the buffer unit 310, the cooling unit 320, the conveying chamber 350, the heat treatment chamber 360, and the liquid treatment chamber 380 in the coating block 300a. When viewed from above, the buffer unit 310, the cooling unit 320, the conveying chamber 350, the heat treatment chamber 360, and the liquid treatment chamber 380 in the developing block 300b may be disposed at an overlapping position with the buffer unit 310, the cooling unit 320, the conveying chamber 350, the heat treatment chamber 360, and the liquid treatment chamber 380 in the coating block 300a.

[0077] The heat treatment chamber 360 performs a heating process on the substrate W. The heating process includes a post-exposure baking process performed on the substrate W after the exposure process is completed, and a hard baking process performed on the substrate W after the development process is completed.

[0078] The liquid processing chamber performs a developing process by supplying a developer onto the substrate W and developing the substrate W.

[0079] exist Figure 3 or Figure 4In the embodiment, the transfer chamber 350 is provided with a transfer robot 351. The transfer robot 351 transfers the substrate W between the buffer unit 310, the cooling unit 320, the heat treatment chamber 360, the liquid treatment chamber 380, and the buffer unit 510 or the cooling unit 520 of the interface module 500. In one example, the transfer robot 351 includes a hand 352 on which the substrate W is placed. The hand 352 may be configured to be movable forward and backward, rotatable about the third direction 16, and movable along the third direction 16. A guide rail 356 having a longitudinal direction parallel to the first direction 12 is provided in the transfer chamber 350, and the transfer robot 351 may be configured to be movable on the guide rail 356.

[0080] Figure 5 is a diagram showing an example of a hand of a transfer robot. Figure 5 , the hand 352 includes a base 352a and a support protrusion 352b. The base 352a may have a circular ring shape in which a portion of the circumference is curved. The base 352a has an inner diameter larger than the diameter of the substrate W. The support protrusion 352b extends inwardly from the base 352a. A plurality of support protrusions 352b are provided, and support an edge region of the substrate W. In one example, the support protrusions 352b may be provided in four equally spaced rows.

[0081] Figure 6 It is schematically shown Figure 3 A top plan view of an example of a thermal processing chamber, and Figure 7 yes Figure 6 Front view of the heat treatment chamber.

[0082] refer to Figure 6 and Figure 7 The heat treatment chamber 360 includes a shell 361 , a heating unit 363 and a transfer plate 364 .

[0083] The housing 361 is arranged in a substantially rectangular parallelepiped shape. In the side wall of the housing 361, an inlet opening (not shown) is formed, through which the substrate W enters and leaves. The inlet opening can be kept open. Alternatively, a door (not shown) can be provided to open and close the inlet opening. The heating unit 363 and the conveying plate 364 are arranged in the housing 361.

[0084] The heating unit 323 includes a heating plate 363a, a cover 363c and a heater 323b. When viewed from the top, the heating plate 363a has a generally circular shape. The heating plate 363a has a larger diameter than the substrate W. The heater 363b is mounted on the heating plate 363a. The heater 363b can be set as a heating wire or a heating pattern heated by supplying electricity. The heating plate 363a is provided with a lifting pin 363e. The lifting pin 363e is set to be movable in the up and down direction along the third direction 16. The lifting pin 363e receives the substrate W from the conveying robot 352 and places the received substrate W on the heating plate 363a, or lifts the substrate W from the heating plate 363a and transfers the substrate to the conveying robot 352. According to an example, three lifting pins 363e can be set. The cover 363c has a space with an open lower part therein. The cover 363c is located above the heating plate 363a and moves in the vertical direction by the driver 363d. A space formed by the cover 363 c and the heating plate 363 a according to the movement of the cover 363 c is provided as a heating space for heating the substrate W.

[0085] The transfer plate 364 is provided in a substantially disk shape and has a diameter corresponding to the diameter of the substrate W. A notch 364b is formed at the edge of the transfer plate 364. The notch 364b may have a shape corresponding to the protrusion 352b formed on the hand of the transfer robot 352 described above. In addition, the notch 364b is provided to correspond in number to the protrusion 352b formed on the hand and is formed at a position corresponding to the protrusion 352b. At a position where the hand and the transfer plate 364 are arranged in a vertical direction, when the vertical position of the hand and the transfer plate 364 is changed, the substrate W is transferred between the hand 354 and the transfer plate 364. The transfer plate 364 is mounted on a guide rail 364d and can be moved along the guide rail 364d by a driver 364c.

[0086] A plurality of slit-shaped guide grooves 364a are provided in the transfer plate 364. The guide grooves 364a extend from the distal end of the transfer plate 364 to the inside of the transfer plate 364. The longitudinal directions of the guide grooves 364a are provided along the second direction 14, and the guide grooves 364a are spaced apart from each other along the first direction 12. When the substrate W is transferred between the transfer plate 364 and the heating unit 363, the guide grooves 364a prevent the transfer plate 364 and the lifting pins 363e from interfering with each other.

[0087] The heat transfer plate 364 is provided with a heat conductive material. In one example, the heat transfer plate 364 can be made of a metal material.

[0088] A cooling channel 364 is formed in the transfer plate 364. A coolant is supplied to the cooling channel 364. The substrate W that has been heated in the heating unit 363 may be cooled while being transferred by the transfer plate 364. In addition, when the transfer plate 364 stops so that the substrate W is taken over by the transfer robot 351, the substrate W may be cooled on the transfer plate 364.

[0089] Optionally, the cooling unit may also be disposed in the housing 361. In this case, the cooling unit may be arranged in parallel with the heating unit 363. The cooling unit may be provided as a cooling plate having a channel formed therein through which a coolant flows. The substrate that has been heated in the heating unit may be returned to the cooling unit for cooling.

[0090] Figure 8 It is schematically shown Figure 3 Front view of the liquid handling chamber.

[0091] refer to Figure 8 The liquid processing chamber 380 includes a housing 382 , an outer cup 384 , a guide cup 385 , a support unit 386 , a liquid supply unit 387 , a capture ring 1000 , and a ring cleaning unit 2000 .

[0092] The housing 382 is provided in a rectangular cylindrical shape having an inner space. An opening 382a is formed in one side of the housing 382. The opening 382a functions as a passage through which the substrate W enters and leaves. A door (not shown) is installed in the opening 382a, and the door opens and closes the opening.

[0093] The inner space of the housing 382 is provided with an outer cup 384. The outer cup 384 has a processing space with an open top.

[0094] The support unit 386 supports the substrate W in the processing space of the outer cup 384. The support unit 386 includes a support plate 386a, a rotation shaft 386b and a driver 386c. The support plate 386a is provided with a circular top surface. The support plate 386a has a smaller diameter than the substrate W. The support plate 386a is provided to support the substrate W by vacuum pressure. The rotation shaft 386b is coupled to the center of the lower surface of the support plate 386a, and the driver 386c is provided on the rotation shaft 386b to provide a rotational force to the rotation shaft 386b. The driver 386c may be a motor. In addition, a lifting driver (not shown) may be provided to adjust the relative height of the support plate 386a and the outer cup 384.

[0095] The liquid supply unit 387 supplies the treatment liquid onto the substrate W. When the liquid treatment chamber 380 is arranged in the coating block 300a, the treatment liquid may be a liquid for forming a photoresist film, an anti-reflection film or a protective film. The photoresist film may have a viscosity of 1000cP or higher. If the liquid treatment chamber 380 is arranged in the developing block 300b, the treatment liquid may be a developer liquid. The liquid supply unit 387 has a nozzle 387a, a nozzle support 387b and a liquid supply source (not shown). The nozzle 387a discharges the treatment liquid onto the substrate W. The nozzle 387a is supported on the nozzle support 387b. The nozzle support 387b enables the nozzle 387a to move between the process position and the standby position. In the process position, the nozzle 387a supplies the treatment liquid to the substrate W placed on the support plate 386a, and after completing the supply of the treatment liquid, the nozzle 387a waits in the standby position. In the standby position, the nozzle 387a waits at the groove port 388 , and the groove port 388 is located on the outside of the outer cup 384 within the housing 382 .

[0096] A fan filter unit 383 is provided on the top wall of the housing 382, ​​and the fan filter unit supplies downward airflow to the inner space. The fan filter unit 383 has a fan that introduces air from the outside into the inner space and a filter that filters the air from the outside.

[0097] The outer cup 384 has a bottom wall 384a, a side wall 384b and a top wall 384c. The inner space as described above is provided inside the outer cup 384. The inner space includes a processing space at the top and an exhaust space at the bottom.

[0098] The bottom wall 384a is set to a circular shape and has an opening in the center. The bottom wall 384a extends inward from the side wall 384b. The bottom wall 384a forms a liquid discharge space in the lower part of the guide cup 385. A discharge hole 384d is formed in the bottom wall 384a to discharge the processing liquid. The discharge hole 384d can be set at a position opposite to the capture ring 1000, which will be described later. The side wall 384b extends upward from the outer end of the bottom wall 384a. The side wall 384b is set to an annular shape and is set to be perpendicular to the bottom wall 384a. Optionally, the side wall 384b can be set parallel to the vertical direction. In one example, the side wall 384b extends to a height equivalent to the top surface of the support plate 386a, or extends to a height slightly lower than the top surface of the support plate 386a. The top wall 384c has an annular shape with an opening in the center. The top wall 384c is provided with an upward slope from the top of the side wall 384b toward the central axis of the outer cup 384.

[0099] The guide cup 385 is positioned on the inner side of the outer cup 384. The guide cup 385 has an inner wall 385a, an outer wall 385b and a top wall 385c. The guide cup 385 is arranged to surround the support unit 386. The inner wall 385a has a through hole penetrating in the vertical direction. The inner wall 385a is arranged to surround the driver 386c. The inner wall 385a minimizes the exposure of the driver 386c to the airflow 84 in the processing space. The rotation axis 386b and / or the driver 386c of the support unit 386 extend through the through hole in the vertical direction. The outer wall 385b is spaced apart from the inner wall 385a and is arranged to surround the inner wall 385a. The outer wall 385b is spaced apart from the side wall 384b of the outer cup 384. The outer wall 385b extends downward from the top wall 385c, which will be described later. The inner wall 385a is spaced apart upward from the bottom wall 384a of the outer cup 384. The top wall 385c connects the upper end of the outer wall 385b with the upper end of the inner wall 385a. The top wall 385c has an annular shape and is arranged to surround the support plate 386a. The top wall 385c is provided with a downwardly inclined surface in the direction facing the outer cup 384. In one example, the top wall 385c has an upwardly convex shape. In another exemplary embodiment, the space below the support plate 386a in the processing space can be set as an exhaust space. In one example, the exhaust space can be defined by the guide cup 385. The space surrounded by the outer wall 385b, the top wall 385c and the inner wall 385a of the guide cup 385 and / or the space below the space can be set as the exhaust space.

[0100] The discharge hole 384d of the outer cup 384 is connected to the discharge pipe 381a for discharging the processing liquid. In addition, the bottom wall 384a of the outer cup 384 can be connected to the exhaust pipe 381b for exhausting the processing space from the inner side of the outer wall 385b.

[0101] Fig. 9 is a perspective view of a capture ring according to an exemplary embodiment of the present invention, and Fig.10 yes Figure 81. An enlarged cross-sectional view of the capture ring after installation. The capture ring 1000 is disposed in the gap V between the guide cup 385 and the outer cup 384. The capture ring 1000 captures the process liquid flowing through the gap V. In one example, the capture ring 1000 is located in the gap V between the outer wall 385b of the guide cup 385 and the side wall 384b of the outer cup 384. A capture space T is formed on the top surface of the capture ring 1000 to capture the process liquid. An exhaust hole 1300 is formed in the capture ring 1000, and the gas flowing through the gap V passes through the exhaust hole. In one example, the exhaust hole 1300 is formed on one side of the capture space T. In one example, the capture ring 1000 may include a first side wall 1100 and a second side wall 1200. The first side wall 1100 is positioned closer to the side wall 384b of the outer cup 384 than the second side wall 1200. The space between the first side wall 1100 and the second side wall 1200 may provide the capture space T. The first side wall 1100 and the second side wall 1200 are each provided with an inclined surface relative to the ground. The first side wall 1100 is provided so as to be away from the outer cup 384 as the first side wall 1100 is downward. The second side wall 1200 is provided so as to be away from the guide cup 385 as it is downward. The first side wall 1100 and the second side wall 1200 may be provided at the same angle as the ground. In one example, the bottom end of the first side wall 1100 and the bottom end of the second side wall 1200 may contact each other. The exhaust hole 1300 is formed in at least one of the first side wall 1100 and the second side wall 1200. In one example, the exhaust hole 1300 may be provided in both the first side wall 1100 and the second side wall 1200. The exhaust hole 1300 may be formed in the lower region of the first side wall 1100. The exhaust hole 1300 is formed at a position spaced apart from the bottom end of the first side wall 1100. A plurality of exhaust holes 1300 are provided along the circumferential direction of the first side wall 1100. The exhaust holes 1300 may each be formed in a circular shape. The exhaust holes 1300 may be provided with the same size. The exhaust holes 1300 may be spaced equidistantly. The exhaust holes 1300 formed in the second side wall 1200 may be provided with the same size and the same arrangement as the exhaust holes 1300 formed in the first side wall 1100. The exhaust holes 1300 are provided to be spaced apart from the bottom ends of the first side wall 1100 and the second side wall 1200 in the upward direction. If the exhaust holes 1300 are provided at this height, it is sufficient so that a certain amount of the processing liquid and the cleaning liquid can be captured in the capture space T of the capture ring 1000. In addition, a plurality of exhaust holes 1300 may be provided. The intervals between the exhaust holes 1300 may be provided to be constant. An external protrusion 1210 is formed at the top of the first side wall 1100. The external protrusion 1210 extends from the top of the first side wall toward the direction of the outer cup 384. The external protrusion 1210 is connected to the guide cup 385. The outer protrusion 1210 may be inserted into a groove formed in the sidewall 384b of the outer cup 384. At the top of the second sidewall 1200, an inner protrusion 1110 is formed.The inner protrusion 1110 extends from the top of the second side wall toward the direction of the guide cup 385. The inner protrusion 1110 is coupled to the outer cup 384. The inner protrusion 1110 may be inserted into a groove formed in the outer wall 385b of the guide cup 385. The inner protrusion 1110 and the outer protrusion 1210 may be disposed at the same height.

[0102] Furthermore, the apparatus may be provided with a removal liquid nozzle 2200. The removal liquid nozzle 2200 supplies a cleaning liquid that removes a film from an edge region of the top surface of the substrate W. Furthermore, the apparatus may be provided with a back cleaning nozzle 2300. The back cleaning nozzle 2300 supplies a cleaning liquid to the lower side of the substrate W.

[0103] Fig.11 2 is a schematic diagram of a nozzle provided in a ring cleaning unit according to an exemplary embodiment of the present invention. The ring cleaning unit 2000 cleans the capture ring. The ring cleaning unit 2000 includes a ring cleaning nozzle 2100 that supplies a cleaning liquid. For example, the removal liquid may be a diluent. In one example, the ring cleaning nozzle 2100 may supply the cleaning liquid to the top wall 385 of the guide cup 385. The above-mentioned removal liquid nozzle 2200 and the back cleaning nozzle 2300 may be used as the ring cleaning unit 2000 for cleaning the capture ring 1000.

[0104] Figure 12 to Figure 14 is a flow chart showing the process of cleaning a photoresist solution using a trap ring. Fig.12 , during the coating process, the liquid supply unit 387 supplies a photoresist solution to the substrate W supported on the support unit 386. The driving unit of the support unit 386 rotates the substrate, and the photoresist solution is applied to the substrate W. The uncoated photoresist solution is scattered toward the top wall 384c and the side wall 384b of the outer cup 384. The scattered photoresist solution is captured in the capture ring 1000. When the photoresist solution has a high viscosity, the photoresist solution may gather into a line shape and scatter. Gas may be supplied during the coating process. In addition, gas may be generated during the coating process. The gas is discharged along the exhaust path. The exhaust path includes an exhaust hole 1300 and an exhaust pipe 381b.

[0105] refer to Fig.13, a removal process is performed after the coating process. In the removal process, the film is removed from the edge area in the top surface of the substrate W. The removal liquid nozzle 2200 supplies a cleaning liquid to the edge area of ​​the top surface of the substrate W. The cleaning liquid removes the film from the edge area of ​​the substrate W. In the cleaning process, the cleaning process cleans any residual contaminants on the lower side of the substrate W. A back cleaning process may be performed after the removal process. Alternatively, the back cleaning process may be performed simultaneously with the removal process. The back cleaning nozzle 2300 supplies a cleaning liquid to the lower side of the substrate W. The cleaning liquid cleans the lower side of the substrate W. For example, the removal liquid may be a diluent. During the removal process and the back cleaning process, the support unit 385 rotates the substrate.

[0106] In the ring cleaning process, the capture ring 1000 is cleaned. The ring cleaning process may be performed after the removal process and the back cleaning process. Alternatively, the ring cleaning process may be performed during any one of the coating process, the removal process, or the back cleaning process. Alternatively, the ring cleaning process may be performed during the coating process, the removal process, and the back cleaning process. The ring cleaning nozzle 2100 supplies a cleaning liquid directly to the top wall 385 of the guide cup 385. The cleaning liquid cleans any photoresist solution remaining on the top wall 385 of the guide cup 385. The cleaning liquid also flows into the capture ring 1000 to clean the captured photoresist solution.

[0107] See also Fig.14 , the photoresist solution can be cleaned by dissolving in the cleaning liquid. By rotating the substrate W, the cleaning liquid is dispersed onto the top wall 384c or the side wall 384b of the outer cup 384. The scattered cleaning liquid is captured in the capture ring 1000. The captured photoresist solution is dissolved in the cleaning liquid and cleaned. The cleaning liquid in which the photoresist solution is dissolved is discharged to the discharge hole 1300 or captured in the capture space T of the capture ring 1000. The coating process, the removal process and the back cleaning process are repeated. During the repeated process, the cleaning liquid accumulates in the capture space T of the capture ring 1000. The accumulated cleaning liquid may dissolve the already scattered photoresist solution. The cleaning liquid can be retained in the capture space until the height of the exhaust hole 1300 is formed therein. When a larger amount of cleaning liquid is stored in the capture space exceeding the height of the exhaust hole, the cleaning liquid is discharged from the capture space through the exhaust hole. The discharged cleaning liquid is discharged to the outside through the discharge pipe 381a formed in the bottom wall 384a corresponding to the position of the capture ring 1000. In this way, the capture ring 1000 can effectively capture and clean the photoresist solution and the cleaning liquid through the capture space T. When the photoresist is a high-viscosity photoresist of 1000 cP or more, even if a high-viscosity photoresist solution is used, the photoresist solution can be cleaned to suppress the generation of smoke, thereby preventing photoresist particles from accumulating in the exhaust channel.

[0108] Fig.15 is a cross-sectional view showing another embodiment of a guide cup according to the present invention; Fig.16 It is shown Fig.15 a perspective view of the guide cup shown; and Fig.17 It is shown Fig.15 A cross-sectional view of the top wall of the guide cup is shown. Figures 15 to 17 Zhongyu Figure 8 The overlapping parts of the exemplary embodiments of Figures 15 to 17 In an exemplary embodiment, the top wall 1220c of the guide cup 1220 is formed with a first wall 1221, a second wall 1222, a bottom surface 1223, a stop groove 1225, and a step 1226. The first wall 1221 and the second wall 1222 are arranged to face each other. The second wall 1222 is arranged to be spaced apart from the first wall 1221 in the direction from the guide cup 385 toward the outer cup 384. The stop groove 1225 is defined by the second wall 1222 and the bottom surface 1223 extending between the first wall 1221 and the second wall 1222. The stop groove 1225 provides a space for the cleaning liquid to gather. In one example, the height of the first wall 1221 is set to be higher than the height of the second wall 1222. The stop groove 1225 relatively close to the support unit 386 is defined as a first stop groove 1225a, and the stop groove 1225 relatively far from the support unit 386 is defined as a second stop groove 1225b. The step 1226 is arranged between the first limiting groove 1225a and the second limiting groove 1225b. The step 1226 ensures that the cleaning liquid gathered in the first limiting groove 1225a stays in the first limiting groove 1225a, rather than flowing directly into the second limiting groove 1225b. The second limiting groove 1225b is spaced apart from the first limiting groove 1225a in the direction from the first limiting groove 1225a toward the outer cup 384. In one example, the bottom surface 1223 of the first limiting groove 1225a is arranged at a position higher than the bottom surface 1223 of the second limiting groove 1225b. Therefore, the guide cup 385 is arranged in a stepped shape that descends outward. In one example, a plurality of limiting grooves 1225 are arranged in an annular shape along the circumferential direction of the top wall 385c. For example, the limiting grooves 1225 can be arranged in a plurality of concentric rings of different diameters.

[0109] The outer surface of the outer wall 1220b is provided with at least two guide grooves 1242 formed downward from the bottom end of the top wall 1220c. In one example, the guide grooves 1242 form a straight line downward from the bottom end of the top wall 1220c. For example, the guide grooves 1242 can be formed in a vertical direction from the bottom end of the top wall 1220c to the bottommost end of the outer wall 1220b. In one example, a plurality of guide grooves 1242 can be arranged at equal intervals around the circumference of the outer wall 1220b. In one example, the spacing between the centers of the guide grooves 1242 can be arranged to be shorter than the longitudinal length of the outer wall 1220b. In one example, the spacing between the centers of the guide grooves 1242 can be arranged to be longer than the width of the guide grooves 1242. In one example, the cross section of the guide grooves 1242 can be arranged in a semicircular shape.

[0110] Reference again Figures 1 to 4 The interface module 500 connects the processing module 300 with the external exposure device 700. The interface module 500 includes an interface frame 501, a buffer unit 510, a cooling unit 520, a conveying mechanism 530, an interface robot 540, and an additional process chamber 560.

[0111] A fan filter unit may be disposed on the top of the interface frame 501 , and downward airflow is formed in the fan filter unit. A buffer unit 510 , a cooling unit 520 , a conveying mechanism 530 , an interface robot 540 and an additional process chamber 560 are disposed inside the interface frame 501 .

[0112] The structures and arrangements of the buffer unit 510 and the cooling unit 520 may be the same or similar to those of the buffer unit 310 and the cooling unit 320 provided in the process module 300. The buffer unit 510 and the cooling unit 520 are provided adjacent to the end of the transfer chamber 350. The substrate W being transferred between the process module 300, the cooling unit 520, the additional process chamber 560, and the exposure device 700 may temporarily reside inside the buffer unit 510. The cooling unit 520 may be provided between the coating block 300a and the developing block 300b only at a height corresponding to the coating block 300a.

[0113] The conveying mechanism 530 may convey the substrate W between the buffer units 510. The conveying mechanism 530 may also convey the substrate W between the buffer unit 510 and the cooling unit 520. The conveying mechanism 530 may be provided with a structure that is the same as or similar to the conveying mechanism 330 of the process module 300. Another conveying mechanism 531 may also be provided in an area opposite to the area in which the conveying mechanism 530 is provided with respect to the buffer unit 510.

[0114] The interface robot 540 is provided between the buffer unit 510 and the exposure device 700. The interface unit 540 is provided to transfer the substrate W between the buffer unit 510, the cooling unit 520, the additional process chamber 560, and the exposure device 700. The interface robot 540 includes a hand 542 on which the substrate W is placed, and the hand 542 may be provided to be movable forward and backward, rotatable about the third direction 16, and movable along the third direction 16.

[0115] The additional process chamber 560 may perform a predetermined additional process before loading the substrate W processed in the coating block 300a into the exposure device 700. Alternatively, the additional process chamber 560 may perform a predetermined additional process before loading the substrate W processed in the exposure device 700 into the developing block 300b. In one example, the additional process may be an edge exposure process for exposing an edge area of ​​the substrate W, or a top surface cleaning process for cleaning the top surface of the substrate W, or a bottom surface cleaning process for cleaning the bottom surface of the substrate W, or an inspection process for performing a predetermined inspection on the substrate W. A plurality of additional process chambers 560 may be provided, and they may be provided to be stacked on top of each other.

[0116] In the above example, the liquid processing chamber provided in the coating block 300a has been described as an example, but is not limited thereto. For example, the catch ring 1000 may also be installed in the liquid processing chamber provided in the developing block 300b.

[0117] In the above example, the case where the bottom end of the first side wall 1100 and the bottom end of the second side wall 1200 of the catch ring 1000 contact each other so that the cross section of the catch ring 1000 is V-shaped, U-shaped, or W-shaped has been described as an example, but the present invention is not limited thereto. Any shape capable of capturing the process liquid is sufficient, for example, including the shape of a bottom wall connecting the bottom end of the first side wall 1100 and the bottom end of the second side wall 1200.

[0118] Furthermore, in the above example, a case is described in which the exhaust hole 1300 has a circular shape, but the present invention is not limited thereto. For example, the exhaust hole 1300 may be provided in any shape that may provide a passage for exhausting and treating liquid and cleaning liquid.

[0119] In addition, in the above example, a case where a plurality of exhaust holes 1300 are provided is described, but the present invention is not limited thereto. For example, only one exhaust hole 1300 may be provided, and the bottom surface of the capture ring 1000 may be provided with a downward slope toward the exhaust hole.

[0120] Furthermore, in the above example, the catch ring 1000 has the inner protrusion 1110 engaged with the groove in the guide cup 385 and the outer protrusion 1210 engaged with the groove in the outer cup 384, but the catch ring 1000 may be mounted by forming protrusions on the outer wall 385b of the guide cup 385 and the side wall 384b of the outer cup 384 and resting on the corresponding protrusions of the inner protrusion 1110 and the outer protrusion 1214. However, the present invention is not limited thereto, and any other means for fixing the catch ring to the gap V is sufficient.

[0121] In addition, in the above example, the case where the catch ring 1000 is coupled to the top end of the outer wall 385 b of the guide cup 385 is described, but the present invention is not limited thereto. For example, the catch ring 1000 may be coupled to the bottom end of the outer wall 385 b of the guide cup 385 .

[0122] It should be understood that exemplary embodiments are disclosed herein, and other variations are possible. Individual elements or features of a particular exemplary embodiment are generally not limited to the particular exemplary embodiment, but are interchangeable and can be used in a selected exemplary embodiment where applicable, even if not specifically shown or described. These modifications should not be considered as departing from the spirit and scope of the present disclosure, and all such modifications that would be apparent to a person of ordinary skill in the art are intended to be included within the scope of the appended claims.

Claims

1. A device for processing a substrate, the device include: an outer cup having a processing space with an open top; a supporting unit for supporting a substrate in the processing space; a guide cup disposed in the processing space and arranged to surround the support unit; a liquid supply unit for supplying a processing liquid to a top surface of the substrate supported by the supporting unit; as well as a catch ring disposed in a gap between the guide cup and the outer cup to capture the process liquid flowing through the gap, wherein the capture ring is formed with an exhaust hole, and the gas flowing through the gap passes through the exhaust hole, and The catch ring has a capture space on a top surface thereof for capturing the process liquid.

2. The device according to claim 1, in, The capture ring comprises: a first side wall; and a second side wall, and The first sidewall is positioned closer to the outer cup than the second sidewall, and The capture space is provided as a space between the first side wall and the second side wall.

3. The device according to claim 2, in, The first side wall is disposed away from the outer cup as the first side wall moves downward.

4. The device according to claim 2, in, The second side wall is disposed away from the guide cup as the second side wall moves downward.

5. The device according to claim 2, in, The first side wall is provided with a downwardly inclined surface in a direction away from the outer cup, and The second side wall is provided with a downwardly inclined surface in a direction away from the guide cup.

6. The device according to claim 5, in, A bottom end of the first side wall and a bottom end of the second side wall contact each other.

7. The device according to claim 2, in, The exhaust hole is formed in at least one of the first side wall and the second side wall.

8. The device according to claim 2, further comprising: include: an external protrusion extending from a top end of the first side wall in a direction toward the outer cup and coupled to the outer cup; as well as An inner protrusion extends from a top end of the second side wall in a direction toward the guide cup and is coupled to the guide cup.

9. The device according to claim 2, in, With respect to an axis perpendicular to the ground, an inclination angle of the first side wall and an inclination angle of the second side wall are the same.

10. The device according to claim 1, further comprising: include: A ring cleaning unit is used to supply cleaning liquid to clean the catch ring.

11. The device according to claim 10, in, The guide cup comprises: a top wall having a downwardly inclined surface in a direction toward the outer cup; and an outer wall extending downwardly from the top wall, The outer cup includes a side wall arranged parallel to the vertical direction, The catch ring is located between the outer wall and the side wall, and The ring cleaning unit further includes a ring cleaning nozzle for supplying a cleaning liquid to the top wall.

12. The device according to claim 11, in, The outer cup comprises: a bottom wall extending inwardly from the side wall to provide a drainage space for liquid in a lower portion of the guide cup; and a discharge hole connected to the discharge space to discharge the liquid, and The outer wall is disposed at a position opposite to the discharge hole.

13. The device according to claim 10, in, The processing liquid is a photosensitive liquid, and the cleaning liquid is a diluent.

14. The device according to claim 13, in, The photosensitive liquid has a viscosity of 1000 cP or higher.

15. An apparatus for applying a resist liquid to a substrate, the apparatus include: an outer cup having a processing space with an open top; a supporting unit for supporting and rotating the substrate in the processing space; a guide cup disposed in the processing space and arranged to surround the support unit; a liquid supply unit for supplying a resist liquid to a top surface of the substrate supported by the support unit; a catch ring disposed in a gap between the guide cup and the outer cup to capture the process liquid flowing through the gap; as well as a ring cleaning unit for supplying a cleaning liquid to clean the catch ring, The capture ring comprises: A first side wall, which is provided with a downwardly inclined surface in a direction away from the outer cup; as well as The second side wall is provided with a downward slope in a direction away from the guide cup, A trapping space is formed between the first side wall and the second side wall to trap the resist liquid that has been scattered from the substrate, and An exhaust hole is formed in at least one of the first side wall and the second side wall, and the gas flowing through the gap passes through the exhaust hole.

16. The device according to claim 15, in, The cleaning liquid is a diluent.

17. The device according to claim 15, in, The guide cup comprises: a top wall having a downwardly inclined surface in a direction toward the outer cup; and an outer wall extending downwardly from the top wall, and The catch ring is located between the outer wall and the side wall, and The annular cleaning unit comprises a central nozzle for supplying cleaning liquid directly to the top wall.

18. The device according to claim 17, in, The outer cup comprises: a bottom wall extending from the side wall in a direction toward the guide cup to form a liquid discharge space at a lower portion of the guide cup; and a discharge hole for discharging the liquid from the discharge space, and The outer wall is disposed at a position opposite to the discharge hole, and The bottom wall is provided with a downwardly inclined surface toward the discharge hole.

19. An apparatus for processing a substrate, the apparatus include: an outer cup having a processing space with an open top; a supporting unit, configured to support a substrate in the processing space; a guide cup disposed in the processing space and arranged to surround the support unit; a liquid supply unit for supplying a processing liquid to a top surface of the substrate supported by the supporting unit; a catch ring disposed in a gap between the guide cup and the outer cup to capture the process liquid flowing through the gap; as well as a ring cleaning unit for supplying a cleaning liquid for cleaning the catch ring, The guide cup comprises: a top wall having a downwardly inclined surface in a direction toward the outer cup; and an outer wall extending downwardly from the top wall, and The outer cup comprises: a side wall disposed parallel to the outer wall; and a bottom wall extending from the side wall in a direction toward the guide cup, The bottom wall is formed with a discharge pipe for discharging the treatment liquid and the cleaning liquid and an exhaust pipe for emptying the treatment space. The outer wall is disposed at a position opposite to the discharge hole, and The bottom wall is provided with a downward slope toward the discharge hole, The capture ring comprises: a first side wall; and The second side wall, The first sidewall is positioned closer to the outer cup than the second sidewall, and The bottom end of the first side wall and the bottom end of the second side wall contact each other to provide a capture space for capturing the treatment liquid, and Each of the first side wall and the second side wall is formed with an exhaust hole through which the gas flowing through the gap passes.

20. The device according to claim 19, in, The top wall forms a limiting groove, and the limiting groove is defined by a first wall, a second wall spaced apart from the first wall in a direction from the guide cup toward the outer cup, and a bottom surface extending from the first wall and the second wall. The height of the first wall is set to be higher than the height of the second wall, A plurality of the limiting grooves are arranged in an annular shape along the circumferential direction of the top wall, The limiting groove comprises: a first limiting groove; and a second limiting groove, which is spaced apart from the first limiting groove in a direction from the first limiting groove toward the outer cup, The bottom surface of the first limiting groove is arranged at a higher position than the bottom surface of the second limiting groove, and The outer surface of the outer wall is provided with at least two guide grooves formed downward from the bottom end of the top wall.

Images