Semiconductor laser characteristic testing device and testing method

Abstract

The invention discloses a semiconductor laser characteristic testing device and method, and the device comprises a tester and a laser rack, the tester comprises a plurality of groups of detachably mounted or movable assembly racks, the interior of each assembly rack is movably connected with a testing panel, and one side, close to the laser rack, of the testing panel is fixedly provided with an optical testing piece. The optical test piece is used for receiving and detecting laser emitted by the semiconductor laser to-be-tested piece on the laser frame; any two adjacent assembling frames are detachably installed through a rotating device, and the included angle or distance between any two assembling frames which are installed in a matched mode is adjusted through the rotating device. The assembling frame can be freely disassembled and assembled through the rotating device, a coordinate curve is drawn according to the laser energy receiving size and distance of the optical test piece, the use characteristics of the tested piece of the semiconductor laser can be found out, the assembling frame can be freely matched and selected according to requirements for operation, and the application range is wide.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor laser test piece testing, in particular to a semiconductor laser characteristic testing device and a testing method. Background Art

[0002] A semiconductor laser DUT is a device that uses semiconductor materials (usually compound semiconductors such as selenides, nitrides, or phosphides) to emit laser light. They play a key role in many modern scientific and technological applications, including communications, medical treatments, material processing, and optical sensing. The working principle of semiconductor laser DUTs is similar to other types of lasers. They use the recombination process of electrons and holes in the semiconductor lattice to generate light. When current passes through the semiconductor material, the electrons and holes combine and emit photons, thereby generating a laser beam. Compared with other types of lasers, semiconductor laser DUTs have the advantages of smaller size, high efficiency, and low cost, so they are widely used in various devices and systems.

[0003] The patent with publication number CN102109571B discloses a semiconductor laser test piece characteristic test system, which specifically discloses "a semiconductor laser test piece characteristic test system, including an optical platform and a computer system, characterized in that: a two-dimensional translation guide is fixedly provided on the optical platform, a laser fixing seat is fixedly provided on the two-dimensional translation guide through a slider, a laser to be tested is provided on the laser fixing seat, and a laser temperature control module for controlling the temperature of the laser to be tested is also provided on the laser fixing seat, and LIV and spectrum test modules, polarization test modules, near The present invention provides one or more of a field spot test module, a near-field nonlinear test module, a far-field test module and a spatial spectrum test module; the laser under test is connected to a computer system through a semiconductor laser under test device driver; the near-field nonlinear test module includes a lens system and a first CCD camera; the light emitted by the laser under test is collimated into parallel light through the lens system in turn, and the parallel light is amplified and presented on the first CCD camera. The technical solution realizes the technical effect of "the present invention is used for high-precision and automated testing of semiconductor laser under test devices, especially high-power semiconductor laser under test devices, and reducing the detection and production manufacturing costs of semiconductor laser under test devices".

[0004] However, when in use, the device can only perform characteristic tests on semiconductor laser test pieces of a single frequency, and there is no test solution for energy loss tests on semiconductor laser test pieces, resulting in incomplete performance of characteristic tests on semiconductor laser test pieces. Summary of the invention

[0005] The object of the present invention is to provide a semiconductor laser characteristic testing device and a testing method to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A semiconductor laser characteristic testing device comprises a tester and a laser rack, wherein the tester comprises a plurality of groups of detachably mounted or movable assembly racks, wherein a test panel is movably connected inside the assembly rack, and the laser rack is used to mount a semiconductor laser test piece, and an optical test piece is fixedly mounted on one side of the test panel close to the laser rack, and the optical test piece is used to receive and detect laser light emitted by the semiconductor laser test piece on the laser rack; any two adjacent assembly racks are detachably mounted by a rotating device, and any two matching assembly racks are adjusted in angle or distance to each other by the rotating device, and a structure for locking the test panel after rotation is provided inside the assembly rack.

[0008] As a further solution of the present invention: the rotating device includes a hinge and a screw rod, screw holes are provided at both ends of the hinge, the two screw rods are threadedly connected to the two screw holes respectively, the two screw rods are hinged to each other through matching hinges, the end of the screw rod away from the hinge is connected to a lead screw, a lead screw nut is sleeved on the lead screw, and the lead screw and the lead screw nut are movably connected, the side end of the assembly frame is fixedly connected to a lead screw nut frame, and the lead screw nut is fixedly connected to the lead screw nut frame.

[0009] As a further solution of the present invention: the laser rack includes a mounting frame, a telescopic column and an anti-elasticity frame, the anti-elasticity frame is fixedly installed inside the mounting frame, the telescopic column is fixedly installed inside the laser rack, and its output end is movably arranged.

[0010] As a further solution of the present invention: one end of the test panel is fixedly connected to a gear shaft after passing through the assembly frame, and the assembly frame is movably connected with a clamping bar, and the clamping bar clamps the gear shaft after meshing with the gear shaft.

[0011] As a further solution of the present invention: a bottom support groove is provided on the bottom side of the assembly frame, a ground support is hingedly connected inside the bottom support groove, and one end of the ground support is configured as a rounded structure.

[0012] As a further solution of the present invention: a ball rolling groove is provided on the bottom side of the assembly frame, a ball is arranged inside the ball rolling groove, and the ball is connected to the ball rolling groove.

[0013] As a further solution of the present invention: a servo motor is installed on the assembly frame, a ball screw is arranged at the output end of the servo motor, and the positioning strip is cooperatively connected with the ball screw.

[0014] As a further solution of the present invention: a mounting groove is arranged on the top of the assembly rack, a magnetic attraction bar is installed in the mounting groove, and one magnetic attraction bar is installed in any two parallel and adjacent mounting grooves of the assembly rack.

[0015] As a further solution of the present invention: a bar frame is provided on one side of the assembly frame, wherein the magnetic attraction bar can be detached away from the installation slot and then placed on the bar frame.

[0016] As a further solution of the present invention: an anti-dropping cap is fixedly connected to one end of the lead screw away from the screw rod.

[0017] A method for testing characteristics of a semiconductor laser.

[0018] The test device according to claim 1 is used for testing, and the steps are as follows:

[0019] Step 1: A plurality of groups of detachable or movable assembly racks are arranged around the laser rack, and any two matched assembly racks are adjusted to have an angle or distance between them through a rotating device;

[0020] Step 2: Install the semiconductor laser test piece on the laser rack, and adjust the position of the test panel so that the optical test piece on the test panel faces the laser rack;

[0021] Step 3: The semiconductor laser test piece emits laser light, and the emitted laser light is detected by a plurality of optical test pieces;

[0022] Step 4: Draw a coordinate curve based on the acceptance size and distance of the laser energy of the semiconductor laser device under test by the optical test piece, and explore the use characteristics of the semiconductor laser device under test.

[0023] Compared with the prior art, the present invention has the following beneficial effects:

[0024] 1. The assembly rack can be freely disassembled and assembled through the rotating device. The laser emitted by the semiconductor laser test piece is detected by multiple optical test pieces. A coordinate curve is drawn according to the acceptance size and distance of the laser energy of the semiconductor laser test piece by the optical test piece to explore the use characteristics of the semiconductor laser test piece. At the same time, it can also detect whether the conventional functions of the semiconductor laser test piece are normal. During the process, the rays of the semiconductor laser test piece will be emitted to the test panel and output from the tester after multiple refractions at multiple angles. During the process, the laser energy at the last refraction needs to be recorded and then compared with the laser energy detected for the first time. If it is within the normal value, it means that the refraction function of the semiconductor laser test piece is normal. This application can be freely matched and selected for operation according to needs, and has a wide range of uses.

[0025] 2. By setting up a rotating device, the two screws are hinged to each other through a matching hinge, so the position of the screw connected to the screw and the screw nut set on the screw can be changed through the hinge, and the two screw nuts are respectively connected to the two assembly frames, which can change the angle of the two assembly frames and the distance between the two assembly frames, so that the equipment can be freely adjusted and used according to needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure in an embodiment of the present invention;

[0027] Figure 2 This is a schematic diagram of the use status of the tester in an embodiment of the present invention;

[0028] Figure 3 It is a structural schematic diagram of a single assembly rack in an embodiment of the present invention;

[0029] Figure 4 It is a schematic diagram of the disassembly structure of the assembly frame, the rotating device, and the magnetic attraction strip in an embodiment of the present invention;

[0030] Figure 5 It is a structural schematic diagram of an assembly rack in an embodiment of the present invention;

[0031] Figure 6 It is a structural schematic diagram of a rotating device in an embodiment of the present invention;

[0032] Figure 7 It is an assembly diagram of the ball rolling groove and the ball rolling in the embodiment of the present invention;

[0033] Figure 8 A schematic diagram of the structure of a laser rack in an embodiment of the present invention;

[0034] Fig. 9 For the embodiment of the present invention Figure 3 The enlarged view of point A in the middle;

[0035] Fig.10 For the embodiment of the present invention Figure 4 The enlarged view of point B in the middle;

[0036] Fig.11 Schematic diagram of the structure of the test panel in an embodiment of the present invention.

[0037] In the figure: 1. tester; 2. assembly frame; 21. lead screw nut frame; 22. bottom support groove; 23. built-in ball screw; 24. servo motor; 25. positioning strip; 26. ball slot; 27. ball; 28. strip frame; 29. ​​ground support; 3. test panel; 31. optical test piece; 32. gear shaft; 4. laser frame; 41. mounting frame; 42. telescopic column; 43. anti-dropping frame; 5. rotating device; 51. matching hinge; 52. lead screw; 53. lead screw nut; 54. screw; 55. screw hole; 56. anti-dropping cap; 6. magnetic strip. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0039] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. The following is an explanation of an embodiment of the present invention based on the overall structure of the present invention.

[0040] A semiconductor laser characteristic testing device comprises a tester 1 and a laser rack 4. The tester 1 comprises a plurality of groups of detachably mounted or movable assembly racks 2. A test panel 3 is movably connected inside the assembly rack 2. The laser rack 4 is movably connected to a semiconductor laser test piece. An optical test piece 31 for receiving laser light emitted by the laser rack 4 is fixedly mounted on one side of the test panel 3. The assembly racks 2 are adjusted to have an angle or distance therebetween or to be disassembled and assembled through a rotating device 5. A structure is provided inside the assembly rack 2 for locking the test panel 3 after rotation.

[0041] Other embodiments of the present invention: please refer to Figures 1 to 11 In this embodiment, the assembly frame 2 can be freely disassembled by the rotating device 5. The specific process is:

[0042] Step S1: The semiconductor laser test piece is mounted on the laser rack 4, and the semiconductor laser test piece emits laser light;

[0043] Step S2: If it is necessary to test the data of laser energy loss of the semiconductor laser test piece under multi-refractive condition, four or more assembly racks 2 can be selected for assembly. During the test, the rays of the semiconductor laser test piece will be emitted to the test panel 3 and received by the optical test piece 31. The optical test piece 31 can be connected to a controller and transmit the captured laser energy to the test host. A distance sensor (not shown) can also be provided inside the optical test piece 31 to detect the position and distance of the optical test piece 31 to the optical test piece 31. Then, a coordinate curve is drawn according to the laser energy acceptance size and distance of the optical test piece 31 to find out the use characteristics of the semiconductor laser test piece.

[0044] Step S3: If the conventional functions of the semiconductor laser test piece are to be detected to be normal, less than four sets of assembly racks 2 can be used for assembly. During the process, the rays of the semiconductor laser test piece will be emitted to the test panel 3, and will be output from the tester 1 after being refracted multiple times at multiple angles. During the process, the laser energy at the last refraction must be recorded and then compared with the laser energy detected for the first time. If it is within the normal value, it means that the refraction function of the semiconductor laser test piece is normal.

[0045] The assembly frame 2 can be freely disassembled and assembled through the rotating device 5. A coordinate curve is drawn according to the acceptance size and distance of the laser energy by the optical test piece 31 to explore the use characteristics of the semiconductor laser test piece; at the same time, it can also detect whether the conventional functions of the semiconductor laser test piece are normal. During the process, the rays of the semiconductor laser test piece will be emitted to the test panel 3, and will be output from the tester after being refracted multiple times at multiple angles. During the process, the laser energy at the last refraction needs to be recorded and then compared with the laser energy detected for the first time. If it is within the normal value, it means that the refraction function of the semiconductor laser test piece is normal. This application can be freely matched and selected for operation according to needs, and has a wide range of uses.

[0046] As a further solution of the present invention: a semiconductor laser characteristic testing device, the rotating device 5 includes a matching hinge 51, a lead screw 52, ​​a lead screw nut 53, a screw 54 and a screw hole 55, a lead screw nut frame 21 is fixedly connected to one side of the assembly frame 2, the lead screw nut 53 is fixedly connected to the lead screw nut frame 21, the lead screw 52 is embedded in the inside of the lead screw nut 53 and is movably connected to the lead screw nut 53, one end of the lead screw 52 is fixedly connected to the screw 54, two groups of screws 54 are screwed together with the screw hole 55, and the two groups of screws 54 are hinged to each other through the matching hinge 51.

[0047] Other embodiments of the present invention: please refer to Figures 1 to 11 Since the rotating device 5 includes a matching hinge 51, a lead screw 52, ​​a lead screw nut 53, a screw 54 and a screw hole 55, a lead screw nut frame 21 is fixedly connected to one side of the assembly frame 2, the lead screw nut 53 is fixedly connected to the lead screw nut frame 21, the lead screw 52 is embedded in the lead screw nut 53 and is movably connected to the lead screw nut 53, one end of the lead screw 52 is fixedly connected to the screw 54, and the two groups of screws 54 are both screwed together with the screw hole 55. The two groups of screws 54 are hinged to each other through the matching hinge 51. Therefore, the angle of the ball screw nut pair composed of the lead screw 52 and the lead screw nut 53 can be changed through the hinge 51. In the process of changing the angle, the distance between the two groups of assembly frames 2 can also be changed, so that the equipment can be freely adjusted and used according to needs.

[0048] As a further solution of the present invention: a semiconductor laser characteristic testing device, the laser frame 4 includes a mounting frame 41, a telescopic column 42 and an anti-elasticity frame 43, the anti-elasticity frame 43 is fixedly installed inside the mounting frame 41 and is used for the semiconductor laser to be tested to be clamped and fixed by the test piece, and the telescopic column 42 is fixedly installed inside the laser frame 4, and its output end is movably arranged.

[0049] Other embodiments of the present invention: please refer to Figures 1 to 11 On the one hand, a bottom support groove 22 is provided on one side of the test panel 3, a ground support 29 is hinged inside the bottom support groove 22, and one side of the ground support 29 is set as a rounded structure. On the other hand, the laser rack 4 includes a mounting frame 41, a telescopic column 42 and an anti-elastic frame 43, the anti-elastic frame 43 is fixedly installed inside the mounting frame 41 and is used for clamping and fixing the semiconductor laser to be tested. The telescopic column 42 is fixedly installed inside the laser rack 4, and its output end is movably arranged. Therefore, when the equipment is placed and needs to be tested, in order to move the placed equipment, the assembly rack 2 can be supported by flipping the ground support 29, and the laser rack 4 can be supported by telescopic columns 42, thereby ensuring the normal operation of the equipment and avoiding the problem of inaccurate test results caused by the movement of the semiconductor laser to be tested.

[0050] As a further solution of the present invention: a semiconductor laser characteristic testing device, one end of the test panel 3 passes through the assembly frame 2 and is fixedly connected to the gear shaft 32, one side of the assembly frame 2 is movably connected with a positioning bar 25, the positioning bar 25 is movably connected to the gear shaft 32, a servo motor 24 is fixedly installed on one side of the assembly frame 2, the output end of the servo motor 24 is provided with a built-in ball screw 23, and the positioning bar 25 and the built-in ball screw 23 are assembled with each other.

[0051] Other embodiments of the present invention: please refer to Figure 5 and Fig. 9 Since one end of the test panel 3 is fixedly connected to the gear shaft 32 after passing through the assembly frame 2, a clamping strip 25 is movably connected to one side of the assembly frame 2, and the clamping strip 25 is movably connected to the gear shaft 32. A servo motor 24 is fixedly installed on one side of the assembly frame 2, and a built-in ball screw 23 is provided at the output end of the servo motor 24. The clamping strip 25 and the built-in ball screw 23 are assembled with each other. Therefore, after the test panel 3 is rotated, the test panel 3 can be fixed by the clamping connection between the clamping strip 25 and the gear shaft 32, thereby preventing the test panel 3 from moving and maintaining the accuracy of the test results of the semiconductor laser test piece.

[0052] As a further solution of the present invention: a semiconductor laser characteristic testing device, a bottom support groove 22 is opened on one side of the test panel 3, a ground support 29 is hinged inside the bottom support groove 22, and one side of the ground support 29 is set as a rounded structure.

[0053] As a further solution of the present invention: a semiconductor laser characteristic testing device, a ball rolling groove 26 is opened on one side of the assembly frame 2, a ball rolling groove 26 is arranged inside the ball rolling groove 26, and the ball rolling 27 is connected to the ball rolling groove 26.

[0054] Other embodiments of the present invention: please refer to Figures 1 to 11 Since a ball rolling groove 26 is provided on one side of the assembly frame 2, a ball rolling groove 26 is provided with a ball rolling 27 inside, and the ball rolling 27 is connected to the ball rolling groove 26, the ball rolling 27 can be used to facilitate the movement of the device when the device is not in use.

[0055] As a further solution of the present invention: a semiconductor laser characteristic testing device and testing method, a servo motor 24 is fixedly installed on one side of the assembly frame 2, and a built-in ball screw 23 is provided at the output end of the servo motor 24, and a positioning strip 25 and the built-in ball screw 23 are assembled with each other.

[0056] As a further solution of the present invention: a semiconductor laser characteristic testing device and testing method, a magnetic attraction bar 6 is provided on one side of the assembly rack 2, and two groups of assembly racks 2 are connected by the magnetic attraction bar 6.

[0057] Other embodiments of the present invention: please refer to Figures 1 to 11Since a mounting groove is provided on the top of the assembly rack 2, any two adjacent and parallel assembly racks 2 are installed and fixed by a magnetic strip 6 to achieve a limiting effect. Therefore, the assembly rack 2 can be fixed when the assembly rack 2 is gathered, which is convenient for carrying the assembly rack 2.

[0058] As a further solution of the present invention: a semiconductor laser characteristic testing device and testing method, a bar frame 28 is fixedly connected to one side of the assembly frame 2, and when the magnetic attraction bar 6 is not loaded in the installation groove, the magnetic attraction bar 6 can be placed on the bar frame 28, and the magnetic attraction bar 6 can be stored through the bar frame 28 to prevent the magnetic attraction bar 6 from being lost.

[0059] Other embodiments of the present invention: please refer to Figures 1 to 11 Since a bar frame 28 is fixedly connected to one side of the assembly frame 2, the magnetic strip 6 is placed on the bar frame 28, and the magnetic strip 6 can be stored through the bar frame 28 to prevent the magnetic strip 6 from being lost.

[0060] As a further solution of the present invention: a semiconductor laser characteristic testing device and testing method, an anti-drop cap 56 is fixedly connected to one end of the lead screw 52 away from the screw rod 54.

[0061] Other embodiments of the present invention: Since the end of the lead screw 52 away from the screw rod 54 is fixedly connected with the anti-drop cap 56, the lead screw 52 can be prevented from being pulled away from the lead screw nut frame 21, thereby avoiding the lead screw 52 from being lost.

[0062] The working principle of the present invention is that the assembly frame 2 can be freely disassembled and assembled by the rotating device 5, and the specific process is:

[0063] Step S1: The semiconductor laser under test mounted on the laser rack 4 emits laser light;

[0064] Step S2: If it is necessary to test the laser energy loss data of the semiconductor laser under test under the condition of multi-refractive index, the following can be done: Figure 1 As shown, four or more assembly racks 2 are selected for assembly. During the test, the radiation of the semiconductor laser test piece will be emitted to the test panel 3 and received by the optical test piece 31. The optical test piece 31 can be connected to a controller and transmit the captured laser energy to the test host. A distance sensor can also be provided inside the optical test piece 31 to detect the position and distance between the optical test piece 31 and the optical test piece 31. Then, a coordinate curve is drawn according to the laser energy acceptance size and distance of the optical test piece 31 to explore the use characteristics of the semiconductor laser test piece.

[0065] Step S3: If the conventional function of the semiconductor laser device under test is detected to be normal, Figure 2The assembly is carried out using less than four sets of assembly racks 2. During the process, the rays of the semiconductor laser test piece will be emitted to the test panel 3, and will be output from the tester 1 after being refracted multiple times at multiple angles. During the process, the laser energy at the last refraction must be recorded and then compared with the laser energy detected for the first time. If it is within the normal value, it means that the refraction function of the semiconductor laser test piece is normal.

[0066] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A semiconductor laser characteristic testing device, characterized in that: The invention comprises a tester (1) and a laser rack (4), wherein the tester (1) comprises a plurality of groups of detachably mounted or movable assembly racks (2), wherein a test panel (3) is movably connected inside the assembly rack (2), the laser rack (4) is used to mount a semiconductor laser test piece, and an optical test piece (31) is fixedly mounted on one side of the test panel (3) close to the laser rack (4), wherein the optical test piece (31) is used to receive and detect laser light emitted by the semiconductor laser test piece on the laser rack (4); Any two adjacent assembly frames (2) are detachably mounted via a rotating device (5), and any two assembly frames (2) that are mounted in a matching manner can adjust the angle or distance between each other via the rotating device (5). A structure for locking the test panel (3) after rotation is provided inside the assembly frame (2). The rotating device (5) comprises a hinge (51) and a screw rod (54). Both ends of the hinge (51) are provided with screw holes (55). The two screw rods (54) are respectively connected to the two The two screw rods (54) are connected by a threaded connection through a screw hole (55), the two screw rods (54) are hinged to each other through a matching hinge (51), one end of the screw rod (54) away from the hinge (51) is connected to a screw rod (52), a screw rod nut (53) is sleeved on the screw rod (52), and the screw rod (52) and the screw rod nut (53) are movably connected, and a screw nut frame (21) is fixedly connected to the side end of the assembly frame (2), and the screw nut (53) is fixedly connected to the screw nut frame (21).

2. A semiconductor laser characteristic testing device according to claim 1, characterized in that: The laser frame (4) comprises a mounting frame (41), a telescopic column (42) and an anti-elasticity frame (43); the anti-elasticity frame (43) is fixedly mounted inside the mounting frame (41); the telescopic column (42) is fixedly mounted inside the laser frame (4), and its output end is movably arranged.

3. A semiconductor laser characteristic testing device according to claim 1, characterized in that: One end of the test panel (3) passes through the assembly frame (2) and is fixedly connected to a gear shaft (32). The assembly frame (2) is movably connected to a clamping strip (25). The clamping strip (25) is meshed with the gear shaft (32) to clamp the gear shaft (32).

4. A semiconductor laser characteristic testing device according to claim 1, characterized in that: A bottom support groove (22) is provided on the bottom side of the assembly frame (2), a ground support (29) is hingedly connected inside the bottom support groove (22), and one end of the ground support (29) is arranged as a rounded structure.

5. A semiconductor laser characteristic testing device according to any one of claims 2 to 4, characterized in that: A ball rolling groove (26) is provided on the bottom side of the assembly frame (2), a ball rolling groove (26) is provided inside with a ball rolling (27), and the ball rolling (27) is connected to the ball rolling groove (26).

6. A semiconductor laser characteristic testing device according to claim 5, characterized in that: A servo motor (24) is installed on the assembly frame (2), a ball screw (23) is arranged at the output end of the servo motor (24), and the positioning strip (25) is connected to the ball screw (23) in a coordinated manner.

7. A semiconductor laser characteristic testing device according to claim 1, characterized in that: A mounting groove is arranged at the top of the assembly frame (2), a magnetic strip (6) is installed in the mounting groove, one magnetic strip (6) is installed in any two mounting grooves of the assembly frame (2) that are arranged parallel and adjacent, a strip frame (28) is arranged on one side of the assembly frame (2), wherein the magnetic strip (6) can be detached away from the mounting groove and placed on the strip frame.

8. A semiconductor laser characteristic testing device according to claim 1, characterized in that: An anti-drop cap (56) is fixedly connected to one end of the lead screw (52) away from the screw rod (54).

9. A method for testing characteristics of a semiconductor laser, characterized in that: The test device according to claim 1 is used for testing, and the steps are as follows: Step 1: a plurality of groups of detachably mounted or movable assembly racks (2) are arranged around the laser rack (4), and any two matched assembly racks (2) are adjusted to have an angle or distance between them through a rotating device (5); Step 2: Mounting the semiconductor laser test piece on the laser rack (4), and adjusting the position of the test panel (3) so that the optical test piece (31) on the test panel (3) faces the laser rack (4); Step 3: The semiconductor laser test piece emits laser light, and the emitted laser light is detected by a plurality of optical test pieces (31); Step 4: Draw a coordinate curve of the laser energy acceptance size and distance of the semiconductor laser device under test according to the optical test piece (31), and find out the use characteristics of the semiconductor laser device under test.

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