Production process of novel color filter for electronic paper

Abstract

The invention discloses a production process of a novel color filter for electronic paper. The processing process comprises the following steps: S1, coating an ITO (Indium Tin Oxide) film; s2, manufacturing a blue pixel point; s3, making red pixel points; s4, manufacturing green pixel points; s5, performing surface protection; comprising the following sub-steps: S2, blue pixel point film attachment: S21, carrying out cleaning treatment on a glass substrate subjected to ITO film coating, S22, coating a layer of whole-surface blue photoresist on the surface of a conductive layer by using a coating machine, S23, curing the flowing photoresist at 100-130 DEG C by using a multi-layer furnace, S24, carrying out exposure treatment on the photoresist by using an exposure machine, and S24, carrying out exposure treatment on the photoresist by using an exposure machine. The method comprises the following steps: S25, carrying out high-temperature curing on a photoresist on the surface of a glass substrate, and generating blue pixel points on the surface of an ITO coating film, and in the technical scheme, by adding R / G / B (red, green and blue) photoresist in the original CF glass, color display can be realized, S25, carrying out high-temperature curing on the photoresist on the surface of the glass substrate, and S25, carrying out high-temperature curing on the photoresist on the surface of the glass substrate, and generating blue pixel points on the surface of the ITO coating film.

Description

Technical Field

[0001] The invention relates to the technical field of color filter processing, and in particular to a production process of a novel color filter for electronic paper. Background Art

[0002] Electronic paper is an electronic display similar to paper. It has the advantages of paper (such as visual perception is almost exactly the same as paper), and can continuously change and refresh the display content like our common LCD displays. It only consumes power when changing the screen, which is much more energy-saving than LCD or OLED. Electronic paper has excellent characteristics such as being as thin as paper, bendable, ultra-low power consumption, wide viewing angle, and visible under strong light. It is a revolutionary breakthrough in new display technology and is gradually becoming popular and practical. The disadvantage is that it can only display black and white. Color filter (CF) is the core component of color LCD display and plays a key role in LCD color display. LCD is mainly composed of three layers: TFT (Thin Film Transistor) glass, CF glass and liquid crystal material filling the space between two layers of glass. TFT glass is the lower substrate glass, equipped with electronic devices such as TFT, ESD, Capacitor (electrolytic capacitor) and various signal transmission circuits. CF glass is the upper substrate glass, equipped with BM (Black Matrix, black matrix, to prevent light leakage around pixels), CF (color filter) and PS (supporting liquid crystal box). In the color LCD panel, each pixel is composed of three liquid crystal cells, each of which has a red, green, or blue filter in front of it. In this way, the light passing through different cells can display different colors on the screen, but the mainstream product of electronic paper before is electrophoretic display electronic paper, which can only display black and white.

[0003] Therefore, we proposed a new production process for color filters for electronic paper to solve the above problems. Summary of the invention

[0004] The purpose of the present invention is to provide a production process for a new color filter for electronic paper, so as to solve the problem that the conventional color filter proposed in the above background technology is only used for LCD display and cannot be used for electronic paper display.

[0005] To achieve the above object, the present invention provides the following technical solution: a production process of a new color filter for electronic paper, the processing process comprising the following steps: A production process of a new color filter for electronic paper, characterized in that the process comprises the following steps: S1, ITO film coating, including the following sub-steps: S11, since the PET film is relatively soft, it is attached to the glass substrate to complete the subsequent actions; S12, magnetron sputtering a layer of transparent ITO film on the surface of glass or PET film by a coating machine, wherein the main component of the ITO film is indium tin oxide; S13, firstly, the glass or PET film is cleaned by a horizontal cleaning machine to remove surface dirt and ensure the bonding strength of the subsequent film layer; S2, blue pixel production, including the following sub-steps: S21, cleaning the ITO-coated glass substrate to remove surface dirt and avoid subsequent photoresist falling off; S22, using a coating machine to apply a layer of blue photoresist on the surface of the conductive layer; S23, using a multi-layer furnace to cure the flowing photoresist at 100-130° C.; S24, exposing the photoresist by an exposure machine, and then using a developer to process the exposed photoresist, the photoresist in the exposed area will undergo a cross-linking reaction and will not be removed by the developer, and will be retained, while the photoresist in the unexposed area will be removed by the developer; S25, curing the photoresist on the surface of the glass substrate at high temperature to completely remove the residual solvent of the photoresist and generate blue pixels on the surface of the ITO coating; S3, attaching a film to the red pixel, including the following sub-steps: S31, cleaning the glass substrate with blue pixels to remove dirt on the surface to prevent the photoresist from falling off, and then coating the entire surface with a layer of red photoresist; S32, using a multi-layer furnace to cure the flowing red photoresist at 100-130° C.; S33, exposing the photoresist by an exposure machine, and avoiding the exposure position of the blue pixel point position, and then using a developer to process the exposed photoresist, the photoresist in the exposed area will undergo a cross-linking reaction and will not be removed by the developer, and will be retained, and the photoresist in the unexposed area will be removed by the developer; S34, curing the red photoresist on the surface of the glass substrate at high temperature to completely remove the residual solvent of the red pixel photoresist and generate red pixel points on the surface of the ITO coating; S4, green pixel film attachment, including the following sub-steps: S41, cleaning the glass substrate on which the red pixels are formed to remove dirt from the surface and avoid subsequent photoresist shedding, and then coating the entire surface with a layer of green photoresist; S42, using a multi-layer furnace to cure the flowing green photoresist at 100-130° C.; S43, exposing the photoresist by an exposure machine, and avoiding the exposure position of blue pixels and red pixels, and then using a developer to process the exposed photoresist, so that the photoresist in the exposed area undergoes a cross-linking reaction and is not removed by the developer, and is retained, while the photoresist in the unexposed area is removed by the developer; S44, curing the green photoresist on the surface of the glass substrate at high temperature to completely remove the residual solvent of the photoresist at the green pixel points, and generating green pixel points on the surface of the ITO coating; S5. Surface protection, including the following sub-steps S51. For products with blue, red and green pixels, both the front and back sides are covered with a layer of PE film; S52, cutting the required pixel points into small particles according to the requirements.

[0006] Preferably, the glass substrate can withstand a temperature of ≤600°C, the PET film can withstand a temperature of ≤130°C, the ITO resistance on the glass substrate is controlled at 200-400Ω, the ITO film thickness is controlled at 60±10Å, the coating temperature is required to be 270°C~350°C, the argon (Ar) flow rate is 350sscm, the coating pressure is 0.4~0.6Pa, and the transmittance is 91%~92%; the ITO resistance on the PET film is controlled at 45±10Ω, the ITO film thickness is controlled at 1350±100Å, the coating temperature is required to be 60-100°C, the argon (Ar) flow rate is 350sscm, the coating pressure is 0.4-0.6Pa, and the transmittance is 87%~88%.

[0007] Preferably, the blue photoresist has a thickness of 1.8-2.3 μm, the exposure machine exposes the blue photoresist with an exposure energy of 100-200 mj / cm2, the exposure GAP (photomask-to-glass distance) is 200-300 μm, and when the blue pixels are cured at high temperature, the glass substrate is cured at 200-240°C for 30 minutes, and the PET film is cured at 100-130°C for 30 minutes.

[0008] Preferably, the thickness of the red photoresist is 1.3-1.8 μm, the exposure machine exposes the red photoresist with an exposure energy of 100-200 mj / cm2, the exposure GAP (photomask-to-glass distance) is 100-200 μm, and when the red pixels are cured at high temperature, the glass substrate is cured at 200-240°C for 30 minutes, and the PET film is cured at 100-130°C for 30 minutes.

[0009] Preferably, the green photoresist has a thickness of 1.8-2.3 μm, the exposure machine exposes the green photoresist with an exposure energy of 100-200 mj / cm2, the exposure GAP (photomask-to-glass distance) is 150-250 μm, and when the green pixels are cured at high temperature, the glass substrate is cured at 200-240°C for 30 minutes, and the PET film is cured at 100-130°C for 30 minutes.

[0010] Preferably, for products with blue, red and green pixels, the entire PE film on the front and back sides may not be stripped.

[0011] Preferably, the blue pixels, the red pixels and the green pixels are arranged in an inclined staggered manner on the surface of the glass substrate after the ITO coating.

[0012] Preferably, the glass or PET film can be used as a substrate for making pixels.

[0013] Compared with the prior art, the beneficial effect of the present invention is that in the technical solution, color display can be achieved by adding R / G / B (red, green, and blue) photoresist inside the original CF glass. DETAILED DESCRIPTION

[0014] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0015] The present invention provides a technical solution: a production process of a new color filter for electronic paper, the processing process includes the following steps: S1, ITO film coating, including the following sub-steps: S11, since the PET film is relatively soft, it is attached to the glass substrate to complete the subsequent actions; S12, magnetron sputtering a layer of transparent ITO film on the surface of glass or PET film by a coating machine, wherein the main component of the ITO film is indium tin oxide; S13, firstly, the glass or PET film is cleaned by a horizontal cleaning machine to remove surface dirt and ensure the bonding strength of the subsequent film layer; The glass substrate can withstand a temperature of ≤600°C, the PET film can withstand a temperature of ≤130°C, the ITO resistance on the glass substrate is controlled at 200-400Ω, the ITO film thickness is controlled at 60±10Å, the coating temperature is required to be 270°C~350°C, the argon (Ar) flow rate is 350sscm, the coating pressure is 0.4~0.6Pa, and the transmittance is 91%~92%. The ITO resistance on the PET film is controlled at 45±10Ω, the ITO film thickness is controlled at 1350±100Å, the coating temperature is required to be 60-100°C, the argon (Ar) flow rate is 350sscm, the coating pressure is 0.4-0.6Pa, and the transmittance is 87%~88%; S2, attaching a film to blue pixels, including the following sub-steps: S21, cleaning the ITO-coated glass substrate to remove surface dirt and avoid subsequent photoresist falling off; S22, using a coating machine to apply a layer of blue photoresist on the surface of the conductive layer; S23, using a multi-layer furnace to cure the flowing photoresist at 100-130° C.; S24, exposing the photoresist by an exposure machine, and then using a developer to process the exposed photoresist, the photoresist in the exposed area will undergo a cross-linking reaction and will not be removed by the developer, and will be retained, while the photoresist in the unexposed area will be removed by the developer; S25, curing the photoresist on the surface of the glass substrate at high temperature to completely remove the residual solvent of the photoresist and generate blue pixels on the surface of the ITO coating; The thickness of the blue photoresist is 1.8-2.3 μm, the exposure machine exposes the blue photoresist with an exposure energy of 100-200 mj / cm2, and the exposure GAP (gap between the mask and the glass) is 200-300 μm. When the blue pixel is cured at high temperature, the glass substrate is cured at 200-240° C. for 30 minutes, and the PET film is cured at 100-130° C. for 30 minutes; S3, attaching a film to the red pixel, including the following sub-steps: S31, cleaning the glass substrate with blue pixels to remove dirt on the surface to prevent the photoresist from falling off, and then coating the entire surface with a layer of red photoresist; S32, using a multi-layer furnace to cure the flowing red photoresist at 100-130° C.; S33, exposing the photoresist by an exposure machine, and avoiding the exposure position of the blue pixel point position, and then using a developer to process the exposed photoresist, the photoresist in the exposed area will undergo a cross-linking reaction and will not be removed by the developer, and will be retained, and the photoresist in the unexposed area will be removed by the developer; S34, curing the red photoresist on the surface of the glass substrate at high temperature to completely remove the residual solvent of the red pixel photoresist and generate red pixel points on the surface of the ITO coating; The thickness of the red photoresist is 1.3-1.8 μm, the exposure machine exposes the red photoresist with an exposure energy of 100-200 mj / cm2, the exposure GAP (gap between the mask and the glass) is 100-200 μm, and when the red pixel is cured at high temperature, the glass substrate is cured at 200-240° C. for 30 minutes, and the PET film is cured at 100-130° C. for 30 minutes; S4, green pixel film attachment, including the following sub-steps: S41, cleaning the glass substrate on which the red pixels are formed to remove dirt from the surface and avoid subsequent photoresist shedding, and then coating the entire surface with a layer of green photoresist; S42, using a multi-layer furnace to cure the flowing green photoresist at 100-130° C.; S43, exposing the photoresist by an exposure machine, and avoiding the exposure position of blue pixels and red pixels, and then using a developer to process the exposed photoresist, so that the photoresist in the exposed area undergoes a cross-linking reaction and is not removed by the developer, and is retained, while the photoresist in the unexposed area is removed by the developer; S44, curing the green photoresist on the surface of the glass substrate at high temperature to completely remove the residual solvent of the photoresist at the green pixel points, and generating green pixel points on the surface of the ITO coating; The green photoresist has a thickness of 1.8-2.3 μm, and the exposure machine exposes the green photoresist with an exposure energy of 100-200 mj / cm2, and the exposure GAP (gap between the photomask and the glass) is 150-250 μm. When the green pixel is cured at high temperature, the glass substrate is cured at 200-240° C. for 30 minutes, and the PET film is cured at 100-130° C. for 30 minutes; S5. Surface protection, including the following sub-steps S51. For products with blue, red and green pixels, both the front and back sides are covered with a layer of PE film; S52, cutting the required pixel points into small particles according to the requirements.

[0016] The blue pixels, red pixels and green pixels are arranged in an inclined staggered manner on the surface of the glass substrate after ITO coating. For products with blue, red and green pixels, the entire PE film on the front and back sides can be processed without debonding.

[0017] It should be noted that the glass or PET film can be used as a substrate for making pixels.

[0018] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0019] Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments, or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A production process for a new color filter for electronic paper, characterized in that: The process comprises the following steps: S1, ITO film coating, including the following sub-steps: S11, since the PET film is relatively soft, it is attached to the glass substrate to complete the subsequent actions; S12, magnetron sputtering a layer of transparent ITO film on the surface of glass or PET film by a coating machine, wherein the main component of the ITO film is indium tin oxide; S13, firstly, the glass or PET film is cleaned by a horizontal cleaning machine to remove surface dirt and ensure the bonding strength of the subsequent film layer; S2, blue pixel production, including the following sub-steps: S21, cleaning the ITO-coated glass substrate to remove surface dirt and avoid subsequent photoresist falling off; S22, using a coating machine to apply a layer of blue photoresist on the surface of the conductive layer; S23, using a multi-layer furnace to cure the flowing photoresist at 100-130° C.; S24, exposing the photoresist by an exposure machine, and then using a developer to process the exposed photoresist, the photoresist in the exposed area will undergo a cross-linking reaction and will not be removed by the developer, and will be retained, while the photoresist in the unexposed area will be removed by the developer; S25, curing the photoresist on the surface of the glass substrate at high temperature to completely remove the residual solvent of the photoresist and generate blue pixels on the surface of the ITO coating; S3, red pixel production, including the following sub-steps: S31, cleaning the glass substrate with blue pixels to remove dirt on the surface to prevent the photoresist from falling off, and then coating the entire surface with a layer of red photoresist; S32, using a multi-layer furnace to cure the flowing red photoresist at 100-130° C.; S33, exposing the photoresist by an exposure machine, and avoiding the exposure position of the blue pixel point position, and then using a developer to process the exposed photoresist, the photoresist in the exposed area will undergo a cross-linking reaction and will not be removed by the developer, and will be retained, and the photoresist in the unexposed area will be removed by the developer; S34, curing the red photoresist on the surface of the glass substrate at high temperature to completely remove the residual solvent of the red pixel photoresist and generate red pixel points on the surface of the ITO coating; S4, green pixel production, including the following sub-steps: S41, cleaning the glass substrate on which the red pixels are formed to remove dirt from the surface and avoid subsequent photoresist shedding, and then coating the entire surface with a layer of green photoresist; S42, using a multi-layer furnace to cure the flowing green photoresist at 100-130° C.; S43, exposing the photoresist by an exposure machine, and avoiding the exposure position of blue pixels and red pixels, and then using a developer to process the exposed photoresist, so that the photoresist in the exposed area undergoes a cross-linking reaction and is not removed by the developer, and is retained, while the photoresist in the unexposed area is removed by the developer; S44, curing the green photoresist on the surface of the glass substrate at high temperature to completely remove the residual solvent of the photoresist at the green pixel points, and generating green pixel points on the surface of the ITO coating; S5. Surface protection, including the following sub-steps S51. For products with blue, red and green pixels, both the front and back sides are covered with a layer of PE film; S52, cutting the required pixel points into small particles according to the requirements.

2. The production process of a novel color filter for electronic paper according to claim 1, characterized in that: The glass substrate can withstand a temperature of ≤600°C, the PET film can withstand a temperature of ≤130°C, the ITO resistance on the glass substrate is controlled at 200-400Ω, the ITO film thickness is controlled at 60±10Å, the coating temperature is required to be 270°C~350°C, the argon (Ar) flow rate is 350sscm, the coating pressure is 0.4~0.6Pa, and the transmittance is 91%~92%. The ITO resistance on the PET film is controlled at 45±10Ω, the ITO film thickness is controlled at 1350±100Å, the coating temperature is required to be 60-100°C, the argon (Ar) flow rate is 350sscm, the coating pressure is 0.4-0.6Pa, and the transmittance is 87%~88%.

3. The production process of a novel color filter for electronic paper according to claim 1, characterized in that: The thickness of the blue photoresist is 1.8-2.3 μm. The exposure machine exposes the blue photoresist with an exposure energy of 100-200 mj / cm2. The exposure GAP (the distance between the mask and the glass) is 200-300 μm. When the blue pixels are cured at high temperature, the glass substrate is cured at 200-240°C for 30 minutes, and the PET film is cured at 100-130°C for 30 minutes.

4. The production process of a novel color filter for electronic paper according to claim 1, characterized in that: The thickness of the red photoresist is 1.3-1.8 μm. The exposure machine exposes the red photoresist with an exposure energy of 100-200 mj / cm2. The exposure GAP (the distance between the mask and the glass) is 100-200 μm. When the red pixels are cured at high temperature, the glass substrate is cured at 200-240°C for 30 minutes, and the PET film is cured at 100-130°C for 30 minutes.

5. The production process of a novel color filter for electronic paper according to claim 1, characterized in that: The green photoresist has a thickness of 1.8-2.3 μm. The exposure machine exposes the green photoresist with an exposure energy of 100-200 mj / cm2. The exposure GAP (photomask-to-glass distance) is 150-250 μm. When the green pixels are cured at high temperature, the glass substrate is cured at 200-240°C for 30 minutes, and the PET film is cured at 100-130°C for 30 minutes.

6. The production process of a novel color filter for electronic paper according to claim 1, characterized in that: For products with blue, red and green pixels, the entire PE film on the front and back can be left unpeeled.

7. The production process of a novel color filter for electronic paper according to claim 1, characterized in that: The blue pixel points, the red pixel points and the green pixel points are arranged in an inclined staggered manner on the surface of the glass substrate after the ITO coating is completed.

8. The production process of a novel color filter for electronic paper according to claim 1, characterized in that: The glass or PET film can be used as a substrate for making pixels.