Display panel and display device

By designing specific conductive parts and insulating layer structures on the substrate of the OLED display panel, the problem that the conductive parts are prone to break in the via hole is solved, signal transmission performance is improved and the risk of display abnormalities is reduced.

CN119562714AActive Publication Date: 2025-03-04HEFEI VISIONOX TECH CO LTD +1
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Patent Information

Application Number
CN202411753081.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-29
Publication Date
2025-03-04
Estimated Expiration
2044-11-29

AI Technical Summary

Technical Problem

The existing OLED display panel has a problem of display abnormality, mainly because the edges of the conductive part in the via hole are prone to breakage, affecting signal transmission.

Method used

By designing a specific conductive portion and insulating layer structure on the substrate of the display panel, it is ensured that the edge value on the signal transmission direction side is greater than the edge value on the non-signal transmission direction side, thereby reducing the risk of breakage of the conductive portion at the via hole.

Benefits of technology

The risk of breaking of the second conductive part in the signal transmission direction side is effectively improved, signal transmission performance is ensured, and the risk of display abnormalities on the display panel is reduced.

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Abstract

The invention relates to a display panel and a display device. A first conductive part of the display panel comprises a first edge part and a second edge part; the first insulating layer is provided with a first via hole, and the first via hole exposes the first connecting region; the orthographic projection of the first sub-edge of the first via hole on the substrate is located in the orthographic projection of the first conductive part on the substrate; the second conductive part comprises a main body part and a first connecting part connected to the main body part, and at least part of the first connecting part is located in the first via hole and connected with the first connecting area; the orthographic projection of the first sub-edge on the substrate is located between the orthographic projection of the second sub-edge on the substrate and the orthographic projection of the main body part on the substrate; the orthographic projection of the second sub-edge on the substrate is located outside the orthographic projection of the first conductive part on the substrate; or, the orthographic projection of the second sub-edge on the substrate is overlapped with the orthographic projection of the first conductive part on the substrate, and the minimum distance between the first sub-edge and the first edge part is greater than the minimum distance between the second sub-edge and the second edge part. The signal transmission performance of the second conductive part can be ensured, and the display abnormal risk of the display panel is reduced.
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Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) display technology is regarded as the most promising new flat panel display technology for the next generation. Compared with liquid crystal display technology, OLED display technology has the advantages of low energy consumption, low cost, self-luminescence, wide viewing angle and fast response speed. However, the current OLED display panel still has the problem of display abnormality. Summary of the invention

[0003] Based on this, it is necessary to provide a display panel and a display device that can improve display defects.

[0004] In a first aspect, an embodiment of the present application provides a display panel, including:

[0005] substrate;

[0006] A first conductive portion is disposed on the substrate, wherein a surface of the first conductive portion away from the substrate includes a first connection area, and the first conductive portion includes a first side portion and a second side portion;

[0007] A first insulating layer is provided on the substrate and covers a part of the first conductive part away from the substrate, the first insulating layer is provided with a first via hole, and the first via hole exposes the first connection area; the outer edge of the first via hole close to the substrate includes a first sub-side close to the first side portion and a second sub-side close to the second side portion; the orthographic projection of the first sub-side on the substrate is located within the orthographic projection of the first conductive part on the substrate;

[0008] The second conductive portion includes a main body portion and a first connecting portion connected to the main body portion, the main body portion is disposed on a side of the first insulating layer away from the substrate, at least a portion of the first connecting portion is disposed in the first via hole and is connected to the first connecting area; an orthographic projection of the first sub-side on the substrate is disposed between an orthographic projection of the second sub-side on the substrate and an orthographic projection of the main body portion on the substrate;

[0009] The orthographic projection of the second sub-side on the substrate is outside the orthographic projection of the first conductive portion on the substrate; or the orthographic projection of the second sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the first sub-side and the first side is greater than the minimum distance between the second sub-side and the second side.

[0010] In the display panel provided by the embodiment of the present application, the orthographic projection of the first sub-side on the substrate is located between the orthographic projection of the second sub-side on the substrate and the orthographic projection of the main body on the substrate, which is equivalent to: in the direction parallel to the surface of the substrate, the first sub-side is located between the second sub-side and the main body, that is, the first sub-side is the side of the first via on the signal transmission direction side, and the second sub-side is the side of the first via on the non-signal transmission direction side. The orthographic projection of the first sub-side on the substrate is located within the orthographic projection of the first conductive part on the substrate, which is equivalent to: the first conductive part has an edge wrapping around the first sub-side. When the orthographic projection of the second sub-side on the substrate is located outside the orthographic projection of the first conductive part on the substrate, the first conductive part does not wrap around the second sub-side. When the orthographic projection of the second sub-side on the substrate overlaps with the orthographic projection of the first conductive part on the substrate, the minimum distance between the first sub-side and the first side portion is greater than the minimum distance between the second sub-side and the second side portion, that is, the edge wrapping value of the first sub-side is greater than the edge wrapping value of the second sub-side. In this way, it is equivalent to making the edging value on the signal transmission direction side greater than the edging value on the non-signal transmission direction side. In this way, the risk of the second conductive part being easily broken at the first sub-edge can be improved, thereby ensuring the signal transmission performance of the second conductive part and reducing the possibility of display abnormalities on the display panel.

[0011] In one embodiment, the first conductive portion further includes a third side portion, and the first side portion, the third side portion and the second side portion are arranged in sequence along the circumference of the first conductive portion;

[0012] The outer edge of the first via on the side close to the substrate also includes a third sub-side close to the third side, and the orthographic projection of the third sub-side on the substrate is located outside the orthographic projection of the first conductive portion on the substrate; or, the orthographic projection of the third sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the first sub-side and the first side is greater than or equal to the minimum distance between the third sub-side and the third side.

[0013] In one embodiment, the orthographic projection of the third sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the second sub-side and the second side portion is equal to the minimum distance between the third sub-side and the third side portion.

[0014] In one embodiment, the first conductive portion further includes a fourth side portion, and the first side portion, the third side portion, the second side portion and the fourth side portion are arranged in sequence along the circumference of the first conductive portion;

[0015] The outer edge of the first via on the side close to the substrate also includes a fourth sub-side close to the fourth side, and the orthographic projection of the fourth sub-side on the substrate is located outside the orthographic projection of the first conductive portion on the substrate; or, the orthographic projection of the fourth sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the first sub-side and the first side is greater than or equal to the minimum distance between the fourth sub-side and the fourth side.

[0016] In one embodiment, the orthographic projection of the fourth sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the second sub-side and the second side is equal to the minimum distance between the fourth sub-side and the fourth side.

[0017] In one embodiment, the display panel further comprises:

[0018] A second insulating layer is provided between the film layer where the first conductive part is located and the substrate; the second insulating layer is provided with a second via hole; the orthographic projection of the first via hole on the substrate is located outside the orthographic projection of the second via hole on the substrate;

[0019] A third conductive portion is located between the substrate and the second insulating layer, the surface of the third conductive portion away from the substrate includes a second connection area, and the second via hole exposes the second connection area;

[0020] A second connection portion connected to the first conductive portion, the second connection portion and the first conductive portion are disposed in the same layer, at least a portion of the second connection portion is located in the second via hole and connected to the second connection area;

[0021] Optionally, the second side portion, the third side portion or the fourth side portion is connected to the second connecting portion;

[0022] Optionally, the fourth side portion is connected to the second connecting portion; the orthographic projection of the main body portion on the substrate, the orthographic projection of the first side portion on the substrate, and the orthographic projection of the second side portion on the substrate are arranged in sequence along the first direction, and the orthographic projection of the third side portion on the substrate, the orthographic projection of the fourth side portion on the substrate, and the orthographic projection of the second connecting portion on the substrate are arranged in sequence along the second direction, and the first direction and the second direction intersect; or,

[0023] The second side is connected to the second connecting portion; the orthographic projection of the main body on the substrate, the orthographic projection of the first side on the substrate, the orthographic projection of the second side on the substrate, and the orthographic projection of the second connecting portion on the substrate are arranged in sequence along the first direction, the third side and the fourth side are arranged along the second direction, and the first direction and the second direction intersect.

[0024] In one embodiment, the first conductive portion further includes a third side portion, and the first side portion, the third side portion and the second side portion are arranged in sequence along the circumference of the first conductive portion;

[0025] The outer edge of the first via on the side close to the substrate also includes a third sub-side close to the third side, and the orthographic projection of the third sub-side on the substrate is located outside the orthographic projection of the first conductive portion on the substrate; or, the orthographic projection of the third sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the second sub-side and the second side is less than or equal to the minimum distance between the third sub-side and the third side.

[0026] In one embodiment, the orthographic projection of the third sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the first sub-side and the first side portion is equal to the minimum distance between the third sub-side and the third side portion.

[0027] In one embodiment, the first conductive portion further includes a fourth side portion, and the first side portion, the third side portion, the second side portion and the fourth side portion are arranged in sequence along the circumference of the first conductive portion;

[0028] The outer edge of the first via on the side close to the substrate also includes a fourth sub-side close to the fourth side, and the orthographic projection of the fourth sub-side on the substrate is located outside the orthographic projection of the first conductive portion on the substrate; or, the orthographic projection of the fourth sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the second sub-side and the second side is less than or equal to the minimum distance between the fourth sub-side and the fourth side.

[0029] In one embodiment, the orthographic projection of the fourth sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the first sub-side and the first side is equal to the minimum distance between the fourth sub-side and the fourth side.

[0030] In one embodiment, the display panel further comprises:

[0031] A second insulating layer is provided between the film layer where the first conductive part is located and the substrate; the second insulating layer is provided with a second via hole; the orthographic projection of the first via hole on the substrate overlaps with the orthographic projection of the second via hole on the substrate;

[0032] A third conductive portion is located between the substrate and the second insulating layer, the surface of the third conductive portion away from the substrate includes a second connection area, and the second via hole exposes the second connection area; at least part of the first conductive portion is located in the second via hole and connected to the second connection area;

[0033] Optionally, the display panel further includes: a second connecting portion connected to the first conductive portion, the second connecting portion and the first conductive portion are arranged in the same layer, at least a portion of the second connecting portion and at least a portion of the first conductive portion are located in the second via hole and connected to the second connecting area;

[0034] Optionally, the second side, the third side or the fourth side is connected to the second connecting portion; and / or, the orthographic projection of the second sub-side, the third sub-side or the fourth sub-side on the substrate overlaps with the orthographic projection of the second via hole on the substrate;

[0035] Optionally, the fourth side portion is connected to the second connecting portion; the orthographic projection of the main body portion on the substrate, the orthographic projection of the first side portion on the substrate, and the orthographic projection of the second side portion on the substrate are arranged in sequence along the first direction, and the orthographic projection of the third side portion on the substrate, the orthographic projection of the fourth side portion on the substrate, and the orthographic projection of the second connecting portion on the substrate are arranged in sequence along the second direction, and the first direction and the second direction intersect; or,

[0036] The second side portion is connected to the second connecting portion; the orthographic projection of the main body portion on the substrate, the orthographic projection of the first side portion on the substrate, the orthographic projection of the second side portion on the substrate, and the orthographic projection of the second connecting portion on the substrate are arranged in sequence along the first direction, the third side portion and the fourth side portion are arranged along the second direction, and the first direction and the second direction intersect;

[0037] Optionally, the first insulating layer includes an organic material.

[0038] In one embodiment, the first side portion and the second side portion are arranged along a first direction;

[0039] Optionally, the third side portion and the fourth side portion are arranged along the second direction, and the first direction intersects the second direction;

[0040] Optionally, the first side portion and the second side portion extend along the second direction;

[0041] Optionally, the third side portion and the fourth side portion extend along the first direction;

[0042] Optionally, the outer edge of the first via hole on the side close to the substrate is a circle, an ellipse, a rectangle, a rounded rectangle, a polygon with a side length greater than or equal to 5, or a rounded polygon with a side length greater than or equal to 5;

[0043] Optionally, the first conductive portion is a circle, an ellipse, a rectangle, a rounded rectangle, a polygon with a side length greater than or equal to 5, or a rounded polygon with a side length greater than or equal to 5;

[0044] Optionally, the first conductive portion is a rounded rectangle; the outer edge of the first via hole on a side close to the substrate is a circle; or, the first conductive portion is a rounded square; the outer edge of the first via hole on a side close to the substrate is an ellipse;

[0045] Optionally, the length of the first side of the rounded rectangular first conductive portion is smaller than the length of the third side; or, the major axis of the ellipse corresponding to the outer edge of the first via hole on the side close to the substrate is parallel to the extension direction of the first side.

[0046] In one embodiment, the first side portion and the second side portion are arranged along a first direction, the third side portion and the fourth side portion are arranged along a second direction, and the first direction intersects the second direction;

[0047] Optionally, the orthographic projection outer contour of the first conductive portion on the substrate is located at the periphery of the orthographic projection outer contour of the first via hole on a side close to the substrate;

[0048] Optionally, the minimum distance between the second sub-edge and the second edge, the minimum distance between the third sub-edge and the third edge, and the minimum distance between the fourth sub-edge and the fourth edge are all equal;

[0049] Optionally, the maximum dimension of the first via hole along the first direction is equal to the maximum dimension of the first via hole along the second direction; the minimum distance between the first side portion and the second side portion is greater than the minimum distance between the third side portion and the fourth side portion;

[0050] Alternatively, the maximum dimension of the first via hole along the first direction is smaller than the maximum dimension of the first via hole along the second direction; and the minimum distance between the first side and the second side is equal to the minimum distance between the third side and the fourth side.

[0051] In one embodiment, the display panel further comprises a pixel defining layer, the pixel defining layer is provided with a pixel opening, the pixel defining layer is located on a side of the film layer where the second conductive portion is located away from the substrate, and the pixel opening exposes at least a portion of the main body;

[0052] Optionally, at least part of the main body portion serves as a pixel electrode;

[0053] Optionally, the display panel further includes a light-emitting functional layer, at least a portion of the light-emitting functional layer is located in the pixel opening;

[0054] Optionally, the display panel further includes a second electrode, and the second electrode is located on a side of the light-emitting functional layer away from the substrate.

[0055] In one of the embodiments, the display panel further comprises at least one light-emitting unit, the light-emitting unit comprising a first electrode, a light-emitting functional layer, and a second electrode sequentially stacked in a direction away from the substrate, and the main body serves as the first electrode;

[0056] Optionally, the second side corresponding to the same light-emitting unit is parallel to the fifth side of the first connecting portion corresponding to the light-emitting unit on a side away from the main body.

[0057] In one of the embodiments, at least one light emitting unit includes a first light emitting unit and a second light emitting unit;

[0058] The first side portion, the second side portion, the first connecting portion, and the main body portion corresponding to the first light-emitting unit are arranged along a third direction;

[0059] The first side portion, the second side portion, the first connecting portion, and the main body portion corresponding to the second light emitting unit are arranged along a fourth direction; and the third direction intersects with the fourth direction.

[0060] In one embodiment, the aperture of the orthographic projection of the outer edge of the first via hole on the side close to the substrate on the substrate is greater than or equal to 1.5 microns and less than or equal to 5 microns;

[0061] Optionally, the aperture of the orthographic projection of the outer edge of the first via hole on the side close to the substrate on the substrate is greater than or equal to 2.5 microns and less than or equal to 3 microns;

[0062] Optionally, the first conductive portion includes a titanium layer, an aluminum layer and a titanium layer stacked in sequence along the thickness direction of the substrate;

[0063] Optionally, the first insulating layer comprises an organic material;

[0064] The display panel further includes a power signal line disposed on the substrate, the power signal line and the first conductive portion are disposed in the same layer and material, and are insulated from each other;

[0065] Optionally, the display panel further comprises a data signal line disposed on the substrate, the data signal line and the first conductive part are disposed in the same layer and material, and are insulated from each other;

[0066] Optionally, the display panel further includes a fan-out wiring disposed on the substrate, at least a portion of the fan-out wiring is disposed in the same layer and material as the first conductive portion and is insulated from each other; the fan-out wiring is connected to a corresponding data signal line; at least a portion of the fan-out wiring is located in a display area of ​​the display panel;

[0067] Optionally, the display panel further includes a reference potential line disposed on the substrate, the reference potential line and the first conductive portion are disposed in the same layer and material, and are insulated from each other.

[0068] In one embodiment, the orthographic projection of the third sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the difference between the minimum distance between the first sub-side and the first side portion minus the minimum distance between the second sub-side and the second side portion is greater than or equal to 0 micrometers and less than or equal to 5 micrometers;

[0069] Optionally, a difference between a minimum distance between the first sub-edge and the first edge minus a minimum distance between the second sub-edge and the second edge is greater than or equal to 0.5 micrometers and less than or equal to 5 micrometers;

[0070] Optionally, the minimum distance between the second sub-edge and the second edge is greater than or equal to 0.

[0071] In a second aspect, an embodiment of the present application provides a display panel, including:

[0072] substrate;

[0073] A first conductive portion is provided on the substrate, wherein a surface of the first conductive portion away from the substrate includes a first connection area, and the first conductive portion includes a first side portion, a second side portion and a third side portion arranged in sequence along a circumferential direction of the first conductive portion;

[0074] A first insulating layer is provided on the substrate and covers a part of the first conductive part away from the substrate, the first insulating layer is provided with a first via hole, and the first via hole exposes the first connection area; the outer edge of the first via hole close to the substrate includes a first sub-side close to the first side, a second sub-side close to the second side, and a third sub-side close to the third side; the orthographic projection of the first sub-side on the substrate is located within the orthographic projection of the first conductive part on the substrate;

[0075] The second conductive portion includes a main body portion and a first connecting portion connected to the main body portion, the main body portion is disposed on a side of the insulating layer away from the substrate, at least a portion of the first connecting portion is disposed in the first via hole and is connected to the first connecting area; an orthographic projection of the first sub-side on the substrate is disposed between an orthographic projection of the second sub-side on the substrate and an orthographic projection of the main body portion on the substrate;

[0076] The orthographic projection of the third sub-side on the substrate is outside the orthographic projection of the first conductive portion on the substrate; or, the orthographic projection of the third sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the first sub-side and the first side is greater than the minimum distance between the third sub-side and the third side.

[0077] In the display panel provided by the embodiment of the present application, the orthographic projection of the first sub-side on the substrate is located between the orthographic projection of the second sub-side on the substrate and the orthographic projection of the main body on the substrate, which is equivalent to: in the direction parallel to the surface of the substrate, the first sub-side is located between the second sub-side and the main body, that is, the first sub-side is the side of the first via on the signal transmission direction side, and the second sub-side and the third sub-side are the side of the first via on the non-signal transmission direction side. The orthographic projection of the first sub-side on the substrate is located within the orthographic projection of the first conductive part on the substrate, which is equivalent to: the first conductive part has an edge wrapping around the first sub-side. When the orthographic projection of the third sub-side on the substrate is located outside the orthographic projection of the first conductive part on the substrate, the first conductive part does not wrap around the third sub-side. When the orthographic projection of the third sub-side on the substrate overlaps with the orthographic projection of the first conductive part on the substrate, the minimum distance between the first sub-side and the first side portion is greater than the minimum distance between the third sub-side and the second side portion, that is, the edge wrapping value of the first sub-side is greater than the edge wrapping value of the third sub-side. In this way, it is equivalent to making the edge value on the signal transmission direction side greater than the edge value on the non-signal transmission direction side. In this way, the risk of the second conductive part being easily broken at the first sub-edge can be improved, thereby ensuring the signal transmission performance of the second conductive part and reducing the risk of display abnormality of the display panel.

[0078] In a third aspect, an embodiment of the present application provides a display device, comprising the display panel in the first aspect or the second aspect. The display device provided by the embodiment of the present application can reduce the risk of display abnormality of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0079] In order to more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of the present application, the drawings required for use in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0080] Figure 1A schematic diagram of a partial cross-sectional structure of a display panel provided in one embodiment of the present application.

[0081] Figure 2 for Figure 1 A schematic plan view of a first conductive portion and a second conductive portion in a display panel is shown.

[0082] Figure 3A for Figure 2 A plan schematic diagram of the first conductive portion and the first via hole in the embodiment of the present invention.

[0083] Figure 3B for Figure 3A A cross-sectional schematic diagram of the first conductive portion and the first via in FIG.

[0084] Figure 4A Another plan view of the first conductive part and the second conductive part in the display panel.

[0085] Figure 4B A schematic plan view of the structure of a film layer where a first conductive part of another display panel is located and a second conductive part provided by an embodiment of the present application.

[0086] Figure 5 for Figure 4A A cross-sectional schematic diagram showing that a first via hole and a second via hole in a display panel do not overlap.

[0087] Figure 6 A schematic plan view of the structure of a film layer where a first conductive part of another display panel is located and a second conductive part provided by an embodiment of the present application.

[0088] Figure 7 A schematic plan view of a first conductive portion and a second conductive portion of another display panel provided by an embodiment of the present application.

[0089] Fig. 8A A schematic plan view of the structure of a film layer where a first conductive part of another display panel is located and a second conductive part provided by an embodiment of the present application.

[0090] Figure 8B A schematic plan view of the structure of a film layer where a first conductive part of another display panel is located and a second conductive part provided by an embodiment of the present application.

[0091] Fig. 9 for Figure 6 A cross-sectional schematic diagram showing the overlap of a first via hole and a second via hole in a display panel is shown.

[0092] Fig.10 for Figure 2 Another plan schematic diagram of the first conductive portion and the first via in FIG.

[0093] Fig.11for Figure 2 Another plan schematic diagram of the first conductive portion and the first via hole in FIG.

[0094] Fig.12 for Figure 2 Another plan schematic diagram of the first conductive portion and the first via in FIG.

[0095] Fig.13 for Figure 2 Another plan schematic diagram of the first conductive portion and the first via in FIG.

[0096] Fig.14 for Figure 2 Another plan schematic diagram of the first conductive portion and the first via in FIG.

[0097] Fig.15 for Figure 2 Another plan schematic diagram of the first conductive portion and the first via in FIG.

[0098] Fig.16 for Figure 2 Another plan schematic diagram of the first conductive portion and the first via in FIG.

[0099] Fig.17 for Figure 2 Another plan schematic diagram of the first conductive portion and the first via in FIG.

[0100] Fig.18 for Figure 2 Another plan schematic diagram of the first conductive portion and the first via in FIG.

[0101] Fig.19 for Figure 2 Another plan schematic diagram of the first conductive portion and the first via in FIG.

[0102] Fig. 20 for Figure 2 Another plan schematic diagram of the first conductive portion and the first via in FIG.

[0103] Fig.21 for Figure 2 Another plan schematic diagram of the first conductive portion and the first via in FIG.

[0104] Fig. 22 A schematic plan view of the structure of a film layer where a first conductive part of another display panel is located and a second conductive part provided by an embodiment of the present application.

[0105] Description of reference numerals: 10, display panel; 11, substrate; 12, first conductive portion; 12a, first connection region; 121, first side portion; 122, second side portion; 123, third side portion; 124, fourth side portion; 13, first insulating layer; 13a, first via hole; 13a1, first sub-side; 13a2, second sub-side; 13a3, third sub-side; 13a4, fourth sub-side; 14, second conductive portion; 141, main body; 142, first connection portion; 1421, fifth side; 15, second insulating layer; 15a, second via hole; 16, third conductive portion; 16a, second connection area; 17, second connection portion; 18, pixel defining layer; 19, light-emitting unit; 191, first electrode; 192, light-emitting functional layer; 193, second electrode; 19a, first light-emitting unit; 19b, second light-emitting unit; 110, power signal line; 111, data signal line; 112, fan-out wiring; 113, reference potential line. DETAILED DESCRIPTION

[0106] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0107] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, they do not represent any order, quantity or importance, but are only used to distinguish different components. These terms are only used to distinguish one element from another. For example, without departing from the scope of the present application, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element. "Include" or "comprising" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0108] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0109] In the relevant display panel, there is a problem of display abnormality. After research, the inventor found that when the electrode is connected to the conductive part below through the via hole, the conductive part does not wrap the edge of the signal transmission side of the via hole sufficiently (or does not wrap the edge), causing the edge of the conductive part to be lifted in the via hole, and the electrode on the conductive part and the electrode on the side wall of the via hole are broken, which affects the transmission of the signal and causes the display abnormality problem.

[0110] In view of at least one of the above problems, the embodiments of the present application provide a display panel and a display device, wherein the orthographic projection of the first sub-side on the substrate is located between the orthographic projection of the second sub-side on the substrate and the orthographic projection of the main body on the substrate, which is equivalent to: in the direction parallel to the surface of the substrate, the first sub-side is located between the second sub-side and the main body, that is, the first sub-side is the side of the first via on the signal transmission direction side, and the second sub-side is the side of the first via on the non-signal transmission direction side. The orthographic projection of the first sub-side on the substrate is located within the orthographic projection of the first conductive part on the substrate, which is equivalent to: the first conductive part has an edge wrapping around the first sub-side. When the orthographic projection of the second sub-side on the substrate is located outside the orthographic projection of the first conductive part on the substrate, the first conductive part does not wrap around the second sub-side. When the orthographic projection of the second sub-side on the substrate overlaps with the orthographic projection of the first conductive part on the substrate, the minimum distance between the first sub-side and the first side portion is greater than the minimum distance between the second sub-side and the second side portion, that is, the edge wrapping value of the first sub-side is greater than the edge wrapping value of the second sub-side. In this way, it is equivalent to making the edge value of the signal transmission direction side greater than the edge value of the non-signal transmission direction side, so that the risk of the second conductive part being easily broken at the first sub-side can be improved, thereby ensuring the signal transmission performance of the second conductive part and reducing the possibility of display abnormalities of the display panel. For example, the edge value of the second sub-side is small or there is no edge, reducing the size of the first conductive part is conducive to improving pixel resolution.

[0111] Specifically, refer to Figure 1-Figure 22 As shown, an embodiment of the present application provides a display panel 10, which may be an organic light emitting diode display (Organic Light Emitting Diode, OLED) or a quantum dot electroluminescent display (Quantum Dot Light Emitting Diodes, QLED).

[0112] Specifically, the display panel 10 includes a substrate 11, a first conductive portion 12, a first insulating layer 13, and a second conductive portion 14. The first conductive portion 12 is disposed on the substrate 11, and the surface of the first conductive portion 12 away from the substrate 11 includes a first connection area 12a, and the first conductive portion 12 includes a first side portion 121 and a second side portion 122. The first insulating layer 13 is disposed on the substrate 11 and covers a portion of the first conductive portion 12 away from the substrate 11. The first insulating layer 13 is provided with a first via 13a, and the first via 13a exposes the first connection area 12a; the outer edge of the first via 13a on the side close to the substrate 11 includes a first sub-side 13a1 close to the first side portion 121 and a second sub-side 13a2 close to the second side portion 122. The outer edge of the first via 13a on the side close to the substrate 11 may be equivalent to the contour of the first insulating layer 13 facing and surrounding the side wall of the first via 13a close to the substrate 11.

[0113] The orthographic projection of the first sub-side 13a1 on the substrate 11 is located within the orthographic projection of the first conductive part 12 on the substrate 11, which is equivalent to: the first conductive part 12 has an edge around the first sub-side 13a1. The second conductive part 14 includes a main body 141 and a first connecting part 142 connected to the main body 141. The main body 141 is arranged on the side of the first insulating layer 13 away from the substrate 11. At least part of the first connecting part 142 is located in the first via 13a and connected to the first connecting area 12a. Here, the main body 141 is equivalent to the functional area of ​​the second conductive part 14. The electrical signal is transmitted from the first connecting area 12a of the first conductive part 12 to the first connecting part 142, and then to the main body 141. The orthographic projection of the first sub-side 13a1 on the substrate 11 is located between the orthographic projection of the second sub-side 13a2 on the substrate 11 and the orthographic projection of the main body 141 on the substrate 11. This is equivalent to: in a direction parallel to the surface of the substrate 11, the first sub-side 13a1 is located between the second sub-side 13a2 and the main body 141, that is, the first sub-side 13a1 is the side of the first via 13a on the signal transmission direction side, and the second sub-side 13a2 is the side of the first via 13a on the non-signal transmission direction side. Figure 2 and Figure 3B In the figure, the one-way arrow indicates the direction of signal transmission. Figure 3B Can be along Figure 3A Cross-sectional view along the A1A2 direction.

[0114] Among them, the orthographic projection of the second sub-edge 13a2 on the substrate 11 is located outside the orthographic projection of the first conductive portion 12 on the substrate 11; or, the orthographic projection of the second sub-edge 13a2 on the substrate 11 overlaps with the orthographic projection of the first conductive portion 12 on the substrate 11, and the minimum distance between the first sub-edge 13a1 and the first side portion 121 is greater than the minimum distance between the second sub-edge 13a2 and the second side portion 122.

[0115] It is understandable that the substrate 11 may be a flexible substrate 11, such as a polyimide (PI) substrate 11, a polyethylene terephthalate (PET) substrate 11 or a polymethyl methacrylate (PMMA) substrate 11. The substrate 11 may also be a rigid substrate 11, such as glass.

[0116] The display panel 10 provided in the embodiment of the present application is as follows: Fig.12 As shown, when the orthographic projection of the second sub-side 13a2 on the substrate 11 is outside the orthographic projection of the first conductive portion 12 on the substrate 11, the first conductive portion 12 does not surround the second sub-side 13a2. For example, the distance (for example, the minimum distance) between the second sub-side 13a2 and the second side portion 122 may be less than or equal to 0.5 micrometers, for example, 0, 0.1 micrometers, 0.2 micrometers, 0.3 micrometers, 0.4 micrometers, and 0.5 micrometers.

[0117] like Figure 3A and 3B As shown, when the orthographic projection of the second sub-side 13a2 on the substrate 11 overlaps with the orthographic projection of the first conductive part 12 on the substrate 11, the minimum distance a between the first sub-side 13a1 and the first side 121 is greater than the minimum distance b between the second sub-side 13a2 and the second side 122, that is, the edge value of the first sub-side 13a1 is greater than the edge value of the second sub-side 13a2. In this way, it is equivalent to making the edge value of the signal transmission direction side greater than the edge value of the non-signal transmission direction side, so that the risk of the second conductive part 14 being easily broken at the first sub-side 13a1 can be improved, thereby ensuring the signal transmission performance of the second conductive part 14 and reducing the possibility of display abnormalities in the display panel 10.

[0118] It should also be noted that, in the embodiment of the present application, by making the edge value of the first conductive part 12 to the first sub-side 13a1 greater than the edge value of the first conductive part 12 to the second sub-side 13a2, it is equivalent to increasing the edge value of the signal transmission direction side of the first via 13a on the basis of the relevant technology, without increasing the edge value of the second sub-side 13a2 side of the first via 13a. In this way, only a small area needs to be added to the original first conductive part 12 to solve the display abnormality problem, thereby saving the space in the horizontal direction of the display panel 10, which is conducive to high-resolution (PPI) design. The first sub-side 13a1 may be parallel or non-parallel to the first side 121. The second sub-side 13a2 may be parallel or non-parallel to the second side 122. The first sub-side 13a1 may include a straight side, a curved side, or a folded line side. The first side 121 may include a straight side, a curved side, or a folded line side. The second sub-side 13a2 may include a straight side, a curved side, or a folded line side. The second side 122 may include a straight side, a curved side, or a folded line side.

[0119] In one embodiment, if Figure 3A and Figure 4A , Figure 4B As shown, the first conductive portion 12 further includes a third side portion 123, and the first side portion 121, the third side portion 123 and the second side portion 122 are arranged in sequence along the circumference (e.g., the circumference direction) of the first conductive portion 12. The outer edge of the first via 13a on the side close to the substrate 11 also includes a third sub-side 13a3 close to the third side portion 123. The third sub-side 13a3 and the third side portion 123 may be parallel or non-parallel. The third sub-side 13a3 may include a straight side, a curved side, or a zigzag side. The third side portion 123 may include a straight side, a curved side, or a zigzag side.

[0120] In one example, if Fig.13 As shown, the orthographic projection of the third sub-side 13a3 on the substrate 11 is outside the orthographic projection of the first conductive portion 12 on the substrate 11, that is, the first conductive portion 12 does not surround the third sub-side 13a3, so as to reduce the size of the first conductive portion 12, which is beneficial to improve the pixel resolution. For example, the distance (for example, the minimum distance) between the third sub-side 13a3 and the third side portion 123 can be less than or equal to 0.5 microns, for example, 0, 0.1 microns, 0.2 microns, 0.3 microns, 0.4 microns, 0.5 microns.

[0121] In another example, combining Fig.10 As shown, the orthographic projection of the third sub-side 13a3 on the substrate 11 overlaps with the orthographic projection of the first conductive portion 12 on the substrate 11, and the minimum distance a between the first sub-side 13a1 and the first side portion 121 is greater than or equal to the minimum distance c between the third sub-side 13a3 and the third side portion 123. That is, the edge value of the first sub-side 13a1 is greater than or equal to the edge value of the third sub-side 13a3.

[0122] For example, the minimum distance a between the first sub-side 13a1 and the first side portion 121 is equal to the minimum distance c between the third sub-side 13a3 and the third side portion 123, that is, the edge value of the first sub-side 13a1 is equal to the edge value of the third sub-side 13a3. In this way, the first connecting portion 142 is not easy to break at the third sub-side 13a3, ensuring that the first connecting portion 142 located on the side wall of the first via hole 13a and the first connecting portion 142 located on the first connection area 12a have a larger connection area, which is conducive to reducing the connection resistance.

[0123] For example, the minimum distance a between the first sub-side 13a1 and the first side portion 121 is greater than the minimum distance c between the third sub-side 13a3 and the third side portion 123, that is, the edge value of the first sub-side 13a1 is greater than the edge value of the third sub-side 13a3. The edge value of the third sub-side 13a3 is smaller, so as to reduce the size of the first conductive portion 12, which is beneficial to improve the pixel resolution.

[0124] In one embodiment, the minimum distance b between the second sub-side 13a2 and the second side portion 122 is equal to the minimum distance c between the third sub-side 13a3 and the third side portion 123. That is, the edge value of the second sub-side 13a2 is equal to the edge value of the third sub-side 13a3. In this way, the edge value of the third sub-side 13a3 is smaller, so as to reduce the size of the first conductive portion 12, which is beneficial to improve the pixel resolution.

[0125] It is understandable that the minimum distance b between the second sub-side 13a2 and the second side portion 122 may be different from the minimum distance c between the third sub-side 13a3 and the third side portion 123. For example, b may be greater than c. For example, b may be less than c.

[0126] In one embodiment, the first conductive portion 12 further includes a fourth side 124, and the first side 121, the third side 123, the second side 122 and the fourth side 124 are arranged in sequence along the circumference of the first conductive portion 12. The outer edge of the first via 13a on the side close to the substrate 11 also includes a fourth sub-side 13a4 close to the fourth side 124. The fourth sub-side 13a4 and the fourth side 124 may be parallel or non-parallel. The fourth sub-side 13a4 may include a straight side, a curved side or a zigzag side. The fourth side 124 may include a straight side, a curved side or a zigzag side.

[0127] In one example, if Fig.14As shown, the orthographic projection of the fourth sub-side 13a4 on the substrate 11 is outside the orthographic projection of the first conductive portion 12 on the substrate 11, that is, the first conductive portion 12 does not surround the fourth sub-side 13a4, so as to reduce the size of the first conductive portion 12, which is beneficial to improve the pixel resolution. For example, the distance (for example, the minimum distance) between the fourth sub-side 13a4 and the fourth side portion 124 can be less than or equal to 0.5 microns, for example, 0.1 microns, 0.2 microns, 0.3 microns, 0.4 microns, 0.5 microns.

[0128] For example, the first conductive portion 12 does not wrap around one or more of the second sub-side 13a2, the third sub-side 13a3, and the fourth sub-side 13a4. Figure 12-14 , Fig.18 , Fig.19 , Fig. 20 , Fig.21 shown.

[0129] In another example, combining Fig.10 As shown, the orthographic projection of the fourth sub-side 13a4 on the substrate 11 overlaps with the orthographic projection of the first conductive portion 12 on the substrate 11, and the minimum distance a between the first sub-side 13a1 and the first side portion 121 is greater than or equal to the minimum distance d between the fourth sub-side 13a4 and the fourth side portion 124. That is, the edge value of the first sub-side 13a1 is greater than or equal to the edge value of the fourth sub-side 13a4.

[0130] For example, the minimum distance a between the first sub-side 13a1 and the first side portion 121 is equal to the minimum distance d between the fourth sub-side 13a4 and the fourth side portion 124. That is, the edge value of the first sub-side 13a1 is equal to the edge value of the fourth sub-side 13a4. In this way, the first connecting portion 142 is not easy to break at the fourth sub-side 13a4, ensuring that the first connecting portion 142 located on the side wall of the first via 13a and the first connecting portion 142 located on the first connecting region 12a have a larger connection area, which is conducive to reducing the connection resistance.

[0131] In one embodiment, the minimum distance b between the second sub-side 13a2 and the second side portion 122 is equal to the minimum distance d between the fourth sub-side 13a4 and the fourth side portion 124. That is, the edge value of the second sub-side 13a2 is equal to the edge value of the fourth sub-side 13a4. In this way, the edge value of the fourth sub-side 13a4 is smaller, so as to reduce the size of the first conductive portion 12, which is beneficial to improve the pixel resolution.

[0132] It is understandable that the minimum distance b between the second sub-side 13a2 and the second side portion 122 may be different from the minimum distance d between the fourth sub-side 13a4 and the fourth side portion 124. For example, b may be greater than d. For example, b may be less than d.

[0133] For example, the minimum distance c between the third sub-side 13a3 and the third side portion 123 and the minimum distance d between the fourth sub-side 13a4 and the fourth side portion 124 may be equal or unequal. For example, d may be greater than c. For example, d may be less than c.

[0134] In one embodiment, referring to Figure 5 As shown, the display panel 10 further includes a second insulating layer 15, a third conductive portion 16 and a second connecting portion 17. The second insulating layer 15 is disposed between the film layer where the first conductive portion 12 is located and the substrate 11; the second insulating layer 15 is provided with a second via hole 15a, and the orthographic projection of the first via hole 13a on the substrate 11 is located outside the orthographic projection of the second via hole 15a on the substrate 11, that is, in the thickness direction Z of the display panel 10, the first via hole 13a and the second via hole 15a do not overlap. The orthographic projection of the first via hole 13a on the substrate 11 does not overlap with the orthographic projection of the second via hole 15a on the substrate 11, or the minimum distance between the orthographic projection of the first via hole 13a on the substrate 11 and the orthographic projection of the second via hole 15a on the substrate 11 is greater than 3 microns, for example, greater than 5 microns, for example, 3 microns, 4 microns, 5 microns, 6 microns, and the required edge value of the third sub-side 13a3 and / or the edge value of the fourth sub-side 13a4 is small, which can ensure the reliability of signal transmission and help improve pixel resolution. Figure 5 Can be along Figure 4A The distance between the first via hole 13a and the second via hole 15a is relatively large, which can reduce the influence of the first conductive part 12 on the edge value of each side of the first via hole.

[0135] The third conductive portion 16 is located between the substrate 11 and the second insulating layer 15 . The surface of the third conductive portion 16 away from the substrate 11 includes a second connection region 16 a . The second via hole 15 a exposes the second connection region 16 a .

[0136] The second connection portion 17 is connected to the first conductive portion 12, and the second connection portion 17 is arranged in the same layer as the first conductive portion 12. At least part of the second connection portion 17 is located in the second via 15a and is connected to the second connection area 16a. Multiple structures arranged in the same layer can be obtained by patterning the same film layer, thereby simplifying the process. It is understandable that other film layers can be arranged between the film layer where the third conductive portion 16 is located and the film layer where the first conductive portion 12 is located, and the embodiment of the present application is not limited here.

[0137] It should be noted that the film layer above the via hole area will have fluctuations. The above arrangement prevents the first via hole 13a and the second via hole 15a from overlapping, which can reduce the fluctuation of the second conductive portion 14 at the first via hole 13a, and is beneficial to the production of subsequent film layers.

[0138] Optionally, the second side 122, the third side 123 or the fourth side 124 (for example, one of the second side 122, the third side 123 or the fourth side 124) is connected to the second connection portion 17. Compared with the manner in which multiple sides (such as at least two of the second side 122, the third side 123 and the fourth side 124) are connected to the second connection portion 17, the above arrangement can reduce the arrangement area of ​​the second connection portion 17, which is conducive to high PPI design.

[0139] It is understandable that at least two of the second side portion 122 , the third side portion 123 and the fourth side portion 124 may be connected to the second connecting portion 17 .

[0140] Optional, such as Figure 4A and Figure 4B As shown, the fourth side portion 124 is connected to the second connection portion 17. The orthographic projection of the main body portion 141 on the substrate 11, the orthographic projection of the first side portion 121 on the substrate 11, and the orthographic projection of the second side portion 122 on the substrate 11 are arranged in sequence along the first direction X, and the orthographic projection of the third side portion 123 on the substrate 11, the orthographic projection of the fourth side portion 124 on the substrate 11, and the orthographic projection of the second connection portion 17 on the substrate 11 are arranged in sequence along the second direction Y, and the first direction X and the second direction Y intersect, for example, are perpendicular.

[0141] Or, if Figure 6 As shown, the second side portion 122 is connected to the second connecting portion 17. The orthographic projection of the main body portion 141 on the substrate 11, the orthographic projection of the first side portion 121 on the substrate 11, the orthographic projection of the second side portion 122 on the substrate 11, and the orthographic projection of the second connecting portion 17 on the substrate 11 are sequentially arranged along the first direction X, and the third side portion 123 and the fourth side portion 124 are arranged along the second direction Y, and the first direction X and the second direction Y intersect, for example, are perpendicular.

[0142] The above settings can enable designers to perform layout design according to actual conditions, which is beneficial to improving space utilization and performing high PPI design. It is understandable that the above two different layout methods can be applied to the layout design of the same display panel 10.

[0143] In one embodiment, if Figure 6 As shown, the first conductive part 12 further includes a third side 123, and the first side 121, the third side 123 and the second side 122 are arranged in sequence along the circumference of the first conductive part 12. The outer edge of the first via 13a close to the substrate 11 also includes a third sub-side 13a3 close to the third side 123.

[0144] In one example, the orthographic projection of the third sub-edge 13a3 on the substrate 11 is outside the orthographic projection of the first conductive portion 12 on the substrate 11, that is, the first conductive portion 12 does not surround the third sub-edge 13a3, so as to reduce the size of the first conductive portion 12, which is beneficial to improve pixel resolution.

[0145] In another example, combining Fig.10 As shown, the orthographic projection of the third sub-side 13a3 on the substrate 11 overlaps with the orthographic projection of the first conductive portion 12 on the substrate 11, and the minimum distance b between the second sub-side 13a2 and the second side portion 122 is less than or equal to the minimum distance c between the third sub-side 13a3 and the third side portion 123. That is, the edge value of the second sub-side 13a2 is less than or equal to the edge value of the third sub-side 13a3.

[0146] For example, the minimum distance b between the second sub-side 13a2 and the second side portion 122 is equal to the minimum distance c between the third sub-side 13a3 and the third side portion 123. That is, the edge value of the second sub-side 13a2 is equal to the edge value of the third sub-side 13a3. The edge value of the third sub-side 13a3 is smaller, so as to reduce the size of the first conductive portion 12, which is beneficial to improve the pixel resolution.

[0147] For example, the minimum distance b between the second sub-side 13a2 and the second side portion 122 is smaller than the minimum distance c between the third sub-side 13a3 and the third side portion 123. That is, the edge value of the second sub-side 13a2 is smaller than the edge value of the third sub-side 13a3. In this way, the first connection portion 142 is not easily broken at the third sub-side 13a3, ensuring that the first connection portion 142 located on the side wall of the first via hole 13a and the first connection portion 142 located on the first connection area 12a have a larger connection area, which is conducive to reducing the connection resistance.

[0148] In one embodiment, the orthographic projection of the third sub-side 13a3 on the substrate 11 overlaps with the orthographic projection of the first conductive portion 12 on the substrate 11, and the minimum distance a between the first sub-side 13a1 and the first side portion 121 is equal to the minimum distance c between the third sub-side 13a3 and the third side portion 123. That is, the edge value of the third sub-side 13a3 is equal to the edge value of the first sub-side 13a1. In this way, the first connecting portion 142 is not easy to break at the third sub-side 13a3, ensuring that the first connecting portion 142 located on the side wall of the first via 13a and the first connecting portion 142 located on the first connecting area 12a have a larger connection area, which is conducive to reducing the connection resistance.

[0149] It is understandable that the minimum distance a between the first sub-side 13a1 and the first side portion 121 and the minimum distance c between the third sub-side 13a3 and the third side portion 123 may not be equal. For example, a may be greater than c.

[0150] In one embodiment, the first conductive portion 12 further includes a fourth side portion 124, and the first side portion 121, the third side portion 123, the second side portion 122 and the fourth side portion 124 are sequentially arranged along the circumference of the first conductive portion 12. The outer edge of the first via 13a on the side close to the substrate 11 further includes a fourth sub-side 13a4 close to the fourth side portion 124.

[0151] In one example, the orthographic projection of the fourth sub-edge 13a4 on the substrate 11 is outside the orthographic projection of the first conductive portion 12 on the substrate 11, that is, the first conductive portion 12 does not surround the fourth sub-edge 13a4, so as to reduce the size of the first conductive portion 12, which is beneficial to improve pixel resolution.

[0152] In another example, combining Fig.10 As shown, the orthographic projection of the fourth sub-side 13a4 on the substrate 11 overlaps with the orthographic projection of the first conductive portion 12 on the substrate 11, and the minimum distance b between the second sub-side 13a2 and the second side portion 122 is less than or equal to the minimum distance d between the fourth sub-side 13a4 and the fourth side portion 124. That is, the edge value of the fourth sub-side 13a4 is less than or equal to the edge value of the second sub-side 13a2.

[0153] For example, the minimum distance b between the second sub-side 13a2 and the second side portion 122 is equal to the minimum distance d between the fourth sub-side 13a4 and the fourth side portion 124. That is, the edge value of the fourth sub-side 13a4 is equal to the edge value of the second sub-side 13a2. In this way, the edge value of the second sub-side 13a2 is smaller, which is beneficial to saving space in the horizontal direction of the display panel 10, thereby facilitating high PPI design.

[0154] For example, the minimum distance b between the second sub-side 13a2 and the second side portion 122 is smaller than the minimum distance d between the fourth sub-side 13a4 and the fourth side portion 124. That is, the edge value of the fourth sub-side 13a4 is smaller than the edge value of the second sub-side 13a2. In this way, the first connection portion 142 is not easy to break at the fourth sub-side 13a4, ensuring that the first connection portion 142 located on the side wall of the first via hole 13a and the first connection portion 142 located on the first connection area 12a have a larger connection area, which is conducive to reducing the connection resistance.

[0155] In one embodiment, the orthographic projection of the fourth sub-side 13a4 on the substrate 11 overlaps with the orthographic projection of the first conductive portion 12 on the substrate 11, and the minimum distance a between the first sub-side 13a1 and the first side portion 121 is equal to the minimum distance d between the fourth sub-side 13a4 and the fourth side portion 124. In this way, the first connecting portion 142 is not easy to break at the fourth sub-side 13a4, ensuring that the first connecting portion 142 located on the side wall of the first via 13a and the first connecting portion 142 located on the first connecting region 12a have a larger connection area, which is conducive to reducing the connection resistance. In other embodiments, a may be greater than d.

[0156] In one embodiment, if Fig. 9 As shown, the display panel 10 further includes a second insulating layer 15 and a third conductive portion 16, wherein the second insulating layer 15 is disposed between the film layer where the first conductive portion 12 is located and the substrate 11; the second insulating layer 15 is provided with a second via hole 15a; the orthographic projection of the first via hole 13a on the substrate 11 overlaps with the orthographic projection of the second via hole 15a on the substrate 11, which is beneficial to improving the pixel resolution. The orthographic projection of the first via hole 13a on the substrate 11 overlaps with the orthographic projection of the second via hole 15a on the substrate 11, or the minimum distance between the orthographic projection of the first via hole 13a on the substrate 11 and the orthographic projection of the second via hole 15a on the substrate 11 is less than or equal to 3 micrometers, for example, less than or equal to 1 micrometer, for example, 0.5 micrometers, 1 micrometer, 2 micrometers, 3 micrometers, and the required edge value of the third sub-side 13a3 and / or the edge value of the fourth sub-side 13a4 is large to ensure the reliability of signal transmission. Fig. 9 Can be along Figure 7 Cross-sectional view along the C1C2 direction.

[0157] The third conductive part 16 is located between the substrate 11 and the second insulating layer 15. The surface of the third conductive part 16 away from the substrate 11 includes a second connection area 16a, and the second via 15a exposes the second connection area 16a. At least part of the first conductive part 12 is located in the second via 15a and connected to the second connection area 16a. It can be understood that other film layers can be arranged between the film layer where the third conductive part 16 is located and the film layer where the first conductive part 12 is located, and the embodiment of the present application is not limited here.

[0158] It should be noted that the above arrangement is conducive to maximizing the use of the space in the horizontal direction of the display panel 10, thereby facilitating high PPI design.

[0159] Optionally, the display panel 10 further includes a second connection portion 17, the second connection portion 17 is connected to the first conductive portion 12, the second connection portion 17 is disposed in the same layer as the first conductive portion 12, at least a portion of the second connection portion 17 and at least a portion of the first conductive portion 12 are located in the second via hole 15a and connected to the second connection area 16a. Optionally, the orthographic projection of the second sub-edge, the third sub-edge or the fourth sub-edge on the substrate overlaps with the orthographic projection of the second via hole on the substrate.

[0160] Optionally, the second side 122, the third side 123 or the fourth side 124 is connected to the second connection portion 17. Compared with the manner in which multiple sides (such as at least two of the second side 122, the third side 123 and the fourth side 124) are connected to the second connection portion 17, the above arrangement can reduce the arrangement area of ​​the second connection portion 17, which is conducive to high PPI design.

[0161] It is understandable that at least two of the second side portion 122 , the third side portion 123 and the fourth side portion 124 may be connected to the second connecting portion 17 .

[0162] Optional, such as Fig. 8A As shown, the fourth side 124 is connected to the second connecting portion 17; the orthographic projection of the main body 141 on the substrate 11, the orthographic projection of the first side 121 on the substrate 11, and the orthographic projection of the second side 122 on the substrate 11 are arranged in sequence along the first direction X, and the orthographic projection of the third side 123 on the substrate 11, the orthographic projection of the fourth side 124 on the substrate 11, and the orthographic projection of the second connecting portion 17 on the substrate 11 are arranged in sequence along the second direction Y, and the first direction X and the second direction Y intersect.

[0163] Or, if Figure 8B As shown, the second side portion 122 is connected to the second connecting portion 17. The orthographic projection of the main body portion 141 on the substrate 11, the orthographic projection of the first side portion 121 on the substrate 11, the orthographic projection of the second side portion 122 on the substrate 11, and the orthographic projection of the second connecting portion 17 on the substrate 11 are sequentially arranged along the first direction X, and the third side portion 123 and the fourth side portion 124 are arranged along the second direction Y, and the first direction X and the second direction Y intersect.

[0164] The above settings can enable designers to perform layout design according to actual conditions, which is beneficial to improving space utilization and performing high PPI design. It is understandable that the above two different layout methods can be applied to the layout design of the same display panel 10.

[0165] In one embodiment, the first insulating layer 13 includes an organic material, and further, the first insulating layer 13 is a planarization layer. It is understandable that the first insulating layer 13 can be a single-layer structure or a stacked-layer structure composed of multiple layers.

[0166] In one embodiment, the second insulating layer 15 includes an organic material or an inorganic material. For example, the second insulating layer 15 is a planarization layer.

[0167] In one embodiment, referring to Fig.10 and Fig.11 As shown, the first side portion 121 and the second side portion 122 are arranged along the first direction X, that is, the first side portion 121 and the second side portion 122 are opposite to each other along the first direction X.

[0168] Optionally, the third side portion 123 and the fourth side portion 124 are arranged along the second direction Y, and the first direction X intersects the second direction Y. That is, the third side portion 123 and the fourth side portion 124 are opposite to each other along the second direction Y.

[0169] Optionally, the first direction X is perpendicular to the second direction Y.

[0170] Optionally, the first side portion 121 extends along the second direction Y, and / or the second side portion 122 extends along the second direction Y, that is, the extension directions of the first side portion 121 and the second side portion 122 are parallel to the second direction Y.

[0171] Optionally, the third side portion 123 extends along the first direction X, and / or the fourth side portion 124 extends along the first direction X, that is, the extension directions of the third side portion 123 and the fourth side portion 124 are parallel to the first direction X.

[0172] Optional, combined Figure 12-Figure 17 As shown, the outer edge of the first via hole 13a on the side close to the substrate 11 is a circle, an ellipse, a rectangle, a rounded rectangle, a polygon with a side length greater than or equal to 5, or a rounded polygon with a side length greater than or equal to 5. That is, the orthographic projection of the outer edge of the first via hole 13a on the side close to the substrate 11 on the substrate 11 is the above shape.

[0173] Optionally, the first conductive portion 12 is a circle, an ellipse, a rectangle, a rounded rectangle, a polygon with sides greater than or equal to 5, or a rounded polygon with sides greater than or equal to 5. That is, the orthographic projection of the first conductive portion 12 on the substrate 11 is the above shape.

[0174] In one example, if Fig.15 As shown, the first conductive portion 12 is a polygon or a rectangle or a chamfered polygon or a chamfered long side or a rounded rectangle, and the outer edge of the first via 13a on the side close to the substrate 11 is round. The length of the first side of the first conductive portion of the polygon or rectangle or the chamfered polygon or the chamfered long side or the rounded rectangle is less than the length of the third side. The distance between the first side 121 and the second side 122 along the first direction may be greater than the distance between the third side 123 and the fourth side 124 in the second direction.

[0175] In another example, the first conductive portion 12 is a rectangle or a chamfered rectangular shape or a rounded rectangular shape, and the outer edge of the first via hole 13a on the side close to the substrate 11 is a circle or a square or a chamfered rectangular shape or a rounded square shape.

[0176] In another example, Fig.16 As shown, the first conductive portion 12 is a polygon or a square chamfered polygon or a chamfered regular polygon or a rounded square, and the outer edge of the first via 13a on the side close to the substrate 11 is an ellipse. For example, the major axis of the ellipse corresponding to the outer edge of the first via close to the substrate is parallel to the extension direction of the first side. The distance between the first side 121 and the second side 122 along the first direction may be equal to the distance between the third side 123 and the fourth side 124 in the second direction.

[0177] In another example, the first conductive portion 12 is a square or a chamfered square or a rounded square, and the outer edge of the first via hole 13a close to the substrate 11 is an ellipse or a rectangle or a chamfered rectangular shape or a rounded rectangle.

[0178] In one embodiment, if Fig.17 As shown, the first conductive portion 12 is a polygon (for example, the number of sides is greater than or equal to 4), for example, the polygon has a chamfer. The first via 13a is a polygon, and the polygon has a chamfer. The chamfer can be a straight chamfer (non-rounded chamfer) or a rounded chamfer. By setting a chamfer, such as a rounded corner, a right angle can be avoided, thereby reducing the risk of tip discharge.

[0179] In one embodiment, referring to Fig.10 As shown, the first side portion 121 and the second side portion 122 are arranged along the first direction X, the third side portion 123 and the fourth side portion 124 are arranged along the second direction Y, and the first direction X and the second direction Y intersect.

[0180] Optionally, the orthographic projection outer contour of the first conductive portion 12 on the substrate 11 is located at a position where the outer edge of the first via hole 13 a on a side close to the substrate 11 is outside the orthographic projection outer contour on the substrate 11 .

[0181] Optionally, a minimum distance b between the second sub-side 13a2 and the second side 122, a minimum distance c between the third sub-side 13a3 and the third side 123, and a minimum distance d between the fourth sub-side 13a4 and the fourth side 124 are all equal.

[0182] In one example, if Fig.10 As shown, the maximum dimension e of the first via hole 13a along the first direction X is equal to the maximum dimension f of the first via hole 13a along the second direction Y; the minimum distance g between the first side portion 121 and the second side portion 122 is greater than the minimum distance h between the third side portion 123 and the fourth side portion 124. In the related art, the minimum distance g between the first side portion 121 and the second side portion 122 is equal to the minimum distance h between the third side portion 123 and the fourth side portion 124. Based on the related art, the embodiment of the present application increases the minimum distance g between the first side portion 121 and the second side portion 122, thereby increasing the minimum distance a between the first sub-side 13a1 and the first side portion 121, so that a is greater than b, c, and d.

[0183] In another example, Fig.11As shown, the maximum dimension e of the first via 13a along the first direction X is smaller than the maximum dimension f of the first via 13a along the second direction Y; the minimum distance g between the first side 121 and the second side 122 is equal to the minimum distance h between the third side 123 and the fourth side 124. In this way, based on the relevant technology, the embodiment of the present application does not increase the area of ​​the first conductive part 12, but adjusts the inner diameter of the first via 13a, thereby increasing the minimum distance a between the first sub-side 13a1 and the first side 121, so that a is greater than b, c, and d. This setting method is conducive to achieving a high PPI design.

[0184] In one embodiment, the display panel 10 further includes a pixel defining layer 18 , which is provided with a pixel opening. The pixel defining layer 18 is located on a side of the film layer where the second conductive portion 14 is located away from the substrate 11 , and the pixel opening exposes at least a portion of the main body 141 .

[0185] Optionally, at least a portion of the main body 141 serves as a pixel electrode, such as an anode.

[0186] Optionally, the display panel 10 further includes a light-emitting functional layer 192 , and at least a portion of the light-emitting functional layer 192 is located at the pixel opening.

[0187] Optionally, the display panel 10 further includes a second electrode 193 located on a side of the light emitting functional layer 192 away from the substrate 11. It can be understood that one of the main body 141 and the second electrode 193 is an anode, and the other is a cathode.

[0188] In one embodiment, the display panel 10 further includes at least one light emitting unit 19, for example, the light emitting unit 19 includes a first electrode 191, a light emitting functional layer 192, and a second electrode 193 which are sequentially stacked in a direction away from the substrate 11, and the main body 141 serves as the first electrode 191. It can be understood that one of the first electrode 191 and the second electrode 193 is an anode, and the other is a cathode.

[0189] Optional, reference Figure 2 As shown, the second side portion 122 corresponding to the same light-emitting unit 19 is parallel to the fifth side portion 1421 on the side of the first connecting portion 142 corresponding to the light-emitting unit 19 away from the main body 141. That is, the second side portion 122 is parallel to the fifth side portion 1421. In this way, even if the relative orientation of the main body 141 and the first connecting portion 142 is adjusted, it is possible to ensure that the outer edge of the first conductive portion 12 and the outer edge of the first connecting portion 142 remain parallel, which is conducive to having a good hemming amount in all directions of the first via 13a within the limited area of ​​the first conductive portion 12.

[0190] In one embodiment, if Fig. 22As shown, at least one light emitting unit 19 includes a first light emitting unit 19a and a second light emitting unit 19b. The first side portion 121, the second side portion 122, the first connecting portion 142, and the main body portion 141 corresponding to the first light emitting unit 19a are arranged along a third direction A. The first side portion 121, the second side portion 122, the first connecting portion 142, and the main body portion 141 corresponding to the second light emitting unit 19b are arranged along a fourth direction B; the third direction A and the fourth direction B intersect, for example, are perpendicular.

[0191] It should be noted that the colors of the light emitted by the first light emitting unit 19a and the second light emitting unit 19b may be the same or different. In the first light emitting unit 19a, the first side portion 121, the second side portion 122, the first connecting portion 142, and the main body portion 141 are arranged along the first direction X1 (same direction X2). Fig. 22 The third side portion 123 and the fourth side portion 124 are arranged along the second direction Y1 (the same Fig. 22 In the second light emitting unit 19b, the first side portion 121, the second side portion 122, the first connecting portion 142, and the main body portion 141 are arranged along the first direction X2 (the same as Fig. 22 The third side 123 and the fourth side 124 are arranged along the second direction Y2 (the same Fig. 22 The third direction in the arrangement is A).

[0192] For example, the orthographic projections of the first via hole and the second via hole corresponding to one of the first light-emitting unit 19a and the second light-emitting unit 19b on the substrate overlap, and the orthographic projections of the first via hole and the second via hole corresponding to the other light-emitting unit 19a on the substrate do not overlap. For example, the orthographic projections of the first via hole and the second via hole corresponding to the first light-emitting unit 19a on the substrate do not overlap, or the minimum distance between the orthographic projection of the first via hole 13a corresponding to the first light-emitting unit 19a on the substrate 11 and the orthographic projection of the second via hole 15a on the substrate 11 is less than or equal to 3 micrometers, for example, less than or equal to 1 micrometer, for example, 0.5 micrometers, 1 micrometer, 2 micrometers, 3 micrometers; the orthographic projections of the first via hole and the second via hole corresponding to the second light-emitting unit 19b on the substrate overlap, for example, the minimum distance between the orthographic projection of the first via hole 13a corresponding to the second light-emitting unit 19b on the substrate 11 and the orthographic projection of the second via hole 15a on the substrate 11 is greater than 3 micrometers, for example, greater than 5 micrometers, for example, 3 micrometers, 4 micrometers, 5 micrometers, 6 micrometers. For example, the minimum distance a between the first sub-side 13a1 corresponding to the second light-emitting unit 19b and the first side 121 is greater than, less than, or equal to the minimum distance a between the first sub-side 13a1 and the first side 121 of the first light-emitting unit 19a. For example, the minimum distance b between the second sub-side 13a2 corresponding to the second light-emitting unit 19b and the second side 122 is greater than, less than, or equal to the minimum distance b between the second sub-side 13a2 and the second side 122 of the first light-emitting unit 19a. For example, the minimum distance c between the third sub-side 13a3 corresponding to the second light-emitting unit 19b and the third side 123 is greater than, less than, or equal to the minimum distance c between the third sub-side 13a3 and the third side 123 of the first light-emitting unit 19a. For example, the minimum distance d between the fourth sub-side 13a4 corresponding to the second light-emitting unit 19b and the fourth side 124 is greater than, less than, or equal to the minimum distance d between the fourth sub-side 13a4 and the fourth side 124 of the first light-emitting unit 19a.

[0193] The above settings allow designers to carry out typesetting design according to actual conditions, which is conducive to improving space utilization and carrying out high PPI design.

[0194] In one of the embodiments, the aperture of the orthographic projection of the outer edge of the first via 13a on the side close to the substrate 11 on the substrate 11 is greater than or equal to 1.5 microns and less than or equal to 5 microns. Exemplarily, the aperture may be 1.5μm, 2μm, 3μm, 4.2μm or 5μm, etc. The above arrangement allows the first connecting portion 142 to have a sufficient contact area with the first conductive portion 12, which is beneficial to reducing the connection resistance. It should be noted that when the shape of the first via 13a is irregular or polygonal, the aperture refers to the minimum inner diameter of the orthographic projection of the first via 13a.

[0195] Optionally, the aperture of the orthographic projection of the outer edge of the first via hole 13a on the side close to the substrate 11 on the substrate 11 is greater than or equal to 2.5 microns and less than or equal to 3 microns. For example, the aperture may be 2.5 μm, 2.6 μm, 2.7 μm, 2.8 μm, 2.9 μm or 3 μm. The above arrangement, on the one hand, can make the first connecting portion 142 and the first conductive portion 12 have sufficient contact area, and on the other hand, is conducive to achieving a high PPI design.

[0196] Optionally, the first conductive portion 12 includes a plurality of metal layers stacked in sequence along the thickness direction Z of the substrate 11 . For example, the first conductive portion 12 includes a titanium layer, an aluminum layer, and a titanium layer stacked in sequence along the thickness direction Z of the substrate 11 .

[0197] Optional, see Figure 4B As shown, the display panel 10 further includes a power signal line 110 disposed on the substrate 11. The power signal line 110 and the first conductive portion 12 are disposed in the same layer and material and are insulated from each other. Further, the power signal line 110 is an ELVDD signal line. In this way, the power signal line 110 and the first conductive portion 12 can be manufactured simultaneously in the same process, which is conducive to reducing the manufacturing cost.

[0198] Optional, see Figure 4B As shown, the display panel 10 further includes a data signal line 111 disposed on the substrate 11. The data signal line 111 and the first conductive part 12 are disposed in the same layer and material and are insulated from each other. In this way, the data signal line 111 and the first conductive part 12 can be manufactured simultaneously in the same process, which is beneficial to reducing the manufacturing cost.

[0199] Optional, see Figure 4B As shown, the display panel 10 further includes a fan-out wiring 112 disposed on the substrate 11, and at least a portion of the fan-out wiring 112 is disposed in the same layer and material as the first conductive portion 12, and is insulated from each other. For example, the fan-out wiring 112 is connected to the corresponding data signal line 111, and at least a portion of the fan-out wiring 112 is located in the display area of ​​the display panel 10 to reduce the frame of the display panel.

[0200] In this way, the fan-out traces 112 and the first conductive portion 12 can be manufactured simultaneously in the same process, which is beneficial to reducing the manufacturing cost.

[0201] Optional, see Fig. 8A As shown, the display panel 10 further includes a reference potential line 113 disposed on the substrate 11. The reference potential line 113 and the first conductive part 12 are disposed in the same layer and material and are insulated from each other. In this way, the reference potential line 113 and the first conductive part 12 can be manufactured simultaneously in the same process, which is beneficial to reducing the manufacturing cost.

[0202] In one embodiment, the orthographic projection of the second sub-side 13a2 on the substrate 11 overlaps with the orthographic projection of the first conductive portion 12 on the substrate 11, and the difference between the minimum distance a between the first sub-side 13a1 and the first side 121 and the minimum distance b between the second sub-side 13a2 and the second side 122 is greater than or equal to 0 micrometers and less than or equal to 5 micrometers. Exemplarily, the difference may be 0μm, 1μm, 2μm, 3μm, 4μm, 5μm, etc.

[0203] Optionally, a difference between a minimum distance a between the first sub-side 13a1 and the first side portion 121 and a minimum distance b between the second sub-side 13a2 and the second side portion 122 is greater than or equal to 0.5 micrometers and less than or equal to 5 micrometers.

[0204] Optionally, the minimum distance b between the second sub-side 13a2 and the second side portion 122 is greater than or equal to 0. In this way, the risk of the second conductive portion 14 being easily broken at the second sub-side 13a2 can be improved, thereby ensuring the signal transmission performance of the second conductive portion 14 and reducing the possibility of display abnormalities in the display panel 10.

[0205] In a second aspect, the embodiment of the present application provides a display panel 10, including a substrate 11, a first conductive portion 12, a first insulating layer 13, and a second conductive portion 14. The first conductive portion 12 is disposed on the substrate 11, and the surface of the first conductive portion 12 away from the substrate 11 includes a first connection area 12a, and the first conductive portion 12 includes a first side portion 121, a second side portion 122, and a third side portion 123 arranged in sequence along the circumference of the first conductive portion 12. The first insulating layer 13 is disposed on the substrate 11 and covers a part of the side of the first conductive portion 12 away from the substrate 11, and the first insulating layer 13 is provided with a first via 13a, and the first via 13a exposes the first connection area 12a; the outer edge of the first via 13a on the side close to the substrate 11 includes a first sub-side 13a1 close to the first side portion 121, a second sub-side 13a2 close to the second side portion 122, and a third sub-side 13a3 close to the third side portion 123; the orthographic projection of the first sub-side 13a1 on the substrate 11 is located within the orthographic projection of the first conductive portion 12 on the substrate 11. The second conductive portion 14 includes a main body portion 141 and a first connecting portion 142 connected to the main body portion 141. The main body portion 141 is arranged on a side of the insulating layer away from the substrate 11. At least a portion of the first connecting portion 142 is located in the first via hole 13a and connected to the first connecting area 12a. The orthographic projection of the first sub-side 13a1 on the substrate 11 is located between the orthographic projection of the second sub-side 13a2 on the substrate 11 and the orthographic projection of the main body portion 141 on the substrate 11.

[0206] Among them, the orthographic projection of the third sub-side 13a3 on the substrate 11 is located outside the orthographic projection of the first conductive portion 12 on the substrate 11; or, the orthographic projection of the third sub-side 13a3 on the substrate 11 overlaps with the orthographic projection of the first conductive portion 12 on the substrate 11, and the minimum distance between the first sub-side 13a1 and the first side portion 121 is greater than or equal to the minimum distance between the third sub-side 13a3 and the third side portion 123.

[0207] Figures 10 to 21 Applicable to Figure 4A , Figure 4B , Figure 6 , Figure 7 , Fig. 8A , Figure 8B , Fig. 22 wait.

[0208] In the display panel 10 provided in the embodiment of the present application, the orthographic projection of the first sub-side 13a1 on the substrate 11 is located between the orthographic projection of the second sub-side 13a2 on the substrate 11 and the orthographic projection of the main body 141 on the substrate 11, which is equivalent to: in the direction parallel to the surface of the substrate 11, the first sub-side 13a1 is located between the second sub-side 13a2 and the main body 141, that is, the first sub-side 13a1 is the side of the first via 13a on the signal transmission direction side, and the second sub-side 13a2 and the third sub-side 13a3 are the side of the first via 13a on the non-signal transmission direction side. The orthographic projection of the first sub-side 13a1 on the substrate 11 is located within the orthographic projection of the first conductive part 12 on the substrate 11, which is equivalent to: the first conductive part 12 has an edge around the first sub-side 13a1. When the orthographic projection of the third sub-side 13a3 on the substrate 11 is located outside the orthographic projection of the first conductive part 12 on the substrate 11, the first conductive part 12 does not have an edge around the third sub-side 13a3. When the orthographic projection of the third sub-side 13a3 on the substrate 11 overlaps with the orthographic projection of the first conductive portion 12 on the substrate 11, the minimum distance between the first sub-side 13a1 and the first side portion 121 is greater than the minimum distance between the third sub-side 13a3 and the second side portion 122, that is, the edge value of the first sub-side 13a1 is greater than the edge value of the third sub-side 13a3. In this way, it is equivalent to making the edge value of the signal transmission direction side greater than the edge value of the non-signal transmission direction side. In this way, the risk of the second conductive portion 14 being easily broken at the first sub-side 13a1 can be improved, thereby ensuring the signal transmission performance of the second conductive portion 14 and reducing the risk of display abnormality of the display panel 10. It can be understood that the specific structure of the display panel 10 in the second aspect can be the same as the specific structure of the display panel 10 in the first aspect, and the embodiments of the present application will not be repeated here. This embodiment can be combined with some or all of the features of the above embodiments, and will not be repeated here.

[0209] In a third aspect, an embodiment of the present application provides a display device, comprising a display panel as in the first aspect or the second aspect.

[0210] The display device can be a mobile phone, tablet computer, wearable device, laptop computer, mobile phone, wireless device, personal digital assistant (PDA), handheld or portable computer, GPS receiver / navigator, camera, MP4 video player, camcorder, game console, watch, clock, calculator, TV monitor, flat panel display, computer monitor, car display (e.g., odometer display, etc.), navigator, cockpit controller and / or display, display of camera view (e.g., display of rear view camera in vehicle), electronic photo, electronic billboard or sign, projector, etc.

[0211] In the case of using “including”, “having”, and “comprising” described herein, another component may be added unless a clear limiting term such as “only”, “consisting of”, etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as being one in number.

[0212] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0213] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A display panel, characterized in that: include: substrate; A first conductive portion, disposed on the substrate, wherein a surface of the first conductive portion away from the substrate includes a first connection area, and the first conductive portion includes a first side portion and a second side portion; A first insulating layer is provided on the substrate and covers a part of the first conductive portion away from the substrate, the first insulating layer is provided with a first via hole, and the first via hole exposes the first connection area; an outer edge of the first via hole close to the substrate includes a first sub-side close to the first side and a second sub-side close to the second side; an orthographic projection of the first sub-side on the substrate is located within an orthographic projection of the first conductive portion on the substrate; A second conductive portion includes a main body portion and a first connecting portion connected to the main body portion, wherein the main body portion is disposed on a side of the first insulating layer away from the substrate, at least a portion of the first connecting portion is located in the first via hole and connected to the first connecting area; an orthographic projection of the first sub-side on the substrate is located between an orthographic projection of the second sub-side on the substrate and an orthographic projection of the main body portion on the substrate; Wherein, the orthographic projection of the second sub-edge on the substrate is outside the orthographic projection of the first conductive portion on the substrate; Or, the orthographic projection of the second sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the first sub-side and the first side portion is greater than the minimum distance between the second sub-side and the second side portion.

2. The display panel according to claim 1, characterized in that: The first conductive portion further includes a third side portion, and the first side portion, the third side portion and the second side portion are arranged in sequence along the circumference of the first conductive portion; The outer edge of the first via hole on the side close to the substrate further includes a third sub-side close to the third side portion, and the orthographic projection of the third sub-side on the substrate is located outside the orthographic projection of the first conductive portion on the substrate; Alternatively, the orthographic projection of the third sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the first sub-side and the first side is greater than or equal to the minimum distance between the third sub-side and the third side.

3. The display panel according to claim 2, characterized in that: The orthographic projection of the third sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the second sub-side and the second side portion is equal to the minimum distance between the third sub-side and the third side portion.

4. The display panel according to claim 2, characterized in that: The first conductive portion further includes a fourth side portion, and the first side portion, the third side portion, the second side portion and the fourth side portion are arranged in sequence along the circumference of the first conductive portion; The outer edge of the first via hole on a side close to the substrate also includes a fourth sub-side close to the fourth side, and the orthographic projection of the fourth sub-side on the substrate is located outside the orthographic projection of the first conductive part on the substrate; or, the orthographic projection of the fourth sub-side on the substrate overlaps with the orthographic projection of the first conductive part on the substrate, and the minimum distance between the first sub-side and the first side is greater than or equal to the minimum distance between the fourth sub-side and the fourth side.

5. The display panel according to claim 4, characterized in that: The orthographic projection of the fourth sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the second sub-side and the second side portion is equal to the minimum distance between the fourth sub-side and the fourth side portion.

6. The display panel according to any one of claims 2 to 5, characterized in that: The display panel further includes: A second insulating layer is provided between the film layer where the first conductive part is located and the substrate; the second insulating layer is provided with a second via hole; the orthographic projection of the first via hole on the substrate is located outside the orthographic projection of the second via hole on the substrate; a third conductive portion, located between the substrate and the second insulating layer, wherein a surface of the third conductive portion away from the substrate comprises a second connection region, and the second via hole exposes the second connection region; a second connection portion connected to the first conductive portion, the second connection portion and the first conductive portion being disposed in the same layer, at least a portion of the second connection portion being located in the second via hole and connected to the second connection area; Optionally, the second side portion, the third side portion or the fourth side portion is connected to the second connecting portion; Optionally, the fourth side portion is connected to the second connecting portion; the orthographic projection of the main body portion on the substrate, the orthographic projection of the first side portion on the substrate and the orthographic projection of the second side portion on the substrate are arranged in sequence along a first direction, the orthographic projection of the third side portion on the substrate, the orthographic projection of the fourth side portion on the substrate and the orthographic projection of the second connecting portion on the substrate are arranged in sequence along a second direction, and the first direction and the second direction intersect; or, The second side portion is connected to the second connecting portion; the orthographic projection of the main body portion on the substrate, the orthographic projection of the first side portion on the substrate, the orthographic projection of the second side portion on the substrate, and the orthographic projection of the second connecting portion on the substrate are arranged in sequence along a first direction, the third side portion and the fourth side portion are arranged along a second direction, and the first direction and the second direction intersect.

7. The display panel according to claim 1, characterized in that: The first conductive portion further includes a third side portion, and the first side portion, the third side portion and the second side portion are arranged in sequence along the circumference of the first conductive portion; The outer edge of the first via hole on the side close to the substrate further includes a third sub-side close to the third side portion, and the orthographic projection of the third sub-side on the substrate is located outside the orthographic projection of the first conductive portion on the substrate; Or, the orthographic projection of the third sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the second sub-side and the second side is less than or equal to the minimum distance between the third sub-side and the third side.

8. The display panel according to claim 7, characterized in that: The orthographic projection of the third sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the first sub-side and the first side portion is equal to the minimum distance between the third sub-side and the third side portion.

9. The display panel according to claim 7, characterized in that: The first conductive portion further includes a fourth side portion, and the first side portion, the third side portion, the second side portion and the fourth side portion are arranged in sequence along the circumference of the first conductive portion; The outer edge of the first via hole on a side close to the substrate also includes a fourth sub-side close to the fourth side, and the orthographic projection of the fourth sub-side on the substrate is located outside the orthographic projection of the first conductive part on the substrate; or, the orthographic projection of the fourth sub-side on the substrate overlaps with the orthographic projection of the first conductive part on the substrate, and the minimum distance between the second sub-side and the second side is less than or equal to the minimum distance between the fourth sub-side and the fourth side.

10. The display panel according to claim 9, characterized in that: The orthographic projection of the fourth sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the minimum distance between the first sub-side and the first side portion is equal to the minimum distance between the fourth sub-side and the fourth side portion.

11. The display panel according to any one of claims 7 to 10, characterized in that: The display panel further includes: A second insulating layer is provided between the film layer where the first conductive part is located and the substrate; the second insulating layer is provided with a second via hole; the orthographic projection of the first via hole on the substrate overlaps with the orthographic projection of the second via hole on the substrate; a third conductive portion, located between the substrate and the second insulating layer, wherein a surface of the third conductive portion away from the substrate includes a second connection area, and the second via hole exposes the second connection area; at least a portion of the first conductive portion is located in the second via hole and connected to the second connection area; Optionally, the display panel further includes: a second connecting portion connected to the first conductive portion, the second connecting portion and the first conductive portion being arranged in the same layer, at least a portion of the second connecting portion and at least a portion of the first conductive portion being located in the second via hole and connected to the second connecting area; Optionally, the second side portion, the third side portion or the fourth side portion is connected to the second connecting portion; and / or, the orthographic projection of the second sub-side, the third sub-side or the fourth sub-side on the substrate overlaps with the orthographic projection of the second via hole on the substrate; Optionally, the fourth side portion is connected to the second connecting portion; the orthographic projection of the main body portion on the substrate, the orthographic projection of the first side portion on the substrate and the orthographic projection of the second side portion on the substrate are arranged in sequence along a first direction, the orthographic projection of the third side portion on the substrate, the orthographic projection of the fourth side portion on the substrate and the orthographic projection of the second connecting portion on the substrate are arranged in sequence along a second direction, and the first direction and the second direction intersect; or, The second side portion is connected to the second connecting portion; the orthographic projection of the main body portion on the substrate, the orthographic projection of the first side portion on the substrate, the orthographic projection of the second side portion on the substrate, and the orthographic projection of the second connecting portion on the substrate are arranged in sequence along a first direction, the third side portion and the fourth side portion are arranged along a second direction, and the first direction and the second direction intersect.

12. The display panel according to claim 4 or 9, characterized in that: The first side portion and the second side portion are arranged along a first direction; Optionally, the third side portion and the fourth side portion are arranged along a second direction, and the first direction intersects with the second direction; Optionally, the first side portion and the second side portion extend along the second direction; Optionally, the third side portion and the fourth side portion extend along the first direction; Optionally, the outer edge of the first via hole on a side close to the substrate is circular, elliptical, rectangular, rounded rectangular, polygonal with side lengths greater than or equal to 5, or rounded polygonal with side lengths greater than or equal to 5; Optionally, the first conductive portion is a circle, an ellipse, a rectangle, a rounded rectangle, a polygon with a side length greater than or equal to 5, or a rounded polygon with a side length greater than or equal to 5; Optionally, the first conductive portion is a rounded rectangular shape; the outer edge of the first via hole on a side close to the substrate is a circle; or, the first conductive portion is a rounded square shape; the outer edge of the first via hole on a side close to the substrate is an ellipse; Optionally, the length of the first side of the first conductive portion of the rounded rectangle is smaller than the length of the third side; or the major axis of the ellipse corresponding to the outer edge of the first via hole on a side close to the substrate is parallel to the extension direction of the first side.

13. The display panel according to claim 4 or 9, characterized in that: The first side portion and the second side portion are arranged along a first direction, the third side portion and the fourth side portion are arranged along a second direction, and the first direction intersects with the second direction; Optionally, the orthographic projection outer contour of the first conductive portion on the substrate is located at the periphery of the orthographic projection outer contour of the outer edge of the first via hole on a side close to the substrate on the substrate; Optionally, the minimum distance between the second sub-edge and the second edge, the minimum distance between the third sub-edge and the third edge, and the minimum distance between the fourth sub-edge and the fourth edge are all equal; Optionally, the maximum dimension of the first via along the first direction is equal to the maximum dimension of the first via along the second direction; the minimum distance between the first side and the second side is greater than the minimum distance between the third side and the fourth side; Alternatively, the maximum dimension of the first via along the first direction is smaller than the maximum dimension of the first via along the second direction; and the minimum distance between the first side and the second side is equal to the minimum distance between the third side and the fourth side.

14. The display panel according to claim 1, characterized in that: The display panel further comprises a pixel defining layer, wherein the pixel defining layer is provided with a pixel opening, the pixel defining layer is located on a side of the film layer where the second conductive portion is located away from the substrate, and the pixel opening exposes at least a portion of the main body portion; Optionally, at least part of the main body portion serves as a pixel electrode; Optionally, the display panel further includes a light-emitting functional layer, at least a portion of which is located in the pixel opening; Optionally, the display panel further includes a second electrode, and the second electrode is located on a side of the light-emitting functional layer away from the substrate.

15. The display panel according to claim 1, characterized in that: The display panel further comprises at least one light-emitting unit, wherein the light-emitting unit comprises a first electrode, a light-emitting functional layer, and a second electrode which are sequentially stacked in a direction away from the substrate, and the main body serves as the first electrode; Optionally, the second side corresponding to the same light-emitting unit is parallel to the fifth side of the first connecting portion corresponding to the light-emitting unit on a side away from the main body.

16. The display panel according to claim 15, characterized in that: The at least one light emitting unit comprises a first light emitting unit and a second light emitting unit; The first side portion, the second side portion, the first connecting portion, and the main body portion corresponding to the first light-emitting unit are arranged along a third direction; The first side portion, the second side portion, the first connecting portion, and the main body portion corresponding to the second light emitting unit are arranged along a fourth direction; and the third direction intersects with the fourth direction.

17. The display panel according to claim 1, characterized in that: The aperture of the orthographic projection of the outer edge of the first via hole on the side close to the substrate on the substrate is greater than or equal to 1.5 microns and less than or equal to 5 microns; Optionally, the aperture of the orthographic projection of the outer edge of the first via hole on the side close to the substrate on the substrate is greater than or equal to 2.5 microns and less than or equal to 3 microns; Optionally, the first conductive portion includes a titanium layer, an aluminum layer and a titanium layer stacked in sequence along the thickness direction of the substrate; Optionally, the first insulating layer comprises an organic material; Optionally, the display panel further comprises a power signal line disposed on the substrate, the power signal line and the first conductive part are disposed in the same layer and material, and are insulated from each other; Optionally, the display panel further comprises a data signal line disposed on the substrate, the data signal line and the first conductive part are disposed in the same layer and material, and are insulated from each other; Optionally, the display panel further comprises a fan-out wiring arranged on the substrate, at least a portion of the fan-out wiring is arranged in the same layer and material as the first conductive portion, and is insulated from each other; the fan-out wiring is connected to the corresponding data signal line; at least a portion of the fan-out wiring is located in the display area of ​​the display panel; Optionally, the display panel further includes a reference potential line disposed on the substrate, wherein the reference potential line and the first conductive portion are disposed in the same layer and material and are insulated from each other.

18. The display panel according to claim 1, characterized in that: The orthographic projection of the second sub-side on the substrate overlaps with the orthographic projection of the first conductive portion on the substrate, and the difference between the minimum distance between the first sub-side and the first side portion minus the minimum distance between the second sub-side and the second side portion is greater than or equal to 0 micrometers and less than or equal to 5 micrometers; Optionally, a difference between a minimum distance between the first sub-edge and the first edge minus a minimum distance between the second sub-edge and the second edge is greater than or equal to 0.5 micrometers and less than or equal to 5 micrometers; Optionally, a minimum distance between the second sub-edge and the second edge is greater than or equal to 0.

19. A display panel, characterized in that: include: substrate; A first conductive portion, disposed on the substrate, wherein a surface of the first conductive portion away from the substrate comprises a first connection region, and the first conductive portion comprises a first side portion, a second side portion and a third side portion sequentially arranged along a circumference of the first conductive portion; A first insulating layer is provided on the substrate and covers a part of the first conductive part away from the substrate, the first insulating layer is provided with a first via hole, and the first via hole exposes the first connection area; the outer edge of the first via hole close to the substrate includes a first sub-side close to the first side, a second sub-side close to the second side, and a third sub-side close to the third side; the orthographic projection of the first sub-side on the substrate is located within the orthographic projection of the first conductive part on the substrate; A second conductive portion includes a main body portion and a first connecting portion connected to the main body portion, wherein the main body portion is disposed on a side of the insulating layer away from the substrate, at least a portion of the first connecting portion is located in the first via hole and connected to the first connecting area; an orthographic projection of the first sub-side on the substrate is located between an orthographic projection of the second sub-side on the substrate and an orthographic projection of the main body portion on the substrate; Wherein, the orthographic projection of the third sub-edge on the substrate is located outside the orthographic projection of the first conductive portion on the substrate; Alternatively, an orthographic projection of the third sub-side on the substrate overlaps with an orthographic projection of the first conductive portion on the substrate, and a minimum distance between the first sub-side and the first side is greater than a minimum distance between the third sub-side and the third side.

20. A display device, characterized in that: Comprising a display panel as described in any one of claims 1-19.

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