Repair device

Abstract

The invention relates to a repair device. The repair device according to one embodiment includes: a laser generator that irradiates laser light; a laser pressurizing head module that transmits the laser light and is capable of pressurizing in one direction; the processor is connected to the laser generator and the laser pressurization head module and controls operation of the laser generator and the laser pressurization head module, and the laser pressurization head module comprises a rigid light-transmitting part and an elastic film which is deformed in shape through laser irradiation.

Description

Technical Field

[0001] The present disclosure relates to prosthetic devices. Background Art

[0002] With the development of information society, the demand for display devices for displaying images is increasing in various forms. The display device may be a flat panel display device such as a liquid crystal display device (Liquid Crystal Display), a field emission display device (Field Emission Display), a light emitting display device (Light Emitting Display), etc.

[0003] The light-emitting display device can be implemented as an organic light-emitting display device including an organic light-emitting diode element as a light-emitting element, an inorganic light-emitting display device including an inorganic semiconductor element as a light-emitting element, or an ultra-small light-emitting diode display device including an ultra-small light-emitting diode element (or micro light emitting diode element) as a light-emitting element.

[0004] In the case of ultra-small light-emitting diode elements, it can refer to LEDs (Light Emitting Diodes) with a width, length, and height of 10 micrometers (μm) to 100 μm. Micro LEDs can be manufactured in the form of chips on a wafer and arranged on a target substrate to form a light-emitting module for a display.

[0005] A display device using micro LEDs can be manufactured by mounting as few as tens of thousands to as many as tens of millions of micro LEDs at dense intervals.

[0006] However, some of the installed micro LEDs, which range from tens of thousands to tens of millions, may fail to perform their functions due to tolerances in the process and defects in the micro LEDs themselves.

[0007] Therefore, a repair process is needed to remove defective micro LEDs and replace them with new micro LEDs at their removed locations. Summary of the invention

[0008] Technical issues to be solved

[0009] The technical problem of the present disclosure is to provide a plurality of light emitting elements for repair that can stably support and easily repair a step during laser welding.

[0010] The technical problems of the present disclosure are not limited to the above-mentioned technical problems, and those skilled in the art can clearly understand other technical problems not mentioned through the following description.

[0011] Workaround

[0012] A repair device according to one embodiment for solving the above-mentioned technical problem may include: a laser generator, which irradiates laser; a laser pressure head module, which allows the laser to be transmitted and is capable of applying pressure in one direction; and a processor, which is connected to the laser generator and the laser pressure head module and controls the operation of the laser generator and the laser pressure head module, wherein the laser pressure head module may include a rigid light-transmitting component and an elastic membrane that is deformed in shape by laser irradiation.

[0013] The elastic film has an adhesive layer on one surface.

[0014] The elastic film may be arranged to overlap with the light transmitting member in a thickness direction, and may be deformed into a shape that is convex in a laser irradiation direction in a region irradiated with laser light.

[0015] The laser pressure head module may further include: a gas supply component for injecting gas or air into the sealed space between the light-transmitting component and the elastic membrane, thereby generating a pressure on the elastic membrane.

[0016] The gas supply component may include: a reservoir storing gas; a gas pump supplying the gas under pressure; a gas valve regulating the flow of the gas; and a gas supply conduit providing a path for the gas to be supplied to the inside of the sealed space.

[0017] The laser generator includes: a laser light source; and an optical path changing module that changes an irradiation position of laser light irradiated from the laser light source.

[0018] The repair device may further include: an inspection component that determines a defective state of the light emitting element arranged on the substrate and generates position information of the defective light emitting element determined to be defective.

[0019] The processor may control the laser generator to irradiate laser light to the defective light emitting element determined to be defective based on the position information, thereby removing the defective light emitting element from the substrate.

[0020] The processor may control the laser pressure head module to move onto a relay substrate or a substrate on which a repair light-emitting element is arranged.

[0021] The processor may control the laser generator on the laser pressure head module to irradiate the laser beam to a position on the relay substrate mapped to a position where the defective light emitting element is removed, based on the position information.

[0022] The processor can control the laser pressure head module to lift the repair light-emitting element bonded to the elastic film when the elastic film arranged at the bottom of the laser pressure head module is deformed by the laser irradiation to convexly toward the repair light-emitting element arranged on the relay substrate and thus bonded to the adhesive layer.

[0023] The processor can control the laser pressurizing head module to arrange the repair light-emitting element at the position mapped to the position where the defective light-emitting element was removed at the position where the defective light-emitting element was removed on the substrate and supply gas to the sealed space between the light-transmitting component and the elastic membrane, so that the elastic membrane pressurizes the light-emitting elements and the repair light-emitting elements arranged on the substrate.

[0024] The processor may control the laser generator to irradiate laser light toward a position where the repair light-emitting element is arranged, so that the repair light-emitting element is bonded to the substrate.

[0025] The laser pressure head module may be moved onto the relay substrate on which the repair light emitting element is arranged while maintaining a first interval between the laser pressure head module and the relay substrate.

[0026] The light emitting element may include a connection electrode, a first semiconductor layer, an active layer, and a second semiconductor layer, wherein the first semiconductor layer may be a p-type semiconductor layer, and the second semiconductor layer may be an n-type semiconductor layer.

[0027] According to another embodiment, the repair method may include: a step in which an inspection component determines a defective light-emitting element among a plurality of light-emitting elements arranged on a substrate and obtains position information of the defective light-emitting element; a step in which a laser generator irradiates a laser to the defective light-emitting element arranged on the substrate based on the position information, thereby removing the defective light-emitting element from the substrate; a step in which a laser pressure head module moves to a relay substrate on which a repair light-emitting element is arranged, and irradiates a laser to an elastic membrane of the laser pressure head module based on the position information, thereby lifting the repair light-emitting element at a position mapped to the position of the removed defective light-emitting element; and a step in which the laser pressure head module transfers the repair light-emitting element at a position mapped to the position of the removed defective light-emitting element to the position of the substrate from which the defective light-emitting element is removed, wherein the elastic membrane may have an adhesive layer on one surface and may include a substance that undergoes shape deformation by laser irradiation.

[0028] The step of lifting the repair light-emitting element at a position mapped to the position where the defective light-emitting element was removed may include: the step of the laser generator irradiating a laser on the laser pressure head module to a position mapped to the position where the defective light-emitting element was removed on the relay substrate based on the position information; and the step of the laser pressure head module lifting the repair light-emitting element when an elastic membrane arranged at the lower part of the laser pressure head module is deformed by the laser irradiation to convexly toward the side of the repair light-emitting element arranged on the relay substrate so that the repair light-emitting element adheres to the adhesive layer.

[0029] The laser pressure head module may be moved onto the relay substrate on which the repair light emitting element is arranged while maintaining a first interval between the laser pressure head module and the relay substrate.

[0030] The laser pressure head module may include a rigid light-transmitting component, an elastic membrane that is deformed in shape by laser irradiation, and a gas supply component that supplies gas to a sealed space between the light-transmitting component and the elastic membrane or exhausts gas from the sealed space, and the step of transferring a repair light-emitting element at a position mapped to a position where the defective light-emitting element is removed to a position on the substrate where the defective light-emitting element is removed may include: a step in which the laser pressure head module arranges a repair light-emitting element at a position mapped to a position where the defective light-emitting element is removed at a position on the substrate where the defective light-emitting element is removed; a step in which the gas supply component supplies gas to the sealed space between the light-transmitting component and the elastic membrane so that the elastic membrane pressurizes the light-emitting element and the repair light-emitting element arranged on the substrate; and a step in which the laser generator irradiates a laser to a position where the repair light-emitting element is arranged, thereby bonding the repair light-emitting element to the substrate.

[0031] Details of other embodiments are included in the detailed description and drawings.

[0032] Beneficial Effects

[0033] According to an embodiment, a light emitting element can be selectively picked up using an elastic film that reacts to a laser. A plurality of light emitting elements can be picked up almost simultaneously.

[0034] The position of the repaired light emitting element can be confirmed in real time, thereby improving the position accuracy of the repaired light emitting element.

[0035] The light emitting element can be pressurized by utilizing the expansion of the elastic film, so that a plurality of light emitting elements having steps can be pressurized with the same pressure.

[0036] The effects according to the embodiment are not limited to the above-exemplified contents, and more various effects are included in this specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is a schematic diagram showing a repair device according to an embodiment of the present disclosure. Figure 2 is an exploded perspective view of a pressurizing component according to some embodiments.

[0038] Figure 3 is a side view of a pressurizing component according to some embodiments.

[0039] Figure 4 is a cross-sectional view of a pressurizing member according to an embodiment.

[0040] Figure 5 FIG. 1 is a cross-sectional view showing filling of a sealed space of a pressurizing member with gas according to an embodiment.

[0041] Figure 6 is a cross-sectional view showing exhaust of gas from a pressurizing component according to an embodiment.

[0042] Figure 7 FIG. 1 is a cross-sectional view showing filling of a sealed space of a pressurizing member with gas according to another embodiment.

[0043] Figure 8 is a cross-sectional view showing exhaust of gas from a pressurizing member according to another embodiment.

[0044] Figures 9 to 11 FIG. 4 is a schematic diagram illustrating a process of transferring a light emitting element onto a substrate according to an embodiment.

[0045] Fig.12 is a plan view of a first substrate for explaining a state in which a light emitting element is bonded to the first substrate according to an embodiment.

[0046] Fig.13 is a schematic diagram illustrating a process of inspecting a defective state of a light emitting element bonded to a first substrate according to an embodiment.

[0047] Fig.14 FIG. 4 is a schematic diagram for explaining a method for removing defective light emitting elements on a first substrate according to an embodiment.

[0048] Fig.15 and Fig.16 It is a schematic diagram used to illustrate the method of picking up and repairing a light-emitting element by a laser pressure head module.

[0049] Fig.17 1 is a schematic diagram showing a method for lifting a laser pressure head module to repair a light emitting element according to another embodiment.

[0050] Figures 18 to 20 It is a schematic diagram for explaining a method of transferring and repairing a light-emitting element onto a first substrate.

[0051] Fig.21 Yes Fig. 20 An enlarged view of a portion of the repaired light emitting element and the elastic component.

[0052] Figure 22 to Figure 25 is a schematic diagram for explaining a repair method according to another embodiment.

[0053] Description of Reference Numerals

[0054] 1: Repair device

[0055] 10: First substrate

[0056] 20: Relay substrate

[0057] RLE: Repair Light Emitting Elements

[0058] 300: Laser pressure head module

[0059] 310: Pressurized parts

[0060] 311: Light-transmitting parts

[0061] 312: Sealed Space

[0062] 313: Elastic membrane

[0063] 330: Gas supply components

[0064] 400: Control Department

[0065] 500: Laser generator DETAILED DESCRIPTION

[0066] The advantages and features of the present disclosure and the methods for achieving these advantages and features will be described in detail below and in the accompanying drawings. Figure 1 However, the present disclosure is not limited to the embodiments disclosed below, but can be implemented in various forms that are different from each other. This embodiment is only provided to complete the disclosure of the present disclosure and to fully inform the ordinary technicians in the technical field of the present disclosure of the scope of the disclosure. The present disclosure is only limited by the scope of the claims.

[0067] When an element or layer is said to be "on" another element or layer, it includes both the case where it is directly on another element and where other layers or elements are interposed. Throughout the specification, the same reference numerals refer to the same constituent elements. The shapes, sizes, ratios, angles, quantities, etc. disclosed in the drawings for the purpose of illustrating the embodiments are exemplary, and thus the present disclosure is not limited to the matters shown.

[0068] Although "first", "second", etc. are used to describe various components, these components are obviously not limited by these terms. These terms are only used to distinguish one component from another component. Therefore, within the technical concept of the present disclosure, the first component mentioned below can obviously be the second component.

[0069] The various features of the various embodiments of the present disclosure may be partially or entirely coupled or combined with one another, and various linkages and drives may be technically implemented, and the various embodiments may be implemented independently of one another, or may be implemented together in an associated relationship.

[0070] Hereinafter, specific embodiments will be described with reference to the accompanying drawings.

[0071] Reference Figure 1 The structure of a repair device according to an embodiment is described.

[0072] Figure 1 is a schematic diagram showing a repair device according to an embodiment of the present disclosure.

[0073] The repair device 1 is used to repair a first substrate 10 (see Fig. 9 ) can include a laser generator 500, a laser pressure head module 300 and a control unit 400. In addition, the repair device 1 can also include an inspection component 600 (refer to Fig.13 In one embodiment, the inspection component 600 is illustrated as being included in the repair device 1, but is not limited thereto. For example, the arrangement position of the light emitting element may be confirmed by determining the defective light emitting element through an inspection device provided separately from the repair device 1 and providing the determined arrangement position information of the defective light emitting element to the repair device 1.

[0074] The inspection component 600 may include, for example, a visual inspection module and AOI (automatic optical inspection).

[0075] The laser generator 500 is a device that can move in the XYZ direction according to the instruction of the control unit 400 and generates laser light by energy supplied from the outside, and can be configured to generate solid lasers such as YAG laser, ruby ​​laser, glass laser, YVO4 laser, LD laser, fiber laser, liquid laser such as pigment laser, CO 2 Lasers such as lasers, excimer lasers (ArF lasers, KrF lasers, XeCl lasers, XeF lasers, etc.), gas lasers such as Ar lasers and He-Ne lasers, semiconductor lasers, and free electron lasers.

[0076] The laser generator 500 may include a laser light source 510 and a light path changing module 520 that changes a path of laser light irradiated from the laser light source 510 .

[0077] The laser light source 510 may join the bonding objects WP1 , WP2 to each other by applying laser light to positions where the bonding objects WP1 , WP2 are arranged.

[0078] The bonding objects WP1 and WP2 may be bonded to each other so as to be electrically connected to each other. The bonding objects WP1 and WP2 may be semiconductor elements such as substrates, films, display panels, touch panels, or printed circuit boards, flexible printed circuit boards, or light-emitting elements. Exemplarily, according to an embodiment, the first bonding object WP1 may be a substrate, and the second bonding object WP2 may be a light-emitting element (e.g., a micro LED), but is not limited thereto.

[0079] The laser may join the second bonding object WP2 to the first bonding object WP1 by heating the bonding objects WP1, WP2, which is described in more detail later.

[0080] In addition, the laser light source 510 may apply laser light to the elastic film 313 through the optical path changing module 520 in a manner corresponding to the positions where the bonding objects WP1 , WP2 are arranged, so that the form of the elastic film 313 is deformed.

[0081] The laser light may deform the form of the elastic film 313 , which will be described later, by heating the elastic film 313 .

[0082] The optical path changing module 520 is used to quickly change the laser light Z emitted from the laser light source 510 (refer to Fig.14 ), and the laser light source 510 as a point light source can be changed to a near-surface light source or a line light source. For example, the light path changing module 520 can change the laser light Z emitted from one laser light source 510 in units of ms, μs (microseconds), and ns (nanoseconds), and irradiate the laser light Z to the position where the bonding objects WP1 and WP2 are arranged.

[0083] Therefore, a plurality of bonding objects WP1 , WP2 irradiated with the laser light Z whose path is rapidly changed by the optical path changing module 520 can be bonded.

[0084] Here, since the time interval for bonding the bonding objects WP1, WP2 is ms, μs (microseconds), and ns (nanoseconds), a plurality of bonding objects WP1, WP2 can be quickly bonded.

[0085] That is, the optical path changing module 520 may quickly change the path of the laser light Z emitted from one laser light source 510 so that the plurality of second bonding objects WP2 may be bonded to the first bonding object WP1 almost simultaneously.

[0086] For example, the optical path changing module 520 may include a galvano mirror, which is a device capable of rapidly changing the path of a light source by rapidly rotating a mirror that reflects the light source.

[0087] In addition, the optical path changing module 520 may further include more than one lens. The lens may be arranged at one end of the optical path changing module 520 and selectively change the focal length of the laser Z and the path of the laser Z. For example, the lens may be an f-θ lens. Therefore, the laser Z may be sequentially reflected by the galvanometer mirror, thereby changing its path.

[0088] The laser pressure head module 300 is not limited as long as it is for the light emitting element LE (see Fig. 9 ) and a configuration that can be moved and rotated for transfer and repair of the first substrate 10.

[0089] The repairing device 1 may further include a pressurizing component 310 and a gas supply component 330 .

[0090] The pressurizing member 310 may include a light-transmitting member 311 and an elastic film 313 , and may include a sealed space 312 between the light-transmitting member 311 and the elastic film 313 .

[0091] The light-transmitting member 311 and the elastic film 313 may be arranged in a straight line such that they overlap in the thickness direction.

[0092] The light-transmitting member 311 may be formed as a plane having a rectangular shape having long sides in the first direction DR1 and short sides in the second direction DR2 intersecting the first direction DR1. A corner where the long sides in the first direction DR1 and the short sides in the second direction DR2 meet may form a right angle. The plane shape of the light-transmitting member 311 is not limited to a quadrilateral, and may be formed as other polygons, a circle, or an ellipse.

[0093] The light-transmitting member 311 may be formed of a rigid light-transmitting material so as to allow the laser light emitted from the laser generator 500 to pass through. Here, light-transmitting may be defined as allowing more than 80% of the light energy of the laser light emitted from the laser generator 500 to pass through. For example, the light-transmitting member 311 may be formed of a material having a light transmittance of more than about 80% with respect to light in a wavelength range of about 250 nm to 5 μm, but is not limited thereto.

[0094] In addition, the light-transmitting component 311 can be made of any material that can withstand a pressure of about 0.02 MPa to about 5 MPa based on the pressure (e.g., gauge pressure) inside the sealed space 312. The light-transmitting component 311 can be implemented by a material that allows laser transmission. The light-transmitting component 311 can be implemented by all beam-transmitting materials. The light-transmitting component 311 can be implemented by any one of, for example, quartz, sapphire, fused silica glass, and diamond. However, the physical properties of the light-transmitting component 311 implemented by quartz are different from the physical properties of the light-transmitting component 311 implemented by sapphire. For example, when irradiated with a 980nm laser, the transmittance of the light-transmitting component 311 implemented by quartz can be 85% to 99%, and the transmittance of the light-transmitting component 311 implemented by sapphire can be 80% to 90%. In order to prevent the light-transmitting member 311 made of quartz from being damaged and to improve the durability of the light-transmitting member 311, a thin film coating may be formed on the bottom surface of the light-transmitting member 311 made of quartz. The thin film coating formed on the bottom surface of the light-transmitting member 311 may be implemented by a dielectric coating, a SiC coating, or a metal coating, which is a common optical coating.

[0095] The elastic film 313 can be formed of a light-transmitting material having elasticity so that the laser emitted from the laser generator 500 can pass through. In addition, the elastic film 313 can be a film having an adhesive layer on one surface and changing its shape by the laser. The surface of the elastic film 313 irradiated with the laser can be partially expanded. For example, the elastic film 313 can form an uneven portion protruding in the direction of laser irradiation. The protruding uneven portion formed in this way can be bonded to the bonding object WP1, WP2 (for example, a light-emitting element) through an adhesive layer on one surface. For example, the elastic film 313 can be formed of polyimide (Poly Imide), PFA (Polyoxymethylene, polyoxymethylene), silicone multilayer, silicone-PET (polyethyleneterephthalate) stacked layer, etc. However, it is not limited to this.

[0096] Since the elastic film 313 is formed of a light-transmitting material having elasticity as described above, it can transmit the laser light and can be advantageous in pressurizing the bonding objects WP1 and WP2 having a step.

[0097] The gas supply member 330 may supply gas to the sealed space 312 between the light-transmitting member 311 and the elastic film 313 to generate a pressurizing force.

[0098] The gas supply component 330 can supply gas such as nitrogen (N 2 ), helium (He), neon (Ne), argon (Ar), carbon dioxide (CO 2 ) or a mixture thereof, a gas having inertness or very low chemical reactivity is supplied into the above-mentioned internal space. Hereinafter, the gas having inertness or very low chemical reactivity as described above is collectively referred to as gas (neutral gas).

[0099] The gas supply component 330 may include: a reservoir 331 for storing gas, a gas pump 332 for supplying the gas under pressure, a gas valve 333 for regulating the flow of the gas, and a gas supply conduit 334 for providing a path for the gas to be supplied to the inside of the sealed space 312 (see Figure 4 In addition, the gas supply component 330 may further include a gas exhaust conduit 335 for exhausting the gas that generates pressure in the sealed space 312 (see Figure 4 ) and discharge valve 336.

[0100] The gas pump 332 may be configured to supply gas to the sealed space 312 at a pressure higher than the external pressure of the sealed space 312. The gas pump 332 may be configured to supply gas until the pressure inside the sealed space 312 reaches about 0.02 MPa to about 5 MPa based on the gauge pressure, but is not limited thereto.

[0101] The gas valve 333 can be closed when the pressure inside the sealed space 312 is high enough to interrupt the supply of the gas and maintain the internal pressure of the sealed space 312. The gas valve 333 can be, for example, a ball valve, a globe valve, a gate valve, a control valve, etc., and is not particularly limited.

[0102] The elastic film 313 expands in the downward direction (ie, the direction of the supporting member Stg) by the pressure inside the sealed space 312, thereby generating a pressing force in the downward direction.

[0103] After the processing of the bonding objects WP1 and WP2 is completed, the pressure inside the sealed space 312 can be reduced. For this purpose, a gas exhaust conduit 335 and an exhaust valve 336 can be provided. The exhaust valve 336 can be in a closed state during the period when the internal pressure of the sealed space 312 rises and during the period when the raised pressure is maintained.

[0104] On the other hand, after the processing of the above-mentioned combined objects WP1 and WP2 is completed, the exhaust valve 336 can be opened so that the gas in the sealed space 312 can be discharged to the outside of the sealed space 312 through the gas exhaust conduit 335. The exhaust valve 336 can be, for example, a ball valve, a globe valve, a gate valve, a control valve, etc., and is not particularly limited.

[0105] For convenience of explanation, the direction in which the laser beam is irradiated is defined as a downward direction, and the opposite direction of the downward direction is defined as an upward direction. In the present embodiment, the upward direction and the downward direction are parallel to a third direction DR3 defined as a direction perpendicular to each of the first direction DR1 and the second direction DR2. The third direction DR3 may be a reference direction for distinguishing the front surface and the rear surface of a constituent element to be described later. However, the upward direction or the downward direction is a relative concept and may be converted to other directions.

[0106] The control unit 400 may include a processor 420 and a memory 430. In one embodiment, it is illustrated that the memory 430 is included in the control unit 400, but it is not limited thereto, and the memory 430 may be provided as a device separate from the control unit 400.

[0107] The processor 420 may perform a function of controlling the overall operation of the repairing apparatus 1. The processor 420 may be electrically connected to other constituent elements of the repairing apparatus 1 (eg, the laser generator 500 and the laser pressure head module 300) and control each configuration.

[0108] However, it is not limited to controlling all configurations by one processor 420, and each configuration may be controlled by using a plurality of independent processors.

[0109] For example, the processor 420 may control the position of the optical path changing module 520 based on the position information that the second bonding object WP2 should be arranged on the first bonding object WP1 to change the path of the laser Z to correspond to the corresponding position information.

[0110] In addition, the processor 420 may control the position and gas filling of the laser pressure head module 300 and the like.

[0111] The processor 420 may implement a method for manufacturing a micro LED display to be described later through the repairing device 1 .

[0112] The processor 420 may include one or more of a central processing unit (CPU), a controller, an application processor (AP), a communication processor (CP), and an ARM processor.

[0113] In addition, the processor 420 may be electrically connected to the memory 430 and store information in the memory 430 or control various configurations using information stored in the memory 430 .

[0114] The specific functions of the processor 420 according to an embodiment of the present disclosure will be described later.

[0115] The memory 430 may be built into the repairing device 1. In addition, the memory 430 may be implemented as at least one of a flash memory type, a read-only memory (ROM), a random access memory (RAM), a hard disk type, a multimedia card micro type, and a card type memory (e.g., an SD memory or an XD memory).

[0116] In addition, since the memory 430 is electrically connected to the processor 420, the memory 430 can transmit signals and information to and from the processor 420. For example, the memory 430 can store position information of the input or checked combined objects WP1, WP2 and transfer the stored position information to the processor 420.

[0117] Figure 2 is an exploded perspective view of a pressurizing component according to some embodiments, and Figure 3 is a side view of a pressurizing component according to some embodiments.

[0118] Reference Figure 2 and Figure 3 The pressurizing member 310 may include a frame type frame P310 and a light-transmitting member 311 and an elastic film 313 accommodated in the frame type frame P310, but is not limited thereto, as long as it is implemented to prevent leakage of the gas filled between the light-transmitting member 311 and the elastic film 313. For example, the edges of the light-transmitting member 311 and the elastic film 313 may be bonded and sealed to each other by a separate adhesive or sealing material.

[0119] Reference Figure 2 and Figure 3 The frame type frame P310 may include a main frame P311 having a plane form of a quadrilateral frame, and a first side frame P312, a second side frame P313, a third side frame P314, and a fourth side frame P315 respectively vertically connected to four sides of the main frame P311.

[0120] The main frame P311 has an upper surface parallel to a plane defined by the first direction DR1 and the second direction DR2 perpendicular to each other, and has a rear surface in a direction opposite to the upper surface along the third direction DR3.

[0121] The main frame P311 of the frame-type frame P310 is formed in a frame shape having an opening portion formed to expose a surface of the light-transmitting member 311. The main frame P311 may have a quadrilateral shape, but is not limited thereto. The opening portion may have a quadrilateral shape according to the shape of the main frame P311, but is not limited thereto. Figure 1 ) can pass through the light-transmitting component 311 and the elastic membrane 313 through the opening.

[0122] In some embodiments, a light shielding member may be provided on the upper surface of the main frame P311 in the form of a quadrilateral frame, but is not limited thereto.

[0123] The shading member may block the transmission of light. The shading member may include an organic shading material and a liquid-repelling component. Here, the liquid-repelling component may be composed of a fluorine-containing monomer or a fluorine-containing polymer, and specifically, may include a fluorine-containing aliphatic polycarbonate. For example, the shading member may be formed of a black organic substance including a liquid-repelling component. The shading member may be formed by a coating process and an exposure process, etc., for an organic shading material including a liquid-repelling component.

[0124] A portion of the first side frame P312, the second side frame P313, the third side frame P314, and the fourth side frame P315 (for example, the second side frame P313 and the fourth side frame P315 opposite to the second side frame P313) may be bent into an "L" shape. The first surface of the frame bent into an "L" shape as described above may be perpendicular to the main frame P311 and in contact with the side surface of the light-transmitting member 311, and the second surface perpendicular to the above-mentioned first surface may be parallel to the main frame P311 and in contact with the rear surface of the elastic membrane 313. The main frame P311 may be threadedly connected to the first side frame P312, the second side frame P313, the third side frame P314, and the fourth side frame P315, but is not limited thereto.

[0125] A portion of the first side frame P312, the second side frame P313, the third side frame P314, and the fourth side frame P315 (for example, the first side frame P312 and the third side frame P314 opposite to the first side frame P312) may include legs P312-S, P314-S protruding in the downward direction. The legs P312-S, P314-S support the frame-type frame P310 outside the irradiation area of ​​the laser beam during irradiation of the laser beam. Here, the irradiation area of ​​the laser beam is the area where the laser generator 500 (refer to Figure 1 ) or support component Stg (refer to Figure 1 ) is the area reached by the laser beam when the laser is irradiated in a fixed state.

[0126] In another embodiment, the main frame P311 and the first, second, third, and fourth side frames P312, P313, P314, and P315 may be formed as one body.

[0127] The light-transmitting member 311 and the elastic film 313 are arranged in the accommodation space surrounded by the first side frame P312, the second side frame P313, the third side frame P314, and the fourth side frame P315. Therefore, the rear surface of the main frame P311 can be in contact with the upper surface of the light-transmitting member 311, and the first side frame P312, the second side frame P313, the third side frame P314, and the fourth side frame P315 can be in contact with the side surface of the light-transmitting member 311 and the side surface of the elastic film 313. The main frame P311 and the light-transmitting member 311 can be arranged in a straight line so that they overlap each other in the thickness direction on the plane.

[0128] Although in reference Figure 2 and Figure 3 In the embodiment described above, the frame type frame P310 is described, but it is not limited thereto. For example, it can also be implemented as a frame that can support the light-transmitting member 311 and the elastic membrane 313. Shape frame.

[0129] Figure 4 is a cross-sectional view of a pressurizing component according to an embodiment, Figure 5 is a cross-sectional view showing filling of a sealed space of a pressurizing component with gas according to an embodiment, Figure 6 is a cross-sectional view showing exhaust of gas from a pressurizing component according to an embodiment.

[0130] Reference Figure 4 In order to fill the sealed space 312 between the light-transmitting member 311 and the elastic membrane 313 with gas, one end of a gas supply conduit 334 and one end of a gas exhaust conduit 335 may be provided in the sealed space 312 .

[0131] The gas supply conduit 334 and the gas exhaust conduit 335 may pass through the elastic membrane 313 to be connected to the sealed space 312. To this end, the elastic membrane 313 may include through holes 334-H, 335-H for connecting the gas supply conduit 334 and the gas exhaust conduit 335. The gas supply conduit 334 may be connected to the sealed space 312 through the first through hole 334-H, and the gas exhaust conduit 335 may be connected to the sealed space 312 through the second through hole 335-H.

[0132] In addition, a portion of the first side frame P312, the second side frame P313-1, the third side frame P314, and the fourth side frame P315-1 (for example, the second side frame P313-1 and the fourth side frame P315-1) may include through holes P313-H, P315-H for connecting the gas supply conduit 334 and the gas exhaust conduit 335. The gas supply conduit 334 may be connected to the sealed space 312 through the fourth through hole P315-H, and the gas exhaust conduit 335 may be connected to the sealed space 312 through the third through hole P313-H.

[0133] Reference Figure 5 The gas supply conduit 334 is connected to the sealed space 312 through the fourth through hole P315-H of the fourth side frame P315-1 and the first through hole 334-H of the elastic membrane 313. The gas is filled into the sealed space 312 through the gas supply conduit 334. At this time, the gas exhaust conduit 335 should be connected to the aforementioned exhaust valve 336 (refer to Figure 1 ) is blocked.

[0134] Reference Figure 6 The gas exhaust conduit 335 is connected to the sealed space 312 through the third through hole P313-H of the second side frame P313-1 and the second through hole 335-H of the elastic membrane 313. The gas is discharged from the sealed space 312 to the outside through the gas exhaust conduit 335. At this time, the gas supply conduit 334 should be connected to the gas valve 333 (see Figure 1 ) is blocked.

[0135] Figure 7 is a cross-sectional view showing filling of a sealed space of a pressurizing component with gas according to another embodiment, and Figure 8 is a cross-sectional view showing exhaust of gas from a pressurizing member according to another embodiment.

[0136] Reference Figure 7 and Figure 8 In order to fill the sealed space 312 between the light-transmitting member 311 and the elastic membrane 313 with gas, one end of a gas supply conduit 334 - 1 and one end of a gas exhaust conduit 335 - 1 may be provided in the sealed space 312 .

[0137] The gas supply conduit 334-1 and the gas exhaust conduit 335-1 may pass through the light-transmitting member 311 to be connected to the sealed space 312. To this end, the light-transmitting member 311 may include through holes 334-1-H, 335-1-H for connecting the gas supply conduit 334-1 and the gas exhaust conduit 335-1. The gas supply conduit 334-1 may be connected to the sealed space 312 through the fifth through hole 334-1-H, and the gas exhaust conduit 335-1 may be connected to the sealed space 312 through the sixth through hole 335-1-H.

[0138] In addition, the main frame P311 may include through holes P311-H1, P311-H2 for connecting the gas supply conduit 334-1 and the gas exhaust conduit 335-1. The gas supply conduit 334-1 may be connected to the sealed space 312 through the seventh through hole P311-H1, and the gas exhaust conduit 335-1 may be connected to the sealed space 312 through the eighth through hole P311-H2.

[0139] Reference Figure 7 , the gas supply conduit 334-1 is connected to the sealed space 312 through the seventh through hole P311-H1 of the main frame P311 and the fifth through hole 334-1-H of the light-transmitting member 311. The gas is filled into the sealed space 312 through the gas supply conduit 334-1. At this time, the gas exhaust conduit 335-1 should be connected to the exhaust valve 336 (refer to Figure 1 ) is blocked.

[0140] Reference Figure 8 , the gas exhaust conduit 335-1 is connected to the sealed space 312 through the eighth through hole P311-H2 of the main frame P311 and the sixth through hole 335-1-H of the light-transmitting member 311. The gas is discharged from the sealed space 312 to the outside through the gas exhaust conduit 335-1. At this time, the gas supply conduit 334-1 should be connected to the gas valve 333 (refer to Figure 1 ) is blocked.

[0141] Below, refer to Figures 9 to 25 The transfer and repair process of the micro LED according to an embodiment of the present disclosure is described.

[0142] Figures 9 to 11 FIG. 4 is a schematic diagram illustrating a process of transferring a light emitting element onto a substrate according to an embodiment.

[0143] Reference Figures 9 to 11 , the plurality of light emitting elements LE arranged on the base substrate BSUB are transferred onto the first substrate 10 .

[0144] For example, Fig. 9As shown in FIG. 1 , the plurality of light emitting elements LE arranged on the base substrate BSUB are arranged to face the first substrate 10 .

[0145] Here, the base substrate BSUB may be sapphire (Al 2 O 3 ) substrate or a silicon wafer including silicon. However, not limited thereto, in one embodiment, the base substrate BSUB is exemplified as a sapphire substrate. In another embodiment, the base substrate BSUB may be a relay substrate for transferring the light emitting element LE onto the first substrate 10.

[0146] On the base substrate BSUB, a plurality of light emitting elements LE may be arranged at the same first interval. That is, a plurality of light emitting elements LE may be arranged in a dot shape at a predetermined first interval on the base substrate BSUB. A plurality of light emitting elements LE may be composed of a single color. For example, a plurality of light emitting elements LE may be one of a red light emitting element emitting red light, a green light emitting element emitting green light, and a blue light emitting element emitting blue light. Each of the plurality of light emitting elements LE arranged on the base substrate BSUB may include a first semiconductor layer, an active layer, and a second semiconductor layer arranged sequentially. The first semiconductor layer may be formed of GaN doped with a p-type conductive dopant such as Mg, Zn, Ca, Ba, etc. The active layer may be arranged between the first semiconductor layer and the second semiconductor layer, and may emit light by combining electron-hole pairs according to an electrical signal applied through the first semiconductor layer and the second semiconductor layer. The second semiconductor layer may be doped with an n-type conductive dopant such as Si, Ge, Sn, Se, etc. For example, the second semiconductor layer may be n-GaN doped with n-type Si.

[0147] The first substrate 10 is a display basic unit that can realize a display screen, and the first substrate 10 can realize a display screen of various display devices. In addition, the first substrate 10 can be a target substrate installed in a display device. Here, the display device, as a device for displaying a moving image or a still image, can be a portable electronic device such as a mobile phone, a smart phone, a tablet personal computer, a smart watch, a watch phone, a mobile communication terminal, an electronic notepad, an electronic book, a PMP (portable multimedia player), a navigator, a UMPC (Ultra Mobile PC, ultra mobile personal computer), etc., and a television, a notebook computer, a monitor, an advertising board, an Internet of Things (IOT) device, etc., and one of various products.

[0148] A flux (not shown) may be coated on the upper portion of the first substrate 10. The flux may be a substance that facilitates the connection of the first substrate 10 and the bonding electrode to be described later in a pressurized melting process using a laser. The flux may be fat-soluble or water-soluble and may include natural rosin or synthetic rosin. The flux may be in a liquid form or a gel form.

[0149] After the light emitting element LE is bonded to the first substrate 10, the flux is removed by a flux cleaner. A known flux cleaner (preferably an aqueous flux cleaner) can be used as the flux cleaner. For example, the flux cleaner can use CLEANTHROUGH 750HS, CLEANTHROUGH 750K manufactured by Kao Corporation, PINE ALPHA ST-100S manufactured by Arakawa Chemical Industries, Ltd., etc., but is not limited thereto. The cleaning conditions when cleaning the first substrate 10 are not particularly limited. For example, it is preferable to clean the first substrate 10 at a cleaning agent temperature of 30°C to 50°C for 1 minute to 5 minutes (preferably at 40°C for 2 minutes to 4 minutes).

[0150] Next, if Fig.10 and Fig.11 As shown in , a plurality of light emitting elements LE arranged on the base substrate BSUB may be brought into contact with the first substrate 10 , and the light emitting elements LE and the first substrate 10 may be bonded by irradiating laser.

[0151] Thereafter, the base substrate BSUB is separated from the plurality of light emitting elements LE by irradiating a laser to the base substrate BSUB. The process of separating the base substrate BSUB can be performed by a laser lift off (LLO) process. The laser lift off process utilizes laser, and a KrF excimer laser (248 nm wavelength) can be used as a laser source. The energy density of the excimer laser can be about 550 mJ / cm 2 About 950mJ / cm 2 The incident area can be within the range of about 50×50 μm 2 About 1×1cm 2 By irradiating laser to the base substrate BSUB, the base substrate BSUB can be separated from the light emitting element LE.

[0152] Fig.12 is a plan view of a first substrate for explaining a state of a light emitting element bonded to the first substrate according to an embodiment, and Fig.13is a schematic diagram illustrating a process of inspecting a defective state of a light emitting element bonded to a first substrate according to an embodiment.

[0153] Reference Fig.12 , the first substrate 10 may include a plurality of light emitting elements LE arranged on the first substrate 10 at a second interval as a certain interval. The first substrate 10 may be formed as a plane of a rectangular form having a long side in a first direction DR1 and a short side in a second direction DR2 intersecting the first direction DR1. A corner where the long side in the first direction DR1 and the short side in the second direction DR2 intersecting the first direction DR1 meet may be rounded to have a predetermined curvature or formed as a right angle. The plane form of the first substrate 10 is not limited to a quadrilateral, and may be formed as other polygons, a circle, or an ellipse.

[0154] In one embodiment, each of the plurality of light emitting elements LE is illustrated as a vertical light emitting element. The plurality of light emitting elements LE may be formed of an inorganic substance such as GaN. The length of each of the plurality of light emitting elements LE in the first direction DR1, the length in the second direction DR2, and the length in the third direction DR3 may be several μm to several hundred μm, respectively. For example, the length of each of the plurality of light emitting elements LE in the first direction DR1, the length in the second direction DR2, and the length in the third direction DR3 may be approximately 100 μm or less, respectively.

[0155] Here, the first interval, which is the interval between the plurality of light emitting elements LE arranged on the base substrate BSUB, may be equal to the second interval, which is the interval between the plurality of light emitting elements LE arranged on the first substrate 10, but is not limited thereto. The first substrate 10 may include one or more defective light emitting elements DLE. The defective light emitting element DLE may be a light emitting element that is misaligned or has an output wavelength, brightness, and performance level that are lower than a predetermined reference.

[0156] exist Fig.12 FIG. 1 shows that the defective light emitting element DLE is located at the first position P1, the second position P2, the third position P3, the fourth position P4 and the fifth position P5, but is not limited thereto. Fig.13 In the following figures, only the first position P1 and the second position P2 located in the first row are disclosed, but the defective light emitting elements DLE arranged at the third position P3 to the fifth position P5 located in other rows can also be repaired by the same method.

[0157] Afterwards, refer to Fig.12 and Fig.13, the inspection component 600 may determine the defective light emitting element DLE by scanning the bonding state of the plurality of light emitting elements LE on the first substrate 10. For example, the inspection component 600 may determine the characteristic information of each of the plurality of light emitting elements LE through various inspections including visual inspection of the plurality of light emitting elements LE arranged on the first substrate 10. Here, the characteristic information may be a measured value of an output wavelength or brightness for each of the plurality of light emitting elements LE, or may be at least one of the input output wavelength, brightness, and performance level.

[0158] Next, the processor 420 can determine whether it is a defective light-emitting element DLE and the arrangement position corresponding to the plurality of light-emitting elements LE by comparing the characteristic information of each of the determined plurality of light-emitting elements LE with a preset characteristic reference. Here, the arrangement position may mean the coordinate value of the defective light-emitting element DLE arranged on the first substrate 10. The processor 420 may store the position information of the defective light-emitting element DLE of the first substrate 10 in the memory 430.

[0159] Fig.14 FIG. 4 is a schematic diagram for explaining a method for removing defective light emitting elements on a first substrate according to an embodiment.

[0160] Reference Fig.14 The laser generator 500 may remove the defective light emitting element DLE by irradiating the laser Z to the defective light emitting element DLE on the first substrate 10 based on the position information of the defective light emitting element DLE.

[0161] For example, when the position of the defective light-emitting element DLE is the first position P1 and the second position P2, the processor 420 controls the laser generator 500 to irradiate the laser Z to the first position P1 and the second position P2 to weaken the connection between the defective light-emitting element DLE and the first substrate 10, and then peels off the defective light-emitting element DLE.

[0162] Figures 15 to 20 1 is a schematic diagram for explaining a repairing method of a light emitting element according to an embodiment.

[0163] Fig.15 and Fig.16 It is a schematic diagram used to illustrate the method of picking up and repairing a light-emitting element by a laser pressure head module.

[0164] Reference Fig.15, the light-emitting elements LE mapped to the positions P1 and P2 of the defective light-emitting elements DLE on the first substrate 10 among the plurality of light-emitting elements LE arranged on the base substrate BSUB are arranged on the relay substrate 20. For example, the light-emitting element LE on the base substrate BSUB is transferred to the position P1' of the relay substrate 20 mapped to the position P1 of the defective light-emitting element DLE on the first substrate 10, and the light-emitting element LE on the base substrate BSUB is transferred to the position P2' of the relay substrate 20 mapped to the position P2 of the defective light-emitting element DLE on the first substrate 10. The spacing direction and distance between the first position P1 and the second position P2 on the first substrate 10 are the same as the spacing direction and distance between the first position P1' and the second position P2' on the relay substrate 20. For example, when the first substrate 10 and the relay substrate 20 are aligned so that the central axis of the first substrate 10 coincides with the central axis of the relay substrate 20, the first position P1 and the second position P2 on the first substrate 10 and the first position P1' and the second position P2' on the relay substrate 20 can be respectively in the third direction DR3 (refer to Figure 1 ). The characteristic information of the defective light emitting element DLE and the repaired light emitting element RLE mapped to the same position may be the same. For example, the characteristic information may include the output wavelength or brightness of the light emitting element LE.

[0165] The light emitting element RLE on the relay substrate 20 thus placed is a light emitting element for repair, and for the sake of convenience of explanation, it is referred to as a repair light emitting element RLE. In order to transfer the light emitting element LE on the base substrate BSUB to the relay substrate 20, the processor 420 causes the laser generator 500 to be located at a corresponding position on the base substrate BSUB, and controls the laser generator 500 to irradiate the laser Z. The light emitting element LE arranged at the position of the base substrate BSUB irradiated with the laser Z can be detached from the base substrate BSUB and arranged on the relay substrate 20.

[0166] Reference Fig.16 Under the control of the processor 420, the pressurizing component 310 of the laser pressurizing head module 300 can be moved to the positions P1' and P2' on the relay substrate 20 where the repair light-emitting elements RLE are arranged, and can lift the repair light-emitting elements RLE at the positions P1' and P2' mapped to the positions P1 and P2 that are separated from the defective light-emitting elements DLE as they are.

[0167] More specifically, the laser pressure head module 300 is arranged on the relay substrate 20. The elastic film 313 of the laser pressure head module 300 is arranged to face the repair light-emitting element RLE of the relay substrate 20. The pressure component 310 of the laser pressure head module 300 and the relay substrate 20 maintain a certain interval G1. Thereafter, the laser generator 500 irradiates the laser Z to the positions P1' and P2' of the repair light-emitting element RLE on the laser pressure head module 300 according to the control of the processor 420. The elastic film 313 is deformed in shape at the positions corresponding to the positions P1' and P2' of the repair light-emitting element RLE by the irradiation of the laser Z. The shape of the elastic film 313 bulges downward, thereby contacting the repair light-emitting element RLE at the positions P1' and P2'. As described above, since one surface of the elastic film 313 has adhesiveness, the repair light-emitting element RLE in contact with one surface of the elastic film 313 can be bonded and lifted.

[0168] As described above, the elastic film 313 can be deformed to pick up the repair light emitting element RLE while maintaining a certain distance between the laser pressure head module 300 and the relay substrate 20. Thus, it is possible to prevent the repair light emitting element RLE from being defective due to excessive pressure on the repair light emitting element RLE by the laser pressure head module 300 in order to pick up the repair light emitting element RLE.

[0169] Fig.17 It is a schematic diagram for explaining a method for lifting a laser pressure head module to repair a light emitting element according to another embodiment.

[0170] Reference Fig.17 The laser pressure head module 300 is arranged on a base substrate BSUB on which a plurality of light emitting elements LE are arranged. The elastic membrane 313 of the laser pressure head module 300 is arranged to face the plurality of light emitting elements LE of the base substrate BSUB. The pressure component 310 of the laser pressure head module 300 and the base substrate BSUB maintain a certain interval G1.

[0171] Thereafter, the laser generator 500 irradiates the laser Z at the positions P1' and P2' of the base substrate BSUB on the laser pressure head module 300 according to the control of the processor 420, so as to correspond to the positions P1 and P2 of the defective light-emitting elements DLE to be removed. The elastic film 313 is deformed in shape at the positions P1' and P2' by the irradiation of the laser Z. The shape of the elastic film 313 bulges downward and expands, thereby contacting the light-emitting element LE at the positions P1' and P2'. The light-emitting element LE thus contacted becomes the repair light-emitting element RLE. As described above, the repair light-emitting element RLE contacting the adhesive layer on one surface of the elastic film 313 can be bonded and lifted.

[0172] exist Fig.17 Zhong Ye and Fig.16Similarly, the elastic film 313 can be deformed while maintaining a certain distance between the laser pressure head module 300 and the base substrate BSUB, thereby picking up the repair light emitting element RLE. Thus, it is possible to prevent the repair light emitting element RLE from being defective due to excessive pressure on the repair light emitting element RLE by the laser pressure head module 300 in order to pick up the repair light emitting element RLE.

[0173] Figures 18 to 20 It is a schematic diagram for explaining a method of transferring and repairing a light-emitting element onto a first substrate. Fig.21 Yes Fig. 20 An enlarged view of a portion of the repaired light emitting element and the elastic component.

[0174] Reference Fig.18 Under the control of the processor 420 , the laser pressure head module 300 arranges the repair light emitting element RLE at positions P1 and P2 on the first substrate 10 .

[0175] At this time, since the laser pressure head module 300 is transparent, the inspection component 600 can confirm the alignment state between the position of the repair light emitting element RLE and the positions P1 and P2 on the first substrate 10 on the laser pressure head module 300. Therefore, the laser pressure head module 300 can accurately arrange the repair light emitting element RLE at the positions P1 and P2 on the first substrate 10.

[0176] Reference Figures 19 to 21 When the inspection component 600 confirms that the laser pressure head module 300 arranges the repair light emitting element RLE at the positions P1 and P2 on the first substrate 10, the laser pressure head module 300 pressurizes the repair light emitting element RLE, and the laser generator 500 irradiates the laser Z1 and Z2 to the positions P1 and P2 on the first substrate 10. Thus, the repair light emitting element RLE is transferred to the positions P1 and P2 on the first substrate 10.

[0177] The processor 420 controls the laser generator 500 to change the path of the laser Z to correspond to the corresponding position information based on the position information of the plurality of repair light emitting elements RLE to be transferred. For example, the laser Z may be sequentially reflected by a galvanometer mirror to realize a first laser path Z1 corresponding to the first position P1 to be transferred and a second laser path Z2 corresponding to the second position P2.

[0178] When the gas is filled into the sealed space 312 between the light-transmitting member 311 and the elastic film 313, a pressure of, for example, 0.02 MPa to 0.5 MPa can be generated due to the sealed space 312. By filling the gas, the elastic film 313 expands toward the lower part, that is, in the direction where the repair light-emitting element RLE is located, so that a uniform pressure can be applied to the surface of the repair light-emitting element RLE. For example, when the gas is filled into the sealed space 312 between the light-transmitting member 311 and the elastic film 313 so that the elastic film 313 expands under a first pressure (for example, 0.02 MPa) and contacts with a plurality of repair light-emitting elements RLE, the positions of the plurality of repair light-emitting elements RLE are confirmed. At this time, since the pressurizing member 310 is transparent, the positions of the plurality of light-emitting elements LE and the repair light-emitting element RLE arranged below the pressurizing member 310 can be confirmed by the inspection member 600 arranged on the pressurizing member 310. Then, the elastic film 313 can be further pressurized with a second pressure (for example, 0.4 MPa). The direction of the pressure applied by the elastic film 313 to the repair light emitting element RLE may be the same as the irradiation direction of the lasers Z1 and Z2.

[0179] On the other hand, when the temperature of the connection electrode CNE of one surface of the repair light emitting element RLE rises due to the applied lasers Z1 and Z2, the connection electrode CNE may be melted and thus bonded to the first substrate 10. In some embodiments, the connection electrode CNE may be at least one selected from tin (Sn), gold (Au), silver (Ag), platinum (Pt), copper (Cu), bismuth (Bi), palladium (Pd), chromium (Cr), calcium (Ca), nickel (Ni), germanium (Ge), zinc (Zn), manganese (Mn), cobalt (Co), tungsten (W), antimony (Sb), lead (Pb), and alloys thereof. However, it is not limited thereto.

[0180] Figure 22 to Figure 25 is a schematic diagram for explaining a repair method according to another embodiment.

[0181] Reference Figure 22 to Figure 25 , and reference Figures 9 to 21 The illustrated embodiment is different in that the laser pressure head module 300 repairs the light emitting elements RLE one by one.

[0182] Reference Fig. 22 and Fig.23 The laser pressure head module 300 can bond and lift a repair light emitting element RLE arranged on the relay substrate 20. Regarding the method of lifting the repair light emitting element RLE in a state where the laser pressure head module 300 is bonded to the repair light emitting element RLE arranged on the relay substrate 20, reference has been made to Fig.17However, since there is only one repair light emitting element RLE disposed on the relay substrate 20, the repair light emitting element RLE can be bonded to the elastic film 313 and lifted by filling the sealed space 312 between the light-transmitting member 311 and the elastic film 313 with gas to pressurize the elastic film 313.

[0183] Reference Fig.24 and Fig.25 The laser pressure head module 300 transfers the repair light emitting element RLE to the positions P1 and P2 on the first substrate 10 where the defective light emitting element DLE is removed. The method of transferring the repair light emitting element RLE by the laser pressure head module 300 has been referred to. Figures 18 to 21 The above description has been given, so the repeated description is omitted.

[0184] The embodiments of the present disclosure are described above with reference to the accompanying drawings, but those skilled in the art will understand that the present disclosure can be implemented in other specific forms without changing the technical ideas or essential features of the present disclosure. Therefore, it should be understood that the embodiments described above are exemplary in all aspects and not restrictive.

Claims

1. A repair device, wherein: include: A laser generator for irradiating laser light; The laser pressure head module transmits the laser and can apply pressure in one direction; as well as a processor connected to the laser generator and the laser pressure head module and controlling the operation of the laser generator and the laser pressure head module, The laser pressure head module includes a rigid light-transmitting component and an elastic membrane that is deformed in shape by laser irradiation.

2. The repair device according to claim 1, wherein: The elastic film has an adhesive layer on one surface, is arranged to overlap with the light-transmitting member in a thickness direction, and is deformed into a shape that is convex in a laser irradiation direction in a region irradiated with laser light.

3. The repair device according to claim 2, wherein: The laser pressure head module also includes: The gas supply component injects gas or air into the sealed space between the light-transmitting component and the elastic membrane, thereby generating a pressure on the elastic membrane.

4. The repair device according to claim 3, wherein: The gas supply component comprises: a storage device for storing the gas; a gas pump for supplying the gas under pressure; a gas valve to regulate the flow of the gas; and The gas supply conduit provides a path for the gas to be supplied into the sealed space.

5. The repair device according to claim 1, wherein: The laser generator comprises: Laser light source; and The optical path changing module changes the irradiation position of the laser light irradiated from the laser light source.

6. The repair device according to claim 3, wherein: Also includes: The inspection part determines a defective state of a light emitting element arranged on a substrate, and generates position information of a defective light emitting element determined to be defective.

7. The repair device according to claim 6, wherein: When the elastic film arranged at the bottom of the laser pressure head module is convexly deformed toward the repair light-emitting element arranged on the relay substrate by the laser irradiation so that the repair light-emitting element is adhered to the adhesive layer, the processor controls the laser pressure head module to lift the repair light-emitting element adhered to the elastic film.

8. The repair device according to claim 7, wherein: The processor controls the laser pressurizing head module to arrange the repair light-emitting element at a position mapped to the position where the defective light-emitting element was removed at the position where the defective light-emitting element was removed on the substrate and supply the gas to the sealed space between the light-transmitting component and the elastic membrane, so that the elastic membrane pressurizes the light-emitting element and the repair light-emitting element arranged on the substrate.

9. The repair device according to claim 8, wherein: The processor controls the laser generator to irradiate laser light toward a position where the repair light-emitting element is arranged, so that the repair light-emitting element is bonded to the substrate.

10. The repair device according to claim 9, wherein: The laser pressure head module moves onto the relay substrate on which the repair light emitting element is arranged while maintaining a first interval between the laser pressure head module and the relay substrate.

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