Wafer positioning device and method

Abstract

The invention provides a wafer positioning device, which is characterized in that a controller receives image data of an outer edge of a wafer, calculates an accurate position of a positioning characteristic of the outer edge of the wafer by matching a first-order derivative and a second-order derivative of the image data with polynomial regression operation, eliminates the positioning characteristic in the image data, and outputs the positioning characteristic of the outer edge of the wafer. The center offset of the wafer is calculated according to the image data excluding the positioning features, and then the correction angle and the X-Y correction amount are calculated. The controller controls the driving device to control the rotating platform module to rotate according to the correction angle so as to enable the positioning feature to rotate to a specified angle; and controlling a driving device of the wafer positioning device according to the X-Y correction amount to enable the wafer to move on a horizontal plane of a rotating platform module of the wafer positioning device so as to enable the circle center of the wafer to be aligned with a specified position of the rotating platform module.

Description

Technical Field

[0001] The present invention relates to a wafer positioning device and method, and in particular to a wafer positioning device and method which can detect non-transparent silicon wafers and semi-transparent wafers made of special materials and can support the judgment of different positioning features. Background Art

[0002] Before the wafer enters the semiconductor manufacturing equipment, it needs to be positioned first. Therefore, the outer edge of the wafer will be designed with positioning features, such as notch-type positioning features. The wafer positioning device for wafer positioning is also called a wafer edge finder, and the wafer positioning device is mainly used to find the position of the positioning feature on the outer edge of the wafer (which is the angle of the positioning feature) and perform eccentricity correction (including correction of the XY correction amount (XY axis) and correction of the correction angle (θ axis)). After the wafer is corrected, its center will be aligned with the specified position of the rotating platform carrying the wafer, and the wafer will be rotated to the specified angle, and then the rotating platform carrying the wafer will send the wafer to the semiconductor manufacturing equipment for subsequent processes, where the specified position usually refers to the home position of the rotating platform, which is a constant position, and when the wafer is scheduled to enter the next process, the positioning feature needs to be rotated to the specified angle.

[0003] Taiwan's patent No. TW I735315 provides a method and system for detecting the position of a wafer. The detection method is described as follows: first, a rotating platform rotates in one direction at a faster speed to drive a wafer placed on the rotating platform and having a positioning feature on its outer edge to rotate, and a detector detects the outer edge of the wafer to generate a detection result for a controller, each detection result corresponding to a rotation angle of the rotating platform; when the positioning feature passes through the detector, the rotating platform rotates in the opposite direction at a slower speed to drive the wafer to rotate in the opposite direction, and the detector detects the outer edge of the wafer rotating in the opposite direction to generate a detection result for the controller; and when the positioning feature of the wafer passes through the detector again, the rotating platform stops rotating, and the controller estimates the eccentric position of the wafer and the position of the positioning feature based on the accumulated detection results and the corresponding rotation angle.

[0004] However, the detection method of the above-mentioned approved patent requires the rotating platform to rotate more than twice, and according to the detailed description of the above-mentioned approved patent, the wafer in the above-mentioned approved patent cannot be a wafer of a translucent material, and the positioning feature must be a notch type positioning feature. Therefore, the industry still needs a wafer positioning device and method that can reduce the number of rotations of the rotating platform and support various types of wafers and various types of positioning features. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides a wafer positioning device and method, which mainly finds the approximate position of the positioning feature of the outer edge of the wafer by calculating the first-order derivative and the second-order derivative of the image data of the outer edge of the wafer, and then finds the precise position (i.e., the precise angle) of the positioning feature through polynomial regression calculation. After that, after excluding the positioning feature in the image data, the center offset of the wafer is calculated according to the image data excluding the positioning feature, the correction angle is calculated according to the precise position of the positioning feature and the center offset, and the XY correction amount is calculated according to the correction angle and the center offset. Finally, the X-axis moving mechanism, the Y-axis moving mechanism and the θ-axis rotating mechanism of the rotating platform are controlled according to the calculated correction angle and the XY correction amount to align the center of the wafer with the specified position of the rotating platform and rotate the positioning feature of the wafer to the specified angle.

[0006] Based on at least one purpose of the present invention, the present invention provides a wafer positioning device, and the wafer positioning device includes a rotating platform module, a light source, an image capture device, a controller and a driving device. The rotating platform module is used to carry the wafer and to rotate the wafer. The light source is arranged on the outside of the rotating platform module and is used to emit light to illuminate the outer edge of the wafer. The image capture device is arranged on the outside of the rotating platform module and faces the light source, and is used to obtain image data of the outer edge of the wafer. The controller is electrically connected to the light source and the image capture device, and is used to receive the image data, and calculate the precise position of the positioning feature of the outer edge of the wafer through the first-order derivative and the second-order derivative of the image data in combination with a polynomial regression operation, and after excluding the positioning feature in the image data, the center offset of the wafer is calculated according to the image data excluding the positioning feature, the correction angle is calculated according to the precise position of the positioning feature and the center offset, and the XY correction amount is calculated according to the correction angle and the center offset. The driving device is electrically connected to the controller and connected to the rotating platform module. The controller controls the driving device to drive the rotating platform module to rotate according to the correction angle so that the positioning feature is rotated to a specified angle (when the wafer is scheduled to enter the next process, the positioning feature needs to be rotated to the specified angle), and the controller controls the driving device to drive the rotating platform module according to the XY correction amount to move the wafer in the horizontal plane of the rotating platform module so that the center of the wafer is aligned with the specified position of the rotating platform module (the specified position refers to the home position of the rotating platform module).

[0007] Optionally, in the above-mentioned embodiment of the wafer positioning device, the controller calculates the approximate position of the positioning feature based on the first-order derivative and the second-order derivative of the image data, and then performs multiple iterative calculations based on the approximate position using a polynomial regression operation to calculate the precise position of the positioning feature, wherein the precise position is the precise angle of the positioning feature.

[0008] Optionally, in the above-mentioned embodiment of the wafer positioning device, the controller excludes the positioning features of the precise position in the image data, and finds the corresponding circle equation according to the image data excluding the positioning features, so as to obtain the center offset.

[0009] Optionally, in the above-mentioned embodiment of the wafer positioning device, the wafer (WF) is a non-transparent silicon wafer or a wafer made of a semi-transparent material.

[0010] Optionally, in the above-mentioned embodiment of the wafer positioning device, the positioning feature of the wafer (WF) is a notch type positioning feature, a double flat edge type positioning feature or a single flat edge type positioning feature.

[0011] Optionally, in the above-mentioned embodiment of the wafer positioning device, the controller controls the driving device to drive the rotating platform module to rotate at least 360 degrees, and the image data captured by the image capture device is image data of the outer edge of the wafer rotated at least 360 degrees.

[0012] Optionally, in the above-mentioned embodiment of the wafer positioning device, the controller sets the brightness of the light source and the sensitivity of the image capturing device according to instructions input by an operator, wherein the operator determines the input instructions according to the type of wafer.

[0013] Optionally, in the embodiment of the above-mentioned wafer positioning device, the rotating platform module includes a θ-axis rotation mechanism, a Y-axis movement mechanism and an X-axis movement mechanism, wherein the θ-axis rotation mechanism is used to be driven by a driving device to rotate the rotating platform module, and the Y-axis movement mechanism and the X-axis movement mechanism are used to be driven by the driving device to move the wafer in the horizontal plane of the rotating platform module.

[0014] Based on at least one purpose of the present invention, the present invention provides a wafer positioning method, which includes the following steps: starting a light source and an image capture module, wherein the light source and the image capture module are arranged opposite to each other and face the outer edge of the wafer carried by the rotating platform module, and are located outside the rotating platform module; using a controller to control a driving device to drive the rotating platform module to rotate at least 360 degrees, so as to drive the wafer carried by the rotating platform module to rotate at least 360 degrees; using an image capture device to obtain image data of the outer edge of the wafer; using a controller to calculate the approximate position of the positioning feature according to the first-order derivative and the second-order derivative of the image data, and then using a polynomial regression operation to perform multiple iterative calculations based on the approximate position to calculate the precise position of the positioning feature. The method comprises the steps of: determining a position of the wafer, wherein the precise position is the precise angle of the positioning feature; excluding the positioning feature of the precise position in the image data by using a controller, and finding the corresponding circle equation according to the image data excluding the positioning feature to obtain the center offset of the wafer; calculating the correction angle according to the precise position of the positioning feature and the center offset by using the controller, and calculating the XY correction amount according to the center offset and the correction angle; controlling the driving device to drive the rotating platform module to rotate according to the correction angle by using the controller so that the positioning feature rotates to a specified angle, and controlling the driving device to drive the rotating platform module according to the XY correction amount by using the controller so that the wafer moves in the horizontal plane of the rotating platform module so that the center of the wafer is aligned with the specified position of the rotating platform module.

[0015] Optionally, in the embodiment of the above wafer positioning method, the wafer is a non-transparent silicon wafer or a semi-transparent wafer, and the positioning feature of the wafer is a notch type positioning feature, a double flat edge type positioning feature or a single flat edge type positioning feature.

[0016] In summary, compared with the prior art, the wafer positioning device and method of the present invention can reduce the number of rotations of the rotating platform and can support various types of wafers and various types of positioning features. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of a wafer positioning device according to an embodiment of the present invention.

[0018] Figure 2 It is a schematic flow chart of a wafer positioning method according to an embodiment of the present invention.

[0019] Figure 3 It is a detailed flowchart of the steps of finding wafer positioning features and calculating the precise position and center offset of the wafer in the wafer positioning method according to an embodiment of the present invention.

[0020] Figure 4 It is a schematic diagram of the correction angle of the wafer in the wafer positioning method according to an embodiment of the present invention.

[0021] Figure 5 2 is another schematic diagram of the correction angle of the wafer in the wafer positioning method according to the embodiment of the present invention.

[0022] Figure 6 It is a schematic diagram of the XY correction amount of the wafer in the wafer positioning method according to an embodiment of the present invention.

[0023] Figure 7 It is a schematic diagram of another XY correction amount of a wafer in the wafer positioning method according to an embodiment of the present invention.

[0024] Description of the figure number:

[0025] 1: Wafer positioning device

[0026] 11: Rotating platform module

[0027] 111: θ-axis rotation mechanism

[0028] 112: Y-axis moving mechanism

[0029] 113: X-axis moving mechanism

[0030] 12: Light source

[0031] 13: Image capture device

[0032] 14: Controller

[0033] 15: Drive device

[0034] S21~S27, S251~S256: Steps

[0035] θ: Correction angle

[0036] θ a ,θ e ,θ b :angle

[0037] d: triangle height

[0038] D: Center offset

[0039] R: Radius

[0040] θ O : Exact location

[0041] θ t : Target angle

[0042] θ n : direction angle

[0043] WF: wafer. DETAILED DESCRIPTION

[0044] Please refer to Figure 1 , Figure 1 1 is a schematic diagram of a wafer positioning device according to an embodiment of the present invention. The wafer positioning device 1 includes a rotating platform module 11, a light source 12, an image capture device 13, a controller 14 and a driving device 15. In addition to being a rotatable platform for carrying a wafer WF, the rotating platform module 11 further includes a θ-axis rotating mechanism 111, a Y-axis moving mechanism 112 and an X-axis moving mechanism 113. The controller 14 is electrically connected to the light source 12, the image capture device 13 and the driving device 15, and the θ-axis rotating mechanism 111, the Y-axis moving mechanism 112 and the X-axis moving mechanism 113 are connected to the driving device 15.

[0045] The light source 12 is disposed at the lower outer side of the rotating platform module 11, and the image capture device 13 is disposed at the upper outer side of the rotating platform module 11, and the light source 12 and the image capture device 13 are disposed corresponding to each other. When the wafer WF is placed on the rotating platform module 11, the light emitted by the light source 12 will be directed toward the outer edge of the wafer WF, and the image capture device 13 will capture the image data of the outer edge of the wafer WF. The light source 12 can be a laser diode or other directional light source, for example, a directional light source formed by a light emitting diode and a convex lens. The image capture device 13 can be a charge coupled device (CCD) imaging device or other types of imaging devices. In addition, the present invention does not limit the types of the light source 12 and the image capture device 13.

[0046] The controller 14 can rotate the θ-axis rotation mechanism 111 by controlling the driving device 15 (for example, a driving motor or other types of actuators), thereby driving the platform of the rotating platform module 11 to rotate, so that the wafer WF carried by the rotating platform module 11 also rotates. In addition, the controller 14 can also control the Y-axis moving mechanism 112 and the X-axis moving mechanism 113 by controlling the driving device 15 to move the wafer WF carried by the rotating platform module 11 in the horizontal plane (XY axis plane) of the platform. The Y-axis moving mechanism 112 and the X-axis moving mechanism 113 can, for example, move the platform and the wafer WF in the horizontal plane (XY axis plane), and the θ-axis rotation mechanism 111 can be a central rotating shaft disposed below the platform and connected to the platform, but the present invention does not limit the implementation method of the θ-axis rotation mechanism 111, the Y-axis moving mechanism 112, and the X-axis moving mechanism 113.

[0047] Furthermore, the controller 14 can also be used to set the intensity of the light source 12 and the sensitivity of the image capture device 13. In this way, for different types of wafers WF, the wafer positioning device 1 of the present invention can have a more precise positioning accuracy. Please note that since the wafer positioning device 1 of the present invention mainly calculates the precise position of the positioning feature of the wafer WF (i.e., the precise angle of the positioning feature) through the first-order derivative and the second-order derivative of the image data of the outer edge of the wafer in combination with a polynomial regression operation, the controller 14 is used to set the intensity of the light source 12 and the sensitivity of the image capture device 13 only to further improve the positioning accuracy, and this practice is not a necessary limitation of the present invention.

[0048] Please continue to Figure 1 to Figure 3 , Figure 2 is a schematic flow chart of a wafer positioning method according to an embodiment of the present invention, and Figure 3 Detailed flowchart of the steps of finding wafer positioning features and calculating the precise position and center offset of the positioning features of the wafer in the wafer positioning method of the embodiment of the present invention. The controller 14 is usually a microcontroller unit that can be written with a firmware program (but the present invention is not limited to this, and can also be implemented using a pure hardware circuit), and the wafer positioning method of the present invention is mainly executed by the controller 14.

[0049] In step S21, the light source 12 and the image capture device 13 are started. The wafer positioning device 1 of the present invention can support different types of wafers WF. Wafer WF can be a non-transparent silicon wafer or a translucent wafer of a special material. In order to improve the accuracy of positioning, in step S21, the operator can also input instructions to the controller 14 according to the type of wafer WF to set the intensity of the light source 12 and the sensitivity of the image capture device 13. Then, in step S22, the fixture will place the wafer WF on the platform of the rotating platform module 11. At this time, the center of the wafer WF may deviate from the specified position of the rotating platform module 11 (usually referred to as the home position), and the positioning feature has not turned to the specified angle when entering the next process, so the positioning device 4 is required to detect the wafer WF to position the wafer WF.

[0050] In step S23, the controller 14 controls the driving device 15 to drive the θ-axis rotating mechanism 111 to rotate the platform of the rotating platform module 11 by 360 degrees to 720 degrees, so that the image capture device 13 can obtain the image data of the outer edge of the wafer WF in step S24. Then, in step S25, the controller 14 searches for the approximate position of the positioning feature of the wafer WF according to the obtained image data of the outer edge of the wafer WF, wherein the method of searching for the approximate position of the positioning feature of the wafer WF is to first calculate the first-order derivative and the second-order derivative of the image data of the outer edge of the wafer WF, so as to exclude the center offset (i.e., XY offset), and find the approximate position of the positioning feature of the outer edge of the wafer WF through the rate of change of the first-order derivative and the second-order derivative, and then, according to the approximate position, use polynomial regression calculation to perform multiple iterations to calculate the precise position of the positioning feature, wherein the precise position of the positioning feature is the angle of the positioning feature, wherein the positioning feature is not limited to a notch type positioning feature, and can also be a single flat edge, double flat edges or other types of positioning features. In step S25 , the controller 14 excludes the positioning features of the precise positions in the image data, and finds the center offset based on the image data excluding the positioning features.

[0051] Afterwards, in step S26, the controller 14 calculates the correction angle of the wafer WF according to the precise position of the positioning feature and the center offset, and calculates the XY correction amount according to the correction angle and the center offset. Finally, in step S27, the controller 14 corrects the offset of the wafer via the X-axis moving mechanism 113, the Y-axis moving mechanism 112 and the θ-axis rotating mechanism 111. In detail, the controller 14 controls the drive device 15 to drive the θ-axis rotating mechanism 111 to rotate the platform according to the calculated correction angle of the wafer WF, so that the positioning feature of the wafer WF is rotated to the specified angle, and the controller 14 controls the drive device 15 to drive the Y-axis moving mechanism 112 and the X-axis moving mechanism 113 to move the wafer WF in the horizontal plane according to the calculated XY correction amount, so that the center of the wafer WF is aligned with the specified position of the platform.

[0052] In step S24, the controller 14 also checks whether the index of the image data is continuous and checks the angle difference before and after the rotation of the wafer WF. If the index of the image data is not continuous (because if the rotation speed is too fast, the image data may be missing, so it is necessary to check) or the angle difference before and after the rotation of the wafer WF is less than 360 degrees (because there may be an operational error or other factors that cause the platform of the rotating platform module 11 to not rotate more than 360 degrees), it is necessary to perform steps S23 and S24 again to re-acquire valid image data of the outer edge of the wafer WF.

[0053] Furthermore, if Figure 3, step S25 includes steps S251 to S256. In step S251, the controller 14 performs a moving average process on the image data to filter out most of the noise in the image data. Please note that step S251 is not a necessary step, but in most cases, in order to increase the positioning accuracy, step S251 will inevitably be executed. Next, in step S252, the controller 14 calculates the first-order derivative and the second-order derivative of the image data. The first-order derivative of the image data is the slope function of the image data. The slope function is 0, which may be the place where the extreme value occurs, that is, the possible position of the positioning feature. The second-order derivative of the image data can be used to determine the place where the slope changes the most. Usually, the location of the positioning feature will be the place where the slope changes the most. In addition, before performing step S252, the controller 14 can first check whether the brightness setting of the light source 12, the sensitivity setting of the image capture device 13 and the angle difference before and after the platform rotates are correct to avoid unnecessary calculations.

[0054] In step S253, the controller 14 finds the maximum and minimum values ​​of the first-order derivative of the image data. In step S253, the controller 14 also determines whether the rotation angles corresponding to the maximum and minimum values ​​of the first-order derivative are close, that is, whether the difference between the two occurrence positions of the maximum and minimum values ​​of the first-order derivative is less than a specific threshold value. If the rotation angles corresponding to the maximum and minimum values ​​of the first-order derivative are close, the subsequent calculations will be further performed. In step S253, the controller 14 also checks whether the maximum and minimum values ​​of the image data are out of range. If they are out of range, the subsequent calculations will not be performed.

[0055] Then, in step S254, the controller 14 uses the second-order derivative and the first-order derivative of the image data to find the approximate position of the positioning feature. Further, the maximum and minimum values ​​of the first-order derivative found previously may be the positions of the maximum change of the image data, so the positions of the maximum and minimum values ​​of the first-order derivative can be used to narrow the range of finding the positioning feature. In short, the controller 14 uses the first-order derivative of the image data to narrow the range of finding the positioning feature, and then uses the second-order derivative of the image data to find the approximate position of the positioning feature in the above-mentioned narrowed range.

[0056] Next, in step S255, the controller 14 performs multiple iterative calculations using a polynomial regression operation based on the approximate position of the positioning feature to calculate the precise position of the positioning feature (including the angle of the positioning feature). Then, in step S256, the controller 14 excludes the portion of the positioning feature at the precise position in the image data, and finds the corresponding circle equation based on the image data excluding the positioning feature to obtain the center offset of the wafer WF.

[0057] The polynomial regression operation in step S255 is described as follows. The approximate position θ of the positioning feature can be obtained by calculating the first-order derivative and the second-order derivative of the image data. coarse , and the difference Diff between the maximum and minimum values ​​near the approximate position in the image data can also be calculated. Furthermore, when the positioning feature falls at the approximate position θ coarse When the wafer WF center point and the specified position (home position) are offset D coarse It is known that the approximate position of the positioning feature is θ coarse The image value ccd is also known, and the radius R of the wafer WF is also known, so the following expression is used:

[0058] ccd=Diff+D coarse *cos(θ O )-[R 2 -D coarse 2 *sin 2 (θ O )] 1 / 2 , and find the exact position of the positioning feature θ O In the present invention, the number of iterations is 1000, but the present invention is not limited thereto. Next, the precise position θ of the positioning feature is calculated. O After that, the controller 14 can exclude the positioning features of the precise position in the image data, find the corresponding circle equation based on the image data excluding the positioning features, and calculate the center offset D.

[0059] After calculating the exact position of the positioning feature θ O The correction angle θ and the XY correction amount D are calculated in step S26. x , D y The details are as follows, supplementary explanation, D x is the X-axis correction component of the correction amount D, D y It is the Y-axis correction component of the correction amount D. Please refer to Figure 4 and Figure 5 , the radius R of the wafer WF, the center offset D, and the precise position of the positioning feature θ O (precise angle), the target angle θ of the positioning feature relative to the horizontal axis of the center point of the wafer WF t and the orientation angle θ of the positioning feature n is known, so we can calculate θ a =θ O -θ n , d = D * sin (θ a ) and θ e =θ b =sin -1(d / R), without considering the error caused by the positioning characteristics of the notch type, the correction angle θ can be calculated as t -θ n +θ e Next, please refer to Figure 6 Then, the XY correction value D can be calculated based on the correction angle θ and the center offset x =D*cos(θ+θ O ) and D y =D*sin(θ+θ O ). Figures 4 to 6 The calculation of is for the positioning feature of the notch type, but the present invention does not limit the type of positioning feature. Figure 7 , the correction angle θ and XY correction amount D of the positioning feature of the single flat edge type x , D y Calculation method and correction angle θ and XY correction amount D of notch type positioning features x , D y The calculation method is the same, but θ e will be equal to 0, so the correction angle θ=θ t -θ n .

[0060] In summary, since the wafer positioning device and method provided by the present invention finds the positioning features mainly through the first-order derivative and the second-order derivative of the image data of the outer edge of the wafer in combination with a polynomial regression operation, it is not necessary to make the rotating platform rotate more than twice, and the type of wafer and the type of positioning features are not limited. In other words, compared with the prior art, the wafer positioning device and method of the present invention can make the rotating platform rotate less times and can support various types of wafers and various types of positioning features.

Claims

1. A wafer positioning device, characterized in that: include: A rotating platform module (11) is used to carry a wafer (WF) and to rotate the wafer (WF); a light source (12) disposed on an outer side of the rotating platform module (11) and used for emitting a light beam to illuminate an outer edge of the wafer (WF); an image capturing device (13), arranged on the outer side of the rotating platform module (11) and facing the light source (12), for acquiring image data of the outer edge of the wafer (WF); a controller (14), electrically connected to the light source (12) and the image capture device (13), for receiving the image data, and calculating a precise position of a positioning feature of the outer edge of the wafer (WF) through a first-order derivative and a second-order derivative of the image data in conjunction with a polynomial regression operation, excluding the positioning feature from the image data, calculating a center offset of the wafer (WF) based on the image data excluding the positioning feature, and calculating a correction angle based on the precise position of the positioning feature and the center offset, and calculating an XY correction value based on the center offset and the correction angle; and A driving device (15) is electrically connected to the controller (14) and the rotating platform module (11), wherein the controller (14) controls the driving device (15) to drive the rotating platform module (11) to rotate according to the correction angle so that the positioning feature rotates to a specified angle, and the controller (14) controls the driving device (15) to drive the rotating platform module (11) according to the XY correction amount so that the wafer (WF) moves in a horizontal plane of the rotating platform module (11) so that a center of the wafer (WF) is aligned with a specified position of the rotating platform module (11).

2. The wafer positioning device according to claim 1, characterized in that: The controller (14) calculates an approximate position of the positioning feature based on the first-order derivative and the second-order derivative of the image data, and then performs multiple iterative calculations using the polynomial regression operation based on the approximate position to calculate an exact position of the positioning feature, wherein the exact position is an exact angle of the positioning feature.

3. The wafer positioning device according to claim 2, characterized in that: The controller (14) excludes the positioning feature of the precise angle in the image data and finds a corresponding circle equation based on the image data excluding the positioning feature to obtain the center offset.

4. The wafer positioning device according to claim 1, characterized in that: The wafer (WF) is a non-transparent silicon wafer or a wafer made of a semi-transparent material.

5. The wafer positioning device according to claim 1, characterized in that: The positioning feature of the wafer (WF) is a notch type positioning feature, a double flat edge type positioning feature or a single flat edge type positioning feature.

6. The wafer positioning device according to claim 1, characterized in that: The controller (14) controls the driving device (15) to drive the rotating platform module (11) to rotate at least 360 degrees, and the image data captured by the image capture device (13) is image data of the outer edge of the wafer (WF) rotating at least 360 degrees.

7. The wafer positioning device according to claim 1, characterized in that: The controller (14) sets the brightness of the light source (12) and the sensitivity of the image capture device (13) according to an instruction input by an operator, wherein the operator determines the input instruction according to a type of the wafer (WF).

8. The wafer positioning device according to claim 1, characterized in that: The rotating platform module (11) comprises a θ-axis rotating mechanism (111), a Y-axis moving mechanism (112) and an X-axis moving mechanism (113), wherein the θ-axis rotating mechanism (111) is used to be driven by the driving device (15) to rotate the rotating platform module (11), and the Y-axis moving mechanism (112) and the X-axis moving mechanism (113) are used to be driven by the driving device (15) to move the wafer (WF) in the horizontal plane of the rotating platform module (11).

9. A wafer positioning method, characterized in that: include: Starting a light source (12) and an image capturing module (13), wherein the light source (12) and the image capturing module (13) are arranged opposite to each other and face an outer edge of a wafer (WF) carried by the rotating platform module (11), and are located on an outer side of a rotating platform module (11); Using a controller (14) to control a driving device (15) to drive the rotating platform module (11) to rotate at least 360 degrees, so as to drive the wafer (WF) carried by the rotating platform module (11) to rotate at least 360 degrees; Using the image capture device (13) to acquire image data of the outer edge of the wafer (WF); Using the controller (14) to calculate an approximate position of a positioning feature according to a first-order derivative and a second-order derivative of the image data, and then performing multiple iterative calculations using a polynomial regression operation according to the approximate position to calculate an accurate position of the positioning feature, wherein the accurate position is an accurate angle of the positioning feature; Using the controller (14) to exclude the positioning feature of the precise angle in the image data, and finding a corresponding circle equation based on the image data excluding the positioning feature to obtain a center offset of the wafer (WF); Using the controller (14) to calculate a correction angle according to the precise position of the positioning feature and the center offset, and to calculate an XY correction amount according to the correction angle and the center offset; and The controller (14) is used to control the driving device (15) according to the correction angle to drive the rotating platform module (11) to rotate so that the positioning feature rotates to a specified angle, and the controller (14) is used to control the driving device (15) according to the XY correction amount to drive the rotating platform module (11) so that the wafer (WF) moves in a horizontal plane of the rotating platform module (11) so that a center of the wafer (WF) is aligned with a specified position of the rotating platform module (11).

10. The wafer positioning method according to claim 9, characterized in that: The wafer (WF) is a non-transparent silicon wafer or a wafer of a semi-transparent material, and the positioning feature of the wafer (WF) is a notch type positioning feature, a double flat edge type positioning feature or a single flat edge type positioning feature.

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