Converter unit and power conversion device

Abstract

The invention provides a converter unit and a power conversion device. In the converter unit, the outlet of the cooling air flow path is arranged on the surface of the back side of the flow path part, and the flow path part is arranged on the back side of the converter unit main body.

Description

Technical Field

[0001] The present invention relates to a converter unit and a power conversion device. Background Art

[0002] Conventionally, there is known a converter unit including a flow path portion including a cooling air flow path through which air for cooling semiconductor modules passes. Such a power converter is disclosed in, for example, Japanese Patent Application Laid-Open No. 2012-157188.

[0003] Japanese Patent Application Laid-Open No. 2012-157188 ​​describes a converter unit having a wind tunnel through which air for cooling a semiconductor module passes. In the converter unit described in Japanese Patent Application Laid-Open No. 2012-157188, the air sucked into the wind tunnel absorbs heat from a heat dissipation member arranged to be in contact with the semiconductor module inside the wind tunnel, becomes high temperature, and is discharged from the top of the wind tunnel to the outside of the wind tunnel. The converter unit described in Japanese Patent Application Laid-Open No. 2012-157188 ​​is arranged at the uppermost part of the housing of the power conversion device.

[0004] However, although not described in the above-mentioned Patent Document 1, the converter unit described in the above-mentioned Patent Document 1 is usually arranged at a position other than the uppermost part in the housing of the power conversion device. In this case, the relatively high temperature air that cools the semiconductor module of the converter unit and is discharged from the upper part of the wind tunnel to the outside of the wind tunnel will have a thermal effect on other electrical devices arranged above the converter unit in the housing of the power conversion device. Therefore, a structure is desired that can suppress the following situation: the air that becomes relatively high temperature by cooling the semiconductor module of the converter unit has a thermal effect on other electrical devices arranged above the converter unit. Summary of the invention

[0005] The present invention is made to solve the above-mentioned problems. One object of the present invention is to provide a converter unit and a power conversion device that can suppress the heat effect of air that becomes relatively high temperature when cooling the semiconductor module of the converter unit on other electrical equipment arranged above the converter unit.

[0006] In order to achieve the above-mentioned purpose, the converter unit of the first aspect of the present invention comprises: a converter unit main body, which includes a semiconductor module; and a flow path portion, which includes a cooling air flow path and is arranged on the back side of the converter unit main body, the cooling air flow path extends in the up and down direction and air for cooling the semiconductor module passes inside, the flow path portion includes: a heat dissipation component, which is arranged in the cooling air flow path in contact with the semiconductor module; and a fan, which is used to make air pass from one side of the bottom and the top to the other side in the cooling air flow path, the outlet of the cooling air flow path is arranged on the back side of the flow path portion, and at least a part of the outlet of the cooling air flow path is arranged below the upper surface of the converter unit main body and above the bottom surface of the converter unit main body.

[0007] In the converter unit according to the first aspect of the present invention, as described above, the outlet of the cooling air flow path is arranged on the surface on the back side of the flow path portion, and the flow path portion is arranged on the back side of the converter unit body. As a result, the air that has become relatively hot due to cooling the semiconductor module of the converter unit can be discharged from the outlet of the cooling air flow path arranged on the surface on the back side of the flow path portion to the back side of the flow path portion. As a result, it is possible to suppress the air that has become relatively hot due to cooling the semiconductor module of the converter unit from having a thermal effect on other electrical equipment arranged above the converter unit.

[0008] In addition, in the converter unit of the first aspect, as described above, at least a portion of the outlet of the cooling air flow path is arranged below the upper surface of the converter unit body and above the bottom surface of the converter unit body. Thus, compared with the case where the outlet of the cooling air flow path is entirely arranged above the upper surface of the converter unit body or below the bottom surface of the converter unit body, the following situations can be suppressed: the upper end of the flow path portion including the cooling air flow path protrudes upward relative to the upper surface of the converter unit body; the lower end of the flow path portion including the cooling air flow path protrudes downward relative to the bottom surface of the converter unit body. Thus, the height of the converter unit can be suppressed from increasing.

[0009] In the converter unit of the first aspect, it is preferred that the flow path portion includes a guide member that guides the air in the cooling air flow path to the outlet of the cooling air flow path, and at least a portion of the guide member is arranged below the upper surface of the converter unit body and above the bottom surface of the converter unit body. If configured in this way, compared with a case where the guide member is entirely arranged above the upper surface of the converter unit body or below the bottom surface of the converter unit body, it is possible to suppress the following situations: the upper end of the flow path portion including the guide member protrudes upward relative to the upper surface of the converter unit body; the lower end of the flow path portion including the guide member protrudes downward relative to the bottom surface of the converter unit body. Thus, even in the case where the flow path portion includes the guide member, it is possible to suppress the height of the converter unit from increasing.

[0010] In the structure in which the flow path portion includes a guide member, it is preferred that the heat dissipation member is arranged in the central portion of the cooling air flow path in the vertical direction, the guide member is arranged to be inclined from the front surface side of the flow path portion toward the back side as it goes from one side of the bottom and the top to the other, and the end of the heat dissipation member side of the guide member is arranged near the end of the guide member side of the heat dissipation member. If so configured, since the guide member is arranged to be inclined from the front surface side of the flow path portion toward the back side as it goes from one side of the bottom and the top to the other, it is possible to efficiently guide the air in the cooling air flow path to the outlet of the cooling air flow path. In addition, corresponding to the end of the heat dissipation member side of the guide member being arranged near the end of the guide member side of the heat dissipation member, the end of the guide member on the side opposite to the heat dissipation member can be located in the vertical direction on the side of the heat dissipation member arranged in the central portion of the cooling air flow path. Thus, even in a case where the guide member is configured to be inclined from the front surface side of the flow path portion toward the back surface side as it goes from one side of the bottom and the top to the other, it is possible to easily achieve a structure in which the guide member is at least partially configured at a position lower than the upper surface of the converter unit body and higher than the bottom surface of the converter unit body.

[0011] In the structure in which the guide member is inclined from the front surface side of the flow path portion toward the back surface side as it goes from one side of the bottom and the top to the other side, it is preferred that the guide member is composed of a single flat plate member that is inclined from the front surface side of the flow path portion toward the back surface side as it goes from one side of the bottom and the top to the other side. If so, compared with the case where the guide member is composed of a plurality of members, the case where the guide member is composed of a member having a complex shape, etc., it is easy to manufacture the guide member that is inclined from the front surface side of the flow path portion toward the back surface side as it goes from one side of the bottom and the top to the other side.

[0012] In the structure in which the flow path portion includes a guide member, it is preferred that the fan, the heat dissipation member, and the guide member are arranged in this order from one side of the bottom and the top toward the other side in the cooling air flow path. If so configured, the fan is arranged at a position on the upstream side of the heat dissipation member in the cooling air flow path, so that the air passing through the fan can be made relatively low in temperature. Thus, it is possible to suppress the deterioration of the fan due to exposure to relatively high temperature air.

[0013] In addition, in order to achieve the above-mentioned purpose, the power conversion device of the second aspect of the present invention comprises: a converter unit; and a shell, which accommodates the converter unit, the converter unit comprises: a converter unit main body, which includes a semiconductor module; and a flow path portion, which includes a cooling air flow path and is arranged on the back side of the converter unit main body, the cooling air flow path extends in the up and down directions and is used for air to cool the semiconductor module to pass through the inside, the flow path portion comprises: a heat dissipation component, which is arranged in the cooling air flow path in a manner in contact with the semiconductor module; and a fan, which is used to make air pass from one side of the bottom and the top toward the other side in the cooling air flow path, the outlet of the cooling air flow path is arranged on the back side of the flow path portion, and at least a part of the outlet of the cooling air flow path is arranged below the upper surface of the converter unit main body and above the bottom surface of the converter unit main body.

[0014] In the power conversion device according to the second aspect of the present invention, as described above, similarly to the converter unit according to the first aspect, the outlet of the cooling air flow path is arranged on the surface on the back side of the flow path portion, and the flow path portion is arranged on the back side of the converter unit body. Thus, similarly to the converter unit according to the first aspect, it is possible to suppress the heat effect of the air that has become relatively hot while cooling the semiconductor module of the converter unit on other electrical devices arranged above the converter unit.

[0015] In addition, in the power conversion device of the second aspect, as described above, similarly to the converter unit of the first aspect, at least a portion of the outlet of the cooling air flow path is arranged below the upper surface of the converter unit body and above the bottom surface of the converter unit body. Thus, similarly to the converter unit of the first aspect, the height of the converter unit can be suppressed from increasing.

[0016] In the power conversion device of the second aspect, preferably, a plurality of converter units are arranged in a vertical direction in the housing. With such a configuration, since other converter units are arranged above one converter unit, the following structure can be effectively applied: it is possible to suppress the heat effect of air that has become relatively hot due to cooling the semiconductor module on other electrical devices arranged above the converter unit.

[0017] In the power conversion device of the second aspect, it is preferred that the housing includes: an air intake port, which is arranged on the front surface side of the housing; a unit storage portion, which stores the converter unit; and an exhaust flow path, which is arranged at a position closer to the back side than the unit storage portion, and the air supplied to the cooling air flow path of the converter unit is configured to be supplied into the housing through the air intake port, and the air discharged from the outlet of the cooling air flow path of the converter unit is configured to be discharged to the outside of the housing through the exhaust flow path. If so configured, the air discharged from the outlet of the cooling air flow path of the converter unit to the back side of the flow path portion can be discharged to the outside of the housing through the exhaust flow path, and the exhaust flow path is arranged at a position closer to the back side than the unit storage portion that stores the converter unit. As a result, it is possible to reliably suppress the heat effect of the air that becomes relatively high temperature due to cooling the semiconductor module of the converter unit on other electrical equipment arranged above the converter unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a perspective view showing a power conversion device according to one embodiment of the present invention.

[0019] Figure 2 This is a cross-sectional view along the YZ plane of the power conversion device according to one embodiment of the present invention.

[0020] Figure 3 It is a perspective view showing a converter unit according to one embodiment of the present invention.

[0021] Figure 4 This is a cross-sectional view of the converter unit according to one embodiment of the present invention, taken along the YZ plane.

[0022] Figure 5 It is along Figure 4 A cross-sectional view of line VV. DETAILED DESCRIPTION

[0023] Hereinafter, embodiments of the present invention will be described based on the drawings.

[0024] Reference Figure 1 to Figure 5 The configuration of the converter unit 100 and the power conversion device 150 according to one embodiment of the present invention will be described. The power conversion device 150 is a device for converting electric power in factory equipment or the like.

[0025] (Overall structure of power conversion device)

[0026] like Figure 1 As shown, the power conversion device 150 includes a converter unit 100 and an electrical device 110 other than the converter unit 100 (see Figure 2 ), and a housing 120 that accommodates the converter unit 100, electrical equipment 110 other than the converter unit 100, and the like.

[0027] In the following description, the left-right direction, front-back direction, and up-down direction of the housing 120 are referred to as the X direction, the Y direction, and the Z direction, respectively. In addition, the left side (left) and the right side (right) in the left-right direction (X direction) of the housing 120 are referred to as the X1 side and the X2 side, respectively. In addition, the front surface side and the back surface side in the front-back direction (Y direction) of the housing 120 are referred to as the Y1 side and the Y2 side, respectively. In addition, the upper side (upper side) and the lower side (lower side) in the up-down direction (Z direction) of the housing 120 are referred to as the Z1 side and the Z2 side, respectively.

[0028] A plurality of converter units 100 are arranged in the vertical direction (Z direction) in the housing 120. In addition, a plurality of converter units 100 are arranged in the horizontal direction (X direction) in the housing 120. Specifically, the plurality of converter units 100 arranged in the X direction (in Figure 1 The groups of converter units 100 are arranged in a plurality of rows (in the Z direction) in a manner such that the converter units 100 are arranged in a plurality of rows (in the Z direction). Figure 1 In addition, the number of converter units 100 arranged in the X direction may be other than five, and the number of columns (number) of converter units 100 arranged in the Z direction may be other than two columns (two).

[0029] like Figure 2 As shown, the electrical equipment 110 other than the converter unit 100 is, for example, a reactor 111 , a wiring circuit breaker 112 , a control power supply, and the like.

[0030] <Case Structure>

[0031] like Figure 1 As shown, the housing 120 has a box shape. The housing 120 is made of metal.

[0032] like Figure 2 As shown, the housing 120 includes a unit storage portion 121 and an exhaust flow path 122. The unit storage portion 121 is arranged on the Y1 side in the housing 120. The unit storage portion 121 accommodates the converter unit 100, the wiring circuit breaker 112, the control power supply, etc. The exhaust flow path 122 is arranged in the housing 120 at a position closer to the back side (Y2 side) than the unit storage portion 121. The exhaust flow path 122 accommodates the reactor 111, etc. The unit storage portion 121 and the exhaust flow path 122 are separated by a partition plate 125 extending along the X direction and the Z direction. In addition, the converter unit 100 is arranged to be adjacent to the partition plate 125 in the Y direction in the unit storage portion 121.

[0033] The housing 120 includes a front door 123, which is disposed on the Y1 side of the unit storage section 121 and can be opened and closed on the Y1 side relative to the unit storage section 121. The user can access the converter unit 100, the wiring circuit breaker 112, the control power supply, etc. stored in the unit storage section 121 by opening the front door 123 on the Y1 side.

[0034] The housing 120 includes an air intake port 123a, which is disposed on the front surface side (Y1 side) of the housing 120. Specifically, the front surface door 123 disposed on the Y1 side of the unit storage portion 121 is formed with an air intake port 123a configured to enable ventilation between the outside of the housing 120 and the unit storage portion 121. Figure 1 As shown, the air intake port 123a is composed of a plurality of holes penetrating the front surface door 123 along the Y direction.

[0035] like Figure 2 As shown, the housing 120 includes an air outlet 124a, which is arranged at the upper end of the housing 120. Specifically, in the top plate 124 of the housing 120, an air outlet 124a is formed at a position corresponding to the exhaust flow path 122, which allows air to flow between the outside of the housing 120 and the exhaust flow path 122. The air outlet 124a is composed of one hole that penetrates the top plate 124 in the Z direction. In addition, the air outlet 124a may also be composed of a plurality of holes that penetrate the top plate 124 in the Z direction.

[0036] (Construction of converter unit)

[0037] like Figure 3 As shown, the converter unit 100 includes a converter unit main body 10 and a flow path portion 20 arranged on the back side (Y2 side) of the converter unit main body 10 .

[0038] <Converter unit main body structure>

[0039] like Figure 4 As shown, the converter unit main body 10 includes a substrate 11 , a semiconductor module 12 , and a capacitor 13 .

[0040] like Figure 3 As shown, the converter unit body 10 has a box shape. Figure 4 As shown, a substrate 11 , a semiconductor module 12 , a capacitor 13 , and the like are accommodated in a converter unit main body 10 .

[0041] The substrate 11 is a printed circuit board having a component placement surface on which electronic components are placed. The substrate 11 is placed so that the component placement surface extends along the Z direction.

[0042] The semiconductor module 12 includes a switching element for converting electric power, etc. The semiconductor module 12 is arranged on the component arrangement surface on the Y2 side of the substrate 11. The semiconductor module 12 is arranged in the center of the converter unit main body 10 in the Z direction.

[0043] Capacitor 13 is a smoothing capacitor. Capacitor 13 is arranged on the component arrangement surface on the Y1 side of substrate 11. Capacitor 13 is arranged on the upper part of converter unit body 10 in the Z direction. Alternatively, capacitor 13 may be arranged in the center or lower part of converter unit body 10 in the Z direction.

[0044] <Flow path structure>

[0045] like Figure 4 As shown, the flow path portion 20 includes a flow path case 21 , a cooling air flow path 22 , a heat dissipating member 23 , a fan 24 , and a guide member 25 .

[0046] like Figure 5 As shown, the flow path housing 21 includes a surface 21a on the Y2 side, a surface 21b on the X1 side, a surface 21c on the X2 side, a first surface 21d on the Y1 side, and a second surface 21e on the Y1 side. The surface 21a on the Y2 side, the surface 21b on the X1 side, the surface 21c on the X2 side, the first surface 21d on the Y1 side, and the second surface 21e on the Y1 side have a flat plate shape.

[0047] The surface 21a on the Y2 side, the surface 21b on the X1 side, the surface 21c on the X2 side, the first surface 21d on the Y1 side, and the second surface 21e on the Y1 side are formed integrally. Specifically, the surface 21a on the Y2 side extends along the X direction and the Z direction. The surface 21b on the X1 side extends along the Y direction and the Z direction. The end on the Y2 side of the surface 21b on the X1 side is connected to the end on the X1 side of the surface 21a on the Y2 side. The surface 21c on the X2 side extends along the Y direction and the Z direction. The end on the Y2 side of the surface 21c on the X2 side is connected to the end on the X2 side of the surface 21a on the Y2 side. The first surface 21d on the Y1 side extends along the X direction and the Z direction. The end on the X1 side of the first surface 21d on the Y1 side is connected to the end on the Y1 side of the surface 21b on the X1 side. The second surface 21e on the Y1 side extends along the X direction and the Z direction. The end of the second surface 21e on the Y1 side on the X2 side is connected to the end of the surface 21c on the X2 side on the Y2 side. In addition, the end of the first surface 21d on the Y1 side on the X2 side and the end of the second surface 21e on the Y1 side on the X1 side are separated in the X direction.

[0048] The first surface 21d on the Y1 side and the second surface 21e on the Y1 side are respectively attached to the surface 10a on the Y2 side of the converter unit body 10 by fastening members or the like. That is, the flow path case 21 is attached to the Y2 side of the converter unit body 10 by fastening members or the like.

[0049] The surface 21a on the Y2 side is arranged to be aligned with the partition plate 125 (see Figure 2 ) are adjacent. Figure 2 As shown, an opening 125 a is formed in the partition plate 125 of the housing 120 at a position overlapping with an outlet 22 b of a cooling air flow path 22 described later when viewed from the X direction.

[0050] like Figure 4 As shown in FIG. 1 , the cooling air flow path 22 is configured to extend in the vertical direction (Z direction) and air for cooling the semiconductor module 12 passes through the interior. Figure 5 As shown, the cooling air flow path 22 is a cylindrical space extending along the Z direction, which is formed by the surface 21a on the Y2 side of the flow path shell 21, the surface 21b on the X1 side, the surface 21c on the X2 side, the first surface 21d on the Y1 side and the second surface 21e on the Y1 side, and the surface 10a on the Y2 side of the converter unit body 10.

[0051] like Figure 4 As shown, the inlet 22 a of the cooling air flow path 22 is an opening on the Z2 side of the cooling air flow path 22 configured as a tube extending in the Z direction. That is, the inlet 22 a of the cooling air flow path 22 is arranged at the lower end of the flow path portion 20 .

[0052] The outlet 22b of the cooling air flow path 22 is arranged on the surface 21a on the back side (Y2 side) of the flow path portion 20 (flow path housing 21), and the flow path portion 20 is arranged on the back side (Y2 side) of the converter unit body 10. Figure 3 As shown, the outlet 22b of the cooling air flow path 22 is composed of a plurality of holes penetrating the surface 21a on the Y2 side of the flow path housing 21 along the Y direction. Alternatively, the outlet 22b of the cooling air flow path 22 may be composed of a single hole penetrating the surface 21a on the Y2 side of the flow path housing 21 along the Y direction.

[0053] like Figure 4 As shown, the outlet 22b of the cooling air flow path 22 is arranged as a whole at a position lower than the upper surface 10b of the converter unit body 10 (Z2 side) and higher than the bottom surface 10c of the converter unit body 10 (Z1 side). That is, at least a part of the outlet 22b of the cooling air flow path 22 is arranged at a position lower than the upper surface 10b of the converter unit body 10 (Z2 side) and higher than the bottom surface 10c of the converter unit body 10 (Z1 side). Specifically, the upper end of the outlet 22b of the cooling air flow path 22 is arranged at a position lower than the upper surface 10b of the converter unit body 10 (Z2 side). In addition, the lower end of the outlet 22b of the cooling air flow path 22 is arranged at a position closer to the Z1 side than the center of the converter unit body 10 in the Z direction.

[0054] The fan 24, the heat dissipation member 23, and the guide member 25 are arranged in this order from the bottom (Z2 side) toward the top (Z1 side) in the cooling air flow path 22. That is, the fan 24, the heat dissipation member 23, and the guide member 25 are arranged in this order from one of the bottom (Z2 side) and the top (Z1 side) toward the other in the cooling air flow path 22.

[0055] The heat dissipation member 23 is arranged in the central part of the cooling air flow path 22 in the vertical direction (Z direction). The heat dissipation member 23 is made of metal. The heat dissipation member 23 uses a metal with a relatively high thermal conductivity (such as aluminum). The heat dissipation member 23 includes a base portion 23a and a plurality of heat dissipation fins 23b. The base portion 23a has a plate shape extending in the X direction and the Z direction. Figure 5 As shown, the plurality of fins 23b have a plate shape extending in the Y direction and the Z direction while protruding from the base portion 23a toward the Y2 side. That is, the air passing through the cooling air flow path 22 passes through the gaps between the plurality of fins 23b along the Z direction.

[0056] The heat dissipation member 23 is arranged in the cooling air flow path 22 in a manner in contact with the semiconductor module 12. Specifically, in the Z direction, a through hole is formed in the Y direction at the position where the semiconductor module 12 is arranged in the surface 10a on the back side (Y2 side) of the converter unit body 10. In addition, the surface on the Y1 side of the base portion 23a of the heat dissipation member 23 is in contact with the surface on the Y2 side of the semiconductor module 12. As a result, the heat generated from the semiconductor module 12 is transferred to the plurality of heat sinks 23b via the base portion 23a of the heat dissipation member 23. In addition, the plurality of heat sinks 23b are cooled by air passing between the plurality of heat sinks 23b along the Z direction. The heat generated from the semiconductor module 12 is dissipated by repeating the above process. That is, the semiconductor module 12 is cooled.

[0057] like Figure 4 As shown, the fan 24 is arranged at the lower part of the cooling air flow path 22. The fan 24 is provided to allow air to pass from the lower side (Z2 side) to the upper side (Z1 side) in the cooling air flow path 22. That is, the fan 24 is provided to allow air to pass from one side (Z2 side) to the other side in the cooling air flow path 22. The fan 24 is arranged to allow air to pass in the up-down direction (Z direction). Specifically, the fan 24 is arranged in such a manner that the rotation axis is along the up-down direction (Z direction).

[0058] The guide member 25 is arranged at the upper part of the cooling air flow path 22 in the vertical direction (Z direction). The guide member 25 is provided to guide the air in the cooling air flow path 22 to the outlet 22b of the cooling air flow path 22. The guide member 25 is configured separately from the flow path housing 21. In addition, the guide member 25 may also be configured integrally with the flow path housing 21.

[0059] The guide member 25 is arranged so as to be inclined from the front surface side (Y1 side) of the cooling air flow path 22 (flow path portion 20) toward the back surface side (Y2 side) as it goes from the bottom (Z2 side) to the top (Z1 side). That is, the guide member 25 is arranged so as to be inclined from the front surface side (Y1 side) of the cooling air flow path 22 (flow path portion 20) toward the back surface side (Y2 side) as it goes from one of the bottom (Z2 side) and the top (Z1 side) to the other.

[0060] The guide member 25 is composed of a single flat plate member that is inclined from the front surface side (Y1 side) of the flow path portion 20 toward the back surface side (Y2 side) as it goes from the bottom (Z2 side) to the top (Z1 side). That is, the guide member 25 is composed of a single flat plate member that is inclined from the front surface side (Y1 side) of the flow path portion 20 toward the back surface side (Y2 side) as it goes from one of the bottom (Z2 side) and the top (Z1 side) to the other.

[0061] The guide member 25 is entirely arranged at a position below the upper surface 10b of the converter unit body 10 (Z2 side) and above the bottom surface 10c of the converter unit body 10 (Z1 side). That is, at least a portion of the guide member 25 is arranged below the upper surface 10b of the converter unit body 10 (Z2 side) and above the bottom surface 10c of the converter unit body 10 (Z1 side). Specifically, the end 25a of the guide member 25 on the Z1 side is arranged below the upper surface 10b of the converter unit body 10 (Z2 side). In addition, the end 25b of the guide member 25 on the Z2 side is arranged near the end 23c of the heat dissipation member 23 on the Z1 side. That is, the end 25b of the guide member 25 on the heat dissipation member 23 side (Z2 side) is arranged near the end 23c of the heat dissipation member 23 on the guide member 25 side (Z1 side).

[0062] (Flow of air for cooling semiconductor modules of converter units)

[0063] like Figure 2As shown, the air supplied to the cooling air flow path 22 of the converter unit 100 is configured to be supplied into the housing 120 through the air intake port 123a. Specifically, by driving the fan 24, the air outside the housing 120 is supplied into the housing 120 (the unit storage portion 121 storing the converter unit 100) through the air intake port 123a formed in the front surface door 123.

[0064] The air supplied to the unit storage section 121 is supplied into the cooling air flow path 22 from the inlet 22a of the cooling air flow path 22 disposed at the lower end of the flow path section 20. The air supplied into the cooling air flow path 22 passes through the fan 24 and the heat sink 23 in this order from the Z2 side to the Z1 side in the cooling air flow path 22. The air supplied into the cooling air flow path 22 passes through the heat sink 23 while being heated by the semiconductor module 12 (see Figure 4 The relatively high temperature air that has passed through the heat dissipation member 23 is bent from the direction from the Z2 side toward the Z1 side to the direction from the Y1 side toward the Y2 side by the guide member 25, and is guided to the surface 21a (refer to FIG. 21 ) on the Y2 side of the flow path portion 20 of the cooling air flow path 22. Figure 4 ) configured outlet 22b.

[0065] The air discharged from the outlet 22b of the cooling air flow path 22 of the converter unit 100 is configured to be discharged to the outside of the housing 120 through the exhaust flow path 122. Specifically, the relatively high temperature air discharged from the outlet 22b of the cooling air flow path 22 is discharged to the exhaust flow path 122 through the opening 125a formed in the partition plate 125 that partitions the unit storage portion 121 and the exhaust flow path 122. The relatively high temperature air discharged to the exhaust flow path 122 passes through the exhaust flow path 122 from the Z2 side to the Z1 side, and then is discharged to the outside of the housing 120 through the air outlet 124a formed in the top plate 124 of the housing 120. In addition, the relatively high temperature air discharged to the outside of the housing 120 passes through the exhaust guide member 130 disposed above the housing 120, and then is discharged from the exhaust guide member 130 along the Y1 direction and the Y2 direction to the outside of the exhaust guide member 130. In addition, the discharge guide member 130 may not be provided above the housing 120 .

[0066] (Effects of this embodiment)

[0067] In this embodiment, the following effects can be obtained.

[0068] In the present embodiment, as described above, the outlet 22b of the cooling air flow path 22 is arranged on the surface 21a on the back side of the flow path portion 20, and the flow path portion 20 is arranged on the back side (Y2 side) of the converter unit main body 10. As a result, the air that has become relatively hot due to cooling the semiconductor module 12 of the converter unit 100 can be discharged from the outlet 22b of the cooling air flow path 22 arranged on the surface 21a on the back side of the flow path portion 20 to the back side of the flow path portion 20. As a result, it is possible to suppress the air that has become relatively hot due to cooling the semiconductor module 12 of the converter unit 100 from having a thermal effect on other electrical devices arranged above the converter unit 100 (Z1 side).

[0069] In addition, in the present embodiment, as described above, at least a portion of the outlet 22b of the cooling air flow path 22 is arranged below the upper surface 10b of the converter unit main body 10 (Z2 side) and above the bottom surface 10c of the converter unit main body 10 (Z1 side). Thus, compared with a case where the outlet 22b of the cooling air flow path 22 is entirely arranged above the upper surface 10b of the converter unit main body 10 or below the bottom surface 10c of the converter unit main body 10, it is possible to suppress the upper end of the flow path portion 20 including the cooling air flow path 22 from protruding upward relative to the upper surface 10b of the converter unit main body 10 and the lower end of the flow path portion 20 including the cooling air flow path 22 from protruding downward relative to the bottom surface 10c of the converter unit main body 10. Thus, it is possible to suppress the converter unit 100 from increasing in height.

[0070] In addition, in the present embodiment, as described above, the flow path portion 20 includes the guide member 25 that guides the air in the cooling air flow path 22 to the outlet 22b of the cooling air flow path 22. Furthermore, at least a portion of the guide member 25 is disposed below the upper surface 10b of the converter unit body 10 (Z2 side) and above the bottom surface 10c of the converter unit body 10 (Z1 side). Thus, compared with a case where the guide member 25 is entirely disposed above the upper surface 10b of the converter unit body 10 or below the bottom surface 10c of the converter unit body 10, it is possible to suppress the upper end portion of the flow path portion 20 including the guide member 25 from protruding upward relative to the upper surface 10b of the converter unit body 10 and the lower end portion of the flow path portion 20 including the guide member 25 from protruding downward relative to the bottom surface 10c of the converter unit body 10. Thus, even when the flow path portion 20 includes the guide member 25, it is possible to suppress the converter unit 100 from becoming taller.

[0071] In addition, in the present embodiment, as described above, the heat dissipation member 23 is arranged in the central part of the cooling air flow path 22 in the up-down direction (Z direction). Furthermore, the guide member 25 is arranged to be inclined from the front surface side (Y1 side) of the flow path portion 20 toward the back side (Y2 side) as it goes from one side of the bottom (Z2 side) and the top (Z1 side) to the other. In addition, the end 25b of the guide member 25 on the heat dissipation member 23 side is arranged near the end 23c of the guide member 25 on the heat dissipation member 23. Thus, since the guide member 25 is arranged to be inclined from the front surface side of the flow path portion 20 toward the back side as it goes from one side of the bottom and the top to the other, the air in the cooling air flow path 22 can be efficiently guided to the outlet 22b of the cooling air flow path 22. In addition, in accordance with the end 25b of the guide member 25 on the heat dissipation member 23 side being arranged near the end 23c of the guide member 25 on the heat dissipation member 23, the end 25a of the guide member 25 on the side opposite to the heat dissipation member 23 can be located on the side of the heat dissipation member 23 arranged in the central portion of the cooling air flow path 22 in the vertical direction. Thus, even when the guide member 25 is arranged so as to be inclined from the front surface side of the flow path portion 20 toward the back surface side as it goes from one of the lower side and the upper side to the other, it is easy to realize a structure in which at least a part of the guide member 25 is arranged below the upper surface 10b of the converter unit main body 10 and above the bottom surface 10c of the converter unit main body 10.

[0072] In addition, in the present embodiment, as described above, the guide member 25 is composed of a single flat plate member that is inclined from the front surface side (Y1 side) of the flow path portion 20 toward the back surface side (Y2 side) as it goes from one of the lower side (Z2 side) and the upper side (Z1 side) to the other. Thus, compared with the case where the guide member 25 is composed of a plurality of members or the case where the guide member 25 is composed of a member having a complex shape, it is possible to easily manufacture the guide member 25 that is inclined from the front surface side of the flow path portion 20 toward the back surface side as it goes from one of the lower side and the upper side to the other.

[0073] In addition, in the present embodiment, as described above, the fan 24, the heat dissipation member 23, and the guide member 25 are arranged in this order from one of the lower side (Z2 side) and the upper side (Z1 side) toward the other side in the cooling air flow path 22. Thus, in the cooling air flow path 22, the fan 24 is arranged at a position on the upstream side of the heat dissipation member 23, so that the air passing through the fan 24 can be made relatively low in temperature. Thus, it is possible to suppress the deterioration of the fan 24 due to exposure to relatively high temperature air.

[0074] In addition, in the present embodiment, as described above, a plurality of converter units 100 are arranged in the vertical direction (Z direction) in the housing 120. Thus, since other converter units 100 are arranged above one converter unit 100 (on the Z1 side), it is possible to effectively apply a structure in which the air that has become relatively hot by cooling the semiconductor module 12 can be prevented from having a thermal effect on other electrical devices arranged above the converter unit 100 (on the Z1 side).

[0075] In addition, in the present embodiment, as described above, the housing 120 includes: the air intake port 123a, which is arranged on the front surface side (Y1 side) of the housing 120; the unit storage portion 121, which stores the converter unit 100; and the exhaust flow path 122, which is provided at a position closer to the back side (Y2 side) than the unit storage portion 121. And the air supplied to the cooling air flow path 22 of the converter unit 100 is configured to be supplied into the housing 120 through the air intake port 123a. In addition, the air discharged from the outlet 22b of the cooling air flow path 22 of the converter unit 100 is configured to be discharged to the outside of the housing 120 through the exhaust flow path 122. Thus, the air exhausted from the outlet 22b of the cooling air flow path 22 of the converter unit 100 to the back side of the flow path portion 20 can be exhausted to the outside of the housing 120 through the exhaust flow path 122 provided at the back side of the unit housing portion 121 housing the converter unit 100. Thus, it is possible to reliably suppress the air, which has become relatively hot by cooling the semiconductor module 12 of the converter unit 100, from exerting a thermal influence on other electrical devices arranged above the converter unit 100 (on the Z1 side).

[0076] [Modifications]

[0077] The embodiments disclosed this time should be considered as illustrative in all aspects and not restrictive. The scope of the present invention is indicated by the claims rather than the description of the embodiments above, and includes all modifications (variations) within the meaning and scope equivalent to the claims.

[0078] For example, in the above embodiment, an example is shown in which the air supplied to the cooling air flow path 22 of the converter unit 100 is configured to be supplied into the housing 120 via the air intake port 123a arranged on the front surface side (Y1 side) of the housing 120, but the present invention is not limited to this. In the present invention, the air supplied to the cooling air flow path of the converter unit may be configured to be supplied into the housing via a portion other than the above-mentioned air intake port.

[0079] In addition, in the above embodiment, an example is shown in which the air discharged from the outlet 22b of the cooling air flow path 22 of the converter unit 100 is configured to be discharged to the outside of the housing 120 via the exhaust flow path 122, and the exhaust flow path 122 is provided at a position closer to the back side (Y2 side) than the unit storage portion 121 storing the converter unit 100, but the present invention is not limited to this. In the present invention, the air discharged from the outlet of the cooling air flow path of the converter unit may be configured to be discharged to the outside of the housing via a portion other than the above-mentioned exhaust flow path.

[0080] In addition, in the above embodiment, an example is shown in which a plurality of converter units 100 are arranged in the vertical direction (Z direction) in the housing 120, but the present invention is not limited thereto. In the present invention, a plurality of converter units may be arranged in the housing in a manner not arranged in the vertical direction, or a plurality of converter units may not be arranged in the housing.

[0081] In addition, in the above embodiment, an example is shown in which a plurality of converter units 100 are arranged in the left-right direction (X direction) in the housing 120, but the present invention is not limited thereto. In the present invention, a plurality of converter units may be arranged in the housing in a manner not arranged in the left-right direction, or a plurality of converter units may not be arranged in the housing.

[0082] In addition, in the above embodiment, the fan 24, the heat dissipation member 23, and the guide member 25 are arranged in the cooling air flow path 22 from the bottom (Z2 side) to the top (Z1 side) in the order of the fan 24, the heat dissipation member 23, and the guide member 25, but the present invention is not limited thereto. In the present invention, the fan, the heat dissipation member, and the guide member may be arranged in the cooling air flow path from the top to the bottom in the order of the fan, the heat dissipation member, and the guide member.

[0083] In addition, in the above-mentioned embodiment, an example is shown in which the fan 24, the heat dissipation component 23, and the guide component 25 are arranged in the order of the fan 24, the heat dissipation component 23, and the guide component 25 from one side of the bottom (Z2 side) and the top (Z1 side) toward the other side in the cooling air flow path 22, but the present invention is not limited to this. In the present invention, the fan, the heat dissipation component, and the guide component may not be arranged in the order of the fan, the heat dissipation component, and the guide component from one side of the bottom and the top toward the other side in the cooling air flow path. For example, the heat dissipation component, the fan, and the guide component may also be arranged in the order of the heat dissipation component, the fan, and the guide component from one side of the bottom and the top toward the other side in the cooling air flow path.

[0084] In the above embodiment, the fan 24 is arranged to pass air in the up-down direction (Z direction), but the present invention is not limited thereto. In the present invention, the fan may be arranged to pass air in the front-rear direction.

[0085] In addition, in the above-mentioned embodiment, an example is shown in which the guide member 25 is composed of a single flat plate member that is inclined from the front surface side (Y1 side) of the flow path portion 20 toward the back side (Y2 side) as it goes from the bottom (Z2 side) to the top (Z1 side), but the present invention is not limited to this. In the present invention, the guide member may also be composed of a single flat plate member that is inclined from the front surface side of the flow path portion toward the back side as it goes from the top to the bottom.

[0086] In addition, in the above-mentioned embodiment, an example is shown in which the guide member 25 is composed of a single flat plate member that is inclined from the front surface side (Y1 side) of the flow path portion 20 toward the back side (Y2 side) as it goes from one of the lower side (Z2 side) and the upper side (Z1 side), but the present invention is not limited to this. In the present invention, if the guide member 25 includes a portion that is inclined from the front surface side of the flow path portion 20 toward the back side as it goes from one of the lower side and the upper side to the other, it can be composed of a plurality of members or a member having a complex shape.

[0087] In addition, in the above embodiment, the guide member 25 is configured to be inclined from the front surface side (Y1 side) of the flow path portion 20 toward the back side (Y2 side) as it goes from the bottom (Z2 side) to the top (Z1 side), but the present invention is not limited to this. In the present invention, the guide member may be configured to be inclined from the front surface side of the flow path portion toward the back side as it goes from the top to the bottom.

[0088] In addition, in the above-mentioned embodiment, an example is shown in which the guide member 25 is arranged to be inclined from the front surface side (Y1 side) of the flow path portion 20 toward the back side (Y2 side) as it goes from one of the lower side (Z2 side) and the upper side (Z1 side) to the other, but the present invention is not limited thereto. In the present invention, the guide member may not be arranged to be inclined from the front surface side of the flow path portion toward the back side as it goes from one of the lower side and the upper side to the other.

[0089] In addition, in the above embodiment, an example is shown in which the end 25b of the guide member 25 on the heat dissipation member 23 side is arranged near the end 23c of the heat dissipation member 23 on the guide member 25 side, but the present invention is not limited to this. In the present invention, the end of the guide member on the heat dissipation member side may not be arranged near the end of the heat dissipation member on the guide member side.

[0090] In addition, in the above-mentioned embodiment, an example is shown in which at least a part of the guide member 25 is arranged below the upper surface 10b of the converter unit main body 10 (Z2 side) and above the bottom surface 10c of the converter unit main body 10 (Z1 side), but the present invention is not limited to this. In the present invention, the guide member may not be arranged below the upper surface of the converter unit main body and above the bottom surface of the converter unit main body.

[0091] In addition, in the above-mentioned embodiment, an example is shown in which the flow path portion 20 includes a guide member 25 that guides the air in the cooling air flow path 22 to the outlet 22b of the cooling air flow path 22, but the present invention is not limited to this. In the present invention, the flow path portion may not include a guide member that guides the air in the cooling air flow path to the outlet of the cooling air flow path. In this case, it is preferable that the flow path portion has no openings other than the inlet and outlet of the cooling air flow path, so as to prevent the air that has become relatively hot due to cooling the semiconductor module of the converter unit from being discharged above the flow path portion.

Claims

1. A converter unit, wherein: The converter unit has: a converter unit body including a semiconductor module; and a flow path portion including a cooling air flow path and arranged on the back side of the converter unit body, the cooling air flow path extending in the up-down direction and through which air for cooling the semiconductor module passes, The flow path portion comprises: a heat dissipation member disposed in the cooling air flow path so as to be in contact with the semiconductor module; and a fan for passing air through the cooling air flow path from one side toward the other side, The outlet of the cooling air flow path is arranged on the back side of the flow path portion. At least a portion of the outlet of the cooling air flow path is arranged below an upper surface of the converter unit main body and above a bottom surface of the converter unit main body.

2. The converter unit according to claim 1, wherein: The flow path portion includes a guide member that guides the air in the cooling air flow path toward the outlet of the cooling air flow path. At least a portion of the guide member is disposed below the upper surface of the converter unit main body and above the bottom surface of the converter unit main body.

3. The converter unit according to claim 2, wherein: The heat dissipation member is disposed at a central portion of the cooling air flow path in a vertical direction. The guide member is arranged to be inclined from the front surface side of the flow path portion toward the back surface side as it goes from one of the bottom and the top to the other. The end portion of the guide member on the heat dissipation member side is arranged in the vicinity of the end portion of the heat dissipation member on the guide member side.

4. The converter unit according to claim 3, wherein: The guide member is composed of a single flat plate member that is inclined from the front surface side of the flow path portion toward the back surface side as it goes from one of the lower side and the upper side toward the other.

5. The converter unit according to claim 2, wherein: The fan, the heat dissipation member, and the guide member are arranged in this order from one of a lower side and an upper side toward the other side in the cooling air flow path.

6. A power conversion device, wherein: The power conversion device has: a converter unit; and a housing for housing the converter unit, The converter unit comprises: a converter unit body including a semiconductor module; and a flow path portion including a cooling air flow path and arranged on the back side of the converter unit body, the cooling air flow path extending in the up-down direction and through which air for cooling the semiconductor module passes, The flow path portion comprises: a heat dissipation member disposed in the cooling air flow path so as to be in contact with the semiconductor module; and a fan for passing air through the cooling air flow path from one side toward the other side, The outlet of the cooling air flow path is arranged on the back side of the flow path portion. At least a portion of the outlet of the cooling air flow path is arranged below an upper surface of the converter unit main body and above a bottom surface of the converter unit main body.

7. The power conversion device according to claim 6, wherein: A plurality of the converter units are arranged in the housing in an up-down direction.

8. The power conversion device according to claim 6, wherein: The housing comprises: an air intake port disposed on the front surface side of the housing; a unit storage portion storing the converter unit; and an exhaust flow path provided at a rear side of the unit storage portion, The air supplied to the cooling air flow path of the converter unit is configured to be supplied into the housing through the air intake port. The air exhausted from the outlet of the cooling air flow path of the converter unit is configured to be exhausted to the outside of the casing via the exhaust flow path.

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