Power module based on parallel connection of multiple IGBTs and electrical equipment

Abstract

The invention discloses a power module and electrical equipment based on parallel connection of a plurality of IGBTs, and the power module comprises a plurality of same heat dissipation substrate parts, a set of sealed heat dissipation flow channels, a plurality of parallel IGBTs and drives thereof, a set of parallel assemblies between IGBT drives, a plurality of IGBT direct current side laminated copper bars, a plurality of alternating current side parallel copper bars, and other parts. The heat dissipation parts are installed in a space symmetry mode, and the axes of the heat dissipation flow channel parts coincide with the space symmetry central axes of all the heat dissipation substrate parts. The IGBT parallel connection device and system are simple and reasonable in structure, can simultaneously meet the consistency of IGBT heat dissipation, electrical parameters and driving time sequence when a plurality of IGBTs are connected in parallel, and meet the requirements of a plurality of IGBT parallel connection application occasions.

Description

Technical Field

[0001] The present invention belongs to the technical field of high-power power electronics, and more specifically, relates to a power module and electrical equipment based on multiple IGBTs connected in parallel. Background Art

[0002] In high-power power electronic applications such as wind power, solar energy, energy storage, high-voltage frequency conversion, and power quality management, the current development of IGBT semiconductor device technology cannot meet the demand for product capacity. The application of IGBT parallel technology to increase system capacity is becoming more and more widespread. The IGBT parallel system can only have good reliability and economy if it ensures good current sharing characteristics. To ensure current sharing between parallel IGBTs, the following three points need to be met:

[0003] 1) The parallel IGBTs should try to maintain the same operating junction temperature to reduce the difference in heat dissipation conditions;

[0004] 2) The electrical parameters such as primary and secondary circuit impedance, stray inductance, capacitance, etc. should be kept as similar as possible between the parallel IGBTs to reduce the difference in circuit electrical parameters;

[0005] 3) The parallel IGBTs should try to maintain the same driving timing to reduce the driving timing difference.

[0006] Therefore, how to simultaneously achieve and maintain the consistency of electrical parameters, operating temperature, and drive timing of the primary and secondary circuits of the parallel IGBTs has become a technical problem that needs to be urgently solved by technical personnel in this field. Summary of the invention

[0007] The technical problem to be solved by the present invention is to overcome the deficiencies in the background technology and provide a power module and electrical equipment based on multiple IGBTs in parallel, which can simultaneously meet the consistency of heat dissipation, electrical parameters and drive timing between IGBTs when multiple IGBTs are connected in parallel, thereby meeting the needs of multiple IGBT parallel application scenarios.

[0008] Based on this, the present application provides a structurally symmetrical power module and electrical equipment. This device adopts a symmetrical arrangement and has a compact structure. An even number of IGBTs can be set symmetrically. The structure is highly versatile and easy to modularize and transport.

[0009] The features and advantages of the present disclosure will become apparent from the following detailed description, or may be learned in part by practice of the present disclosure.

[0010] A first aspect of the present invention provides a power module based on multiple IGBTs connected in parallel;

[0011] The power module comprises: a plurality of identical heat dissipation substrate components, a sealed heat dissipation channel, a plurality of parallel-connected IGBTs and their drive components, a plurality of parallel-connected components between groups of IGBT drivers, a plurality of IGBT DC-side laminated copper bars and a plurality of AC-side copper bars;

[0012] The plurality of identical heat dissipation substrate components are independent of each other, and are arranged with reference to the same spatial symmetry axis; after the heat dissipation substrate components are spatially symmetrically enclosed and sealed, the sealed heat dissipation flow channel is included; the IGBTs and their driving components are equally divided into multiple groups, and the multiple groups of IGBTs and their driving components are respectively installed on each heat dissipation substrate component in the same way;

[0013] The parallel components between the multiple groups of IGBT drivers convert the host computer driving signals from the same source into driving signals with the same timing, and send them to the IGBTs and their driving components on each heat dissipation substrate component through driving cables of the same length.

[0014] Preferably, the heat dissipation substrate component is an air-cooled heat sink or a liquid-cooled heat sink.

[0015] Preferably, the IGBTs mounted on each heat dissipation substrate component are of the same quantity, specification and layout.

[0016] Preferably, the IGBT and its driving component include: a driving board and an absorption capacitor, wherein the driving board and the absorption capacitor are fixed on the IGBT;

[0017] The number of the driving boards and the absorption capacitors is an even number, and they are symmetrically arranged along a symmetry plane of the heat dissipation substrate component.

[0018] Preferably, the sealed heat dissipation channel is an air-cooling channel, a liquid-cooling channel, a steam channel or a phase change channel.

[0019] Preferably, the sealed heat dissipation channel is a single heat dissipation channel, or a plurality of heat dissipation channels with the same layout position, flow rate and temperature.

[0020] Preferably, the plurality of IGBT DC-side laminated copper busbars are of the same structure, and each set of DC-side laminated busbars is adapted and installed with the IGBT and drive components on each heat dissipation substrate component;

[0021] The multiple IGBT AC side connection components all have the same structure, and each group of AC side connection components is adapted and installed with the IGBT and drive components on each heat dissipation substrate component.

[0022] Preferably, the plurality of IGBT DC-side laminated copper busbars include flat plates and / or bent structures.

[0023] Preferably, the AC measurement connection component is a cable, a copper busbar, a soft copper plate or a soft connection, and supports optional accessories.

[0024] Preferably, on each heat dissipation substrate component, the IGBT and its driving components may be one group or multiple groups of the same number.

[0025] A second aspect of the present invention provides an electrical device, comprising a power module based on multiple IGBTs connected in parallel according to the first aspect.

[0026] Compared with the prior art, the beneficial effects of the present invention include at least: the structurally symmetrical device enables the parallel high-power IGBTs to have exactly the same electrical parameters and heat dissipation conditions, thereby ensuring that the parallel IGBTs have good current sharing characteristics, improving the operating reliability of the converter, having a compact structure and high heat dissipation efficiency, and can meet the needs of high-power IGBT parallel applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without exceeding the scope of protection required by the present application.

[0028] Figure 1 A front view of a power module according to an exemplary embodiment of the present application is shown;

[0029] Figure 2 A top view of a power module according to an exemplary embodiment of the present application is shown;

[0030] Figure 3 A side view of a power module according to an exemplary embodiment of the present application is shown;

[0031] Figure 4 An overall structural diagram of a power module according to an exemplary embodiment of the present application is shown;

[0032] In the figure:

[0033] 110- heat sink, 120- air duct;

[0034] 210-IGBT, 220-absorption capacitor;

[0035] 310-drive adapter board, 320-drive core board, 330-drive core board mounting support board;

[0036] 400-Laminated busbar. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0038] The present invention relates to a power module and electrical equipment based on multiple IGBTs in parallel, including a device for connecting IGBTs in parallel, and in particular to a device for realizing the same primary and secondary circuit impedance and the same heat dissipation conditions between parallel IGBTs through a symmetrical design of structural space, and realizing the same driving timing of parallel IGBTs through a symmetrical design of driving timing. The technical solution of the present application will be described in detail below in conjunction with the accompanying drawings.

[0039] Embodiment 1 of the present invention provides a power module based on multiple IGBTs in parallel, including several identical heat dissipation substrate components, sealed heat dissipation channels, several parallel IGBTs and their drive components, parallel components between multiple groups of IGBT drives, several IGBT DC side laminated copper busbars and several AC side copper busbars and other components.

[0040] The several identical heat dissipation substrate components are independent of each other, and the layout between them refers to the same spatial symmetry axis, adopting a spatial symmetry method, that is, the heat dissipation substrate components are spatially symmetrically enclosed and sealed to form a spatially symmetrical regular polygonal column layout. Specifically, according to the number of parallel components, when 2 components are connected in parallel, the column cross-section forms mirror symmetry, when 3 components are connected in parallel, the column cross-section forms regular triangle symmetry, when 4 components are connected in parallel, the column cross-section forms regular quadrilateral symmetry, and so on. The number of IGBTs installed on each of the heat dissipation substrate components is the same, the specifications are the same, and the layout is the same.

[0041] Those skilled in the art may implement the heat dissipation substrate component in any heat dissipation type, preferably but not limited to, an air-cooled heat sink or a liquid-cooled heat sink.

[0042] After the spaces of the heat dissipation substrate components are symmetrically enclosed and sealed, the sealed heat dissipation channels are included therein, and the heat dissipation structures between the heat dissipation channels and the heat dissipation substrates are symmetrical and consistent, so that each heat dissipation substrate assembly has the same heat dissipation performance.

[0043] Preferably but not restrictively, according to the heat dissipation type adopted, the sealed heat dissipation channel is an air cooling channel, a liquid cooling channel, a steam channel or a phase change channel.

[0044] Preferably but not restrictively, the sealed heat dissipation channel may be a single heat dissipation channel or may be a plurality of heat dissipation channels with the same layout position, flow rate and temperature.

[0045] The IGBTs and their drive components are equally divided into multiple groups, and the multiple groups of IGBTs and their drive components are respectively mounted on each heat dissipation substrate component in the same manner. Preferably but not restrictively, on each heat dissipation substrate component, the IGBTs and their drive components can be one group or multiple groups of the same number.

[0046] The parallel components between the multiple groups of IGBT drivers convert the host computer driving signals from the same source into driving signals with the same timing, and send them to the IGBTs and their driving components on each heat dissipation substrate component through driving cables of the same length.

[0047] The plurality of IGBT DC-side laminated copper bars are of the same structure, and each set of DC-side laminated busbars is adapted to be installed with the IGBT and drive components on each heat dissipation substrate component; the plurality of IGBT AC-side connection components are of the same structure, and each set of AC-side connection components is adapted to be installed with the IGBT and drive components on each heat dissipation substrate component. Preferably, but not restrictively, the AC-side connection components can be in various forms such as cables, copper bars, soft copper plates, and soft connections, and support optional accessories such as magnetic rings and current-sharing reactors.

[0048] The core concept of the present invention is fully introduced above through Example 1. In order to make it easier for those skilled in the art to understand the significant progress brought by the present invention to the prior art, the technical problems solved by the present invention and the outstanding substantial features of the present invention are explained below.

[0049] In the prior art, the equivalent impedance loop between the parallel IGBT and the DC support loop is not completely consistent, and there is at least one group of loops that is longer than other loops. The inventor team of the present invention first realized that in the prior art, the loop impedance and stray inductance between the IGBT, the laminated busbar and the DC support capacitor are larger, and there are three risks: First, the stray inductance of one group of IGBT loops in the asymmetric structure is relatively large, resulting in a high IGBT switch peak voltage, which will reduce the voltage safety working space and reliability of the entire module loop; second, if it is set in a triangular shape, one group of IGBT loop paths is relatively long, the equivalent impedance is large, and when the entire module is running, multiple groups of currents are unbalanced, and the dynamic current of the group of IGBTs with the longest path is relatively small, which reduces the IGBT current utilization and the economy of the entire module; third, the layout of each IGBT cannot be completely consistent in terms of heat dissipation, so each IGBT has a certain operating temperature deviation, which usually has a certain adverse effect on the economy and reliability of parallel IGBT applications.

[0050] The present invention solves the above technical problems through structural design, that is, one of the outstanding substantial features of the present invention is that each parallel IGBT component adopts a completely consistent electrical circuit and heat dissipation circuit design, the laminated busbar circuit impedance and stray inductance between each component and the DC support capacitor circuit are consistent, and each parallel IGBT enjoys the same heat dissipation conditions, which can ensure the consistency of the circuit impedance, stray inductance, and heat dissipation conditions between each parallel IGBT, thereby giving full play to the economy of IGBT parallel connection and having higher reliability. The scope of application will be expanded from the existing technology that is only applicable to 3 or more IGBT modules in parallel to the parallel connection of any number of IGBT modules.

[0051] In addition, in the prior art, placing IGBTs on the same heat sink to form an overall full bridge in parallel also has technical difficulties. The current sharing between the circuits does not completely rely on hardware design, but is achieved through software control methods such as PWM modulation. Multiple three-phase bridge IGBTs are placed on the same heat sink component, and the problem of thermal coupling of mutual heating of IGBTs will affect the improvement of the system power limit.

[0052] The present invention further solves the above technical problems through structural design. That is, another outstanding substantial feature of the present invention is that each parallel IGBT component is arranged on a separate heat dissipation carrier (heat sink, water cooling plate, etc.), and there is no thermal coupling problem between the parallel IGBT components. Therefore, the potential of the IGBT can be fully unleashed, and it has better economy and reliability.

[0053] Embodiment 2 of the present invention provides a power module based on multiple IGBTs in parallel, including several identical heat dissipation substrate components, sealed heat dissipation channels, several parallel IGBTs and their drive components, a set of parallel components between multiple groups of IGBT drivers, several IGBT DC side laminated copper busbars and several AC side copper busbars and other components.

[0054] Compared with Example 1, in Example 2, air cooling is adopted for heat dissipation, and the heat dissipation substrate component is at least two independent heat dissipation fins 110, which are arranged with reference to the same spatial symmetry axis and adopt a spatially symmetrical manner, that is, each heat dissipation fin 110 is spatially symmetrically enclosed and sealed to form a spatially symmetrical hollow cylindrical structure layout, and the radial cross-sectional dimensions of the heat dissipation fins are consistent.

[0055] Figures 1 to 4 The structure when there are two heat sinks 110 is shown by way of example but not limitation. The two heat sinks 110 are mirror-symmetrical. It can be understood that when three heat sinks 110 are connected in parallel, the cross section of the column forms a regular triangle symmetry, when four heat sinks 110 are connected in parallel, the cross section of the column forms a regular quadrilateral symmetry, and so on.

[0056] The number of IGBTs installed on each heat sink 110 is the same, the specifications are the same, and the layout is the same. In a preferred but non-restrictive embodiment, a high-power IGBT is installed on each heat sink, which avoids thermal coupling between the high-power IGBTs during operation, thereby significantly improving the heat dissipation effect. In another preferred but non-restrictive embodiment, multiple IGBTs are installed on each heat sink, which can make the structure more compact without sacrificing heat dissipation performance. More specifically, when designing the power module, at least two heat sinks of matching sizes are first selected according to the heat dissipation requirements of the IGBT, and the heat sink plates are assembled into a cylindrical module. Then, the fan model is selected according to the heat dissipation requirements, and the fan and heat sink are connected with the air duct to complete the installation of the cooling module.

[0057] Preferably, but not restrictively, the heat sink can be a common aluminum extruded heat sink or a heat sink with a heat pipe integrated process heat dissipation substrate, which has a compact structure and good heat dissipation effect. For example, but not limited to, the heat sink 110 has a substrate and a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged on the substrate. The plurality of heat dissipation fins are arranged in parallel along the air outlet direction of the fan, and there is a gap between each heat dissipation fin, so as to minimize wind loss and increase heat dissipation effect.

[0058] In Embodiment 2, the sealed heat dissipation channel is an air duct. Specifically, after each heat sink 110 is spatially symmetrically enclosed and sealed, the air duct is included therein, and the heat dissipation structure between the air duct and each heat sink 110 is symmetrical and consistent, so that each heat sink has the same heat dissipation performance.

[0059] In the embodiment, a cooling assembly is formed by a heat sink 110, a fan and an air duct 120, wherein the fan is fixed on the surface of the bottom plate, and the air duct 120 connects the fan and the heat sink 110. The cooling assembly body structure is bilaterally symmetrical, and the middle plane of the two identical heat sinks 110 is the symmetry plane. The symmetrical structure solves the thermal coupling and current sharing problems of parallel IGBTs, has a simple and reasonable structure, low loop stray inductance, good parallel current sharing effect, and high heat dissipation efficiency, which can meet the needs of high-power IGBT parallel applications.

[0060] Preferably, but not restrictively, the fan includes at least one of an axial flow fan and a centrifugal fan. The fan includes a single fan and / or multiple fans connected in series / parallel. Specifically, according to the heat dissipation requirements, the fan of the power module adopts a single axial flow fan or a centrifugal fan, and the high power consumption converter module adopts multiple axial flow fans or centrifugal fans, and the heat dissipation requirements of the module are met by connecting the fans in series / parallel.

[0061] In embodiment 2, the IGBT and its driving component include: an IGBT component and a driving component.

[0062] Specifically, the IGBT assembly includes: a plurality of IGBTs 210 , an absorption capacitor 220 and a driving board.

[0063] The plurality of IGBTs 210, the driving board and the absorption capacitor 220 are symmetrically arranged on the at least two heat sinks 110. The single-sided module includes at least one heat sink 110, the IGBT 210 is fixed on the heat sink 110, preferably but not limitedly, it can be screwed; the driving board and the absorption capacitor 220 are both fixed on the IGBT 210.

[0064] The number of the absorption capacitors 220 and the driving boards is an even number, and they are symmetrically arranged along the symmetry plane of the heat sink 110 .

[0065] The driving assembly includes: a driving adapter board 310, a driving core board 320, a driving core board mounting support board 330 and a driving harness.

[0066] The drive adapter board 310 is directly welded or mounted on the IGBT by screws. The drive core board 320 is mounted on the heat sink 110 through the drive core board mounting support plate. The drive harness completes the connection between the drive adapter board 310 and the drive core board 320, and the connection between the drive core board 320 and the host computer.

[0067] Preferably but not restrictively, the internal board configurations of the drive components are consistent and the lengths of the drive harnesses are the same.

[0068] like Figure 2 , which is a top view of the power module. The structure without the laminated busbar 400 in the device can better illustrate the fixing method of the power module. The IGBT 210 is fixed on the heat sink 110 , and the driving board 320 is fixed on the IGBT 210 .

[0069] In Example 2, the IGBT DC side laminated copper busbar is a laminated busbar 400, which is used to connect the IGBT component with an external DC main circuit. The number of the IGBT components and the laminated busbar 400 is the same as the number of the heat sinks 110, and they are symmetrically arranged on the at least two heat sinks 110.

[0070] Specifically, the laminated busbar 400 is symmetrically arranged on both sides of the power module and the symmetry plane is the same as the symmetry plane of the at least two heat sinks 110. One end of the laminated busbar 400 is fixed to the heat sink 110, and the other end is fixed to the IGBT 210.

[0071] Furthermore, the cooling assembly, IGBT assembly, absorption capacitor 220 and laminated busbar 400 in the power module are spatially symmetrically arranged, and in Example 2 are symmetrically arranged along the symmetry plane of the at least two heat sinks 110, that is, the power module is symmetrical along the symmetry plane of the at least two heat sinks 110.

[0072] Preferably, but not limiting, such as Figure 3 , which is a side view of the power module. The power module is a completely symmetrical structure along the middle plane. In any half module of the symmetrical structure, according to the relative position of the IGBT 210, the laminated busbar 400 connecting the DC terminal of the IGBT 210 can be designed in a pure plane, or the DC terminals of the IGBT 210 in different planes can be connected by bending. The laminated busbar 400 is arranged symmetrically based on the center line of the DC terminal of the IGBT 210, which can realize the shortest commutation path design of the IGBT 210 and reduce the stray inductance of the commutation circuit of the IGBT 210.

[0073] During installation, the IGBT assembly is fixed on the cooling assembly, the drive assembly and the absorption capacitor 220 are installed on the IGBT and the cooling assembly, and the laminated busbar 400 is fixed on the capacitor assembly and the IGBT assembly to complete the installation of the power module.

[0074] Embodiment 3 of the present invention provides a power module based on multiple IGBTs in parallel, including several identical heat dissipation substrate components, sealed heat dissipation channels, several parallel IGBTs and their drive components, a set of parallel components between multiple groups of IGBT drivers, several IGBT DC side laminated copper busbars and several AC side copper busbars and other components.

[0075] In Example 3, water cooling is used for heat dissipation. The heat dissipation substrate component is a water-cooled plate. The water-cooled plate dissipates heat on both sides. IGBTs are symmetrically installed on both sides. The cooling assembly in Example 3 is composed of a water-cooled plate, a water-cooled pipeline, a water pump, and a water-cooled machine.

[0076] Embodiment 4 of the present invention provides a power module based on multiple IGBTs in parallel, including several identical heat dissipation substrate components, sealed heat dissipation channels, several parallel IGBTs and their drive components, a set of parallel components between multiple groups of IGBT drivers, several IGBT DC side laminated copper busbars and several AC side copper busbars and other components.

[0077] In Example 4, evaporative cooling is used for heat dissipation. The heat dissipation substrate component is an evaporative cooling evaporative end cold plate. The evaporative cooling evaporative end cold plate dissipates heat on both sides. IGBTs are symmetrically installed on both sides. The evaporative cooling evaporative end cold plate, pipelines, and condensing end constitute the cooling component in Example 4.

[0078] Embodiment 5 of the present invention provides an electrical device, comprising a power module based on multiple IGBTs connected in parallel according to any one of Embodiments 1 to 4.

[0079] Compared with the prior art, the beneficial effects of the present invention include at least: the structurally symmetrical device enables the parallel high-power IGBTs to have exactly the same electrical parameters and heat dissipation conditions, thereby ensuring that the parallel IGBTs have good current sharing characteristics, improving the operating reliability of the converter, having a compact structure and high heat dissipation efficiency, and can meet the needs of high-power IGBT parallel applications.

[0080] The embodiments of the present application are described in detail above. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and its core idea of ​​the present application. At the same time, changes or deformations made by those skilled in the art based on the ideas of the present application, the specific implementation methods and the scope of application of the present application, all belong to the scope of protection of the present application. In summary, the content of this specification should not be construed as a limitation on the present application.

Claims

1. A power module based on multiple IGBTs in parallel, characterized in that: The power module comprises: a plurality of identical heat dissipation substrate components, a sealed heat dissipation channel, a plurality of parallel-connected IGBTs and their drive components, a plurality of parallel-connected components between groups of IGBT drivers, a plurality of IGBT DC-side laminated copper bars and a plurality of AC-side copper bars; The plurality of identical heat dissipation substrate components are independent of each other, and are arranged with reference to the same spatial symmetry axis; after the heat dissipation substrate components are spatially symmetrically enclosed and sealed, the sealed heat dissipation flow channel is included; the IGBTs and their driving components are equally divided into multiple groups, and the multiple groups of IGBTs and their driving components are respectively installed on each heat dissipation substrate component in the same way; The parallel components between the multiple groups of IGBT drivers convert the host computer driving signals from the same source into driving signals with the same timing, and send them to the IGBTs and their driving components on each heat dissipation substrate component through driving cables of the same length.

2. A power module based on multiple IGBTs connected in parallel according to claim 1, characterized in that: The heat dissipation substrate component is an air-cooled heat sink or a liquid-cooled heat sink.

3. The power module based on multiple IGBTs connected in parallel according to claim 1, characterized in that: The number, specifications and layout of IGBTs mounted on each heat dissipation substrate component are the same.

4. A power module based on multiple IGBTs connected in parallel according to any one of claims 1 to 3, characterized in that: The IGBT and its driving component include: a driving board and an absorption capacitor, wherein the driving board and the absorption capacitor are fixed on the IGBT; The number of the driving boards and the absorption capacitors is an even number, and they are symmetrically arranged along a symmetry plane of the heat dissipation substrate component.

5. A power module based on multiple IGBTs connected in parallel according to any one of claims 1 to 3, characterized in that: The sealed heat dissipation channel is an air cooling channel, a liquid cooling channel, a steam channel or a phase change channel.

6. The power module based on multiple IGBTs connected in parallel according to claim 5, characterized in that: The sealed heat dissipation channel is a single heat dissipation channel, or a plurality of heat dissipation channels with the same layout position, flow rate and temperature.

7. A power module based on multiple IGBTs connected in parallel according to any one of claims 1 to 3, characterized in that: The plurality of IGBT DC side laminated copper busbars are of the same structure, and each set of DC side laminated busbars is adapted and installed with the IGBT and drive components on each heat dissipation substrate component; The multiple IGBT AC side connection components all have the same structure, and each group of AC side connection components is adapted and installed with the IGBT and drive components on each heat dissipation substrate component.

8. The power module based on multiple IGBTs connected in parallel according to claim 7, characterized in that: The plurality of IGBT DC-side laminated copper busbars include flat plates and / or bent structures.

9. The power module based on multiple IGBTs connected in parallel according to claim 7, characterized in that: The AC measurement connection components are cables, copper busbars, soft copper plates or soft connections, and support optional accessories.

10. A power module based on multiple IGBTs connected in parallel according to any one of claims 1 to 3, characterized in that: On each heat dissipation substrate component, the IGBT and its driving components can be one group or multiple groups of the same number.

11. An electrical device, characterized in that: The invention comprises a power module based on a plurality of IGBTs connected in parallel according to any one of claims 1 to 9.

Images