Feeding and discharging pressure balancing method for coating and coating equipment applying method

Abstract

The invention belongs to the technical field of metal material plating, and particularly relates to a feeding and discharging pressure balancing method for film plating and film plating equipment applying the method, and the feeding and discharging pressure balancing method for film plating comprises the steps that S1, a compensation pipe, a feeding balancing cavity and a discharging balancing cavity are pumped to be in a vacuum state; s2, balancing the pressure behind the loading cavity and a compensation pipe; s3, the pressure of the loading cavity and the pressure of the feeding balance cavity in the vacuum state are balanced, and then the substrate is fed into the feeding balance cavity; s4, gas backfilling is conducted on the loading cavity, and the feeding balance cavity is vacuumized; s5, the pressure of a discharging balance cavity and the pressure of a compensation pipe are balanced; s6, the pressure of the discharging balance cavity and the pressure of a normal-pressure unloading cavity are balanced, and then the coating substrate is fed into the unloading cavity; s7, gas backfilling is conducted on the unloading cavity, and a discharging balance cavity is vacuumized; step S8, circulating the step S2 to the step S7 for a plurality of times; and therefore, the backfilling gas amount is reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of plating of metal materials, and specifically relates to a plating process, and more particularly to a method for balancing inlet and outlet pressures for plating and a plating device using the method. Background Art

[0002] In coating technology, the coated substrate generally undergoes the following processes:

[0003] 1. Send the substrate into the loading chamber at normal pressure;

[0004] 2. Balance the pressure of the vacuum feed balance chamber and the loading chamber and then receive the substrate;

[0005] 3. After the feed balance chamber is evacuated, the substrate is sent into the process chamber for coating;

[0006] 4. Send the coated substrate into the vacuum feed balance chamber;

[0007] 5. Balance the pressure of the unloading chamber and the vacuum feeding balance chamber and then receive the substrate;

[0008] 6. Backfill the unloading chamber with gas to remove the coated substrate.

[0009] In order to speed up the entire process, in the relevant technology, before the loading chamber and the vacuum feed balance chamber balance the pressure, a certain air pressure will be drawn into the loading chamber, and before the unloading chamber and the vacuum discharge balance chamber balance the pressure, a certain air pressure will also be drawn into the unloading chamber.

[0010] However, in the above scheme, it is necessary to evacuate the loading chamber and the unloading chamber by a vacuum pump; at the same time, when the unloading chamber is backfilled with gas, a large amount of gas is required, resulting in a long backfilling time and high cost.

[0011] Therefore, how to shorten the time and amount of gas backfilling in the unloading chamber is a technical problem that those skilled in the art need to solve urgently.

[0012] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the invention

[0013] The embodiments of the present disclosure at least provide a method for balancing the inlet and outlet pressures of coating and a coating device using the method.

[0014] In a first aspect, an embodiment of the present disclosure provides a method for balancing the inlet and outlet pressures for coating, which comprises the following steps: step S1, evacuating the compensation tube, the inlet balancing chamber, and the outlet balancing chamber to a vacuum state; step S2, after sending the substrate into a loading chamber at normal pressure, balancing the pressure of the loading chamber with the compensation tube; step S3, balancing the pressure of the loading chamber after balancing the pressure again with the inlet balancing chamber in a vacuum state, and then sending the substrate into the inlet balancing chamber; step S4, backfilling the loading chamber with gas to wait for receiving a new substrate, and evacuating the inlet balancing chamber Then the received substrate is sent into the process chamber for coating; step S5, after the coated substrate in the process chamber is sent into the discharge balancing chamber in a vacuum state, the pressure in the discharge balancing chamber is balanced with the compensation tube; step S6, the pressure in the discharge balancing chamber after the pressure is balanced is balanced again with the unloading chamber at normal pressure, and then the coated substrate is sent into the unloading chamber; step S7, the unloading chamber is backfilled with gas to send out the coated substrate, and the discharge balancing chamber is evacuated to wait for receiving a new coated substrate; step S8, step S2 to step S7 are repeated several times until the pressure in the compensation tube is stable.

[0015] In an optional embodiment, the method of step S8 includes: after cycling steps S2 to S7 several times, the compensation tube is pressure-balanced with the discharge balance chamber at a stable pressure, and then the discharge balance chamber is pressure-balanced with the unloading chamber again to increase the starting point of the gas backfill pressure of the unloading chamber.

[0016] In an optional embodiment, the method of step S7 includes: releasing the negative pressure in the unloading chamber by backfilling nitrogen into the unloading chamber to deliver the coated substrate; and restoring the vacuum state of the discharge balance chamber by a vacuum pump to wait for receiving a new coated substrate.

[0017] In an optional embodiment, the method of step S2 includes: opening the corresponding gate valve of the loading chamber; closing the corresponding gate valve after the substrate is sent into the loading chamber; opening the first angle valve between the compensation tube and the loading chamber to allow the high-pressure gas in the loading chamber to flow into the low-pressure compensation tube to balance the pressure; closing the first angle valve after the pressure in the loading chamber and the compensation tube is balanced.

[0018] In an optional embodiment, the method of step S5 includes: opening the corresponding gate valve of the discharge balancing chamber; closing the corresponding gate valve after the coated substrate in the process chamber is sent into the discharge balancing chamber; opening the second angle valve between the compensation tube and the discharge balancing chamber to allow the high-pressure gas in the compensation tube to flow into the low-pressure discharge balancing chamber to balance the pressure; closing the second angle valve after the pressure in the discharge balancing chamber and the compensation tube is balanced.

[0019] In the second aspect, the embodiment of the present disclosure also provides a coating device that applies the method of balancing the inlet and outlet pressures for coating, comprising: a coating area, which is separated by corresponding gate valves to form a plurality of chambers, and comprises: a loading chamber, a feed balancing chamber, a discharge balancing chamber, and an unloading chamber; a compensation tube, which is respectively connected to the loading chamber and the discharge balancing chamber; a vacuum pump; and a control module, which is configured to control the vacuum pump to evacuate the feed balancing chamber, the discharge balancing chamber, and the compensation tube to a vacuum state; wherein, after the loading chamber receives the substrate, the loading chamber first balances the pressure with the compensation tube, and then balances the pressure with the feed balancing chamber; and after the discharge balancing chamber receives the coated substrate, the discharge balancing chamber first balances the pressure with the compensation tube, and then balances the pressure with the unloading chamber.

[0020] In an optional embodiment, the coating equipment also includes: a backfill pump, which is respectively connected to the loading chamber and the unloading chamber, and is electrically connected to the control module; wherein the control module is also configured to control the backfill pump to backfill nitrogen into the loading chamber and the unloading chamber to relieve the negative pressure.

[0021] In an optional embodiment, the compensation pipe is connected to the loading chamber through a first pipe, and a first angle valve is provided on the first pipe; the compensation pipe is connected to the discharge balance chamber through a second pipe, and a second angle valve is provided on the second pipe.

[0022] In an optional embodiment, the loading chamber is connected to the feed balance chamber through a third pipe, and a feed balance valve is provided on the third pipe; and the discharge balance chamber is connected to the unloading chamber through a fourth pipe, and a discharge balance valve is provided on the fourth pipe.

[0023] In an optional embodiment, the coating area further includes: a process chamber; the process chamber is located between the feed balance chamber and the discharge balance chamber to receive the substrate for coating and then send it out.

[0024] The beneficial effect of the present invention is that, in the coating inlet and outlet pressure balancing method, when the substrate enters the loading chamber, the pressure of the loading chamber at normal pressure is balanced with the vacuum compensation tube, so that the high-pressure gas in the loading chamber flows into the low-pressure compensation tube, thereby replacing the operation of using a vacuum pump to extract a certain air pressure from the loading chamber in the prior art. Not only does it not need to use a vacuum pump, but the speed of high pressure going to low pressure is faster. After completing this operation, the compensation tube is no longer in a vacuum state, but has a certain pressure; when the substrate enters the discharge balancing chamber, the compensation tube that is no longer in a vacuum state is pressure-balanced with the discharge balancing chamber in a vacuum state, so that the high-pressure gas in the compensation tube flows into the discharge balancing chamber, and then the discharge balancing chamber that is no longer in a vacuum state is pressure-balanced with the unloading chamber in a normal pressure state. At this time, the pressure of the unloading chamber is higher than that after the operation using the prior art, so the amount of nitrogen used when the unloading chamber is backfilled with nitrogen is also less.

[0025] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, this article specifically cites preferred embodiments and provides detailed descriptions as follows in conjunction with the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A flow chart of a method for balancing inlet and outlet pressures for coating provided in an embodiment of the present disclosure;

[0029] Figure 2 A structural block diagram of a coating device provided in an embodiment of the present disclosure.

[0030] In the figure:

[0031] Coating area 1, gate valve 11, loading chamber 12, feed balance chamber 13, discharge balance chamber 14, unloading chamber 15, process chamber 16;

[0032] Compensation tube 2;

[0033] Vacuum pump 3;

[0034] Backfill pump 4;

[0035] A first pipeline 51, a second pipeline 52, a third pipeline 53, and a fourth pipeline 54;

[0036] A first angle valve 61 , a second angle valve 62 , a feed balance valve 63 , and a discharge balance valve 64 . DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, in the drawings, the thickness of the components may be exaggerated or reduced in order to effectively describe the technical content.

[0039] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0040] like Figure 1 As shown, at least one embodiment provides a method for balancing the inlet and outlet pressures of a coating film, which comprises the following steps:

[0041] Step S1, evacuate the compensation tube 2, the feed balance chamber 13, and the discharge balance chamber 14 to a vacuum state;

[0042] Step S2, after the substrate is sent into the loading chamber 12 at normal pressure, the pressure in the loading chamber 12 and the compensation tube 2 are balanced;

[0043] Step S3, making the pressure of the loading chamber 12 after pressure balancing be balanced again with the feeding balancing chamber 13 in a vacuum state, and then sending the substrate into the feeding balancing chamber 13;

[0044] Step S4, backfilling the loading chamber 12 with gas to wait for receiving a new substrate, and evacuating the feed balance chamber 13 to deliver the received substrate into the process chamber 16 for coating;

[0045] Step S5, after the coated substrate in the process chamber 16 is sent into the discharge balance chamber 14 in a vacuum state, the pressure in the discharge balance chamber 14 and the compensation tube 2 are balanced;

[0046] Step S6, making the pressure of the discharge balance chamber 14 after pressure balance balanced again with the unloading chamber 15 at normal pressure, and then sending the coated substrate into the unloading chamber 15;

[0047] Step S7, backfilling the unloading chamber 15 with gas to deliver the coated substrate, and evacuating the discharge balance chamber 14 to wait for receiving a new coated substrate;

[0048] Step S8, looping steps S2 to S7 for several times until the pressure in the compensation pipe 2 is stable.

[0049] In the present embodiment, step S1 is the operation of initializing the device; when the substrate enters the loading chamber 12, the pressure of the loading chamber 12 at normal pressure is balanced with the vacuum compensation tube 2, so that the high-pressure gas in the loading chamber 12 flows into the low-pressure compensation tube 2, so as to replace the operation of using a vacuum pump to extract a certain air pressure from the loading chamber in the prior art. Not only does it not need to use a vacuum pump, but the gas moves faster from high pressure to low pressure; after completing this operation, the compensation tube 2 is no longer in a vacuum state, but there is a certain pressure. When the substrate enters the discharge balance chamber 14, the compensation tube 2 which is no longer in a vacuum state is pressure-balanced with the discharge balance chamber 14 in a vacuum state, so that the high-pressure gas in the compensation tube 2 flows into the low-pressure discharge balance chamber 14, and then the discharge balance chamber 14 which is no longer in a vacuum state is pressure-balanced with the unloading chamber 15 in a normal pressure state. At this time, the pressure of the unloading chamber is higher than that after the operation using the prior art, so the amount of nitrogen used when the unloading chamber 15 is backfilled with nitrogen is also less.

[0050] In some embodiments, the method of step S8 includes: after cycling steps S2 to S7 several times, the compensation tube 2 is pressure balanced with the discharge balance chamber 14 at a stable pressure, and then the discharge balance chamber 14 is pressure balanced with the unloading chamber 15 again to increase the starting point of the gas backfill pressure of the unloading chamber 15.

[0051] In this embodiment, during the first cycle, the compensation tube 2 is evacuated. As the compensation tube 2 balances the pressure between the normal pressure loading chamber 12 and the vacuum discharge balance chamber 14 for multiple times, it will gradually tend to a stable pressure to balance the pressure with the discharge balance chamber 14.

[0052] In one embodiment, the volumes of the loading chamber 12, the feed balance chamber 13, the discharge balance chamber 14, the unloading chamber 15, and the compensation tube 2 are the same, and the pressures of the normal pressure loading chamber 12 and the normal pressure unloading chamber 15 are both 100 kPa, as shown in the following table:

[0053]

[0054] In the comparative example of the prior art, the volumes of the loading chamber 12, the feed balance chamber 13, the discharge balance chamber 14, and the unloading chamber 15 are the same, and the pressures of the normal pressure loading chamber 12 and the normal pressure unloading chamber 15 are both 100 kPa. The unloading operation process is as follows: first, the 100 kPa unloading chamber 15 is evacuated to 60 kPa, and then the 60 kPa unloading chamber 15 is pressure-balanced with the vacuum discharge balance chamber 14 to obtain a 30 kPa unloading chamber 15. After the unloading chamber 15 receives the coated substrate, the 30 kPa unloading chamber 15 is backfilled with nitrogen until the negative pressure is released.

[0055] As can be seen from the comparison between the above table and the prior art, in the present embodiment, during multiple cycles, the unloading chamber 15 can be stabilized at 66.66 kPa and start to backfill with nitrogen; while the unloading chamber in the prior art needs to be backfilled with nitrogen from 30 kPa; by comparing the two, it can be clearly seen that the amount of backfill nitrogen required in the present embodiment is significantly reduced.

[0056] In some embodiments, the method of step S7 includes: releasing the negative pressure of the unloading chamber by backfilling nitrogen into the unloading chamber, thereby delivering the coated substrate; and restoring the vacuum state of the discharge balance chamber by a vacuum pump, thereby receiving a new coated substrate.

[0057] In this embodiment, it can be seen from the above table that the unloading chamber only needs to be backfilled with nitrogen from 66666.68 Pa; while the prior art generally involves first extracting a certain air pressure from the unloading chamber and then performing pressure balance with the discharge balance chamber. For example, the unloading chamber is pumped from 100 kPa to 60 kPa, and then the 60 kPa unloading chamber is pressure-balanced with the vacuum discharge balance chamber to obtain a 30 kPa unloading chamber. At this time, the backfilling of nitrogen needs to start from 30 kPa.

[0058] In some embodiments, the method of step S2 includes: opening the corresponding gate valve of the loading chamber; closing the corresponding gate valve after the substrate is sent into the loading chamber; opening the corresponding angle valve between the compensation tube and the loading chamber to allow the high-pressure gas in the loading chamber to flow into the low-pressure compensation tube to balance the pressure; closing the corresponding angle valve after the pressure in the loading chamber and the compensation tube is balanced.

[0059] In some embodiments, the method of step S5 includes: opening the corresponding gate valve of the discharge balancing chamber; closing the corresponding gate valve after sending the coated substrate in the process chamber into the discharge balancing chamber; opening the corresponding angle valve between the compensation tube and the discharge balancing chamber to allow the high-pressure gas in the compensation tube to flow into the low-pressure discharge balancing chamber to balance the pressure; closing the corresponding angle valve after the discharge balancing chamber and the compensation tube balance the pressure.

[0060] like Figure 2 As shown, at least one embodiment also provides a coating device that applies the method of balancing the inlet and outlet pressures for coating, comprising: a coating area 1, which is separated by corresponding gate valves 11 to form a plurality of chambers, including: a loading chamber 12, a feed balancing chamber 13, a discharge balancing chamber 14, and an unloading chamber 15; a compensation tube 2, which is respectively connected to the loading chamber 12 and the discharge balancing chamber 14; and a vacuum pump 3, which is electrically connected to the control module, and the control module is configured to control the vacuum pump 3 to evacuate the feed balancing chamber 13, the discharge balancing chamber 14, and the compensation tube 2 to a vacuum state; wherein, after the loading chamber 12 receives the substrate, the loading chamber 12 first balances the pressure with the compensation tube 2, and then balances the pressure with the feed balancing chamber 13; and after the discharge balancing chamber 14 receives the coated substrate, the discharge balancing chamber 14 first balances the pressure with the compensation tube 2, and then balances the pressure with the unloading chamber 15.

[0061] In some embodiments, the coating equipment also includes: a backfill pump 4, which is respectively connected to the loading chamber 12 and the unloading chamber 15, and is electrically connected to the control module. The control module is configured to control the backfill pump 4 to backfill nitrogen into the loading chamber 12 and the unloading chamber 15 to relieve the negative pressure.

[0062] In some embodiments, the compensation tube 2 is connected to the loading chamber 12 through a first pipe 51 , and a first angle valve 61 is provided on the first pipe 51 ; the compensation tube 2 is connected to the discharge balance chamber 14 through a second pipe 52 , and a second angle valve 62 is provided on the second pipe 72 .

[0063] In this embodiment, when the loading chamber 12 needs to balance the pressure with the compensation pipe 2 , the first angle valve 61 is opened, and after the pressure balance is completed, the first angle valve 61 is closed; the same is true for the discharge balance chamber 14 .

[0064] In some embodiments, the loading chamber 12 is connected to the feed balance chamber 13 through a third pipe 53, and a feed balance valve 63 is provided on the third pipe 53; and the discharge balance chamber 14 is connected to the unloading chamber 15 through a fourth pipe 54, and a discharge balance valve 64 is provided on the fourth pipe 54.

[0065] In this embodiment, when the loading chamber 12 needs to balance the pressure with the feed balance chamber 13 , the feed balance valve 63 is opened, and after the pressure balance is completed, the feed balance valve 63 is closed; the same is true for the discharge balance chamber 14 .

[0066] In some embodiments, the coating area 1 further includes: a process chamber 16; the process chamber 16 is located between the feed balance chamber 13 and the discharge balance chamber 14 to receive the substrate for coating and then send it out.

[0067] Regarding the method for balancing the inlet and outlet pressures for coating, please refer to the relevant discussion in the above embodiments, which will not be repeated here.

[0068] In the present embodiment, in the inlet and outlet pressure balancing method for coating, when the substrate enters the loading chamber, the loading chamber at normal pressure is pressure-balanced with the vacuum compensation tube, so that the high-pressure gas in the loading chamber flows into the low-pressure compensation tube, thereby replacing the operation of using a vacuum pump to extract a certain air pressure from the loading chamber in the prior art. Not only does it not need to use a vacuum pump, but the speed of high pressure going to low pressure is faster. After completing this operation, the compensation tube is no longer in a vacuum state, but has a certain pressure; when the substrate enters the outlet balancing chamber, the compensation tube, which is no longer in a vacuum state, is pressure-balanced with the outlet balancing chamber in a vacuum state, so that the high-pressure gas in the compensation tube flows into the outlet balancing chamber, and then the outlet balancing chamber, which is no longer in a vacuum state, is pressure-balanced with the unloading chamber in a normal pressure state. At this time, the pressure of the unloading chamber is higher than that after the operation using the prior art, so the amount of nitrogen used when the unloading chamber is backfilled with nitrogen is also less.

[0069] Herein, when it is mentioned that a first component is located on a second component, this may mean that the first component may be directly formed on the second component, or a third component may be interposed between the first component and the second component.

[0070] In this article, when an element or layer is referred to as being "located on," "engaged to," "connected to," "attached to," or "coupled to" another element or layer, it may be directly located on, engaged, connected, attached to, or coupled to another element or layer, or there may be intermediate elements or layers. In contrast, when an element is referred to as being "directly on," "directly engaged to," "directly connected to," "directly attached to," or "directly coupled to" another element or layer, there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0071] Herein, example embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. As used herein, expressions such as "at least one of..." modify the entire list of elements when following a list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, or all of a, b, and c.

[0072] The terms used herein are only used to describe specific exemplary configurations and are not intended to be limited. As used herein, the singular articles "one", "an" and "the" may also be intended to include plural forms, unless it is clearly indicated above that this is not the case. The terms "comprise", "include" and "have" are inclusive, and therefore specify the presence of features, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components and / or combinations thereof. The method steps, processes and operations described herein should not be interpreted as necessarily requiring them to be performed in the specific order discussed or shown, unless specifically identified as an execution order. Additional or alternative steps may be adopted.

[0073] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Therefore, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, so that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. On the contrary, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0074] In the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0075] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, terms such as "first", "second" and other numerical terms do not imply an order or sequence when used in this document unless explicitly indicated above. Therefore, without departing from the teachings of the example embodiments, the first element, component, region, layer or section discussed above may be referred to as a second element, component, region, layer or section.

[0076] Spatially relative terms, such as "inside", "outside", "below", "below", "down", "above", "on", etc., may be used herein to facilitate description of the relationship of one element or feature to another element or feature as illustrated in the figure. In addition to the orientation depicted in the figure, spatially relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is turned over, the elements described as "below" or "below" other elements or features will be oriented to be "above" other elements or features. Therefore, the example term "below" can cover the orientation above and below. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0077] In the above discussion, unless otherwise stated, the terms "about," "approximately," "substantially," etc., when used to describe a numerical value, mean a variation of + / - 10% of the value.

[0078] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A method for balancing the inlet and outlet pressures of a coating, characterized in that: The steps include: Step S1, evacuating the compensation tube (2), the feed balance chamber (13), and the discharge balance chamber (14) to a vacuum state; Step S2, after the substrate is placed into a loading chamber (12) at normal pressure, the pressure in the loading chamber (12) and the compensation tube (2) are balanced; Step S3, making the pressure of the loading chamber (12) after pressure balancing be balanced again with the feeding balancing chamber (13) in a vacuum state, and then sending the substrate into the feeding balancing chamber (13); Step S4, backfilling the loading chamber (12) with gas to wait for receiving a new substrate, and evacuating the feed balance chamber (13) before sending the received substrate into the process chamber (16) for coating; Step S5, after the coated substrate in the process chamber (16) is sent into the discharge balancing chamber (14) in a vacuum state, the pressure in the discharge balancing chamber (14) and the compensation tube (2) are balanced; Step S6, making the pressure of the discharge balancing chamber (14) after the pressure is balanced again balance the pressure with the unloading chamber (15) at normal pressure, and then sending the coated substrate into the unloading chamber (15); Step S7, backfilling the unloading chamber (15) with gas to deliver the coated substrate, and evacuating the discharge balance chamber (14) to wait for receiving a new coated substrate; Step S8, looping steps S2 to S7 for several times until the pressure in the compensation pipe (2) is stable.

2. The method for balancing the inlet and outlet pressures of coating according to claim 1, characterized in that: The method of step S8 comprises: After cycling through steps S2 to S7 for several times, the compensating pipe (2) is pressure balanced with the discharge balancing chamber (14) at a stable pressure, and then the discharge balancing chamber (14) is pressure balanced with the unloading chamber (15) again, so as to increase the starting point of the gas backfill pressure of the unloading chamber (15).

3. The method for balancing the inlet and outlet pressures of coating according to claim 1, characterized in that: The method of step S7 comprises: Releasing the negative pressure in the unloading chamber (15) by backfilling nitrogen into the unloading chamber (15) to deliver the coated substrate; and The discharge balance chamber (14) is restored to a vacuum state by means of a vacuum pump (3) to wait for receiving a new coated substrate.

4. The method for balancing the inlet and outlet pressures of coating according to claim 1, characterized in that: The method of step S2 comprises: Opening the corresponding gate valve (11) of the loading chamber (12); After the substrate is placed into the loading chamber (12), the corresponding gate valve (11) is closed; Opening the first angle valve (61) between the compensation tube (2) and the loading chamber (12) to allow the high-pressure gas in the loading chamber (12) to flow into the low-pressure compensation tube (2) to balance the pressure; After the pressure in the loading chamber (12) and the compensation pipe (2) is balanced, the first angle valve (61) is closed.

5. The method for balancing the inlet and outlet pressures of coating according to claim 1, characterized in that: The method of step S5 comprises: Open the corresponding gate valve (11) of the discharge balance chamber (14); After the coated substrate in the process chamber (16) is sent into the discharge balance chamber (14), the corresponding gate valve (11) is closed; Opening the second angle valve (62) between the compensation pipe (2) and the discharge balancing chamber (14) to allow the high-pressure gas in the compensation pipe (2) to flow into the low-pressure discharge balancing chamber (14) to balance the pressure; After the pressure in the discharge balance chamber (14) and the compensation pipe (2) is balanced, the second angle valve (62) is closed.

6. A coating device using the coating inlet and outlet pressure balancing method as claimed in claim 1, characterized in that: include: The coating area (1) is separated by corresponding gate valves (11) to form a plurality of chambers, and includes: a loading chamber (12), a feed balance chamber (13), a discharge balance chamber (14), and an unloading chamber (15); The compensating tube (2) is connected to the loading chamber (12) and the discharge balance chamber (14) respectively; a vacuum pump (3); and A control module is configured to control the vacuum pump (3) to evacuate the feed balance chamber (13), the discharge balance chamber (14), and the compensation pipe (2) to a vacuum state; Wherein, after the loading chamber (12) receives the substrate, the loading chamber (12) first balances the pressure with the compensation tube (2), and then balances the pressure with the feed balance chamber (13); and After the discharge balancing chamber (14) receives the coated substrate, the discharge balancing chamber (14) first balances the pressure with the compensation tube (2) and then balances the pressure with the unloading chamber (15).

7. The coating device according to claim 6, characterized in that: Also includes: A backfill pump (4) is connected to the loading chamber (12) and the unloading chamber (15), respectively, and is electrically connected to the control module; The control module is further configured to control the backfill pump (4) to backfill nitrogen into the loading chamber (12) and the unloading chamber (15) to relieve the negative pressure.

8. The coating device according to claim 7, characterized in that: The compensating pipe (2) is connected to the loading chamber (12) via a first pipe (51), and a first angle valve (61) is provided on the first pipe (51); The compensation pipe (2) is connected to the discharge balance chamber (14) via a second pipeline (52), and a second angle valve (62) is provided on the second pipeline (72).

9. The coating device according to claim 8, characterized in that: The loading chamber (12) is connected to the feed balancing chamber (13) via a third pipeline (53), and a feed balancing valve (63) is provided on the third pipeline (53); and The discharge balancing chamber (14) is connected to the unloading chamber (15) via a fourth pipeline (54), and a discharge balancing valve (64) is provided on the fourth pipeline (54).

10. The coating device according to claim 6, characterized in that: The coating area (1) further comprises: a process chamber (16); The process chamber (16) is located between the feed balance chamber (13) and the discharge balance chamber (14) to receive the substrate for coating and then send it out.

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