Plate vibration optimization method and device of power amplifier, equipment and storage medium

Abstract

The invention relates to the technical field of communication, in particular to a board vibration optimization method, device and equipment of a power amplifier and a computer readable storage medium. The power amplifier comprises a signal gain processing module, a power amplification module and a boost module, and the gain processing module is used for carrying out first gain processing on an input audio signal and sending the processed signal to the power amplification module. The boosting module is used for boosting the power amplifier module under the condition that the voltage amplitude of the processed signal is greater than the current boosting threshold value of the power amplifier module; the method comprises the following steps: determining an initial value of a first gain adopted by first gain processing; and when the current boost threshold value is greater than the conventional boost threshold value of the power amplifier module, reducing the value of the first gain by a first value which is greater than 0 and less than the initial value of the first gain. According to the method disclosed by the invention, the loudness of the output sound can be ensured while the frequency of generating the plate vibration by the power amplifier is reduced.

Description

Technical Field

[0001] The present disclosure relates to the field of communication technology, and in particular to a board oscillation optimization method, device, equipment and computer-readable storage medium for a power amplifier. Background Art

[0002] Currently in the audio field, when a signal passes through a power amplifier, it may cause board vibration, causing noise and affecting audio listening.

[0003] In the related art, due to the business needs of the power amplifier, the output pin of the boost circuit has high requirements for the parallel capacitor. The small package capacitor cannot meet the requirements of the power amplifier, while the large package capacitor is prone to cause board vibration problems during use.

[0004] However, most of the current power amplifier components are purchased from outside, and the components produced by the manufacturer are fixed, which cannot completely avoid the board vibration phenomenon that may occur in some scenarios. In this case, how to fine-tune the components of the power amplifier to eliminate the board vibration is a problem to be solved. Summary of the invention

[0005] In order to overcome the problems existing in the related art, the present disclosure provides a board vibration optimization method, device, equipment and computer-readable storage medium for a power amplifier, which can solve the above problems.

[0006] According to a first aspect of an embodiment of the present disclosure, a board vibration optimization method for a power amplifier is provided, wherein the power amplifier comprises a signal gain processing module, a power amplifier module and a boost module, wherein the gain processing module is used to perform a first gain processing on an input audio signal and send the processed signal to the power amplifier module, and the boost module is used to boost the power amplifier module when the voltage amplitude of the processed signal is greater than a current boost threshold of the power amplifier module; the method comprises: determining an initial value of a first gain adopted for the first gain processing; and when the current boost threshold is greater than a conventional boost threshold of the power amplifier module, reducing the value of the first gain by a first value, wherein the first value is greater than 0 and less than the initial value of the first gain.

[0007] According to a second aspect of an embodiment of the present disclosure, a board vibration optimization device for a power amplifier is provided, wherein the power amplifier comprises a signal gain processing module, a power amplifier module and a boost module, wherein the gain processing module is used to perform a first gain processing on an input audio signal and send the processed signal to the power amplifier module, and the boost module is used to boost the power amplifier module when the voltage amplitude of the processed signal is greater than a current boost threshold of the power amplifier module; the device comprises: a determination unit, configured to determine an initial value of a first gain adopted for the first gain processing; and a reduction unit, configured to reduce the value of the first gain by a first value when the current boost threshold is greater than a conventional boost threshold of the power amplifier module, the first value being greater than 0 and less than the initial value of the first gain.

[0008] According to a third aspect of an embodiment of the present disclosure, an electronic device is provided, comprising: a processor and a memory; the memory is used to store a computer program; the processor is used to execute the board oscillation optimization method of the power amplifier as described in the first aspect by calling the computer program.

[0009] According to a fourth aspect of an embodiment of the present disclosure, there is provided a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the board vibration optimization method of a power amplifier as described in the first aspect.

[0010] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0011] The present disclosure increases the boost threshold of the power amplifier module and reduces the value of the first gain, so that the voltage amplitude of the audio signal can be less than or equal to the boost threshold of the power amplifier module, so that the power amplifier module can complete the power amplification processing of the audio signal without the need for the boost module to perform a boost, thereby avoiding the occurrence of board vibration. In the case where the voltage amplitude of the audio signal is less than or equal to the boost threshold of the power amplifier module, the voltage required for the power amplifier processing is positively correlated with the boost threshold. If the boost threshold is too high, the part of the audio signal with a smaller voltage amplitude will fail to meet the boost requirement and cannot be amplified normally by the power amplifier module, thereby affecting the loudness of the final output sound. Therefore, the board vibration optimization method of the power amplifier disclosed in the present disclosure, in addition to appropriately increasing the boost threshold, also reduces the value of the first gain, thereby ensuring the loudness of the output sound on the basis of reducing the frequency of board vibration of the power amplifier.

[0012] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0014] Figure 1 It is a schematic diagram of the structure of a power amplifier according to an exemplary embodiment of the present disclosure.

[0015] Figure 2 It is a schematic flow chart of a method for optimizing plate vibration of a power amplifier according to an exemplary embodiment of the present disclosure.

[0016] Figure 3 It is a schematic diagram of the structure of a power amplifier according to an exemplary embodiment of the present disclosure.

[0017] Figure 4 It is a schematic diagram of the structure of a power amplifier according to an exemplary embodiment of the present disclosure.

[0018] Figure 5 It is a block diagram of a board vibration optimization device for a power amplifier shown in the present disclosure according to an exemplary embodiment.

[0019] Figure 6 It is a schematic block diagram of a plate vibration optimization device for a power amplifier according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0020] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0021] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. The singular forms of "a", "said" and "the" used in this disclosure and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0022] It should be understood that although the terms first, second, third, etc. may be used in the present disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present disclosure, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0023] In power amplifiers, multi-layer ceramic capacitors (MLCC) are often used, and MLCC has an inverse piezoelectric effect. When a large voltage change is applied to the two ends of the MLCC capacitor in the power amplifier, the MLCC will generate mechanical stress, causing the material to deform, and the deformation vibration of the MLCC will be transmitted to the printed circuit board (PCB), causing the PCB board to resonate. When the frequency of the voltage signal is within the human hearing range of 20Hz to 20kHz, the capacitor will produce audible howling.

[0024] Capacitor howling caused by capacitor plate vibration may cause noise. When a user uses a handheld terminal to make a call, the plate vibration of the power amplifier near the receiver will cause receiver noise.

[0025] Figure 1 It is a schematic diagram of the structure of a power amplifier according to an embodiment of the present disclosure.

[0026] like Figure 1 As shown, the power amplifier 110 includes a signal gain processing module 112, a power amplifier module 114 and a boost module 116, wherein the gain processing module 112 is used to perform a first gain processing on the input audio signal 100 and send the processed signal to the power amplifier module 114, and the boost module 116 is used to boost the power amplifier module 114 when the voltage amplitude of the processed signal is greater than the current boost threshold of the power amplifier module 114; the power amplifier module 114 is used to power amplify the received processed signal and send the power-amplified signal to the signal transmission module 120; the signal transmission module 120 is used to transmit or convert the power-amplified signal.

[0027] In some embodiments, the input audio signal 100 may be an audio signal forwarded by other functional modules and received by the power amplifier 110 , or may be an audio signal generated after an audio acquisition device acquires sound.

[0028] In some embodiments, the gain processing module 112 is used to perform a first gain processing on the input audio signal 100 and send the processed signal to the power amplifier module 114, wherein the first gain processing includes at least one of the following: clearing noise of the input audio signal 100; and gain amplifying the loudness of the input audio signal 100.

[0029] In some embodiments, a digital analog converter (DAC) is further disposed between the gain processing module 112 and the power amplifier module 114 for converting digital signals into analog signals.

[0030] In some embodiments, the material used for the boost module 116 includes MLCC.

[0031] Therefore, when the boost module 116 boosts the power amplifier module 114, board vibration is likely to occur, and when the boost module 116 does not work, board vibration is unlikely to occur.

[0032] In some embodiments, the boost module 116 may be a BOOST boost circuit.

[0033] In some embodiments, the power amplifier module 114 may be a class-D amplifier.

[0034] In some embodiments, the power amplifier module 114 is specifically used for: when the voltage amplitude of the processed signal is less than or equal to the current boost threshold of the power amplifier module 114, using the conventional power supply voltage of the power amplifier module 114 to perform power amplification processing; when the voltage amplitude of the processed signal is greater than the current boost threshold of the power amplifier module 114, the power amplifier module 114 uses the boosted power supply voltage to perform power amplification processing, wherein the conventional power supply voltage of the power amplifier module 114 needs to be boosted by the boost module 116 to obtain the boosted power supply voltage.

[0035] When the voltage amplitude of the signal is less than or equal to the current boost threshold, the normal power supply voltage of the power amplifier module 114 is sufficient to support the power amplification processing of the signal. At this time, the boost module 116 is in standby mode (BYPASS), and the boost module 116 does not work, and it is not easy to cause board vibration; when the voltage amplitude of the signal is greater than the current boost threshold, the normal power supply voltage of the power amplifier module 114 is not sufficient to complete the power amplification processing of the signal with a larger voltage amplitude. At this time, the boost module 116 will increase the power supply voltage of the power amplifier module 114 to ensure that the signal can be power amplified. In this case, board vibration is easily caused.

[0036] Therefore, the key to reducing the board vibration frequency is to avoid frequent voltage boosting of the power amplifier module 114 by the voltage boost module 116 .

[0037] In some embodiments, the normal supply voltage value of the power amplifier module 114 is equal to the current boost threshold.

[0038] Therefore, if a higher boost threshold is set to avoid the operation of the boost module 116, the conventional power supply voltage of the power amplifier module 114 will cause a large amount of power consumption, which is not conducive to the stability of the power amplifier. In addition, if the boost threshold is too high, the partial signal with a smaller voltage amplitude in the audio signal will not meet the boost requirement and cannot be amplified normally by the power amplifier module, thereby affecting the loudness of the final output sound.

[0039] In some embodiments, the signal transmitting module 120 may include an audio module for playing audio after processing the signal.

[0040] Through the processing of the input audio signal 100 by the power amplifier 110 , the audio module can convert the processed signal into a sound with less noise and appropriate loudness and emit it.

[0041] In some embodiments, the power amplifier 110 may be a smart power amplifier (Smart PA).

[0042] In some embodiments, the power amplifier 110 composed of a fixed configuration gain processing module 112, a power amplifier module 114 and a boost module 116 may have a board vibration problem. To address the board vibration problem in this case, the present disclosure proposes a board vibration optimization method for the power amplifier.

[0043] Figure 2 is a schematic flow chart of a board vibration optimization method for a power amplifier according to an embodiment of the present disclosure. The board vibration optimization method for a power amplifier is for example Figure 1 The board oscillation optimization method of the power amplifier shown in the figure can be carried out by Figure 1 The power amplifier 110 is shown as a terminal. The terminal includes but is not limited to mobile phones, tablet computers, wearable devices, sensors, Internet of Things devices and other communication devices.

[0044] like Figure 2 As shown, the board oscillation optimization method of the power amplifier includes:

[0045] In step S201, an initial value of a first gain used in the first gain processing is determined;

[0046] In step S202, when the current boost threshold is greater than the normal boost threshold of the power amplifier module, the value of the first gain is reduced by a first value, where the first value is greater than 0 and less than an initial value of the first gain.

[0047] In some embodiments, the gain processing module 112 performs a first gain processing on the input audio signal 100 , and the voltage amplitude of the audio signal after the first gain processing is greater than that of the input audio signal before the first gain processing.

[0048] In some embodiments, determining an initial value of the first gain used in the first gain processing includes: obtaining an input audio signal and a processed signal obtained by processing the input audio signal with the first gain, and determining an initial value of the first gain used in the first gain processing according to the input audio signal and the corresponding processed signal.

[0049] In some embodiments, the current boost threshold is greater than a normal boost threshold of the power amplifier module.

[0050] If the board oscillation optimization method of the power amplifier proposed in the present disclosure is used, it is necessary to first increase the conventional boost threshold to the current boost threshold, for example, it can be increased in increments or in multiples.

[0051] Since the boost threshold of the power amplifier module also determines the conventional power supply voltage of the power amplifier module, if you want to increase the boost threshold of the power amplifier module, you also need to increase the conventional power supply voltage of the power amplifier module from the hardware. It is impossible to increase the boost threshold only by software.

[0052] For example, a request can be made to a supplier of power amplifier modules to obtain a power amplifier module with a current boost threshold using a higher voltage, thereby replacing the power amplifier module with a conventional boost threshold in a power amplifier that originally had a board vibration problem.

[0053] After the boost threshold is increased, the frequency of the voltage supplied by the boost module to the power amplifier module is reduced, so that the number of voltage fluctuations of the power amplifier module is reduced, thereby reducing the inverse piezoelectric effect of the MLCC material and avoiding board vibration.

[0054] In some embodiments, the conventional boost threshold is a boost threshold of a power amplifier module used in a power amplifier having a board vibration problem.

[0055] When a board vibration problem occurs in a power amplifier, a conventional boost threshold of a power amplifier module in the power amplifier can be determined, and then a power amplifier module with a current boost threshold and a larger boost threshold can be selected for replacement.

[0056] In some embodiments, the conventional boost threshold may range from 0.8V to 1.5V, and the current boost threshold may range from 2.5V to 3.5V. Specifically, in some embodiments, the conventional boost threshold may be 1.3V, and the current boost threshold may be 2.9V.

[0057] It should be noted that the present disclosure does not limit the specific values ​​of the conventional boost threshold and the current boost threshold. The larger the current boost threshold, the better the optimization effect of the board vibration problem, but the greater the power consumption, and the greater the impact on the loudness of the final output sound.

[0058] In some embodiments, the value of the first gain is reduced by a first value, where the first value is greater than 0 and less than an initial value of the first gain.

[0059] Due to business requirements, the gain processing module needs to process the input audio signal through the first gain, but the first gain processing will also cause the voltage amplitude of the input audio signal to increase, thereby causing the voltage amplitude of the audio signal to be greater than the boost threshold of the power amplifier module, thereby causing the boost module to work, resulting in board vibration.

[0060] Therefore, by appropriately reducing the value of the first gain and increasing the boost threshold of the power amplifier module, it is possible to avoid excessive power consumption while optimizing the board vibration problem of the power amplifier, while also ensuring good gain processing of the audio signal and the loudness of the output sound.

[0061] In some embodiments, the first value may be in the range of 3dB-5dB. Specifically, in some embodiments, the first value may be 3dB.

[0062] It should be noted that the present disclosure also does not limit the specific value of the first value, and the first value can be any value greater than 0 and less than the initial value of the first gain according to actual needs. This embodiment has been found to have a good technical effect at 3dB-5dB, and 3dB is a specific example measured through experiments that can better optimize the plate vibration problem while avoiding excessive impact on the first gain.

[0063] When facing a power amplifier with a board vibration problem, the present invention can avoid excessive gain of the voltage amplitude of the input audio signal by reducing the first gain of the gain processing module, and can reduce the probability of the voltage amplitude of the audio signal being greater than the current boost threshold after the power amplifier module is increased, thereby reducing the work of the boost module or avoiding the work of the boost module, thereby achieving the technical effect of optimizing the board vibration while avoiding excessive increase in power consumption and ensuring the loudness of the output sound.

[0064] However, reducing the value of the first gain can not only reduce the peak-to-peak value of the voltage of the signal, thereby reducing the voltage amplitude of the signal, but also have a certain impact on the loudness of the signal.

[0065] Among them, the first value of the first gain reduction accounts for a low proportion of the large signal with a higher acoustic energy value, so the sound loudness of the large signal is relatively less affected by the first value of the first gain reduction. Even if the large signal is not additionally processed, the human ear can still recognize the sound converted from the large signal.

[0066] However, in contrast, in a small signal with a lower acoustic energy value, the first value has a relatively large proportion and has a greater impact on the loudness of the sound, which may make it difficult for the human ear to recognize the sound of the small signal after reducing the first value.

[0067] Therefore, the present disclosure avoids the defects in the plate vibration optimization method through the following embodiments.

[0068] Figure 3 , Figure 4 FIG. 1 is a schematic diagram of a power amplifier structure according to an embodiment of the present disclosure. Figure 3 or Figure 4 shown.

[0069] In some embodiments, the input audio signal 100 is output to the gain processing module 112 after the digital signal processing chip 310 (DigitalSingal Processor, DSP) performs a second gain processing on the received initial audio signal 300; the method also includes: determining an initial value of the second gain adopted for the second gain processing; when the current boost threshold is greater than the normal boost threshold of the power amplifier module, increasing the value of the second gain by a second value, the second value being greater than 0 and less than the initial value of the second gain.

[0070] In some embodiments, the digital signal processing chip 310 includes an audio digital signal processing chip (ADSP).

[0071] In some embodiments, the DSP may perform a second gain processing on the received initial audio signal 300 to eliminate noise and intermittent sounds in the initial audio signal 300 and enhance the signal.

[0072] In some embodiments, determining an initial value of the second gain used in the second gain processing may include: obtaining an initial audio signal 300 and an input audio signal 100 obtained after the second gain processing, and determining an initial value of the second gain used in the second gain processing based on the initial audio signal 300 and the input audio signal 100.

[0073] In some embodiments, when the current boost threshold is greater than a normal boost threshold of the power amplifier module, the value of the second gain is increased by a second value, and the second value is greater than 0 and less than an initial value of the second gain.

[0074] By increasing the value of the second gain, the reduction in loudness of the small signal in the first gain caused by reducing the first value can be offset, so that the loudness of the small signal is basically consistent with that at the initial value of the second gain and the initial value of the first gain under the combined effect of the increase in the second gain and the decrease in the first gain.

[0075] The audio signal necessarily includes large signals and small signals. When the loudness of the large signal remains substantially unchanged, the loudness of the small signal is ensured not to be affected by the first gain being reduced by the first value, thereby ensuring the overall hearing experience of the audio signal.

[0076] In some embodiments, the second value may be equal to the first value.

[0077] That is, the influence on the small signal caused by the reduced first value is compensated by increasing the second value in the second gain of the DSP, so as to avoid a large change in the sound loudness of the small signal.

[0078] In some embodiments, the second value may be in the range of 3dB-5dB. Specifically, in some embodiments, the second value is 3dB.

[0079] In some embodiments, the digital signal processing chip 310 performs the second gain processing on the received initial audio signal 300, and the output input audio signal 100 does not exceed 0 dB.

[0080] Since the maximum value in the value range is selected as the standard voltage ratio during the second gain processing, the value of any signal determined based on the standard voltage ratio will definitely not exceed 0 dB.

[0081] In some embodiments, the input audio signal 100 after the second gain processing is -48 to -45 dB, so even if the value of the second gain is increased by the second value, it will not cause the input audio signal to exceed 0 dB.

[0082] In some embodiments, after the value of the second gain is increased by a second value, the maximum value of the input audio signal is 0 dB.

[0083] In an extreme case, if the second value is large, so that the audio signal after gain exceeds 0 dB, the signal will also become 0 dB after the second gain processing is completed.

[0084] Therefore, by increasing the value of the second gain of DSP, the problem of low loudness of small signals after the first gain is reduced by a first value can be avoided. At the same time, increasing the value of the second gain still limits large signals to below 0dB, and the loudness of the sound received by the large signal after the first gain is reduced by the first value is not greatly affected, thereby solving the defect of sound loudness caused by the board vibration problem.

[0085] In some embodiments, Figure 3 As shown, the power amplifier 110 further includes the digital signal processing chip 310; or Figure 4 As shown, the digital signal processing chip 310 is disposed outside the power amplifier 110 .

[0086] Specifically, in some embodiments, when the digital signal processing chip 310 is disposed outside the power amplifier 110 , the digital signal processing chip 310 is located in a processor 400 (Central Processing Unit, CPU) in the electronic device where the power amplifier 110 is located.

[0087] In some embodiments, the CPU 400 and the power amplifier 110 transmit signals via the IIS protocol.

[0088] In order to receive the signal sent by the CPU through the IIS protocol, the power amplifier 110 may further include a signal interface 410 . The signal interface 410 is also used to send the input audio signal 100 to the gain processing module 112 .

[0089] Corresponding to the embodiment of the board vibration optimization method of the power amplifier disclosed in the present invention, the present disclosure also provides an embodiment of the corresponding board vibration optimization device of the power amplifier.

[0090] See also Figure 5 , Figure 5 1 is a block diagram of a device for optimizing the plate vibration of a power amplifier in one embodiment of the present disclosure. Figure 1 The power amplifier shown in the figure comprises a signal gain processing module, a power amplifier module and a boost module, wherein the gain processing module is used to perform a first gain processing on the input audio signal and send the processed signal to the power amplifier module, and the boost module is used to boost the power amplifier module when the voltage amplitude of the processed signal is greater than the current boost threshold of the power amplifier module.

[0091] like Figure 5 As shown, the board vibration optimization device of the power amplifier includes:

[0092] A determining unit 510 is configured to determine an initial value of a first gain used in the first gain processing;

[0093] The reducing unit 520 is configured to reduce the value of the first gain by a first value when the current boost threshold is greater than the normal boost threshold of the power amplifier module, and the first value is greater than 0 and less than the initial value of the first gain.

[0094] In some embodiments, the conventional boost threshold value ranges from 0.8V to 1.5V, and the current boost threshold value ranges from 2.5V to 3.5V.

[0095] In some embodiments, the first value ranges from 3dB to 5dB.

[0096] In some embodiments, the input audio signal is output to the gain processing module after the digital signal processing chip performs a second gain processing on the received initial audio signal; the device further includes:

[0097] a second determining unit, configured to determine an initial value of a second gain used in the second gain processing;

[0098] The increasing unit is configured to increase the value of the second gain by a second value when the current boost threshold is greater than the normal boost threshold of the power amplifier module, and the second value is greater than 0 and less than an initial value of the second gain.

[0099] In some embodiments, the second value ranges from 3dB to 5dB.

[0100] In some embodiments, the input audio signal output by the digital signal processing chip after performing the second gain processing on the received initial audio signal does not exceed 0 dB.

[0101] In some embodiments, after the value of the second gain is increased by a second value, the maximum value of the input audio signal is 0 dB.

[0102] In some embodiments, the power amplifier further includes the digital signal processing chip; or, the digital signal processing chip is disposed outside the power amplifier.

[0103] In some embodiments, when the digital signal processing chip is disposed outside the power amplifier, the digital signal processing chip is located in a processor in the electronic device where the power amplifier is located.

[0104] The implementation process of the functions and effects of each unit in the above-mentioned device is specifically described in the implementation process of the corresponding steps in the above-mentioned method, and will not be repeated here.

[0105] An embodiment of the present disclosure further proposes an electronic device, comprising: a processor and a memory; the memory is used to store a computer program; the processor is used to execute the board vibration optimization method of the power amplifier as described in any of the above embodiments by calling the computer program.

[0106] An embodiment of the present disclosure further provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the board vibration optimization method of a power amplifier as described in any of the above embodiments.

[0107] Figure 6 6 is a schematic block diagram of a board vibration optimization device 600 for a power amplifier according to an embodiment of the present disclosure. For example, the device 600 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0108] Reference Figure 6 , the device 600 may include one or more of the following components: a processing component 602 , a memory 604 , a power component 606 , a multimedia component 608 , an audio component 610 , an input / output (I / O) interface 612 , a sensor component 614 , and a communication component 616 .

[0109] The processing component 602 generally controls the overall operation of the device 600, such as operations associated with display, phone calls, data communications, camera operations, and recording operations. The processing component 602 may include one or more processors 620 to execute instructions to complete all or part of the steps of the above-mentioned information receiving method. In addition, the processing component 602 may include one or more modules to facilitate the interaction between the processing component 602 and other components. For example, the processing component 602 may include a multimedia module to facilitate the interaction between the multimedia component 608 and the processing component 602.

[0110] The memory 604 is configured to store various types of data to support operations on the device 600. Examples of such data include instructions for any application or method operating on the device 600, contact data, phone book data, messages, pictures, videos, etc. The memory 604 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk, or optical disk.

[0111] The power supply component 606 provides power to the various components of the device 600. The power supply component 606 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the device 600.

[0112] The multimedia component 608 includes a screen that provides an output interface between the device 600 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 608 includes a front camera and / or a rear camera. When the device 600 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera may receive external multimedia data. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

[0113] The audio component 610 is configured to output and / or input audio signals. For example, the audio component 610 includes a microphone (MIC), and when the device 600 is in an operating mode, such as a call mode, a recording mode, and a speech recognition mode, the microphone is configured to receive an external audio signal. The received audio signal can be further stored in the memory 604 or sent via the communication component 616. In some embodiments, the audio component 610 also includes a speaker for outputting audio signals.

[0114] I / O interface 612 provides an interface between processing component 602 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, a home button, a volume button, a start button, and a lock button.

[0115] The sensor assembly 614 includes one or more sensors for providing various aspects of status assessment for the device 600. For example, the sensor assembly 614 can detect the open / closed state of the device 600, the relative positioning of components, such as the display and keypad of the device 600, and the sensor assembly 614 can also detect the position change of the device 600 or a component of the device 600, the presence or absence of user contact with the device 600, the orientation or acceleration / deceleration of the device 600, and the temperature change of the device 600. The sensor assembly 614 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 614 may also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 614 may also include an acceleration sensor, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0116] The communication component 616 is configured to facilitate wired or wireless communication between the device 600 and other devices. The device 600 can access a wireless network based on a communication standard, such as WiFi, 2G, 3G, 4G LTE, 5G NR, or a combination thereof. In an exemplary embodiment, the communication component 616 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 616 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0117] In an exemplary embodiment, the device 600 can be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors or other electronic components to perform the above-mentioned information receiving method.

[0118] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 604 including instructions, and the instructions can be executed by a processor 620 of the device 600 to complete the above-mentioned information receiving method. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0119] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the disclosure disclosed herein. The present disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are to be considered exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0120] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

[0121] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. The terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprises a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0122] The method and device provided in the embodiments of the present disclosure are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present disclosure. The description of the above embodiments is only used to help understand the method of the present disclosure and its core idea. At the same time, for those skilled in the art, according to the idea of ​​the present disclosure, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present disclosure.

Claims

1. A board oscillation optimization method for a power amplifier, characterized in that: The power amplifier comprises a signal gain processing module, a power amplifier module and a boost module, wherein the gain processing module is used to perform a first gain processing on the input audio signal and send the processed signal to the power amplifier module, and the boost module is used to boost the power amplifier module when the voltage amplitude of the processed signal is greater than the current boost threshold of the power amplifier module; The method comprises: Determining an initial value of a first gain used in the first gain processing; When the current boost threshold is greater than a normal boost threshold of the power amplifier module, the value of the first gain is reduced by a first value, where the first value is greater than 0 and less than an initial value of the first gain.

2. The method according to claim 1, characterized in that The conventional boost threshold has a value range of 0.8V-1.5V, and the current boost threshold has a value range of 2.5V-3.5V.

3. The method according to claim 1, characterized in that The first value ranges from 3dB to 5dB.

4. The method according to claim 1, characterized in that: The input audio signal is output to the gain processing module after the digital signal processing chip performs a second gain processing on the received initial audio signal; the method also includes: determining an initial value of a second gain used in the second gain processing; When the current boost threshold is greater than a normal boost threshold of the power amplifier module, the value of the second gain is increased by a second value, where the second value is greater than 0 and less than an initial value of the second gain.

5. The method according to claim 4, characterized in that The second value has a value range of 3dB-5dB.

6. The method according to claim 4, characterized in that The input audio signal output by the digital signal processing chip after performing second gain processing on the received initial audio signal does not exceed 0 dB.

7. The method according to claim 6, characterized in that After the value of the second gain is increased by a second value, the maximum value of the input audio signal is 0 dB.

8. The method according to claim 4, characterized in that The power amplifier also includes the digital signal processing chip; or, The digital signal processing chip is arranged outside the power amplifier.

9. The method according to claim 8, characterized in that In the case where the digital signal processing chip is disposed outside the power amplifier, the digital signal processing chip is located in a processor in the electronic device where the power amplifier is located.

10. A board vibration optimization device for a power amplifier, characterized in that: The power amplifier comprises a signal gain processing module, a power amplifier module and a boost module, wherein the gain processing module is used to perform a first gain processing on the input audio signal and send the processed signal to the power amplifier module, and the boost module is used to boost the power amplifier module when the voltage amplitude of the processed signal is greater than the current boost threshold of the power amplifier module; The device comprises: a determining unit, configured to determine an initial value of a first gain used in the first gain processing; The reducing unit is configured to reduce the value of the first gain by a first value when the current boost threshold is greater than the normal boost threshold of the power amplifier module, and the first value is greater than 0 and less than an initial value of the first gain.

11. An electronic device, characterized in that: include: Processor, memory; The memory is used to store computer programs; The processor is used to execute the board oscillation optimization method of the power amplifier as described in any one of claims 1-9 by calling the computer program.

12. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the board vibration optimization method of the power amplifier described in any one of claims 1-9 is implemented.

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