Heat dissipation control method and device of electric control mainboard, electric control mainboard and storage medium

Abstract

The invention relates to the technical field of household appliances, in particular to a heat dissipation control method and device of an electric control mainboard, the electric control mainboard and a storage medium. According to the invention, when the electric control main board has the power output requirement, the current temperature difference value is calculated according to the current working temperature and the theoretical working temperature of the electric control main board so as to measure the power requirement of the electric control main board; and the current temperature difference value and the historical temperature difference value are comprehensively considered through a preset power control model to adjust the operation power of the electric control mainboard, so that the output power of the electric control mainboard is reduced on the premise that the performance of the electric control mainboard is not affected, heat generated by the mainboard due to overlarge output power is reduced, and the service life of the mainboard is prolonged. The technical problems that in the prior art, a circuit board is poor in heat dissipation capacity during working, and potential safety hazards exist are solved, and meanwhile the working performance of the electric control mainboard is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of household appliances, and in particular to a heat dissipation control method and device for an electronic control mainboard, an electronic control mainboard and a storage medium. Background Art

[0002] In household appliances, in pursuit of intelligence and cost control, the main control boards that control the operation of the equipment are getting smaller and smaller. However, the reduction in size will bring serious heat dissipation problems. If the heat dissipation is not timely, it will seriously affect the service life and operating status of the main control board, causing the electronic components to age and even cause fires, seriously affecting the use.

[0003] The above contents are only used to assist in understanding the technical solution of the present invention and do not constitute an admission that the above contents are prior art. Summary of the invention

[0004] The main purpose of the present invention is to provide a heat dissipation control method and device for an electronic control mainboard, an electronic control mainboard and a storage medium, aiming to solve the technical problems of poor heat dissipation capacity and potential safety hazards caused by the existing circuit boards during operation.

[0005] To achieve the above object, the present invention provides a heat dissipation control method for an electronic control mainboard, the method comprising the following steps:

[0006] When the electric control mainboard has a power output demand, obtaining the current operating temperature and theoretical operating temperature of the electric control mainboard;

[0007] determining a current temperature difference between the theoretical operating temperature and the current operating temperature;

[0008] Calculating the target power through a preset power control model according to the current temperature difference and the historical temperature difference;

[0009] The output power of the electronic control mainboard is adjusted according to the target power to control the heat dissipation of the electronic control mainboard.

[0010] Optionally, before determining the current temperature difference between the theoretical operating temperature and the current operating temperature, the method further includes:

[0011] Obtaining the ambient temperature of the area where the electronic control mainboard is located;

[0012] Determine a target temperature rise difference according to the theoretical operating temperature and the ambient temperature;

[0013] Determining the initial output power of the electronic control mainboard according to the target temperature rise difference and a preset mapping relationship;

[0014] The electronic control mainboard is controlled to operate at the initial output power.

[0015] Optionally, before determining the initial output power of the electronic control mainboard according to the current temperature rise difference and a preset mapping relationship, the method further includes:

[0016] Acquire at least two sets of data samples of output power and temperature rise difference of the electronic control mainboard, wherein the temperature rise difference is determined according to the ambient temperature and the operating temperature of the area where the electronic control mainboard is located;

[0017] A preset mapping relationship is established according to the corresponding relationship between the output power and the temperature rise difference.

[0018] Optionally, obtaining the theoretical operating temperature of the electronic control mainboard includes:

[0019] Obtaining specification parameters of the electronic control mainboard and corresponding junction temperature thresholds;

[0020] De-rating the junction temperature threshold to obtain a rated operating temperature;

[0021] The theoretical operating temperature of the electronic control mainboard is determined according to the rated operating temperature and the safety factor.

[0022] Optionally, the historical temperature difference includes: the sum of the previous temperature difference and the historical temperature difference;

[0023] The calculating the target power by using a preset power control model according to the current temperature difference and the historical temperature difference includes:

[0024] Determining constant coefficients of a preset power control model;

[0025] Determine a temperature difference change value between the current temperature difference value and the previous temperature difference value;

[0026] The target power is calculated according to the constant coefficients, the current temperature difference, the temperature difference change value and the total of the historical temperature difference values.

[0027] Optionally, the constant coefficients include: proportional constant coefficients, integral constant coefficients and differential constant coefficients;

[0028] The calculating the target power according to the constant coefficients, the current temperature difference, the temperature difference change value and the sum of the historical temperature difference values ​​includes:

[0029] determining a first product between the proportional constant coefficient and the current temperature difference,

[0030] Determine a second product between the integral constant coefficient and the sum of the historical temperature difference values, and determine a third product between the differential constant coefficient and the temperature difference change value;

[0031] The target power is determined according to the sum of the first product, the second product and the third product.

[0032] In addition, to achieve the above-mentioned purpose, the present invention also proposes a heat dissipation control device for an electronic control mainboard, the heat dissipation control device for the electronic control mainboard comprising:

[0033] An acquisition module, used to acquire the current operating temperature and theoretical operating temperature of the electronic control mainboard when there is a power output demand of the electronic control mainboard;

[0034] A determination module, configured to determine a current temperature difference between the theoretical operating temperature and the current operating temperature;

[0035] A calculation module, used for calculating the target power through a preset power control model according to the current temperature difference and the historical temperature difference;

[0036] The adjustment module is used to adjust the output power of the electronic control mainboard according to the target power to control the heat dissipation of the electronic control mainboard.

[0037] In addition, to achieve the above-mentioned purpose, the present invention also proposes a heat dissipation control device for an electronic control mainboard, the heat dissipation control device for the electronic control mainboard comprising: a memory, a processor, and a heat dissipation control program for the electronic control mainboard stored in the memory and executable on the processor, the heat dissipation control program for the electronic control mainboard being configured to implement the steps of the heat dissipation control method for the electronic control mainboard as described above.

[0038] Optionally, the electronic control mainboard includes: a housing, an electronic control board, a heat dissipation structure and a glue filling layer, and the heat dissipation structure includes a radiator and a heat dissipation layer;

[0039] Wherein, the shell is open on one side;

[0040] The heat dissipation layer is arranged on the inner bottom of the housing through contact constraint;

[0041] The radiator is arranged on the electric control board, and the electric control board is arranged on the upper layer of the heat dissipation layer;

[0042] The thickness of the glue potting layer is greater than the height of the electric control board from the inner bottom of the shell.

[0043] In addition, to achieve the above-mentioned purpose, the present invention also proposes a storage medium, on which a heat dissipation control program of an electronic control mainboard is stored. When the heat dissipation control program of the electronic control mainboard is executed by a processor, the steps of the heat dissipation control method of the electronic control mainboard as described above are implemented.

[0044] The present invention measures the power demand of the electronic control mainboard by calculating the current temperature difference according to the current operating temperature and the theoretical operating temperature of the electronic control mainboard when there is a power output demand of the electronic control mainboard, and then adjusts the operating power of the electronic control mainboard through a preset power control model based on the current temperature difference and the historical temperature difference, so as to reduce the output power of the electronic control mainboard without affecting the performance of the electronic control mainboard, reduce the heat generated by the mainboard due to excessive output power, avoid the technical problems of poor heat dissipation capacity and potential safety hazards caused by the circuit board in the prior art when working, and at the same time ensure the working performance of the electronic control mainboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 It is a structural schematic diagram of a heat dissipation control device of an electronic control mainboard in a hardware operating environment involved in an embodiment of the present invention;

[0046] Figure 2 It is a flow chart of a first embodiment of a heat dissipation control method for an electronic control mainboard of the present invention;

[0047] Figure 3 A schematic diagram of the structure of an electronic control mainboard according to an embodiment of a heat dissipation control method of an electronic control mainboard of the present invention;

[0048] Figure 4 A schematic cross-sectional view of an electronic control mainboard according to an embodiment of a heat dissipation control method of an electronic control mainboard of the present invention;

[0049] Figure 5 It is a flow chart of a second embodiment of the heat dissipation control method of the electronic control mainboard of the present invention;

[0050] Figure 6 It is a flow chart of a third embodiment of the heat dissipation control method of an electronic control mainboard of the present invention;

[0051] Figure 7 It is a structural block diagram of the first embodiment of the heat dissipation control device of the electronic control mainboard of the present invention.

[0052] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0053] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0054] Reference Figure 1 , Figure 1 The figure is a schematic diagram of the structure of the heat dissipation control device of the electronic control mainboard in the hardware operating environment involved in the embodiment of the present invention.

[0055] like Figure 1As shown, the heat dissipation control device of the electronic control motherboard may include: a processor 1001, such as a central processing unit (CPU), a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. Among them, the communication bus 1002 is used to realize the connection and communication between these components. The user interface 1003 may include a display screen (Display), an input unit such as a keyboard (Keyboard), and the optional user interface 1003 may also include a standard wired interface and a wireless interface. The network interface 1004 may optionally include a standard wired interface and a wireless interface (such as a wireless fidelity (Wireless-Fidelity, Wi-Fi) interface). The memory 1005 may be a high-speed random access memory (Random Access Memory, RAM), or a stable non-volatile memory (Non-Volatile Memory, NVM), such as a disk storage. The memory 1005 may also be a storage device independent of the aforementioned processor 1001.

[0056] Those skilled in the art will understand that Figure 1 The structure shown in does not constitute a limitation on the heat dissipation control device of the electronic control mainboard, and may include more or fewer components than shown in the figure, or a combination of certain components, or a different arrangement of components.

[0057] like Figure 1 As shown, the memory 1005 as a storage medium may include an operating system, a network communication module, a user interface module, and a heat dissipation control program of the electronic control mainboard.

[0058] exist Figure 1 In the heat dissipation control device of the electronic control mainboard shown, the network interface 1004 is mainly used for data communication with the network server; the user interface 1003 is mainly used for data interaction with the user; the processor 1001 and the memory 1005 in the heat dissipation control device of the electronic control mainboard of the present invention can be set in the heat dissipation control device of the electronic control mainboard, and the heat dissipation control device of the electronic control mainboard calls the heat dissipation control program of the electronic control mainboard stored in the memory 1005 through the processor 1001, and executes the heat dissipation control method of the electronic control mainboard provided in the embodiment of the present invention.

[0059] The embodiment of the present invention provides a heat dissipation control method for an electronic control mainboard, referring to Figure 2 , Figure 2 The figure is a flow chart of a first embodiment of a heat dissipation control method for an electronic control mainboard according to the present invention.

[0060] In this embodiment, the heat dissipation control method of the electronic control mainboard includes the following steps:

[0061] Step S10: when the electronic control mainboard has a power output demand, the current operating temperature and the theoretical operating temperature of the electronic control mainboard are obtained.

[0062] It should be noted that the executor of the method of this embodiment can be a device with data collection, network communication and data processing functions, such as: an electronic control motherboard or controller of a household appliance, or other devices with the same or similar functions. This embodiment does not impose specific restrictions on this. In this embodiment and the following embodiments, the electronic control motherboard of a household appliance will be used as an example for explanation.

[0063] Among them, the household appliance in this embodiment can be a household appliance such as a water purifier or a water dispenser.

[0064] It should be understood that in electronic circuit design, in addition to considering heat dissipation, it is also necessary to test whether the product's electromagnetic interference (EMI) anti-interference ability meets the requirements. Electromagnetic interference is electronic noise that interferes with cable signals and reduces signal integrity. It is usually generated by electromagnetic radiation sources such as motors and machines. Electromagnetic interference will reduce the quality of transmission signals, interfere with or even damage circuits or equipment, and make the equipment unable to meet the technical indicators specified in the electromagnetic compatibility standards. During use, it will seriously affect the user experience.

[0065] It is worth noting that, in this embodiment, reference Figure 3 , Figure 3 The schematic diagram of the structure of the electronic control mainboard is shown in FIG. The electronic control mainboard specifically includes: a housing 1, an electronic control board 2, a heat dissipation structure 3, and a glue filling layer 4. The heat dissipation structure includes a heat sink 31 and a heat dissipation layer 32. The heat sink can be composed of multiple layers of heat dissipation aluminum sheets, wherein the heat dissipation layer is a single layer of aluminum sheet. Figure 4 , Figure 4 It is a schematic diagram of the cross section of the electronic control mainboard. The shell is open on one side and is used to place the heat dissipation aluminum sheet and the electronic control board. The heat dissipation layer is set on the inner bottom of the shell through contact constraint. The contact constraint refers to the setting of the inner bottom surface of the shell and the heat dissipation aluminum sheet surface to improve the heat dissipation. A radiator is provided on the electronic control board, and the electronic control board is set on the upper layer of the heat dissipation aluminum sheet.

[0066] In the specific implementation, the heat dissipation aluminum sheet can dissipate heat and cool down the heating elements at the bottom of the board and the entire electronic control mainboard; and because the aluminum sheet is connected to the ground, it can shield the external electromagnetic interference (EMI) to the electronic control from the electrical principle. The aluminum sheet plays a fundamental anti-interference protection role for the position it covers, ensuring the reliable operation of the system. In order to achieve the above effects, under the premise of limited space at the bottom of the board, the shape of the aluminum sheet should cover the inner side of the bottom surface of the shell corresponding to the PCB board as much as possible, with a thickness of 0.5mm, to meet the electromagnetic shielding of the entire bottom of the PCB board, and at the same time meet the design requirements of dispersing the heat as much as possible to cool it down.

[0067] It can be understood that the radiator in this embodiment mainly plays the role of cooling and cooling important heat-generating chips on the electric control board, such as power conversion chips, power component chips, and IPM integrated power modules. The setting of the radiator is estimated and determined by theoretical calculation based on the expected heat generation. The calculated heat dissipation is substituted into the radiator formula, and then the design and material selection of the radiator are guided by the calculation results of the formula. Finally, experiments are conducted to verify whether the heat dissipation effect meets the requirements. The radiator formula is:

[0068] Q=K*F*△T

[0069] Among them, Q represents the heat dissipation, K represents the heat transfer coefficient, F represents the heat dissipation area, and △T refers to the standard heat transfer temperature.

[0070] It should be noted that the thickness of the potting layer needs to be greater than the height of the electronic control board from the inner bottom of the shell. When performing the potting process, the heat dissipation aluminum sheet can be placed inside the shell first, and then a certain amount of potting glue can be injected, and finally the electronic control board can be pressed into the shell to allow the potting glue to overflow under pressure and gradually cover the entire electronic control board, and then wait for the potting glue to solidify to complete the potting packaging.

[0071] In the specific implementation, the glue potting can reduce the pollution level and improve the protection level of the circuit board under high temperature and high humidity conditions; it can also play a heat conductive role, so that the temperature of heating elements such as power components and IPM integrated power modules can be better transferred to the heat dissipation aluminum sheet at the bottom of the board to improve heat dissipation. In this embodiment, the glue potting is selected as MJ3000AB two-component room temperature (heating) potting glue. The thermal conductivity of the potting glue is 0.6 to 0.8w / mk, and the process technology requires that the thickness of the potting glue reaches 5mm on the board surface.

[0072] It should be noted that the power output demand of the electronic control main board refers to the situation that the electronic control main board needs to drive a larger load to operate. At this time, the operation of each load can be driven by the intelligent power module (IPM) of the electronic control main board. The intelligent power module is a highly efficient power switching device with the advantages of high current, low saturation voltage and high withstand voltage of a large-power transistor (GTR), as well as the advantages of high input impedance, high switching frequency and low driving power of a field-effect transistor.

[0073] It can be understood that the current operating temperature of the electronic control mainboard can be measured by temperature sensors installed at various locations on the electronic control mainboard or temperature sensors or temperature sensing packages installed inside the object. When there are multiple temperature sensors or temperature sensing packages at the same time, the average of the collected operating temperatures can be used as the current operating temperature of the electronic control mainboard. The theoretical operating temperature refers to the theoretical maximum normal operating temperature of the electronic control mainboard.

[0074] Furthermore, the step of obtaining the theoretical operating temperature of the electronic control mainboard specifically includes obtaining the specification parameters of the electronic control mainboard and the corresponding junction temperature threshold, then derating the junction temperature threshold to obtain the rated operating temperature, and finally determining the theoretical operating temperature of the electronic control mainboard based on the rated operating temperature and the safety factor.

[0075] It should be understood that the specification parameters of the electronic control mainboard may be various parameters recorded in the specification sheet of the intelligent power module in the electronic control mainboard. Since there is at least one type of semiconductor in the intelligent power module, and the semiconductor will be damaged when the temperature exceeds a certain temperature, and then the semiconductor will fail. In order to avoid this situation, this embodiment performs derating processing based on the junction temperature threshold to avoid hardware damage. The specific derating processing refers to reducing the junction temperature threshold by a certain ratio to obtain the rated operating temperature. The calculation formula of the rated operating temperature is:

[0076] Tmax=K*Tj

[0077] Among them, Tmax is the rated operating temperature, K is the enterprise or industry derating standard coefficient, such as 0.8; Tj is the upper limit threshold of the junction temperature of the intelligent power module.

[0078] In a specific implementation, the rated operating temperature after derating only ensures that the components on the electronic control mainboard will not be damaged due to temperature, and does not improve their working performance. This embodiment reserves a certain safety margin based on the rated operating temperature, and uses the calculated operating temperature as the rated operating temperature, that is, the product of the rated operating temperature and the safety factor is used as the rated operating temperature. In this embodiment, the value of the safety factor can be 0.9, which can be adaptively modified according to different complete machines. This embodiment does not impose specific restrictions on this.

[0079] Step S20: Determine a current temperature difference between the theoretical operating temperature and the current operating temperature.

[0080] It is worth noting that in the present embodiment, the current temperature difference represents the operating status of the electronic control mainboard to a certain extent. However, in order to improve the accuracy of power control, the current temperature difference and the historical temperature difference can be combined for comprehensive regulation. For example, at the beginning of the temperature rise, the temperature changes faster, and the current temperature difference is larger. At the end of the temperature rise, the temperature changes slower and the current temperature difference is smaller. However, if a smaller load is applied at the beginning of the temperature rise and a larger load is applied at the end of the temperature rise, it may cause a change in temperature change. At this time, the current temperature difference does not change much. Therefore, it is necessary to comprehensively consider adjusting the power of the electronic control mainboard.

[0081] Step S30: Calculating the target power through a preset power control model according to the current temperature difference and the historical temperature difference.

[0082] It should be noted that the historical temperature difference includes the temperature difference of the last adjustment cycle and the temperature difference in all adjustment cycles since the power demand existed on the electronic control main board. In this embodiment and the following embodiments, the adjustment cycle can be set to 100ms, that is, the power adjustment is performed every 100ms based on the current operating temperature and the theoretical operating temperature.

[0083] In this embodiment, the preset power control model may be a power control model based on a PID algorithm, or other models that can implement the same or similar power control, and this embodiment does not impose any specific limitation on this.

[0084] Step S40: adjusting the output power of the electronic control mainboard according to the target power to control the heat dissipation of the electronic control mainboard.

[0085] It is understandable that by using the calculated target power as the output power of the electronic control mainboard, rather than correcting or compensating for the output power of the electronic control mainboard, additional calculation steps can be avoided. At the same time, power can be reduced by directly adjusting the operating state of the electronic control mainboard, reducing heat generation and avoiding damage to the hardware structure.

[0086] This embodiment measures the power demand of the electronic control mainboard by calculating the current temperature difference based on the current operating temperature and the theoretical operating temperature of the electronic control mainboard when there is a power output demand of the electronic control mainboard, and then adjusts the operating power of the electronic control mainboard through a preset power control model based on the current temperature difference and the historical temperature difference, so as to reduce the output power of the electronic control mainboard without affecting the performance of the electronic control mainboard, reduce the heat generated by the mainboard due to excessive output power, avoid the technical problems of poor heat dissipation capacity of the circuit board in the prior art during operation and the potential safety hazard, and at the same time ensure the working performance of the electronic control mainboard.

[0087] refer to Figure 5 , Figure 5 The figure is a flow chart of a second embodiment of a heat dissipation control method for an electronic control mainboard according to the present invention.

[0088] Based on the first embodiment above, in this embodiment, before step S20, the following steps are further included:

[0089] Step S110: obtaining the ambient temperature of the area where the electronic control mainboard is located.

[0090] It should be noted that the ambient temperature of the area where the electronic control mainboard is located can be measured by a temperature sensor or a temperature sensing package outside the housing, or can be acquired by other electronic devices that can achieve temperature measurement, such as: a temperature acquisition device of a household appliance corresponding to the electronic control mainboard, etc. This embodiment does not impose specific restrictions on this.

[0091] Step S120: determining a target temperature rise difference according to the theoretical operating temperature and the ambient temperature.

[0092] In the specific implementation, the target temperature rise difference between the theoretical operating temperature and the ambient temperature represents the temperature rise range of the electronic control mainboard. When the electronic control mainboard outputs heat to the outside, it needs to ensure that the heat is less than the temperature rise difference, otherwise the hardware equipment will be damaged.

[0093] Furthermore, in order to reduce the possibility of hardware damage, in the present embodiment, the target temperature rise difference can be proportionally reduced, leaving a certain safety margin, for example: the limit temperature rise difference is determined based on the target temperature rise difference and the second safety factor, and accordingly, the initial output power of the electronic control mainboard is determined based on the limit temperature rise difference and the preset mapping relationship.

[0094] The second safety factor may be set to 0.95, and this embodiment does not impose any specific limitation on this.

[0095] Step S130: determining the initial output power of the electronic control mainboard according to the target temperature rise difference and a preset mapping relationship.

[0096] It should be understood that the preset mapping relationship refers to the mapping relationship between the target temperature rise difference under ideal conditions and the output power of the electronic control mainboard.

[0097] Furthermore, in order to obtain a preset mapping relationship, the following can be done: obtain at least two sets of data samples of output power and temperature rise difference of the electronic control mainboard, the temperature rise difference being determined based on the ambient temperature and operating temperature of the area where the electronic control mainboard is located; and construct a preset mapping relationship based on the correspondence between the output power and the temperature rise difference.

[0098] In this embodiment, a functional relationship between the output power and the temperature rise difference may be established through two or more groups of data samples of the output power and the temperature rise difference, thereby establishing a mapping relationship between the two.

[0099] Step S140: controlling the electronic control mainboard to operate at the initial output power.

[0100] In the specific implementation, after the electronic control mainboard runs for a certain period of time at the initial output power, the current temperature difference between the theoretical operating temperature and the current operating temperature is determined, and the output of the electronic control mainboard is controlled based on the current temperature difference. Under the premise of ensuring the operating performance of the electronic control mainboard, the output power is reduced, the heat generation is reduced, and the performance is maximized.

[0101] This embodiment provides an initial output power to the electronic control mainboard, thereby reducing and avoiding the impact of excessive temperature difference during the startup phase, which affects power control and causes unreasonable control of components, thereby causing hardware damage.

[0102] refer to Figure 6 , Figure 6 The figure is a flow chart of a second embodiment of a heat dissipation control method for an electronic control mainboard according to the present invention.

[0103] Based on the above second embodiment, in this embodiment, step S30 includes:

[0104] Step S301: Determine constant coefficients of a preset power control model.

[0105] It should be noted that the constant coefficients include: proportional constant coefficients, integral constant coefficients and differential constant coefficients; among them, the proportional constant coefficients are used to control the proportional control of each participating power control parameter; the integral constant coefficients can be used to eliminate steady-state errors, but may increase overshoot; finally, the differential constant coefficients are used to speed up the response speed of large inertia systems and reduce the overshoot trend caused by integral control.

[0106] Step S302: Determine a temperature difference change value between the current temperature difference value and the previous temperature difference value.

[0107] It can be understood that the previous temperature difference refers to the difference between the theoretical operating temperature in the previous power adjustment cycle and the operating temperature of the previous power adjustment cycle. For example: the current operating temperature is 30 degrees Celsius, the operating temperature of the previous adjustment cycle is 10 degrees Celsius, and the theoretical operating temperature is 60 degrees Celsius. Then the current temperature difference is 30 degrees Celsius, and the temperature difference of the previous power adjustment cycle is 50 degrees Celsius. The temperature difference change value is -20 degrees Celsius.

[0108] Step S303: Calculate the target power according to the constant coefficients, the current temperature difference, the temperature difference change value and the sum of the historical temperature difference values.

[0109] It should be noted that the total historical temperature difference refers to the sum of the temperature differences in all power adjustment cycles since there was a demand for power output. For example: the last power adjustment cycle is the first cycle, the current temperature difference is 30 degrees Celsius, and the temperature difference in the last power adjustment cycle is 50 degrees Celsius, then the total historical temperature difference is 80 degrees Celsius.

[0110] Further, the calculating the target power according to the constant coefficients, the current temperature difference, the temperature difference change value and the sum of the historical temperature difference values ​​includes:

[0111] determining a first product between the proportional constant coefficient and the current temperature difference,

[0112] Determine a second product between the integral constant coefficient and the sum of the historical temperature differences, and

[0113] determining a third product between the differential constant coefficient and the temperature difference change value;

[0114] The target power is determined according to the sum of the first product, the second product and the third product.

[0115] In a specific implementation, the formula for determining the target power according to the sum of the first product, the second product and the third product is:

[0116]

[0117] Where u is the target power, E' is the temperature difference between the theoretical operating temperature and the operating temperature in the previous adjustment cycle, It refers to the sum of historical temperature differences, Kp is the proportional constant coefficient, Ki is the integral constant coefficient, Kd is the differential constant coefficient, Kp can be 2, Ki can be 0.15, and Kd is 20.

[0118] This embodiment achieves accurate calculation of the target power of the electronic control mainboard by combining the proportional constant coefficient with the current temperature difference, the integral constant coefficient with the sum of historical temperature differences, and the differential constant coefficient with the temperature difference change value, so as to reduce the heat generation of the electronic control mainboard and improve the heat dissipation effect.

[0119] In addition, an embodiment of the present invention further proposes a storage medium, on which a heat dissipation control program of an electronic control mainboard is stored. When the heat dissipation control program of the electronic control mainboard is executed by a processor, the steps of the heat dissipation control method of the electronic control mainboard as described above are implemented.

[0120] Since the storage medium adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0121] Reference Figure 7 , Figure 7 It is a structural block diagram of the first embodiment of the heat dissipation control device of the electronic control mainboard of the present invention.

[0122] like Figure 7 As shown, the heat dissipation control device of the electronic control mainboard proposed in the embodiment of the present invention includes:

[0123] The acquisition module 10 is used to acquire the current operating temperature and theoretical operating temperature of the electronic control mainboard when the electronic control mainboard has a power output demand.

[0124] It should be noted that the executor of the method of this embodiment can be a device with data collection, network communication and data processing functions, such as: an electronic control motherboard or controller of a household appliance, or other devices with the same or similar functions. This embodiment does not impose specific restrictions on this. In this embodiment and the following embodiments, the electronic control motherboard of a household appliance will be used as an example for explanation.

[0125] Among them, the household appliance in this embodiment can be a household appliance such as a water purifier or a water dispenser.

[0126] It should be understood that in electronic circuit design, in addition to considering heat dissipation, it is also necessary to test whether the product's electromagnetic interference (EMI) anti-interference ability meets the requirements. Electromagnetic interference is electronic noise that interferes with cable signals and reduces signal integrity. It is usually generated by electromagnetic radiation sources such as motors and machines. Electromagnetic interference will reduce the quality of transmission signals, interfere with or even damage circuits or equipment, and make the equipment unable to meet the technical indicators specified in the electromagnetic compatibility standards. During use, it will seriously affect the user experience.

[0127] It is worth noting that, in this embodiment, reference Figure 3 , Figure 3 The schematic diagram of the structure of the electronic control mainboard is shown in FIG. The electronic control mainboard specifically includes: a housing 1, an electronic control board 2, a heat dissipation structure 3, and a glue filling layer 4. The heat dissipation structure includes a heat sink 31 and a heat dissipation layer 32. The heat sink can be composed of multiple layers of heat dissipation aluminum sheets, wherein the heat dissipation layer is a single layer of aluminum sheet. Figure 4 , Figure 4 It is a schematic diagram of the cross section of the electronic control mainboard. The shell is open on one side and is used to place the heat dissipation aluminum sheet and the electronic control board. The heat dissipation layer is set on the inner bottom of the shell through contact constraint. The contact constraint refers to the setting of the inner bottom surface of the shell and the heat dissipation aluminum sheet surface to improve the heat dissipation. A radiator is provided on the electronic control board, and the electronic control board is set on the upper layer of the heat dissipation aluminum sheet.

[0128] In the specific implementation, the heat dissipation aluminum sheet can dissipate heat and cool down the heating elements at the bottom of the board and the entire electronic control mainboard; and because the aluminum sheet is connected to the ground, it can shield the external electromagnetic interference (EMI) to the electronic control from the electrical principle. The aluminum sheet plays a fundamental anti-interference protection role for the position it covers, ensuring the reliable operation of the system. In order to achieve the above effects, under the premise of limited space at the bottom of the board, the shape of the aluminum sheet should cover the inner side of the bottom surface of the shell corresponding to the PCB board as much as possible, with a thickness of 0.5mm, to meet the electromagnetic shielding of the entire bottom of the PCB board, and at the same time meet the design requirements of dispersing the heat as much as possible to cool it down.

[0129] It can be understood that the radiator in this embodiment mainly plays the role of cooling and cooling important heat-generating chips on the electric control board, such as power conversion chips, power component chips, and IPM integrated power modules. The setting of the radiator is estimated and determined by theoretical calculation based on the expected heat generation. The calculated heat dissipation is substituted into the radiator formula, and then the design and material selection of the radiator are guided by the calculation results of the formula. Finally, experiments are conducted to verify whether the heat dissipation effect meets the requirements. The radiator formula is:

[0130] Q=K*F*△T

[0131] Among them, Q represents the heat dissipation, K represents the heat transfer coefficient, F represents the heat dissipation area, and △T refers to the standard heat transfer temperature.

[0132] It should be noted that the thickness of the potting layer needs to be greater than the height of the electronic control board from the inner bottom of the shell. When performing the potting process, the heat dissipation aluminum sheet can be placed inside the shell first, and then a certain amount of potting glue can be injected, and finally the electronic control board can be pressed into the shell to allow the potting glue to overflow under pressure and gradually cover the entire electronic control board, and then wait for the potting glue to solidify to complete the potting packaging.

[0133] In the specific implementation, the glue potting can reduce the pollution level and improve the protection level of the circuit board under high temperature and high humidity conditions; it can also play a heat conductive role, so that the temperature of heating elements such as power components and IPM integrated power modules can be better transferred to the heat dissipation aluminum sheet at the bottom of the board to improve heat dissipation. In this embodiment, the glue potting is selected as MJ3000AB two-component room temperature (heating) potting glue. The thermal conductivity of the potting glue is 0.6 to 0.8w / mk, and the process technology requires that the thickness of the potting glue reaches 5mm on the board surface.

[0134] It should be noted that the power output demand of the electronic control main board refers to the situation that the electronic control main board needs to drive a larger load to operate. At this time, the operation of each load can be driven by the intelligent power module (IPM) of the electronic control main board. The intelligent power module is a highly efficient power switching device with the advantages of high current, low saturation voltage and high withstand voltage of a large-power transistor (GTR), as well as the advantages of high input impedance, high switching frequency and low driving power of a field-effect transistor.

[0135] It can be understood that the current operating temperature of the electronic control mainboard can be measured by temperature sensors installed at various locations on the electronic control mainboard or temperature sensors or temperature sensing packages installed inside the object. When there are multiple temperature sensors or temperature sensing packages at the same time, the average of the collected operating temperatures can be used as the current operating temperature of the electronic control mainboard. The theoretical operating temperature refers to the theoretical maximum normal operating temperature of the electronic control mainboard.

[0136] Further, obtaining the theoretical operating temperature of the electronic control mainboard includes:

[0137] Obtaining specification parameters of the electronic control mainboard and corresponding junction temperature thresholds;

[0138] De-rating the junction temperature threshold to obtain a rated operating temperature;

[0139] The theoretical operating temperature of the electronic control mainboard is determined according to the rated operating temperature and the safety factor.

[0140] It should be understood that the specification parameters of the electronic control mainboard may be various parameters recorded in the specification sheet of the intelligent power module in the electronic control mainboard. Since there is at least one type of semiconductor in the intelligent power module, and the semiconductor will be damaged when the temperature exceeds a certain temperature, and then the semiconductor will fail. In order to avoid this situation, this embodiment performs derating processing based on the junction temperature threshold to avoid hardware damage. The specific derating processing refers to reducing the junction temperature threshold by a certain ratio to obtain the rated operating temperature. The calculation formula of the rated operating temperature is:

[0141] Tmax=K*Tj

[0142] Among them, Tmax is the rated operating temperature, K is the enterprise or industry derating standard coefficient, such as 0.8; Tj is the upper limit threshold of the junction temperature of the intelligent power module.

[0143] In a specific implementation, the rated operating temperature after derating only ensures that the components on the electronic control mainboard will not be damaged due to temperature, and does not improve their working performance. This embodiment reserves a certain safety margin based on the rated operating temperature, and uses the calculated operating temperature as the rated operating temperature, that is, the product of the rated operating temperature and the safety factor is used as the rated operating temperature. In this embodiment, the value of the safety factor can be 0.9, which can be adaptively modified according to different complete machines. This embodiment does not impose specific restrictions on this.

[0144] The determination module 20 is used to determine a current temperature difference between the theoretical operating temperature and the current operating temperature.

[0145] It is worth noting that in the present embodiment, the current temperature difference represents the operating status of the electronic control mainboard to a certain extent. However, in order to improve the accuracy of power control, the current temperature difference and the historical temperature difference can be combined for comprehensive regulation. For example, at the beginning of the temperature rise, the temperature changes faster, and the current temperature difference is larger. At the end of the temperature rise, the temperature changes slower and the current temperature difference is smaller. However, if a smaller load is applied at the beginning of the temperature rise and a larger load is applied at the end of the temperature rise, it may cause a change in temperature change. At this time, the current temperature difference does not change much. Therefore, it is necessary to comprehensively consider adjusting the power of the electronic control mainboard.

[0146] The calculation module 30 is used to calculate the target power according to the current temperature difference and the historical temperature difference through a preset power control model.

[0147] It should be noted that the historical temperature difference includes the temperature difference of the last adjustment cycle and the temperature difference in all adjustment cycles since the power demand existed on the electronic control main board. In this embodiment and the following embodiments, the adjustment cycle can be set to 100ms, that is, the power adjustment is performed every 100ms based on the current operating temperature and the theoretical operating temperature.

[0148] In this embodiment, the preset power control model may be a power control model based on a PID algorithm, or other models that can implement the same or similar power control, and this embodiment does not impose any specific limitation on this.

[0149] The adjustment module 40 is used to adjust the output power of the electronic control mainboard according to the target power to control the heat dissipation of the electronic control mainboard.

[0150] It is understandable that by using the calculated target power as the output power of the electronic control mainboard, rather than correcting or compensating for the output power of the electronic control mainboard, additional calculation steps can be avoided. At the same time, power can be reduced by directly adjusting the operating state of the electronic control mainboard, reducing heat generation and avoiding damage to the hardware structure.

[0151] In one embodiment, the determination module 20 is also used to obtain the ambient temperature of the area where the electronic control mainboard is located; determine the target temperature rise difference based on the theoretical operating temperature and the ambient temperature; determine the initial output power of the electronic control mainboard based on the target temperature rise difference and a preset mapping relationship; and control the electronic control mainboard to operate at the initial output power.

[0152] In one embodiment, the determination module 20 is also used to obtain at least two groups of data samples of output power and temperature rise difference of the electronic control mainboard, and the temperature rise difference is determined according to the ambient temperature and working temperature of the area where the electronic control mainboard is located; and a preset mapping relationship is constructed according to the corresponding relationship between the output power and the temperature rise difference.

[0153] In one embodiment, the acquisition module 10 is further used to obtain the specification parameters of the electronic control mainboard and the corresponding junction temperature threshold; derate the junction temperature threshold to obtain the rated operating temperature; and determine the theoretical operating temperature of the electronic control mainboard based on the rated operating temperature and the safety factor.

[0154] In one embodiment, the calculation module 30 is also used to determine the constant coefficients of the preset power control model; determine the temperature difference change value between the current temperature difference and the previous temperature difference; and calculate the target power based on the constant coefficients, the current temperature difference, the temperature difference change value and the sum of the historical temperature differences.

[0155] In one embodiment, the calculation module 30 is also used to determine a first product between the proportional constant coefficient and the current temperature difference, determine a second product between the integral constant coefficient and the sum of the historical temperature differences, and determine a third product between the differential constant coefficient and the temperature difference change value; and determine the target power based on the sum of the first product, the second product and the third product.

[0156] This embodiment measures the power demand of the electronic control mainboard by calculating the current temperature difference based on the current operating temperature and the theoretical operating temperature of the electronic control mainboard when there is a power output demand of the electronic control mainboard, and then adjusts the operating power of the electronic control mainboard through a preset power control model based on the current temperature difference and the historical temperature difference, so as to reduce the output power of the electronic control mainboard without affecting the performance of the electronic control mainboard, reduce the heat generated by the mainboard due to excessive output power, avoid the technical problems of poor heat dissipation capacity of the circuit board in the prior art during operation and the potential safety hazard, and at the same time ensure the working performance of the electronic control mainboard.

[0157] It should be understood that the above is only an example and does not constitute any limitation on the technical solution of the present invention. In specific applications, technicians in this field can make settings as needed, and the present invention does not limit this.

[0158] It should be noted that the workflow described above is merely illustrative and does not limit the scope of protection of the present invention. In practical applications, technicians in this field can select part or all of them according to actual needs to achieve the purpose of the present embodiment, and no limitation is made here.

[0159] In addition, for technical details not fully described in this embodiment, reference can be made to the heat dissipation control method for the electronic control mainboard provided in any embodiment of the present invention, and will not be repeated here.

[0160] In addition, it should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or system including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or system. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or system including the element.

[0161] The serial numbers of the above embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0162] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium (such as a read-only memory (ROM) / RAM, a magnetic disk, or an optical disk), and includes a number of instructions for a terminal device (which can be a mobile phone, a computer, a server, or a network device, etc.) to execute the methods described in each embodiment of the present invention.

[0163] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A heat dissipation control method for an electronic control mainboard, characterized in that: The heat dissipation control method of the electronic control mainboard includes: When the electric control mainboard has a power output demand, obtaining the current operating temperature and theoretical operating temperature of the electric control mainboard; determining a current temperature difference between the theoretical operating temperature and the current operating temperature; Calculating the target power by using a preset power control model according to the current temperature difference and the historical temperature difference; and The output power of the electronic control mainboard is adjusted according to the target power to control the heat dissipation of the electronic control mainboard.

2. The heat dissipation control method of the electronic control mainboard according to claim 1, characterized in that: Before determining the current temperature difference between the theoretical operating temperature and the current operating temperature, the method further includes: Obtaining the ambient temperature of the area where the electronic control mainboard is located; Determine a target temperature rise difference according to the theoretical operating temperature and the ambient temperature; Determining the initial output power of the electronic control mainboard according to the target temperature rise difference and a preset mapping relationship; and The electronic control mainboard is controlled to operate at the initial output power.

3. The heat dissipation control method of the electronic control mainboard according to claim 2, characterized in that: Before determining the initial output power of the electronic control mainboard according to the current temperature rise difference and the preset mapping relationship, the method further includes: Acquire at least two sets of data samples of output power and temperature rise difference of the electronic control mainboard, wherein the temperature rise difference is determined according to the ambient temperature and the operating temperature of the area where the electronic control mainboard is located; and A preset mapping relationship is established according to the corresponding relationship between the output power and the temperature rise difference.

4. The heat dissipation control method of the electronic control mainboard according to any one of claims 1 to 3, characterized in that: Obtaining the theoretical operating temperature of the electronic control mainboard includes: Obtaining specification parameters of the electronic control mainboard and corresponding junction temperature thresholds; Derating the junction temperature threshold to obtain a rated operating temperature; and The theoretical operating temperature of the electronic control mainboard is determined according to the rated operating temperature and the safety factor.

5. The heat dissipation control method of the electronic control mainboard according to any one of claims 1 to 3, characterized in that: The historical temperature difference includes: the sum of the previous temperature difference and the historical temperature difference; The calculating the target power by using a preset power control model according to the current temperature difference and the historical temperature difference includes: Determining constant coefficients of a preset power control model; Determining a change in temperature difference between the current temperature difference and the previous temperature difference; and The target power is calculated according to the constant coefficients, the current temperature difference, the temperature difference change value and the total of the historical temperature difference values.

6. The heat dissipation control method of the electronic control mainboard according to claim 5, characterized in that: The constant coefficients include: proportional constant coefficients, integral constant coefficients and differential constant coefficients; The calculating the target power according to the constant coefficients, the current temperature difference, the temperature difference change value and the sum of the historical temperature difference values ​​includes: determining a first product between the proportional constant coefficient and the current temperature difference, Determining a second product between the integral constant coefficient and the sum of the historical temperature difference values, and determining a third product between the differential constant coefficient and the temperature difference change value; and The target power is determined according to the sum of the first product, the second product and the third product.

7. A heat dissipation control device for an electronic control mainboard, characterized in that: The heat dissipation control device of the electronic control mainboard includes: An acquisition module, used to acquire the current operating temperature and theoretical operating temperature of the electronic control mainboard when there is a power output demand of the electronic control mainboard; A determination module, configured to determine a current temperature difference between the theoretical operating temperature and the current operating temperature; a calculation module, configured to calculate a target power according to the current temperature difference and the historical temperature difference through a preset power control model; and The adjustment module is used to adjust the output power of the electronic control mainboard according to the target power to control the heat dissipation of the electronic control mainboard.

8. An electronic control mainboard, characterized in that: The electronic control mainboard includes: a memory, a processor, and a heat dissipation control program of the electronic control mainboard stored in the memory and executable on the processor. The heat dissipation control program of the electronic control mainboard is configured to implement the heat dissipation control method of the electronic control mainboard as described in any one of claims 1 to 6.

9. The electronic control mainboard according to claim 8, characterized in that: The electronic control mainboard comprises: a housing, an electronic control board, a heat dissipation structure and a glue filling layer, wherein the heat dissipation structure comprises a radiator and a heat dissipation layer; Wherein, the shell is open on one side; The heat dissipation layer is arranged on the inner bottom of the housing through contact constraint; The radiator is arranged on the electric control board, and the electric control board is arranged on the upper layer of the heat dissipation layer; The thickness of the glue potting layer is greater than the height of the electric control board from the inner bottom of the shell.

10. A storage medium, characterized in that: The storage medium stores a heat dissipation control program of the electronic control mainboard, and when the heat dissipation control program of the electronic control mainboard is executed by the processor, the heat dissipation control method of the electronic control mainboard according to any one of claims 1 to 6 is implemented.

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