In-situ on-chip impact tensile strength online detection system and manufacturing method and application thereof

Abstract

The invention discloses an in-situ on-chip impact tensile strength online detection system and a manufacturing method and application thereof, and belongs to the technical field of micro-electromechanical system processing. The on-chip testing machine comprises a tested micro beam, an impacted mass block, a double-hammer structure, first and second probe loading structures, a lock catch structure, a lock tooth structure, first to third elastic suspension folding beams, an elastic energy storage beam, an elastic beam, a power bolt and first to fifth fixed anchor points. According to the system, the on-chip testing machine is combined with the probe station, and the breaking strength of the micro-beam structure to be tested is extracted when the micro-beam structure is subjected to impact tensile fracture. The system is used for carrying out online detection on the impact tensile strength of the micro beam to be detected, has the advantages of wide range and repeatability, is simple in method, and does not need a large precise instrument and a thermal driving loading and unloading mechanism.

Description

Technical Field

[0001] The invention belongs to the field of micro-electromechanical system (MEMS) processing technology, and specifically discloses an in-situ on-chip impact tensile strength online detection system and a manufacturing method and application thereof. Background Art

[0002] Micro-electromechanical system (MEMS) is a new technology based on microelectronics and micro-machining technology. Since the 1990s, MEMS technology has developed rapidly due to its advantages such as light weight, small size, high sensitivity, easy integration and excellent performance. Various sensor devices such as pressure gauges, accelerometers, gyroscopes, microphones, inertial measurement units (IMUs) manufactured based on this technology are widely used in all aspects from consumer products to professional markets in extreme environments, and have huge development space.

[0003] For most sensor devices, they will be affected by external impacts in all aspects of their manufacturing, transportation, storage and final use. At the same time, since such devices often contain delicate movable structures (such as suspended membranes, cantilever beams, folded beams, adhesive interfaces, etc.), they are very sensitive to external mechanical impacts. The inertial stress and contact stress generated by MEMS devices made of silicon-based brittle materials under external impact environments often become important factors causing device structural fracture failure. Therefore, it is very important to accurately predict the reliability of microstructures under external mechanical impacts and extract parameters for the impact fracture strength of key structures in MEMS devices. Among them, the impact tensile fracture strength of microbeams is one of the most important parameters.

[0004] At present, there are many common impact test methods, including: pendulum (or drop hammer) test machine, Hopkinson bar, drop test platform, vibration table, light gas gun, etc. Such structures and methods are all aimed at sample structures of millimeter scale and above. For samples of micrometer scale and below, there are great difficulties in achieving their fixation, loading, positioning, self-alignment and detection. Devices of this size are often manufactured on the chip by slicing and packaging the sample structure and then performing the drop test. However, there are great problems with this type of test method: the test process is one-time and cannot be repeated, the large-area damage of the test sample cannot accurately analyze the impact damage behavior of the device structure, and it is impossible to directly test the impact strength of the micro-nanostructure sample. Therefore, it is necessary to propose a detection system and method with a wide range and repeatability that can realize online detection of impact tensile strength. Summary of the invention

[0005] In response to the above-mentioned problems, the present invention proposes a novel double-hammer, wide-range, repeatable in-situ on-chip impact tensile strength online detection system and its manufacturing method and application. The detection system utilizes a newly designed on-chip testing machine structure in combination with a probe station, which can realize in-situ, online detection and extraction of the dynamic impact tensile strength of the MEMS device structure under a complex external mechanical impact environment, and obtain the destruction form and law of the micro-beam structure specimen at the micro-nano size, thereby achieving accurate reliability prediction and quality monitoring of the MEMS device structure.

[0006] The present invention adopts the following technical solution:

[0007] An in-situ on-chip impact tensile strength online detection system comprises: an on-chip test machine and a probe station for applying an external load force to the on-chip test machine; the on-chip test machine comprises: a microbeam to be measured, a mass block to be impacted, a double hammer structure, first and second type probe loading structures, a locking structure, a locking tooth structure, first to third types of elastic suspension folding beams, an elastic energy storage beam, an elastic beam, a power bolt and first to fifth fixed anchor points, all of which are symmetrical about a vertical central axis;

[0008] The two vertical sides of the measured micro-beam are respectively connected to the first fixed anchor point and the impacted mass block, and the two lateral sides of the impacted mass block are connected to the two second fixed anchor points through two first-class elastic suspension folding beams;

[0009] The two conical hammers of the double hammer structure are close to the impacted mass block, a type of probe loading structure is located between the two conical hammers, and two lateral sides of the double hammer structure are connected to two third fixed anchor points through two elastic energy storage beams;

[0010] The locking tooth structure is connected to the side of the double hammer head structure away from the conical hammer head, and two rows of first-class saw teeth are distributed on both sides of the locking tooth structure;

[0011] The lock buckle structure includes two laterally symmetrical parts, with a space between the two parts for accommodating the entry and exit of the lock tooth structure, two second-class saw teeth cooperating with the first-class saw teeth are arranged at the inner side of the two parts close to the lock tooth structure, the outer sides of the two parts are connected to two fourth fixed anchor points through two second-class elastic suspension folding beams, and the vertical side of the two parts away from the lock tooth structure is connected to two fifth fixed anchor points through two elastic beams;

[0012] One end of the power bolt is located between the two parts of the locking structure, and the other end is provided with a second-type probe loading structure. The lateral sides of the power bolt are connected to two sixth fixed anchor points through two third-type elastic suspension folding beams.

[0013] Furthermore, an anti-collision block is provided on a side of the impacted mass block away from the measured microbeam, and a gap is left between the anti-collision block and the impacted mass block.

[0014] Furthermore, the ends of the two conical hammer heads of the impact hammer structure are arc-shaped and are in line contact with the impacted mass block.

[0015] Furthermore, both the first and second type probe loading structures are arc-shaped grooves.

[0016] Furthermore, the first type of saw teeth are triangular saw teeth, the second type of saw teeth are arc-shaped saw teeth, and there is line contact between the first type of saw teeth and the second type of saw teeth.

[0017] Furthermore, each elastic energy storage beam is composed of two parallel single beams.

[0018] Furthermore, the structural shapes of the first to sixth fixing anchor points may be square, rectangular or circular.

[0019] A method for manufacturing an in-situ on-chip impact tensile strength online detection system comprises the following steps of manufacturing an on-chip testing machine:

[0020] Etching on the front side of the silicon wafer by photolithography and anisotropic etching processes to form anchor points, including first to sixth fixed anchor points;

[0021] A shallow groove is prepared on the surface of the glass sheet by photolithography and wet etching process, metal is sputtered in the shallow groove, and a metal electrode for preventing footing effect is prepared by lift-off process;

[0022] The obtained silicon wafer and glass wafer are bonded by a silicon-glass anodic bonding process, and the metal electrode on the glass is pressed into the anchor point area;

[0023] The back side of the silicon wafer is thinned to a preset thickness through a wet etching process;

[0024] A layer of Al metal is sputtered on the back of the silicon wafer as a hard mask;

[0025] The suspended movable structure is released through photolithography and anisotropic etching processes, and the movable structure is each structure of the on-chip test machine except each anchor point and anti-collision block.

[0026] Furthermore, the silicon wafer is an N-type single crystal silicon wafer with a resistivity of 0.001-0.003Ω·cm; three metals, Ti, Pt and Au, are sputtered in shallow grooves on the glass surface.

[0027] An application of an in-situ on-chip impact tensile strength online detection system in the impact tensile strength detection of a microbeam comprises the following steps:

[0028] Applying a displacement load to a type of probe loading structure using a probe of a probe station until the type of saw teeth of the locking structure are engaged with the type of saw teeth of the locking structure;

[0029] The probe of the probe station is used to apply a displacement load to the second-type probe loading structure, and the power bolt is driven to act on the locking structure to release the engagement state between the first-type sawtooth and the second-type sawtooth, and the double hammer structure is released to impact the measured micro-beam and the impacted mass block;

[0030] Observe the impact of the measured micro-beam. If the measured micro-beam is not damaged, repeat the above steps to make the first type of saw teeth of the lock tooth structure engage with the second type of saw teeth of the lock structure in the order from near to far from the lock structure until the measured micro-beam is damaged.

[0031] The position of a type of sawtooth corresponding to the failure of the measured micro-beam is recorded, the loading deflection is calculated, and the impact tensile strength is obtained.

[0032] The beneficial effects achieved by the present invention are as follows:

[0033] 1) The online detection system of the present invention can perform impact tensile testing on micro-scale micro-beam specimens to be tested;

[0034] 2) The online detection system of the present invention can monitor the process quality of the micro-beam preparation process;

[0035] 3) The online detection system of the present invention can realize the synchronous release of the lock structure based on the local contact between the lock tooth structure and the lock structure;

[0036] 4) The method of using the online detection system of the present invention to perform online detection of the in-situ on-chip impact tensile strength is simple and does not require the use of large-scale precision instruments and thermal drive loading and unloading mechanisms, etc.;

[0037] 5) The online detection system of the present invention has repeatability and can realize repeated impact testing of the micro-beam sample under test;

[0038] 6) The online detection system of the present invention has a wide range, and the impact structure loading deflection can reach hundreds of microns, meeting various test requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 It is a schematic diagram of the structure of the on-chip test machine in an embodiment of the present invention.

[0040] Description of reference numerals:

[0041] 1: microbeam under test;

[0042] 2: impacted mass block;

[0043] 3: A type of elastically suspended folding beam;

[0044] 4: Anti-collision block;

[0045] 5: Double hammer structure;

[0046] 6: Elastic energy storage beam;

[0047] 7: A type of probe loading structure;

[0048] 8: Locking tooth structure;

[0049] 9: A type of sawtooth;

[0050] 10: Locking structure;

[0051] 11: Type II sawtooth;

[0052] 12: elastic beam;

[0053] 13: Class II elastic suspension folding beam;

[0054] 14: Power bolt;

[0055] 15: Type II probe loading structure;

[0056] 16: Three types of elastically suspended folding beams;

[0057] 17: first fixed anchor point;

[0058] 18: second fixed anchor point;

[0059] 19: The third fixed anchor point;

[0060] 20: fourth fixed anchor point;

[0061] 21: fifth fixed anchor point;

[0062] 22: Sixth fixed anchor point.

[0063] Figure 2 FIG. 1 is a side view of the on-chip tester in the embodiment of the present invention.

[0064] Figures 3A-3F It is a manufacturing flow chart of the on-chip test machine in the embodiment of the present invention.

[0065] Description of reference numerals:

[0066] 31: Silicon wafer;

[0067] 32: Metal electrode;

[0068] 33: Glass pieces;

[0069] 34: Anchor point;

[0070] 35: hard mask;

[0071] 36: Movable structure. DETAILED DESCRIPTION

[0072] In order to make the above features and advantages of the present invention more obvious and easy to understand, the following embodiments are specifically cited and described in detail with reference to the accompanying drawings. Those skilled in the art can easily understand the structure, advantages and effects of the present invention from the contents disclosed in the following embodiments. The present invention can also be implemented or applied by other different specific examples, and the details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made to the details without departing from the concept and scope of the present invention.

[0073] This embodiment discloses an in-situ on-chip impact tensile strength online detection system, including: an on-chip test machine and a probe station for applying an external load force to the on-chip test machine. The on-chip test machine has a structure as shown in FIG. Figure 1 and Figure 2 As shown, it includes: a microbeam to be measured 1, a mass block to be impacted 2, a type of elastic suspension folding beam 3, an anti-collision block 4, a double hammer structure 5, an elastic energy storage beam 6, a type of probe loading structure 7, a locking tooth structure 8, a type of sawtooth 9, a locking structure 10, a type of sawtooth 11, an elastic beam 12, a type of elastic suspension folding beam 13, a power bolt 14, a type of probe loading structure 15, a type of elastic suspension folding beam 16, and first to sixth fixed anchor points 17, 18, 19, 20, 21, and 22. The overall structure of the on-chip test machine is symmetrical about the central axis of the microbeam to be measured 1. For the convenience of description, the direction of the central axis is called the vertical direction, and the perpendicular direction is called the horizontal direction. Figure 1 The orientation of each structure is consistent. Figure 1 The two sides above and below the center are called the upper side and the lower side respectively.

[0074] The lower side of the measured microbeam 1 is connected to the first fixed anchor point 17, and the upper side is connected to the lower side of the impacted mass block 2. The length, width and thickness of the measured microbeam 1 are all in the micrometer order. The lateral sides of the impacted mass block 2 are connected to the inner ends of two first-class elastic suspension folding beams 3, and the outer ends of the two first-class elastic suspension folding beams 3 are connected to two second fixed anchor points 18. The anti-collision block 4 is located above the impacted mass block 2, and a certain gap is left between the two to prevent the measured microbeam 1 from breaking due to excessive impact energy.

[0075] The upper side of the double hammer structure 5 is provided with two conical hammers, the ends of which are arc-shaped and close to the lower side of the struck mass block 2. When the two are in contact, they are in line contact. The measured microbeam 1 and the first step fixed anchor point 17 are located in the space between the two conical hammers. A type of probe loading structure 7 is located in the middle of the two conical hammers and is an arc-shaped groove, which is convenient for aligning the loading force and positioning the loading position ( Figure 1The downward arrow in the middle is the direction of the loading force). The lateral sides of the double hammer structure 5 are connected to the inner ends of the two elastic energy storage beams 6, and the outer ends of the two elastic energy storage beams 6 are connected to the two third fixed anchor points 19. Each elastic energy storage beam 6 is composed of two parallel single beams.

[0076] The locking tooth structure 8 is connected to the lower side of the double hammer structure 5 , and two rows of first-class saw teeth 9 , specifically triangular saw teeth, are distributed on both sides of the locking tooth structure 8 .

[0077] The locking structure 10 includes two symmetrical parts, and a space is left between the two parts for accommodating the entry and exit of the locking tooth structure 8. Two second-class serrations 11, specifically arc-shaped serrations, are provided on the inner side of the two parts near the upper side. The two second-class serrations 11 cooperate with the two rows of first-class serrations 9 to form a line contact, and the arc-shaped serrations and the triangular serrations are in partial contact, which can reduce the friction resistance so as to achieve the synchronous release of the locking structure 10. The lateral sides of the locking structure 10 are connected to the inner ends of the two second-class elastic suspension folding beams 13, and the outer ends of the two second-class elastic suspension folding beams 13 are connected to the two fourth fixed anchor points 20. The lower side of the locking structure 10 is connected to the upper ends of the two elastic beams 12, and the lower ends of the two elastic beams 12 are connected to the two fifth fixed anchor points 21.

[0078] The upper end of the power bolt 14 is located between the two parts of the lock structure 10. By inserting it between the two parts of the lock structure 10 under the action of the loading force, the lock tooth structure 8 is released, and then the elastic energy storage beam 6 is released. The second type probe loading structure 15 is set at the lower end of the power bolt 14, which is an arc-shaped groove, which is convenient for aligning the loading force and positioning the loading position ( Figure 1 The upward arrow in the middle is the direction of the loading force). The two lateral sides of the power bolt 14 are connected to the inner ends of the two third-class elastic suspension folding beams 16, and the outer ends of the two third-class elastic suspension folding beams 16 are connected to the two sixth fixed anchor points 22.

[0079] This embodiment also discloses a method for manufacturing an in-situ on-chip impact tensile strength online detection system, which mainly includes manufacturing an on-chip test machine. The manufacturing process is as follows: Figures 3A-3F As shown, the process used is based on the standard bond deep etch release process, and the main steps include:

[0080] (1) Figure 3A As shown, the silicon wafer 31 is an N-type single crystal silicon wafer with a resistivity of 0.001-0.003Ω·cm and a thickness of 390±10μm. The silicon wafer 31 is anisotropically etched by photolithography and ASE with an etching depth of 4±0.5μm to form a step, thereby forming an anchor point 34 on the front side of the silicon wafer 31, including the first to sixth fixed anchor points.

[0081] (2) Figure 3BAs shown, the glass sheet 33 is made of pyrex7740 with a thickness of 500±10μm. A shallow groove is prepared on the surface of the glass sheet 33 by photolithography and BHF wet etching process. The depth of the shallow groove is PVD sputters metal Ti / Pt / Au, and a metal electrode 32 for preventing footing effect is prepared by a lift-off process.

[0082] (3) Figure 3C As shown, the obtained silicon wafer 31 and glass wafer 33 are bonded by a silicon-glass anodic bonding process, and the metal electrode 32 on the glass wafer 33 is pressed into the anchor point area to achieve the intervention of the footing effect and the detection of the electrical signal.

[0083] (4) Figure 3D As shown, the back side of the silicon wafer 31 is thinned to a corresponding thickness of 60±5 μm by a wet etching process.

[0084] (5) Figure 3E As shown, a layer of Al metal film is PVD sputtered on the back of the silicon wafer 31 as a hard mask 35, and its thickness is About to ensure the effect of deep etch release.

[0085] (6) Figure 3F As shown, the structure is released by photolithography and anisotropic etching processes to obtain a suspended movable structure 36, which is each structure of the on-chip test machine except for the anchor points and the anti-collision blocks.

[0086] This embodiment also discloses the application of an in-situ on-chip impact tensile strength online detection system, which is used to perform online detection of the impact tensile strength of a micro-beam, and the steps include:

[0087] a. Figure 1 As shown, the probe of the probe station is used to apply a corresponding displacement load to the first type of probe loading structure 7 until the first type of saw teeth 9 at the lower end of the locking tooth structure 8 is engaged with the second type of saw teeth 11 in the locking structure 10 .

[0088] b. Use the probe of the probe station to apply the corresponding displacement load to the second type probe loading structure 15, drive the power bolt 14 to act on the locking structure 10 to release the engagement state between the first type sawtooth 9 and the second type sawtooth 11, and release the double hammer structure 5 to impact the measured microbeam 1 sample and the impacted mass block 2.

[0089] c. Observe the impact of the measured microbeam 1. If the measured microbeam 1 is not damaged, repeat the above steps to make the first type of serrations 9 of the locking structure 8 engage with the second type of serrations 11 in the order from near to far with the locking structure 10 until the measured microbeam 1 is damaged.

[0090] d. Record the position of the first type of sawtooth 9 corresponding to the destruction of the microbeam 1 under test in step c, calculate the corresponding loading deflection to obtain the impact tensile strength. The loading deflection in the present invention can reach more than 200 μm, which has a wide range compared with the loading deflection of only tens of microns of the traditional tensile testing machine. Repeat the above process for multiple measurements, and by applying different load thrusts at the arc-shaped loading port of the first type of probe loading structure 7, the statistical impact tensile fracture strength value of the microbeam 1 under test during this impact tensile process can be obtained.

[0091] Furthermore, a mechanical model of impact simulation is constructed by using the Comsol software, and the loading deflection obtained when the measured microbeam 1 is destroyed in step d is brought into the constructed mechanical model to obtain the impact acceleration and maximum stress peak value at the moment of impact between the double hammer structure 5 and the measured microbeam 1 and the impacted mass block 2, that is, the impact load limit strength value. Through the Comsol simulation software and related calculation processes, it can be obtained that the impact strength value of the measured microbeam 1 in this embodiment can reach 2.8GPa.

[0092] The present invention adds a detection area containing the system on a silicon wafer with functional devices, manufactures the functional devices and the detection system through a standard SOG (silicon on glass) process, and after the entire process is completed, performs impact strength testing on the sample through the system to obtain process-related mechanical characteristic parameters of the functional devices in real time and online.

[0093] The above embodiments are only used to describe the technical solution of the present invention, but not to limit it. The structural features and characteristics that belong to common knowledge are not described in detail here. It should be pointed out that for those skilled in the art, without departing from the technical concept of the present invention, in addition to maintaining the feature of combining the on-chip tester with the probe station for microelectronic process detection and analysis in the present invention, several deformations and improvements can be made to the structure of the on-chip tester, which should also be considered to be included in the protection scope of the present invention. The protection scope of the present invention shall be based on the scope defined by the claims.

Claims

1. An in-situ on-chip impact tensile strength online detection system, characterized in that: include: An on-chip test machine and a probe station for applying an external load force to the on-chip test machine; The on-chip test machine comprises: a microbeam to be measured, a mass block to be impacted, a double hammer structure, first and second type probe loading structures, a locking structure, a locking tooth structure, first to third types of elastic suspension folding beams, an elastic energy storage beam, an elastic beam, a power bolt and first to fifth fixed anchor points, all of which are symmetrical about a vertical central axis; The two vertical sides of the measured micro-beam are respectively connected to the first fixed anchor point and the impacted mass block, and the two lateral sides of the impacted mass block are connected to the two second fixed anchor points through two first-class elastic suspension folding beams; The two conical hammers of the double hammer structure are close to the impacted mass block, a type of probe loading structure is located between the two conical hammers, and two lateral sides of the double hammer structure are connected to two third fixed anchor points through two elastic energy storage beams; The locking tooth structure is connected to the side of the double hammer head structure away from the conical hammer head, and two rows of first-class saw teeth are distributed on both sides of the locking tooth structure; The lock buckle structure includes two laterally symmetrical parts, with a space between the two parts for accommodating the entry and exit of the lock tooth structure, two second-class saw teeth cooperating with the first-class saw teeth are arranged at the inner side of the two parts close to the lock tooth structure, the outer sides of the two parts are connected to two fourth fixed anchor points through two second-class elastic suspension folding beams, and the vertical side of the two parts away from the lock tooth structure is connected to two fifth fixed anchor points through two elastic beams; One end of the power bolt is located between the two parts of the locking structure, and the other end is provided with a second-type probe loading structure. The lateral sides of the power bolt are connected to two sixth fixed anchor points through two third-type elastic suspension folding beams.

2. The in-situ on-chip impact tensile strength online detection as claimed in claim 1, characterized in that: An anti-collision block is arranged on a side of the impacted mass block away from the measured micro-beam, and a gap is left between the anti-collision block and the impacted mass block.

3. The in-situ on-chip impact tensile strength online detection as claimed in claim 1, characterized in that: The ends of the two conical hammer heads of the impact hammer structure are arc-shaped and are in line contact with the impacted mass block.

4. The in-situ on-chip impact tensile strength online detection as claimed in claim 1, characterized in that: The loading structures of the first and second type probes are both arc-shaped grooves.

5. The in-situ on-chip impact tensile strength online detection as claimed in claim 1, characterized in that: The first type of saw teeth are triangular saw teeth, the second type of saw teeth are arc-shaped saw teeth, and there is line contact between the first type of saw teeth and the second type of saw teeth.

6. The in-situ on-chip impact tensile strength online detection as claimed in claim 1, characterized in that: Each elastic energy storage beam is composed of two parallel single beams.

7. The in-situ on-chip impact tensile strength online detection as claimed in claim 1, characterized in that: The structural shapes of the first to sixth fixing anchor points can be square, rectangular or circular.

8. A method for manufacturing an in-situ on-chip impact tensile strength online detection system according to any one of claims 1 to 7, characterized in that: The steps of manufacturing a test-on-chip machine include: Etching on the front side of the silicon wafer by photolithography and anisotropic etching processes to form anchor points, including first to sixth fixed anchor points; A shallow groove is prepared on the surface of the glass sheet by photolithography and wet etching process, metal is sputtered in the shallow groove, and a metal electrode for preventing footing effect is prepared by lift-off process; The obtained silicon wafer and glass wafer are bonded by a silicon-glass anodic bonding process, and the metal electrode on the glass is pressed into the anchor point area; The back side of the silicon wafer is thinned to a preset thickness through a wet etching process; A layer of Al metal is sputtered on the back of the silicon wafer as a hard mask; The suspended movable structure is released through photolithography and anisotropic etching processes, and the movable structure is each structure of the on-chip test machine except each anchor point and anti-collision block.

9. The manufacturing method according to claim 8, characterized in that: The silicon wafer is an N-type single crystal silicon wafer with a resistivity of 0.001-0.003Ω·cm; three metals, Ti, Pt and Au, are sputtered in shallow grooves on the glass surface.

10. An application of the in-situ on-chip impact tensile strength online detection system according to any one of claims 1 to 7 in the impact tensile strength detection of micro beams, characterized in that: The following steps are involved: Applying a displacement load to a type of probe loading structure using a probe of a probe station until the type of saw teeth of the locking structure are engaged with the type of saw teeth of the locking structure; The probe of the probe station is used to apply a displacement load to the second-type probe loading structure, and the power bolt is driven to act on the locking structure to release the engagement state between the first-type sawtooth and the second-type sawtooth, and the double hammer structure is released to impact the measured micro-beam and the impacted mass block; Observe the impact of the measured micro-beam. If the measured micro-beam is not damaged, repeat the above steps to make the first type of saw teeth of the lock tooth structure engage with the second type of saw teeth of the lock structure in the order from near to far from the lock structure until the measured micro-beam is damaged. The position of a type of sawtooth corresponding to the failure of the measured micro-beam is recorded, the loading deflection is calculated, and the impact tensile strength is obtained.

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