Method, device, medium and equipment for controlling standby moisturizing of double-sided polishing equipment

Abstract

The present invention provides a method, device, storage medium and electronic device for controlling the standby moisturizing of a double-sided polishing device, which is applied to the technical field of double-sided polishing devices. The method includes: when the double-sided polishing device is in a standby state, determining the standby time and the number of available wafers; when the standby time does not exceed the first set time, sending a first cleaning instruction to the double-sided polishing device, and sending a rotation instruction to the double-sided polishing device when it meets the requirements for loading; when the standby time exceeds the first set time, sending a second cleaning instruction to the double-sided polishing device when it meets the requirements for loading. Through the method, device, storage medium and electronic device for controlling the standby moisturizing of a double-sided polishing device provided by the embodiments of the present invention, a standardized cleaning process of the grinding disc can be achieved while ensuring the moisturizing of the grinding disc and avoiding subsequent scratches on the wafer; excessive moisture can be thrown out to avoid the problem of moisture accumulation.

Description

Technical Field

[0001] The present invention relates to the technical field of double-sided polishing equipment, and in particular to a method, a device, a storage medium and an electronic device for controlling standby moisturizing of double-sided polishing equipment. Background Art

[0002] DSP (Double Side Polishing, also known as double-sided grinding and polishing equipment) is a machine that polishes the upper and lower surfaces of wafers. DSP EFEM (Equipment Front End Module) is a wafer transfer system that is mainly used to realize the automatic supply and unloading of semiconductor equipment wafers, reduce production costs, and improve production efficiency.

[0003] After the DSP is cleaned under high pressure, the upper grinding disc is opened and the DSP is in standby mode, waiting for the DSP EFEM to load the wafer. If the DSP EFEM cannot load the wafer to the DSP in time due to untimely material supply, the DSP will be in standby mode for a long time, causing the grinding materials on the upper and lower grinding discs of the DSP to dry out, and the dry grinding materials will scratch the wafer. When the DSP is in standby mode, it cannot be sprayed for a long time. If it is sprayed for too long, there will be too much water on the lower grinding disc, affecting the visual positioning of the loading and the robot pressing detection, as well as affecting the loading defect inspection. At present, it is generally processed by manual participation, which is inefficient. Summary of the invention

[0004] In order to solve the above problems, the purpose of the embodiments of the present invention is to provide a method, device, storage medium and electronic device for controlling standby moisturizing of double-sided polishing equipment.

[0005] In a first aspect, an embodiment of the present invention provides a method for controlling standby moisturizing of a double-sided polishing device, which is applied to a control system of a front-end module of the device, and the method comprises:

[0006] When the double-side polishing equipment is in standby mode, determining the standby time and the number of wafers available;

[0007] When the standby time does not exceed the first set time, a first cleaning process is performed; when the standby time exceeds the first set time, a second cleaning process is performed;

[0008] Wherein, the first cleaning process comprises:

[0009] Sending a first cleaning instruction to the double-sided polishing device; the first cleaning instruction is used to instruct the double-sided polishing device to clean the grinding disc in a first cleaning manner;

[0010] When the number of wafers meets the first loading condition and the standby time exceeds the second set time, a rotation instruction is sent to the double-sided polishing device; the rotation instruction is used to instruct the double-sided polishing device to control the grinding disc to rotate a preset number of times; the second set time is less than the first set time;

[0011] The second cleaning process comprises:

[0012] When the number of wafers meets the second loading condition, a second cleaning instruction is sent to the double-sided polishing device; the second cleaning instruction is used to instruct the double-sided polishing device to clean the grinding disc in a second cleaning manner, and the grinding disc rotates.

[0013] Optionally, the number of wafers includes the available number in the wafer loading system and the cached number in the wafer cache system;

[0014] In the case where the cache quantity exceeds the first preset quantity, the wafer quantity meets the first loading condition;

[0015] When the sum of the available quantity and the cache quantity exceeds the second preset quantity, the wafer quantity meets the second loading condition; and the first preset quantity is less than or equal to the second preset quantity.

[0016] Optionally, the sum of the first preset number and the preset number of turns is equal to the full load number of the wafer cache system.

[0017] Optionally, the first cleaning process further includes:

[0018] Determine whether the control authority of the double-sided polishing device is obtained, and determine whether the robot of the front-end module of the device leaves the double-sided polishing device;

[0019] After the control authority of the double-sided polishing device is obtained and the robot leaves the double-sided polishing device, a step of sending a rotation instruction to the double-sided polishing device is executed;

[0020] The second cleaning process further comprises:

[0021] Determine whether the control authority of the double-sided polishing device is obtained, and determine whether the robot of the front-end module of the device leaves the double-sided polishing device;

[0022] When the control authority of the double-sided polishing device is obtained and the robot leaves the double-sided polishing device, the step of sending a second cleaning instruction to the double-sided polishing device is performed.

[0023] Optionally, the first cleaning process further includes:

[0024] When the number of wafers meets the first loading condition and the standby time does not exceed the second set time, entering the loading process;

[0025] After the double-sided polishing device controls the grinding disc to rotate a preset number of times, the loading process is entered;

[0026] The second cleaning process further comprises:

[0027] After the double-sided polishing device cleans the grinding disc in the second cleaning mode, the loading process is entered.

[0028] Optionally, the method further comprises:

[0029] Setting a first timer and a second timer; both the first timer and the second timer start timing after the double-sided polishing device enters a standby state;

[0030] Comparing the time in the first timer with the first set time to determine whether the standby time exceeds the first set time;

[0031] Comparing the time in the second timer with the second set time to determine whether the standby time exceeds the second set time;

[0032] When entering the loading process, the first timer and the second timer are reset.

[0033] Optionally, the grinding disc comprises an upper grinding disc and a lower grinding disc;

[0034] The method further comprises:

[0035] Determine whether a rising signal of the upper grinding disc is received, determine whether the upper grinding disc is located at a swiveled-out position, and determine whether there is presence information indicating that a wafer is placed on the lower grinding disc;

[0036] When the rising signal is received, the upper grinding disc is located at the rotated-out position, and the presence information does not exist, it is determined that the double-sided polishing device is in the standby state.

[0037] In a second aspect, an embodiment of the present invention further provides a device for controlling the standby moisturizing of a double-sided polishing device, which is applied to a control system of a front-end module of the device, comprising:

[0038] A pre-processing module, used for determining a standby time and a number of available wafers when the double-sided polishing equipment is in a standby state;

[0039] A control module, configured to execute a first cleaning process when the standby time does not exceed a first set time; and execute a second cleaning process when the standby time exceeds the first set time;

[0040] Wherein, the first cleaning process comprises:

[0041] Sending a first cleaning instruction to the double-sided polishing device; the first cleaning instruction is used to instruct the double-sided polishing device to clean the grinding disc in a first cleaning manner;

[0042] When the number of wafers meets the first loading condition and the standby time exceeds the second set time, a rotation instruction is sent to the double-sided polishing device; the rotation instruction is used to instruct the double-sided polishing device to control the grinding disc to rotate a preset number of times; the second set time is less than the first set time;

[0043] The second cleaning process comprises:

[0044] When the number of wafers meets the second loading condition, a second cleaning instruction is sent to the double-sided polishing device; the second cleaning instruction is used to instruct the double-sided polishing device to clean the grinding disc in a second cleaning manner, and the grinding disc rotates.

[0045] In a third aspect, an embodiment of the present invention further provides a computer storage medium storing computer executable instructions, wherein the computer executable instructions are used in any one of the above-mentioned methods for controlling the standby moisturizing of the double-sided polishing equipment.

[0046] In a fourth aspect, an embodiment of the present invention further provides an electronic device, including:

[0047] at least one processor; and,

[0048] a memory communicatively connected to the at least one processor; wherein,

[0049] The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute any one of the above-mentioned methods for controlling standby moisturizing of double-sided polishing equipment.

[0050] In the solution provided in the first aspect of the embodiment of the present invention, after the DSP enters the standby state due to insufficient material supply or other reasons, the control system of the DSP EFEM is used to control the DSP to clean the grinding disc in the first cleaning mode. In the case of a long standby time, the DSP can also be controlled to clean the grinding disc in the second cleaning mode, so as to ensure that the grinding disc is moisturized and avoid subsequent scratches on the wafer, and achieve a standardized cleaning process for the grinding disc. In addition, before entering the feeding process, the grinding disc is controlled to rotate a preset number of times or continuously to throw out excess water and avoid the problem of water accumulation, so as not to affect subsequent visual positioning, press detection, and feeding defect detection processes.

[0051] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0053] Figure 1 A flow chart showing a method for controlling standby moisturizing of a double-sided polishing device provided by an embodiment of the present invention is shown;

[0054] Figure 2 A flow chart showing another method for controlling standby moisturizing of a double-sided polishing device provided by an embodiment of the present invention is shown;

[0055] Figure 3 A schematic diagram showing the structure of a device for controlling the standby moisturizing of a double-sided polishing device provided by an embodiment of the present invention is shown;

[0056] Figure 4 A schematic structural diagram of an electronic device for executing a method for controlling standby moisturizing of a double-sided polishing device provided by an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0057] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0058] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0059] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0060] The embodiment of the present invention provides a method for controlling the standby moisturizing of a double-sided polishing device, which is applied to the control system of the equipment front end module (EFEM), and the control system controls the double-sided polishing device (DSP). Figure 1 As shown, the method includes:

[0061] Step 101: When the double-sided polishing equipment is in a standby state, determine the standby time and the number of available wafers.

[0062] In the embodiment of the present invention, the DSP (double-sided polishing equipment) and the DSP EFEM (hereinafter referred to as EFEM, i.e., the equipment front-end module) are both in the startup state. If the DSP is in the standby state, it is necessary to wait for the wafer to be placed on the DSP EFEM. In order to prevent the DSP from being in the standby state for a long time and causing the grinding material (grinding plate) of the grinding disc to dry out, the present embodiment uses the EFEM to automatically control the DSP for moisturizing.

[0063] Among them, EFEM determines the standby time of DSP entering the standby state and determines the number of wafers currently available. The standby time and the number of available wafers are used to determine whether humidification is needed later.

[0064] In some optional embodiments, the grinding disc of the DSP includes an upper grinding disc and a lower grinding disc; as the name implies, the upper grinding disc is located at the upper part, and the lower grinding disc is located at the lower part, and the combination of the two realizes double-sided grinding. In addition, the process of determining whether the DSP is in the standby state may include the following steps A1 to A2.

[0065] Step A1, determining whether a rising signal of the upper grinding disk is received, determining whether the upper grinding disk is located at a swiveled-out position, and determining whether there is presence information indicating that a wafer is placed on the lower grinding disk.

[0066] Step A2, when the rising signal is received, the upper grinding disc is at the rotated-out position and there is no presence information, it is determined that the double-sided polishing device is in the standby state.

[0067] In this embodiment, the judgment conditions for the DSP to be in the standby state include: Condition 1, the signal of the grinding disk on the DSP in the rising position is ON and given to the DSP EFEM control system, and the DSP and the DSP EFEM control system are connected; Condition 2, the grinding disk on the DSP is in the rotational position and given to the DSP EFEM control system; Condition 3: There is no wafer presence information on the DSP.

[0068] Among them, the presence information is recorded in the memory of the DSP EFEM control system by the DSP EFEM control system. Every time the DSP EFEM puts a wafer on the DSP lower grinding plate, it will record the presence information of a wafer. Every time the DSP EFEM takes a wafer from the DSP lower grinding plate, it will delete the presence information of a wafer.

[0069] The DSP EFEM includes a robot 1 and a robot 2. The DSP EFEM places wafers on and takes wafers from the DSP, which is performed by the robot 1 in the DSP EFEM control system; the robot 2 can perform press testing on the wafers.

[0070] Step 102: When the waiting time does not exceed the first set time, perform a first cleaning process.

[0071] Step 103: When the waiting time exceeds the first set time, a second cleaning process is performed.

[0072] In the embodiment of the present invention, two cleaning methods are set for the DSP, namely, the first cleaning method and the second cleaning method, and the two cleaning methods are different. Among them, in order to ensure the moisturizing effect on the DSP, the second cleaning method requires more water than the first cleaning method, such as a longer cleaning time and a higher cleaning pressure. For example, the first cleaning method is spraying, and the second cleaning method is high-pressure cleaning. Alternatively, cleaning methods such as high-pressure spraying can also be used, which is not limited in this embodiment.

[0073] The preset setting is whether the second cleaning process needs to be executed, that is, the first setting time. By judging whether the standby time exceeds the first setting time, the appropriate cleaning method is selected. Specifically, if the standby time does not exceed the first setting time, it means that the DSP enters the standby state for a short time. At this time, the first cleaning method is selected, that is, the first cleaning process is executed. On the contrary, if the standby time exceeds the first setting time, it means that the DSP enters the standby state for a long time. At this time, the second cleaning method is selected and the second cleaning process is executed.

[0074] Specifically, the first cleaning process includes the following steps 1021 to 1022 .

[0075] Step 1021: Send a first cleaning instruction to the double-sided polishing device; the first cleaning instruction is used to instruct the double-sided polishing device to clean the grinding disc in a first cleaning manner.

[0076] Step 1022: When the number of wafers meets the first loading condition and the standby time exceeds the second set time, a rotation instruction is sent to the double-sided polishing equipment; the rotation instruction is used to instruct the double-sided polishing equipment to control the grinding disc to rotate a preset number of times; the second set time is less than the first set time.

[0077] In this embodiment, if the standby time does not exceed the first set time, the DSP EFPM control system sends an instruction to the DSP for cleaning the DSP grinding disc in the first cleaning mode, i.e., the first cleaning command cleaning instruction. After receiving the first cleaning instruction, the DSP can clean the grinding disc in the first cleaning mode; for example, the lower grinding disc (or the upper and lower grinding discs) is cleaned in a spraying mode.

[0078] After the DSP enters the standby state, the standby time does not exceed the first set time, and the first cleaning instruction can be sent to the DSP immediately.

[0079] Furthermore, as shown in step 101, after the DSP enters the standby state, it can also determine the number of available wafers in real time, and then determine whether the number of wafers meets the preset first loading condition. For example, the first loading condition is set with a certain preset number. If the number of available wafers exceeds the preset number, it can be considered that the loading is ready, that is, the first loading condition is met at this time, and the subsequent loading process is allowed, that is, the wafer is placed on the grinding disc of the DPS for polishing.

[0080] In addition, a set time is provided for determining the amount of residual water on the grinding disc, that is, the second set time, and the second set time is less than the first set time. When the number of wafers meets the first loading condition, if the standby time at this time exceeds the second set time, it means that because the DPS is cleaned in the first cleaning method for a long time, the DSP grinding disc (lower grinding disc) may have a lot of water, which will affect the visual positioning of the loading and the robot press detection, as well as the loading defect inspection. In this case, a rotation instruction is sent to the DSP; the rotation instruction is used to instruct the DSP to control the grinding disc to rotate a preset number of times; that is, after receiving the rotation instruction, the DSP controls the grinding disc (for example, the lower grinding disc) to rotate a preset number of times, and the preset number of times can be, for example, 1 circle, 2 circles, etc.

[0081] By rotating the DSP a certain number of times, the excess moisture on the grinding disc under the DSP can be thrown out, and the moisture on the grinding disc under the DSP can be evened out, so that there will be no moisture accumulation (moisture accumulation will cause a sudden increase in the amount of water, and will also affect visual positioning, press detection and feeding defect detection). While achieving the moisturizing of the DSP grinding disc, moisture accumulation can be avoided.

[0082] Among them, since the first loading condition is met at this time, after controlling the DSP grinding disc to rotate a preset number of circles, the loading process can be entered.

[0083] If the number of wafers meets the first loading condition and the standby time does not exceed the second set time, it can be considered that there is less moisture on the grinding disc and it has little impact on subsequent operations, so the loading process can be directly entered.

[0084] In addition, if the waiting time reaches the first set time after the DSP is controlled to clean the grinding disc in the first cleaning mode, which meets the condition that the waiting time exceeds the first set time, the second cleaning process is performed.

[0085] The second cleaning process includes the following steps 1031 .

[0086] Step 1031: When the number of wafers meets the second loading condition, a second cleaning instruction is sent to the double-sided polishing device; the second cleaning instruction is used to instruct the double-sided polishing device to clean the grinding disc in a second cleaning manner, and the grinding disc rotates.

[0087] In this embodiment, after the standby time reaches the second set time, the first cleaning process may no longer be performed, and the second cleaning process may be performed instead.

[0088] Among them, since the first cleaning process is a pre-step of the second cleaning process, the first cleaning instruction is sent to the DSP when the first cleaning process is executed. After entering the step of executing the second cleaning process, if the stop instruction of stopping the first cleaning method is not sent to the DSP, the DSP can continue to clean the grinding disc in the first cleaning method. For example, when the standby time exceeds the first set time, but the number of wafers does not meet the second loading condition, the DSP still cleans the grinding disc in a spraying manner to achieve moisturizing.

[0089] Similar to the above step 1022, it is also determined whether the number of wafers meets the corresponding loading condition, that is, the second loading condition. The second loading condition can be the same as the first loading condition or different, depending on actual needs. Similarly, the second loading condition can also be set with a certain preset number. If the number of available wafers exceeds the preset number, it can be considered that the loading is ready, that is, the second loading condition is met at this time, and the loading process is allowed to proceed later.

[0090] Among them, if the number of wafers meets the second loading condition after the standby time exceeds the first set time, then the loading process can be prepared. Specifically, the DSP EFEM control system sends a second cleaning instruction to the DSP, and the second cleaning instruction is used to instruct the DSP to clean the grinding disc in the second cleaning method and control the rotation of the grinding disc. That is, after receiving the second cleaning instruction, the DSP not only cleans the grinding disc in the second cleaning method, but also controls the rotation of the grinding disc, for example, controls the grinding disc to continue to rotate until the second cleaning method ends. Compared with the above-mentioned control of the grinding disc to rotate a preset number of times, by controlling the grinding disc to rotate continuously, while being able to clean the grinding disc in the second cleaning method, it is also possible to avoid moisture accumulation.

[0091] The method for controlling the standby moisturizing of the double-sided polishing equipment provided by the embodiment of the present invention uses the control system of the DSP EFEM to control the DSP to clean the grinding disc in the first cleaning mode after the DSP enters the standby state due to insufficient material supply or other reasons. In the case of a long standby time, the DSP can also be controlled to clean the grinding disc in the second cleaning mode, so as to achieve a standardized cleaning process for the grinding disc while ensuring the moisturizing of the grinding disc and avoiding subsequent scratches on the wafer. In addition, before entering the loading, the grinding disc is controlled to rotate a preset number of times or rotate continuously, so that excessive moisture can be thrown out to avoid the problem of moisture accumulation, thereby not affecting the subsequent visual positioning, press detection and loading defect detection processes.

[0092] In some optional embodiments, the number of wafers includes a removable number in the wafer loading system and a cached number in the wafer cache system.

[0093] The DSP EFEM device includes a wafer loading system (LoadPort) and a wafer buffer system (LoadBuffer), and the wafers in both are available wafers. The number of wafers in the wafer loading system is called the available number, and the number of wafers in the wafer buffer system is called the buffer number.

[0094] When the cache quantity exceeds the first preset quantity, it is determined that the wafer quantity meets the first loading condition. When the sum of the available quantity and the cache quantity exceeds the second preset quantity, it is determined that the wafer quantity meets the second loading condition; the first preset quantity is less than or equal to the second preset quantity, and generally the first preset quantity is set to be less than the second preset quantity.

[0095] For example, the second preset number is set to 15, and the first preset number is set to 14.

[0096] Optionally, the sum of the first preset number and the preset number of turns is equal to the full load number of the wafer cache system.

[0097] In the present embodiment, under normal circumstances, the time it takes for the grinding disc to rotate one circle is relatively close to the time it takes for a wafer to be placed into the wafer cache system. Therefore, if the current cache quantity of wafers exceeds the first preset quantity, the grinding disc will be controlled to rotate the preset number of circles before entering the loading process. Therefore, within the time it takes for the grinding disc to rotate the preset number of circles, a preset number of wafers can basically be placed into the wafer cache system (LoadBuffer), so that the wafer cache system (LoadBuffer) can be fully loaded after the grinding disc rotates the preset number of circles, thereby being able to directly enter the loading process without waiting.

[0098] For example, the full load quantity of the wafer cache system is 15. If the grinding disk is controlled to rotate one circle, that is, the preset number of circles is 1, then the first preset number can be set to 14.

[0099] Optionally, the first cleaning process further includes step A1 to step A2.

[0100] Step A1: Determine whether the control authority of the double-sided polishing device is obtained, and determine whether the robot of the front-end module of the device leaves the double-sided polishing device.

[0101] Step A2: After obtaining the control authority of the double-sided polishing device and the robot leaves the double-sided polishing device, execute the step of sending a rotation instruction to the double-sided polishing device.

[0102] Similarly, the second cleaning process also includes step B1 and step B2.

[0103] Step B1: Determine whether the control authority of the double-sided polishing device is obtained, and determine whether the robot of the front-end module of the device leaves the double-sided polishing device.

[0104] Step B2: After obtaining the control authority of the double-side polishing device and the robot leaves the double-side polishing device, execute the step of sending a second cleaning instruction to the double-side polishing device.

[0105] In this embodiment, when the DSP EFEM control system needs to clean the DSP by spraying, high-pressure cleaning, etc., it needs to obtain control authority over the DSP; and in order to prevent the robot (generally including multiple robots and robots) from affecting the cleaning process, it is also necessary to ensure that the robot currently leaves the DSP.

[0106] Specifically, the DSP EFEM control system determines whether the DSP EFEM obtains the control authority of the DSP. After the DSP EFEM control system obtains the control authority of the DSP, the DSP EFEM control system outputs a DSP control authority acquisition signal. The control authority signal output point of the DSP EFEM control system is connected to the DSP control authority switching relay coil. After the DSP control authority switching relay coil is energized, the normally open point of the relay is closed and the normally closed point is opened, and the DSP control authority is switched to the DSP EFEM control system.

[0107] In addition, the DSP EFEM control system determines whether the robot in the DSP EFEM has left the DSP. After the robot leaves the DSP area, the robot will determine the position of the robot based on the current coordinate position of the position sensor. When the robot leaves the coordinate position range of the DSP area, it will send a safety signal indicating that the robot has left the DSP to the DSP EFEM control system, so that the control system knows that the robot has left the DSP.

[0108] Optionally, the first cleaning process also includes step A3 to step A4.

[0109] Step A3: When the number of wafers meets the first loading condition and the standby time does not exceed the second set time, the loading process is entered.

[0110] Step A4: After the double-sided polishing equipment controls the grinding disc to rotate a preset number of times, the loading process begins.

[0111] The second cleaning process further includes step B3.

[0112] Step B3: After the double-sided polishing equipment cleans the grinding disc in the second cleaning method, the loading process is entered.

[0113] In this embodiment, if the loading conditions are met at present, such as the first loading condition or the second loading condition, it can be said that loading can be performed at this time, so the loading process can be entered. Among them, if the number of wafers meets the first loading condition and the standby time exceeds the second set time, it is necessary to wait for the grinding disc to rotate a preset number of times, and enter the loading process after the DSP controls the grinding disc to rotate a preset number of times; similarly, if the number of wafers meets the second loading condition, it is necessary to enter the loading process after the grinding disc is cleaned by the double-sided polishing equipment in the second cleaning method.

[0114] In addition, if the number of wafers meets the first loading condition, but the standby time does not exceed the second set time, since there is no need to control the grinding disc to rotate a preset number of times, the loading process can be directly entered.

[0115] In this embodiment, when the number of wafers meets the second loading condition, since the DSP is being cleaned in the first cleaning method at this time, the DSP EFEM control system can first stop the first cleaning method, and then use the second cleaning method to clean the DSP. In addition, if the cleaning method (the first cleaning method or the second cleaning method) will affect the subsequent loading process, the corresponding cleaning method also needs to be stopped before entering the loading process.

[0116] For example, if the first cleaning method is spraying and the second cleaning method is high-pressure cleaning, since spraying can also be performed during the loading process, in the above steps A3 and A4, the loading process can be directly entered without initiating a stop command to stop the first cleaning method (of course, a stop command can also be initiated, depending on actual needs). However, high-pressure cleaning cannot be performed during the loading process, so in the above step B3, after the double-sided polishing equipment cleans the grinding disc in the second cleaning method, it is necessary to control the DSP to stop cleaning before entering the loading process.

[0117] Optionally, the method further includes steps C1 to C4.

[0118] Step C1: setting a first timer and a second timer; the first timer and the second timer both start timing after the double-sided polishing device enters a standby state.

[0119] Step C2: Compare the time in the first timer with the first set time to determine whether the standby time exceeds the first set time.

[0120] Step C3: Compare the time in the second timer with the second set time to determine whether the standby time exceeds the second set time.

[0121] Step C4: When entering the loading process, the first timer and the second timer are reset.

[0122] In this embodiment, two timers are set, namely a first timer and a second timer, and the two timers compare the corresponding set time. Specifically, after the DSP enters the standby state, both the first timer and the second timer start timing.

[0123] If the number of wafers meets the first loading condition and the second timer reaches the second set time, the process is performed based on step 1022. If the first timer reaches the first set time, it can be determined that the standby time exceeds the first set time, that is, the second cleaning process is performed.

[0124] Furthermore, in the above step A3, step A4 or step B3, when entering the feeding process, the first timer and the second timer are reset to zero. The first timer and the second timer can be countdown timers, and the set times are the first set time and the second set time respectively. When the timer is 0, it can be determined that the corresponding set time has been reached; at this time, in step B3, the two timers are already zero, so there is no need to reset them to zero, and it is only necessary to ensure that the timer is zero so as not to affect subsequent processing.

[0125] The operator can set the first set time and the second set time on the touch screen of the DSP EFEM control system, and store the setting result in the memory of the DSP EFEM control system. After the DSP EFEM control system and the DSP are started, the first timer and the second timer of the DSP EFEM control system can start working and compare with the corresponding set time.

[0126] Taking the first cleaning method as spraying and the second cleaning method as high pressure cleaning as an example, Figure 2 A schematic diagram of the process of moisturizing DSP is shown. Figure 2 As shown, after the DSP enters the standby state, the standby time and the number of available wafers can be determined in real time, and the following steps can be performed.

[0127] Step 200: Determine whether the first set time T1 has been reached. If not, execute step 201; if reached, execute step 211.

[0128] Step 201: Send a spray command to the DSP, that is, the DSP EFEM control system sends a spray command to the DSP.

[0129] Step 202: DSP performs spraying. At this time, DSP starts to spray the grinding disc.

[0130] Step 203: Determine whether the LoadBuffer is full of 14 wafers. That is, the first preset number is 14. At this time, determine whether the number of wafers that can be cached in the LoadBuffer has reached 14. If not, proceed to step 200 to determine whether high-pressure cleaning is required; if it is full of 14 wafers, proceed to step 204.

[0131] Step 204: Determine whether the second set time T2 has been reached. If so, proceed to step 205; if not, proceed directly to step 220.

[0132] Step 205: Determine whether the first set time T1 has been reached. If the first set time T1 has been reached, proceed to step 211, otherwise proceed to step 205.

[0133] It can be understood that step 205 is the same as step 200 above, except that the processing flow is slightly different when the first set time T1 has not been reached.

[0134] Step 206: Determine whether to obtain the control authority of the DSP.

[0135] Step 207: Determine whether the robot leaves the DSP.

[0136] After the DSP is in standby mode, the DSP EFEM control system can obtain the control authority of the DSP to control the DSP to spray and other controls. In addition, after the DSP enters the standby mode, the robot can be controlled to leave the DSP in time. The main purpose of step 206 and step 207 is to ensure that the DSP can be cleaned normally.

[0137] like Figure 2 As shown, if the control authority of the DSP is obtained and the robot has left the DSP, continue to step 208.

[0138] Step 208: Control the lower grinding disc of the DSP to rotate one circle. At this time, the lower grinding disc of the DSP rotates one circle (the preset number of circles is 1), and then enters the material loading process, that is, executes step 220.

[0139] If the timing of the second timer reaches the second set time T2, it means that the amount of water sprayed by the DSP will exceed the amount of water allowed by the DSP lower grinding disk. If the water amount in the lower grinding disk is too large, it will affect the visual positioning effect of the visual positioning system in the DSP EFEM control system and increase the NG rate of visual positioning; if the water amount in the lower grinding disk is too large, excessive water will overflow to the top of the wafer. When the visual system performs visual positioning, there will be a problem of reflection, and the reflection will cause the vision to fail to find the edge of the target object; at the same time, it will also affect the press detection effect of the DSP EFEM control system robot 2 and increase the false detection rate of the press detection. In addition, if the water volume in the lower grinding disk is too large, there will be too much water under the wafer, which will cause the distance between the wafer and the grinding plate on the lower grinding disk to increase, and the detection value of the pressure detection sensor will become larger, deviating from the normal value; it will also affect the false detection rate of DSP loading defect inspection. The wafer is black, and the background grinding plate (the main material used to grind the wafer in the grinding plate) where the wafer is placed is white. If the wafer has defects, the defective part of the wafer will leak out of the white grinding plate. However, if the water volume in the lower grinding disk is too large, excessive water will overflow to the top of the wafer. During visual inspection, there will be a reflection problem, and the reflection will cause the visual to judge the reflected position as white.

[0140] In this embodiment, by controlling the lower grinding disc to rotate one circle, the excess water sprayed onto the lower grinding disc by DSP can be thrown out, and at the same time, the water on the lower grinding disc of DSP is also homogenized, so that there is no water accumulation. The water accumulation will cause a sudden increase in the water content, and will also affect the visual positioning, press detection and feeding defect detection.

[0141] Step 211: Determine whether the number of wafers is greater than or equal to 15. That is, the second preset number is 15. If it is satisfied, proceed to step 212, otherwise wait for LoadPort to load materials and continue to execute step 200.

[0142] Specifically, the DSP EFEM control system determines whether the sum of the number of wafers available in the LoadPort and the number of wafers in the LoadBuffer is greater than or equal to 15. The sum of the number of wafers in the LoadPort and the number of wafers in the LoadBuffer of the available wafers must be greater than or equal to 15 before high-pressure cleaning can be performed once. Otherwise, after the high-pressure cleaning is completed, the DSP will enter the standby state again.

[0143] Among them, DSP production requires 15 wafers at a time. The sum of the number of wafers in the LoadPort and the number of wafers in the LoadBuffer is less than 15. The DSP cannot load the wafers. The DSP performs spraying, for example, executing step 201. The LoadPort is the loading port of the DSP EFEM, and the LoadBuffer is the buffer unit of the DSP EFEM. The wafers taken from the LoadPort by the robot 1 of the DSP EFEM are first placed in the LoadBuffer. After 15 wafers are loaded, the robot 1 of the DSP EFEM loads the wafers to the DSP.

[0144] Step 212: Determine whether to obtain the control authority of the DSP.

[0145] Step 213: Determine whether the robot leaves the DSP.

[0146] The above steps 212 and 213 are the same as steps 206 and 207 in principle, so they will not be described again. If the control authority of the DSP is obtained and the robot has left the DSP, then proceed to step 214.

[0147] Step 214: Send a spray end command to the DSP.

[0148] Specifically, the DSP FEEM control system sends a command to the DSP to end the spraying, and the command is transmitted by a connection line between the IO output point 11 of the DSP EFEM and the IO input point 11 of the DSP.

[0149] Step 215: Send a high pressure cleaning command to the DSP.

[0150] Specifically, the DSP EFEM control system sends a command for the DSP to execute high-pressure cleaning to the DSP, and the command is transmitted through a connection line between an IO output point 12 of the DSP EFEM and an IO input point 12 of the DSP.

[0151] Step 216: DSP ends spraying and performs high pressure cleaning.

[0152] When the DSP performs high-pressure cleaning, the upper grinding disc of the DSP rotates and the lower grinding disc of the DSP rotates at a certain speed until the high-pressure cleaning is completed.

[0153] Step 217: Determine whether the grinding disc on the DSP is rotated out in place. If it is rotated out in place, load the material, i.e., execute step 220.

[0154] Specifically, after the DSP completes the high-pressure cleaning, the DSP lower grinding disc stops rotating, and the DSP upper grinding disc rotates out. After the DSPEFEM control signal receives the signal that the DSP upper grinding disc rotates out into place, the DSP EFEM control system can end the high-pressure cleaning process and enter the loading process.

[0155] Step 220: DSP enters the material loading process.

[0156] The traditional processing method is generally manual processing. In manual processing, it is necessary to stop the DSP and DSP EFEM equipment first, then return the DSP control authority from the DSP EFEM to the DSP, and then perform high-pressure cleaning; after the high-pressure cleaning is completed, the control authority of the DSP is transferred to the DSP EFEM, and then the DSP and DSP EFEM are started, which seriously affects the efficiency. In addition, there are also cases where operators do not perform high-pressure cleaning due to laziness or fluke. The method provided in this embodiment can automatically moisturize and has high efficiency, which can well solve the above series of problems.

[0157] The above describes in detail the method flow of controlling the standby moisturizing of the double-sided polishing equipment. The method can also be implemented by a corresponding device. The structure and function of the device are described in detail below.

[0158] Based on the same inventive concept, the embodiment of the present invention also provides a device for controlling the standby moisturizing of the double-sided polishing equipment, which is applied to the control system of the front-end module of the equipment, see Figure 3 As shown, the device comprises:

[0159] A pre-processing module 301 is used to determine the standby time and the number of available wafers when the double-sided polishing equipment is in a standby state;

[0160] The control module 302 is configured to execute a first cleaning process when the standby time does not exceed a first set time; and execute a second cleaning process when the standby time exceeds the first set time;

[0161] Wherein, the first cleaning process comprises:

[0162] Sending a first cleaning instruction to the double-sided polishing device; the first cleaning instruction is used to instruct the double-sided polishing device to clean the grinding disc in a first cleaning manner;

[0163] When the number of wafers meets the first loading condition and the standby time exceeds the second set time, a rotation instruction is sent to the double-sided polishing device; the rotation instruction is used to instruct the double-sided polishing device to control the grinding disc to rotate a preset number of times; the second set time is less than the first set time;

[0164] The second cleaning process comprises:

[0165] When the number of wafers meets the second loading condition, a second cleaning instruction is sent to the double-sided polishing device; the second cleaning instruction is used to instruct the double-sided polishing device to clean the grinding disc in a second cleaning manner, and the grinding disc rotates.

[0166] Optionally, the number of wafers includes the available number in the wafer loading system and the cached number in the wafer cache system;

[0167] In the case where the cache quantity exceeds the first preset quantity, the wafer quantity meets the first loading condition;

[0168] When the sum of the available quantity and the cache quantity exceeds the second preset quantity, the wafer quantity meets the second loading condition; and the first preset quantity is less than or equal to the second preset quantity.

[0169] Optionally, the sum of the first preset number and the preset number of turns is equal to the full load number of the wafer cache system.

[0170] Optionally, the first cleaning process further includes:

[0171] Determine whether the control authority of the double-sided polishing device is obtained, and determine whether the robot of the front-end module of the device leaves the double-sided polishing device;

[0172] After the control authority of the double-sided polishing device is obtained and the robot leaves the double-sided polishing device, a step of sending a rotation instruction to the double-sided polishing device is executed;

[0173] The second cleaning process further comprises:

[0174] Determine whether the control authority of the double-sided polishing device is obtained, and determine whether the robot of the front-end module of the device leaves the double-sided polishing device;

[0175] When the control authority of the double-sided polishing device is obtained and the robot leaves the double-sided polishing device, the step of sending a second cleaning instruction to the double-sided polishing device is performed.

[0176] Optionally, the first cleaning process further includes:

[0177] When the number of wafers meets the first loading condition and the standby time does not exceed the second set time, entering the loading process;

[0178] After the double-sided polishing device controls the grinding disc to rotate a preset number of times, the loading process is entered;

[0179] The second cleaning process further comprises:

[0180] After the double-sided polishing device cleans the grinding disc in the second cleaning mode, the loading process is entered.

[0181] Optionally, the preprocessing module 301 is further used for:

[0182] Setting a first timer and a second timer; both the first timer and the second timer start timing after the double-sided polishing device enters a standby state;

[0183] Comparing the time in the first timer with the first set time to determine whether the standby time exceeds the first set time;

[0184] Comparing the time in the second timer with the second set time to determine whether the standby time exceeds the second set time;

[0185] When entering the loading process, the first timer and the second timer are reset.

[0186] Optionally, the grinding disc comprises an upper grinding disc and a lower grinding disc;

[0187] The control module 302 is also used for:

[0188] Determine whether a rising signal of the upper grinding disc is received, determine whether the upper grinding disc is located at a swiveled-out position, and determine whether there is presence information indicating that a wafer is placed on the lower grinding disc;

[0189] When the rising signal is received, the upper grinding disc is located at the rotated-out position, and the presence information does not exist, it is determined that the double-sided polishing device is in the standby state.

[0190] An embodiment of the present invention also provides a computer storage medium, which stores computer executable instructions, including a program for executing the above-mentioned method of controlling standby moisturizing of double-sided polishing equipment. The computer executable instructions can execute the method in any of the above-mentioned method embodiments.

[0191] Among them, the computer storage medium can be any available medium or data storage device that can be accessed by the computer, including but not limited to magnetic storage (such as floppy disks, hard disks, magnetic tapes, magneto-optical disks (MO), etc.), optical storage (such as CD, DVD, BD, HVD, etc.), and semiconductor storage (such as ROM, EPROM, EEPROM, non-volatile memory (NANDFLASH), solid-state drive (SSD)), etc.

[0192] Figure 4The block diagram of the structure of an electronic device of another embodiment of the present invention is shown. The electronic device 1100 may be a host server with computing capability, a personal computer PC, or a portable computer or terminal, etc. The specific embodiment of the present invention does not limit the specific implementation of the electronic device.

[0193] The electronic device 1100 includes at least one processor 1110, a communications interface 1120, a memory array 1130, and a bus 1140. The processor 1110, the communications interface 1120, and the memory array 1130 communicate with each other via the bus 1140.

[0194] The communication interface 1120 is used to communicate with network elements, where the network elements include, for example, a virtual machine management center, shared storage, etc.

[0195] The processor 1110 is used to execute programs. The processor 1110 may be a central processing unit (CPU), or an application specific integrated circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present invention.

[0196] The memory 1130 is used for executable instructions. The memory 1130 may include a high-speed RAM memory, and may also include a non-volatile memory, such as at least one disk memory. The memory 1130 may also be a memory array. The memory 1130 may also be divided into blocks, and the blocks may be combined into virtual volumes according to certain rules. The instructions stored in the memory 1130 can be executed by the processor 1110, so that the processor 1110 can execute the method for controlling the standby moisturizing of the double-sided polishing equipment in any of the above method embodiments.

[0197] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A method for controlling the standby moisturizing of a double-sided polishing device, characterized in that: A control system applied to a front-end module of a device, the method comprising: When the double-side polishing equipment is in standby mode, determining the standby time and the number of wafers available; When the standby time does not exceed the first set time, a first cleaning process is performed; when the standby time exceeds the first set time, a second cleaning process is performed; Wherein, the first cleaning process comprises: Sending a first cleaning instruction to the double-sided polishing device; the first cleaning instruction is used to instruct the double-sided polishing device to clean the grinding disc in a first cleaning method; the first cleaning method is spraying; When the number of wafers meets the first loading condition and the standby time exceeds the second set time, a rotation instruction is sent to the double-sided polishing device; the rotation instruction is used to instruct the double-sided polishing device to control the grinding disc to rotate a preset number of times; the second set time is less than the first set time; The second cleaning process comprises: When the number of wafers meets the second loading condition, a second cleaning instruction is sent to the double-sided polishing device; the second cleaning instruction is used to instruct the double-sided polishing device to clean the grinding disc in a second cleaning mode, and the grinding disc rotates; the second cleaning mode is high-pressure cleaning; The number of wafers includes the available number in the wafer loading system and the cached number in the wafer cache system; In the case where the cache quantity exceeds the first preset quantity, the wafer quantity meets the first loading condition; When the sum of the available quantity and the cache quantity exceeds the second preset quantity, the wafer quantity meets the second loading condition; and the first preset quantity is less than or equal to the second preset quantity.

2. The method for controlling the standby moisturizing of double-sided polishing equipment according to claim 1, characterized in that: The sum of the first preset number and the preset number of revolutions is equal to the full load number of the wafer cache system.

3. The method for controlling the standby moisturizing of double-sided polishing equipment according to claim 1, characterized in that: The first cleaning process further comprises: Determine whether the control authority of the double-sided polishing device is obtained, and determine whether the robot of the front-end module of the device leaves the double-sided polishing device; After the control authority of the double-sided polishing device is obtained and the robot leaves the double-sided polishing device, a step of sending a rotation instruction to the double-sided polishing device is executed; The second cleaning process further comprises: Determine whether the control authority of the double-sided polishing device is obtained, and determine whether the robot of the front-end module of the device leaves the double-sided polishing device; When the control authority of the double-sided polishing device is obtained and the robot leaves the double-sided polishing device, the step of sending a second cleaning instruction to the double-sided polishing device is performed.

4. The method for controlling the standby moisturizing of double-sided polishing equipment according to claim 1, characterized in that: The first cleaning process further comprises: When the number of wafers meets the first loading condition and the standby time does not exceed the second set time, entering the loading process; After the double-sided polishing device controls the grinding disc to rotate a preset number of times, the loading process is entered; The second cleaning process further comprises: After the double-sided polishing device cleans the grinding disc in the second cleaning mode, the loading process is entered.

5. The method for controlling the standby moisturizing of double-sided polishing equipment according to claim 4, characterized in that: Also includes: Setting a first timer and a second timer; both the first timer and the second timer start timing after the double-sided polishing device enters a standby state; Comparing the time in the first timer with the first set time to determine whether the standby time exceeds the first set time; Comparing the time in the second timer with the second set time to determine whether the standby time exceeds the second set time; When entering the loading process, the first timer and the second timer are reset.

6. The method for controlling the standby moisturizing of double-sided polishing equipment according to claim 1, characterized in that: The grinding disc comprises an upper grinding disc and a lower grinding disc; The method further comprises: Determine whether a rising signal of the upper grinding disc is received, determine whether the upper grinding disc is located at a swiveled-out position, and determine whether there is presence information indicating that a wafer is placed on the lower grinding disc; When the rising signal is received, the upper grinding disc is located at the rotated-out position, and the presence information does not exist, it is determined that the double-sided polishing device is in the standby state.

7. A device for controlling the standby moisturizing of double-sided polishing equipment, characterized in that: The control system used in the front-end module of the equipment includes: A pre-processing module, used for determining a standby time and a number of available wafers when the double-side polishing equipment is in a standby state; A control module, configured to execute a first cleaning process when the standby time does not exceed a first set time; and execute a second cleaning process when the standby time exceeds the first set time; Wherein, the first cleaning process comprises: Sending a first cleaning instruction to the double-sided polishing device; the first cleaning instruction is used to instruct the double-sided polishing device to clean the grinding disc in a first cleaning method; the first cleaning method is spraying; When the number of wafers meets the first loading condition and the standby time exceeds the second set time, a rotation instruction is sent to the double-sided polishing device; the rotation instruction is used to instruct the double-sided polishing device to control the grinding disc to rotate a preset number of times; the second set time is less than the first set time; The second cleaning process comprises: When the number of wafers meets the second loading condition, a second cleaning instruction is sent to the double-sided polishing device; the second cleaning instruction is used to instruct the double-sided polishing device to clean the grinding disc in a second cleaning mode, and the grinding disc rotates; the second cleaning mode is high-pressure cleaning; The number of wafers includes the available number in the wafer loading system and the cached number in the wafer cache system; In the case where the cache quantity exceeds the first preset quantity, the wafer quantity meets the first loading condition; When the sum of the available quantity and the cache quantity exceeds the second preset quantity, the wafer quantity meets the second loading condition; and the first preset quantity is less than or equal to the second preset quantity.

8. A computer storage medium, characterized in that The computer storage medium stores computer executable instructions, and the computer executable instructions are used to execute the method for controlling standby moisturizing of double-sided polishing equipment according to any one of claims 1 to 6.

9. An electronic device, characterized in that: include: at least one processor; as well as, a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor so that the at least one processor can execute the method for controlling standby moisturizing of double-sided polishing equipment according to any one of claims 1 to 6.

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