Display panel and display device

Abstract

This application discloses a display panel and a display device. The display panel includes a substrate, a plurality of light-emitting devices, a first encapsulation layer, and a second encapsulation layer. The plurality of light-emitting devices are disposed on one side of the substrate. The first encapsulation layer is disposed on one side of the substrate and covers at least the periphery of the plurality of light-emitting devices. The second encapsulation layer is disposed on the side of the first encapsulation layer away from the substrate and covers the plurality of light-emitting devices. At least one of the first encapsulation layer and the second encapsulation layer is doped with first scattering particles. This application can improve the display effect.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel and a display device. Background Technology

[0002] In traditional display panels, the light-emitting devices are usually encapsulated to protect them. However, after encapsulation, there is a significant difference in refractive index between the surface of the encapsulation layer and the air interface. This causes total internal reflection of the light emitted in the forward direction from the light-emitting device, forming an optical waveguide. Consequently, the amount of light emitted in the forward direction decreases, affecting the display effect.

[0003] Therefore, it is necessary to propose a new technical solution to solve the above-mentioned technical problems. Summary of the Invention

[0004] The purpose of this application is to provide a display panel and a display device to improve the display effect.

[0005] To solve the above problems, the technical solution of this application is as follows:

[0006] In a first aspect, this application proposes a display panel, comprising:

[0007] substrate;

[0008] Multiple light-emitting devices are disposed on one side of the substrate;

[0009] A first encapsulation layer is disposed on one side of the substrate and covers at least the periphery of the plurality of light-emitting devices; and

[0010] The second encapsulation layer is disposed on the side of the first encapsulation layer away from the substrate and covers the plurality of light-emitting devices;

[0011] In this embodiment, at least one of the first encapsulation layer and the second encapsulation layer is doped with a first scattering particle, which is used to scatter light.

[0012] In one embodiment of this application, the first encapsulation layer is doped with first scattering particles.

[0013] In one embodiment of this application, the thickness of the first encapsulation layer is less than the thickness of the light-emitting device.

[0014] In one embodiment of this application, the second encapsulation layer includes:

[0015] Multiple first encapsulation portions are disposed between two adjacent light-emitting devices and located on the side of the first encapsulation layer away from the substrate. The first encapsulation portions are connected to the first encapsulation layer, and the side of the first encapsulation portion away from the substrate is flush with the side of the light-emitting device away from the substrate.

[0016] A second encapsulation portion is disposed on the side of the plurality of first encapsulation portions away from the substrate and is connected to the plurality of first encapsulation portions. The second encapsulation portion covers the side of the plurality of light-emitting devices away from the substrate.

[0017] In one embodiment of this application, the first encapsulation portion is doped with second scattering particles, which are used to scatter light. The number of second scattering particles per unit volume of the first encapsulation portion is less than or equal to the number of first scattering particles per unit volume of the first encapsulation layer.

[0018] In one embodiment of this application, the second encapsulation portion is doped with third scattering particles, which are used to scatter light. The number of third scattering particles per unit volume of the second encapsulation portion is less than or equal to the number of second scattering particles per unit volume of the first encapsulation portion.

[0019] In one embodiment of this application, the particle size of the third scattering particle is smaller than or equal to the particle size of the first scattering particle.

[0020] In one embodiment of this application, the thickness of the first encapsulation layer is equal to the thickness of the light-emitting device, the side of the light-emitting device away from the substrate is flush with the side of the first encapsulation layer away from the substrate, and the second encapsulation layer covers the first encapsulation layer and the side of the plurality of light-emitting devices away from the substrate.

[0021] In one embodiment of this application, the second encapsulation layer is doped with a fourth scattering particle, which is used to scatter light. The number of the fourth scattering particles per unit volume of the second encapsulation layer is less than or equal to the number of the first scattering particles per unit volume of the first encapsulation layer.

[0022] In one embodiment of this application, the first encapsulation layer and the second encapsulation layer are integrally formed, and both the first encapsulation layer and the second encapsulation layer are doped with the first scattering particles.

[0023] In one embodiment of this application, the thickness of the first encapsulation layer is greater than the thickness of the light-emitting device, the first encapsulation layer covers a plurality of the light-emitting devices, the second encapsulation layer is disposed on the side of the first encapsulation layer away from the light-emitting device, and the second encapsulation layer is doped with the first scattering particles.

[0024] In one embodiment of this application, the display panel further includes a light extraction structure, which is disposed on the side of the second encapsulation layer away from the substrate, and each light extraction structure corresponds to at least one light-emitting device.

[0025] In one embodiment of this application, the light-emitting device includes a red light-emitting device, a blue light-emitting device, and a green light-emitting device;

[0026] One light extraction structure corresponds to three light-emitting devices of different colors;

[0027] In a light extraction structure, the orthographic projections of the red light-emitting device, the green light-emitting device, and the blue light-emitting device on the substrate are all located within the range of the orthographic projection of the corresponding light extraction structure on the substrate.

[0028] The red light-emitting device is located between the blue light-emitting device and the green light-emitting device.

[0029] Secondly, this application proposes a display device including a display panel, the display panel including a substrate, a plurality of light-emitting devices, a first encapsulation layer and a second encapsulation layer, the plurality of light-emitting devices being disposed on one side of the substrate; the first encapsulation layer being disposed on one side of the substrate and covering at least the periphery of the plurality of light-emitting devices; the second encapsulation layer being disposed on the side of the first encapsulation layer away from the substrate and covering the plurality of light-emitting devices; at least one of the first encapsulation layer and the second encapsulation layer being doped with a first scattering particle.

[0030] In this application, by doping the encapsulation layer of the display panel with first scattering particles, the first scattering particles can scatter the total internal reflection light at the interface between the surface of the encapsulation layer and the air, change the emission direction of the light, thereby destroying the encapsulated total internal reflection light waveguide, improving the emission angle of the total internal reflection light, increasing the forward light emission efficiency, increasing the brightness, and thus improving the display effect. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of one embodiment of the display panel of this application;

[0032] Figure 2 This is a schematic diagram of another embodiment of the display panel of this application;

[0033] Figure 3 This is a schematic diagram of a first embodiment of the display panel of this application;

[0034] Figure 4 This is a partial light-emitting schematic diagram of an embodiment of a conventional display panel;

[0035] Figure 5 This is a partial light-emitting schematic diagram of the first embodiment of the display panel of this application;

[0036] Figure 6This is a graph showing the relationship between normalized brightness and viewing angle for control group 1 in this application;

[0037] Figure 7 This is a graph showing the relationship between normalized brightness and viewing angle for experimental group 1 in this application;

[0038] Figure 8 This is a flowchart illustrating a manufacturing method of the first embodiment of the display panel of this application;

[0039] Figures 9A-9D This is a schematic diagram of steps S11-S14 in a flowchart of a manufacturing method of the first embodiment of the display panel of this application;

[0040] Figure 10 This is a schematic diagram of a second embodiment of the display panel of this application;

[0041] Figure 11 This is a schematic diagram of a third embodiment of the display panel of this application;

[0042] Figure 12 This is a schematic diagram of a fourth embodiment of the display panel of this application;

[0043] Figure 13 This is another schematic diagram of a fourth embodiment of the display panel of this application;

[0044] Figure 14 This is a schematic diagram of a fifth embodiment of the display panel of this application;

[0045] Figure 15 This is a partial light-emitting schematic diagram of the fifth embodiment of the display panel of this application;

[0046] Figure 16 This is a graph showing the relationship between normalized brightness and viewing angle for experimental group 2 in this application;

[0047] Figure 17 This is a flowchart of a manufacturing method for a fifth embodiment of the display panel of this application;

[0048] Figures 18A-18C This is a schematic diagram of steps S51-S53 in a flowchart of a manufacturing method of a fifth embodiment of the display panel of this application;

[0049] Figure 19 This is a schematic diagram of a sixth embodiment of the display panel of this application;

[0050] Figure 20 This is a partial light-emitting schematic diagram of another embodiment of a conventional display panel;

[0051] Figure 21 This is a partial light-emitting schematic diagram of the sixth embodiment of the display panel of this application;

[0052] Figure 22 This is a graph showing the relationship between normalized brightness and viewing angle for control group 2 in this application;

[0053] Figure 23 This is a graph showing the relationship between normalized brightness and viewing angle for experimental group 3 in this application;

[0054] Figure 24 This is a flowchart of a manufacturing method for a sixth embodiment of the display panel of this application;

[0055] Figures 25A-25D This is a schematic diagram of steps S61-S64 in a flowchart of a manufacturing method of the sixth embodiment of the display panel of this application. Detailed Implementation

[0056] The terms used in this specification and claims have the meanings that are commonly understood by one of ordinary skill in the art to which this application pertains. The terms used in this specification and claims are for the purpose of facilitating the description and understanding of this application only, and are not intended to limit this application to the narrow interpretation of the specific terms used in the specification and claims.

[0057] This application discloses a display device, which can be a mobile phone, tablet computer, e-reader, electronic display screen, laptop computer, mobile phone, augmented reality (AR) / virtual reality (VR) device, media player, wearable device, digital camera, car navigation system, etc. The display device includes a display panel 100.

[0058] This application discloses a display panel 100, which can be a micro light-emitting diode (Micro LED) display panel 100 or a sub-millimeter light-emitting diode (Mini LED) display panel 100. The embodiments of this application are described using a micro light-emitting diode display panel 100 as an example.

[0059] Please see Figure 1In this application, the display panel 100 includes a substrate 10, a plurality of light-emitting devices 20, a first encapsulation layer 30, and a second encapsulation layer 40. The plurality of light-emitting devices 20 are disposed on one side of the substrate 10. The first encapsulation layer 30 is disposed on one side of the substrate 10 and at least covers the periphery of the plurality of light-emitting devices 20. The second encapsulation layer 40 is disposed on the side of the first encapsulation layer 30 away from the substrate 10 and covers the plurality of light-emitting devices 20. At least one of the first encapsulation layer 30 and the second encapsulation layer 40 is doped with a first scattering particle P1, which is used to scatter light.

[0060] In this application, by doping the encapsulation layer of the display panel 100 with a first scattering particle P1, the first scattering particle P1 can scatter the total internal reflection light at the interface between the surface of the encapsulation layer and the air, change the emission direction of the light, thereby destroying the encapsulated total internal reflection light waveguide, improving the emission angle of the total internal reflection light, improving the forward light emission efficiency, and increasing the brightness, thereby improving the display effect.

[0061] Optionally, the substrate 10 includes a substrate and a driving circuit layer disposed on one side of the substrate.

[0062] Optionally, the substrate is a rigid substrate, and the substrate material includes glass.

[0063] Optionally, the substrate is a flexible substrate, and the substrate material includes polyimide.

[0064] Optionally, the driving circuit layer includes multiple thin-film transistors.

[0065] Optionally, multiple light-emitting devices 20 are disposed on the side of the driving circuit layer away from the substrate, and one light-emitting device 20 is electrically connected to at least one thin-film transistor.

[0066] Optionally, the display panel 100 further includes a light extraction structure 50. The light extraction structure 50 is disposed on the side of the second encapsulation layer 40 away from the substrate 10. The display panel 100 of this application adopts a top-emitting mode. In order to extract the light emitted by the light-emitting device 20 to the maximum extent and improve the light extraction efficiency of the display panel 100, the light extraction structure 50 is provided on one side of the second encapsulation layer 40, thereby improving the light extraction efficiency of the display panel 100 and improving the display effect.

[0067] Optionally, the light extraction structure 50 can be a convex lens, wherein the convex surface of the convex lens is disposed away from the substrate 10. Since this application scatters the total internal reflection light at the interface between the encapsulation layer and the air through the first scattering particle P1, the scattered light has a wide emission angle. Because the light extraction structure 50 is a convex lens with its convex surface disposed away from the substrate 10, the scattered light can be converged, reducing the emission from a wide viewing angle and increasing the brightness of the front-facing light, thereby improving the display effect.

[0068] Optional, please refer to Figure 1 Each light extraction structure 50 corresponds to at least one light-emitting device 20.

[0069] In one embodiment, one light extraction structure 50 corresponds to one light-emitting device 20. In this case, each light extraction structure 50 can refocus the light scattered by each light-emitting device 20, thereby improving the overall light output of each light-emitting device 20 and improving the overall light output efficiency of the display panel 100. However, the design of one light extraction structure 50 corresponding to one light-emitting device 20 requires high process precision. This is because the positions of the light extraction structure 50 and the corresponding light-emitting device 20 may shift due to process errors during the manufacturing process of the display panel 100.

[0070] Optionally, the orthographic projection of a light-emitting device 20 onto the substrate 10 is located within the range of the orthographic projection of a light extraction structure 50 onto the substrate 10.

[0071] In another embodiment, one light extraction structure 50 corresponds to two light-emitting devices 20. Compared to a design where one light extraction structure 50 corresponds to one light-emitting device 20, this embodiment has relatively lower requirements for process precision.

[0072] In yet another embodiment, please refer to Figure 2 One light extraction structure 50 corresponds to three light-emitting devices 20. Compared with the previous two embodiments, this embodiment has relatively lower requirements for process precision.

[0073] Optionally, the light-emitting device 20 includes a red light-emitting device 20R, a blue light-emitting device 20B, and a green light-emitting device 20G. Due to the influence of the light-emitting material, in the micro light-emitting diode, the luminous efficiency of the red light-emitting device 20R is less than that of the blue light-emitting device 20B, and the luminous efficiency of the red light-emitting device 20R is less than that of the green light-emitting device 20G.

[0074] Optional, please refer to Figure 2 One light extraction structure 50 corresponds to three light-emitting devices 20 of different colors. Among the three light-emitting devices 20 of different colors corresponding to one light extraction structure 50, the orthographic projections of the red light-emitting device 20R, the green light-emitting device 20G, and the blue light-emitting device 20B onto the substrate 10 are all located within the range of the orthographic projection of the corresponding light extraction structure 50 onto the substrate 10. Specifically, the red light-emitting device 20R is located between the blue light-emitting device 20B and the green light-emitting device 20G.

[0075] Since the red light-emitting device 20R is located between the blue light-emitting device 20B and the green light-emitting device 20G, more lateral light emission or frontal wide-viewing-angle light emission from the red light-emitting device 20R can be converged by the light extraction structure 50, thereby further improving the light emission efficiency of the red light-emitting device 20R and thus improving the display effect of the display panel 100.

[0076] Please see Figure 3 In the first embodiment of this application:

[0077] Optionally, the first encapsulation layer 30 is doped with a first scattering particle P1.

[0078] Please see Figure 4 A conventional display panel 100a includes a substrate 10a, a plurality of light-emitting devices 20a disposed on one side of the substrate 10a, and an encapsulation layer 30a covering the light-emitting devices 20a. However, there is a large difference in refractive index between the encapsulation layer 30a and the air interface of the conventional display panel 100a. Some of the light emitted from the light-emitting devices 20a will undergo total internal reflection when it reaches the encapsulation layer 30a and the air interface, forming an optical waveguide, which leads to a decrease in the amount of light emitted in the forward direction.

[0079] Please see Figure 5 In the first embodiment of this application, the first encapsulation layer 30 covers the periphery of a plurality of light-emitting devices 20. After the light emitted by the light-emitting device 20 undergoes total internal reflection at the interface between the second encapsulation layer 40 and the air, part of the total internally reflected light enters the first encapsulation layer 30. The first scattering particle P1 in the first encapsulation layer 30 scatters the total internally reflected light, changes the light output direction of the total internally reflected light, thereby destroying the encapsulated total internally reflected light waveguide, improving the light output angle of the total internally reflected light, increasing forward light output, and improving the forward light output efficiency.

[0080] To further investigate the effect of the first scattering particle P1 on the forward light extraction efficiency, Figure 4 The conventional display panel 100a shown is used as control group 1, and... Figure 5 The display panel 100 of the first embodiment of this application shown is used as experimental group 1. The difference between experimental group 1 and control group 1 is that the conventional display panel 100a of control group 1 includes multiple light-emitting devices 20a disposed on one side of substrate 10a and an encapsulation layer 30a covering the light-emitting devices 20a. The display panel 100 of experimental group 1 includes a first encapsulation layer 30 and a second encapsulation layer 40 stacked on one side of substrate 10, wherein the first encapsulation layer 30 is doped with first scattering particles P1. The same power voltage is input to experimental group 1 and control group 1, and the emitted light brightness at each viewing angle is normalized to obtain... Figure 6 The graph showing the relationship between normalized brightness and viewing angle for control group 1 is shown below. Figure 7 The graph shown represents the relationship between normalized brightness and viewing angle for experimental group 1.

[0081] Please see Figure 6 and Figure 7 A comparison of the relationship between normalized brightness and viewing angle between control group 1 and experimental group 1 shows that after adding the first scattering particle P1 to the first encapsulation layer 30, when the input power is constant, forward light emission can be improved and wide-viewing-angle light emission can be reduced, thereby improving the forward light emission efficiency.

[0082] Optionally, the first encapsulation layer 30 includes a first host material and a first scattering particle P1 doped in the first host material.

[0083] Optionally, the first substrate material includes a transparent organic material. The transparent organic material can be an organic transparent photoresist, which can be optically clear adhesive (OCA). The transparent organic material can also be a transparent resin. Alternatively, the transparent organic material can be acrylic glass, which can be made of acrylic.

[0084] Optionally, the material of the first scattering particle P1 includes a non-metallic oxide. The non-metallic oxide includes at least one of titanium oxide, aluminum oxide, zinc oxide, silicon oxide, magnesium oxide, and zirconium oxide.

[0085] Optionally, the particle size of the first scattering particle P1 is in the range of 50 nanometers to 500 nanometers. The particle size of the first scattering particle P1 can be any one of the following values: 50 nm, 60 nm, 70 nm, 80 nm, 90 nm, 100 nm, 110 nm, 120 nm, 130 nm, 140 nm, 150 nm, 160 nm, 170 nm, 180 nm, 190 nm, 200 nm, 210 nm, 220 nm, 230 nm, 240 nm, 250 nm, 260 nm, 270 nm, 280 nm, 290 nm, 300 nm, 310 nm, 320 nm, 330 nm, 340 nm, 350 nm, 360 nm, 370 nm, 380 nm, 390 nm, 400 nm, 410 nm, 420 nm, 430 nm, 440 nm, 450 nm, 460 nm, 470 nm, 480 nm, 490 nm, or 500 nm.

[0086] Optionally, the thickness of the first encapsulation layer 30 is less than the thickness of the light-emitting device 20.

[0087] Optionally, the first scattering particle P1 is used to reflect light.

[0088] In this embodiment, the first scattering particle P1 not only scatters light but also reflects it. Since the thickness of the first encapsulation layer 30 is less than the thickness of the light-emitting device 20, the light emitted by the light-emitting device 20 towards the substrate 10 can be reflected without affecting the forward light emission of the light-emitting device 20, so that the reflected light can achieve forward light emission, thereby increasing the amount of forward emitted light and improving the display effect.

[0089] Optionally, referring to the first embodiment of this application, please refer to... Figure 8 This application also proposes a method for manufacturing a first embodiment of the display panel 100, comprising the following steps:

[0090] Please see Figure 9A Step S11: Provide a substrate 10.

[0091] Please see Figure 9B Step S12: Transfer the plurality of light-emitting devices 20 to one side of the substrate 10 and bond the light-emitting devices 20 to the substrate 10.

[0092] Please see Figure 9C Step S13: A first encapsulation layer 30 is formed on one side of the substrate 10 by spin coating or inkjet printing. The thickness of the first encapsulation layer 30 is less than the thickness of the light-emitting device 20. The first encapsulation layer 30 covers the periphery of multiple light-emitting devices 20. The first encapsulation layer 30 is doped with first scattering particles P1.

[0093] Please see Figure 9D Step S14: A second encapsulation layer 40 is formed on one side of the substrate 10 by spin coating or inkjet printing. The second encapsulation layer 40 is disposed on the side of the first encapsulation layer 30 away from the substrate 10, and the second encapsulation layer 40 covers a plurality of light-emitting devices 20.

[0094] Please see Figure 10 In the second embodiment of this application:

[0095] To avoid redundancy, the second embodiment of this application will describe the parts that differ from the first embodiment of this application.

[0096] The second embodiment of this application differs from the first embodiment of this application in that:

[0097] Optionally, the second encapsulation layer 40 includes a plurality of first encapsulation portions 41 and second encapsulation portions 42. The first encapsulation portions 41 are disposed between two adjacent light-emitting devices 20 and are located on the side of the first encapsulation layer 30 away from the substrate 10. The first encapsulation portions 41 are connected to the first encapsulation layer 30, and the side of the first encapsulation portions 41 away from the substrate 10 is flush with the side of the light-emitting devices 20 away from the substrate 10. The second encapsulation portions 42 are disposed on the side of the plurality of first encapsulation portions 41 away from the substrate 10 and are connected to the plurality of first encapsulation portions 41. The second encapsulation portions 42 cover the side of the plurality of light-emitting devices 20 away from the substrate 10.

[0098] Optionally, the second encapsulation layer 40 includes a second body material.

[0099] Optionally, the second main material includes a transparent organic material. The transparent organic material can be an organic transparent photoresist, which can be optically clear adhesive (OCA). The transparent organic material can also be a transparent resin. Alternatively, the transparent organic material can be acrylic glass, which can be made of acrylic.

[0100] In the second embodiment, the material of the second encapsulation layer 40 is an organic material with leveling properties. Since the thickness of the first encapsulation layer 30 is less than the thickness of the light-emitting device 20, the surface formed by the first encapsulation layer 30 and the light-emitting device 20 is uneven. The second encapsulation layer 40 is formed on this uneven surface. If the thickness of the second encapsulation layer 40 is too thin, the flatness of the side of the second encapsulation layer 40 away from the substrate 10 cannot be guaranteed. The conventional approach is to make the height of the encapsulation layer more than 1.5 times the height of the light-emitting device 20, making the encapsulation layer thicker, thereby improving the flatness of the upper surface of the encapsulation layer. However, this is not conducive to the miniaturization and thinning trend of the light-emitting device 20. In this embodiment, the first encapsulation part 41 and the second encapsulation part 42 of the second encapsulation layer 40 can be manufactured in steps. In the manufacturing steps of the second encapsulation layer 40, the first encapsulation part 41 is formed first, and the side of the first encapsulation part 41 away from the substrate 10 is flush with the side of the light-emitting device 20 away from the substrate 10. A second encapsulation portion 42 is then formed, which is connected to multiple first encapsulation portions 41. The second encapsulation portion 42 covers the side of the multiple light-emitting devices 20 away from the substrate 10. In this embodiment, since the surfaces of the first encapsulation portion 41 and the light-emitting devices 20 are flat, the thickness of the second encapsulation portion 42 can be reduced. This eliminates the need for a thicker design for the film layer on top of the second encapsulation portion 42, thereby reducing the thickness of the display panel 100 and achieving thinning and miniaturization of the display panel 100, thus improving the display effect.

[0101] Optionally, the first encapsulation portion 41 is doped with a second scattering particle P2, which is used to scatter light. Doping the first encapsulation portion 41 with the second scattering particle P2 can further disrupt the encapsulated total internal reflection waveguide, improve the light emission angle of the total internal reflection, increase the forward light emission efficiency, and increase the brightness, thereby improving the display effect.

[0102] Optionally, the material of the second scattering particle P2 includes a non-metallic oxide. The non-metallic oxide includes at least one of titanium oxide, aluminum oxide, zinc oxide, silicon oxide, magnesium oxide, and zirconium oxide.

[0103] Optionally, the particle size of the second scattering particle P2 is in the range of 50 nanometers to 500 nanometers. The particle size of the second scattering particle P2 can be any one of the following values: 50 nm, 60 nm, 70 nm, 80 nm, 90 nm, 100 nm, 110 nm, 120 nm, 130 nm, 140 nm, 150 nm, 160 nm, 170 nm, 180 nm, 190 nm, 200 nm, 210 nm, 220 nm, 230 nm, 240 nm, 250 nm, 260 nm, 270 nm, 280 nm, 290 nm, 300 nm, 310 nm, 320 nm, 330 nm, 340 nm, 350 nm, 360 nm, 370 nm, 380 nm, 390 nm, 400 nm, 410 nm, 420 nm, 430 nm, 440 nm, 450 nm, 460 nm, 470 nm, 480 nm, 490 nm, or 500 nm.

[0104] Optionally, the number of second scattering particles P2 in the first encapsulation section 41 per unit volume is less than or equal to the number of first scattering particles P1 in the first encapsulation layer 30 per unit volume.

[0105] All quantities mentioned thereafter in this application refer to average quantities.

[0106] Since the second scattering particles P2 reflect or absorb some light, in order to reduce the impact on the display effect, the number of second scattering particles P2 per unit volume of the first encapsulation portion 41 is relatively reduced, making it less than or equal to the number of first scattering particles P1 per unit volume of the first encapsulation layer 30. This reduces the amount of forward-emitting light absorbed by the second scattering particles P2 without affecting the reflection of light emitted from the substrate 10 side by the first scattering particles P1 of the first encapsulation layer 30, thereby improving forward light emission efficiency and enhancing the display effect.

[0107] Optionally, the particle size of the second scattering particle P2 is smaller than that of the first scattering particle P1. This reduces the amount of forward-emitting light absorbed or reflected by the second scattering particle P2 without affecting the light emitted from the first scattering particle P1 of the first encapsulation layer 30 on the side of the substrate 10. This improves the forward light emission efficiency and enhances the display effect.

[0108] Optionally, corresponding to the second embodiment of this application, this application also proposes a method for manufacturing the display panel 100 according to the second embodiment, including the following steps:

[0109] Step S21: Provide a substrate 10.

[0110] Step S22: Transfer the plurality of light-emitting devices 20 to one side of the substrate 10 and bond the light-emitting devices 20 to the substrate 10.

[0111] Step S23: A first encapsulation layer 30 is formed on one side of the substrate 10 by spin coating or inkjet printing. The thickness of the first encapsulation layer 30 is less than the thickness of the light-emitting device 20. The first encapsulation layer 30 covers the periphery of multiple light-emitting devices 20. The first encapsulation layer 30 is doped with first scattering particles P1.

[0112] Step S24: A first encapsulation portion 41 is formed on one side of the substrate 10 by spin coating or inkjet printing. The first encapsulation portion 41 is disposed on the side of the first encapsulation layer 30 away from the substrate 10. The side of the first encapsulation portion 41 away from the substrate 10 is flush with the side of the light-emitting device 20 away from the substrate 10. The first encapsulation portion 41 is doped with second scattering particles P2. The number of second scattering particles P2 in the first encapsulation portion 41 per unit volume is less than or equal to the number of first scattering particles P1 in the first encapsulation layer 30 per unit volume.

[0113] Step S25: A second encapsulation part 42 is formed on one side of the substrate 10 by spin coating or inkjet printing. The second encapsulation part 42 is connected to a plurality of first encapsulation parts 41. The second encapsulation part 42 covers the side of the plurality of light-emitting devices 20 away from the substrate 10. The first encapsulation parts 41 and the second encapsulation part 42 form a second encapsulation layer 40.

[0114] Please see Figure 11 In the third embodiment of this application:

[0115] To avoid redundancy, the third embodiment of this application will describe the parts that differ from the first embodiment of this application.

[0116] The third embodiment of this application differs from the first embodiment in that:

[0117] Optionally, the second encapsulation section 42 is doped with third scattering particles P3, which are used to scatter light. Doping the second encapsulation section 42 with third scattering particles P3 can further disrupt the encapsulated total internal reflection waveguide, improve the light emission angle of the total internal reflection, increase the forward light emission efficiency, and increase the brightness, thereby improving the display effect.

[0118] Optionally, the material for the third scattering particle P3 includes a non-metallic oxide. Non-metallic oxides include at least one of titanium oxide, aluminum oxide, zinc oxide, silicon oxide, magnesium oxide, and zirconium oxide.

[0119] Optionally, the particle size of the third scattering particle P3 is in the range of 50 nanometers to 500 nanometers. The particle size of the third scattering particle P3 can be any one of the following values: 50 nm, 60 nm, 70 nm, 80 nm, 90 nm, 100 nm, 110 nm, 120 nm, 130 nm, 140 nm, 150 nm, 160 nm, 170 nm, 180 nm, 190 nm, 200 nm, 210 nm, 220 nm, 230 nm, 240 nm, 250 nm, 260 nm, 270 nm, 280 nm, 290 nm, 300 nm, 310 nm, 320 nm, 330 nm, 340 nm, 350 nm, 360 nm, 370 nm, 380 nm, 390 nm, 400 nm, 410 nm, 420 nm, 430 nm, 440 nm, 450 nm, 460 nm, 470 nm, 480 nm, 490 nm, or 500 nm.

[0120] Optionally, the number of third scattering particles P3 in the second encapsulation section 42 per unit volume is less than or equal to the number of second scattering particles P2 in the first encapsulation section 41 per unit volume.

[0121] Since the third scattering particle P3 reflects or absorbs some light, and is located on the front of the light-emitting device 20 while the second scattering particle P2 is located on the side of the light-emitting device 20, an excessive number of third scattering particles P3 can weaken forward light emission and affect the display effect. To reduce the impact on the display effect, the number of third scattering particles P3 per unit volume of the second encapsulation section 42 is relatively reduced, making it less than or equal to the number of first scattering particles P1 per unit volume of the first encapsulation layer 30. This balances the scattering effect of total internal reflection and improves the forward light emission effect, reducing the amount of forward light emitted that is absorbed or reflected by the third scattering particles P3, thereby improving the forward light emission efficiency and the display effect.

[0122] Optionally, the second scattering particle P2 is used to adjust the side-emitting light of the light-emitting device to front-emitting light through reflection. Similarly, the second scattering particle P2 is located on the side of the light-emitting device 20. By relatively increasing the number of the second scattering particles P2 in the first encapsulation part 41 per unit volume, the side-emitting light of the light-emitting device 20 can be adjusted to front-emitting light, thereby improving the front-emitting light efficiency, reducing light emission from a wide viewing angle, and improving the display effect.

[0123] Optionally, the particle size of the third scattering particle P3 is less than or equal to the particle size of the first scattering particle P1.

[0124] Optionally, the particle size of the third scattering particle P3 is smaller than that of the first scattering particle P1. This reduces the amount of forward-emitting light absorbed or reflected by the third scattering particle P3 without affecting its effect on scattering the total internal reflection light, thereby improving the forward light emission efficiency and display effect.

[0125] Optionally, corresponding to the third embodiment of this application, this application also proposes a method for manufacturing the display panel 100 according to the third embodiment, including the following steps:

[0126] Step S31: Provide a substrate 10.

[0127] Step S32: Transfer the plurality of light-emitting devices 20 to one side of the substrate 10 and bond the light-emitting devices 20 to the substrate 10.

[0128] Step S33: A first encapsulation layer 30 is formed on one side of the substrate 10 by spin coating or inkjet printing. The thickness of the first encapsulation layer 30 is less than the thickness of the light-emitting device 20. The first encapsulation layer 30 covers the periphery of multiple light-emitting devices 20. The first encapsulation layer 30 is doped with first scattering particles P1.

[0129] Step S34: A first encapsulation portion 41 is formed on one side of the substrate 10 by spin coating or inkjet printing. The first encapsulation portion 41 is disposed on the side of the first encapsulation layer 30 away from the substrate 10. The side of the first encapsulation portion 41 away from the substrate 10 is flush with the side of the light-emitting device 20 away from the substrate 10. The first encapsulation portion 41 is doped with second scattering particles P2. The number of second scattering particles P2 in the first encapsulation portion 41 per unit volume is less than or equal to the number of first scattering particles P1 in the first encapsulation layer 30 per unit volume.

[0130] Step S35: A second encapsulation portion 42 is formed on one side of the substrate 10 by spin coating or inkjet printing. The second encapsulation portion 42 is connected to a plurality of first encapsulation portions 41. The second encapsulation portion 42 covers the side of the plurality of light-emitting devices 20 away from the substrate 10. The first encapsulation portion 41 and the second encapsulation portion 42 form a second encapsulation layer 40. The second encapsulation portion 42 is doped with third scattering particles P3. The number of third scattering particles P3 in a unit volume of the second encapsulation portion 42 is less than or equal to the number of second scattering particles P2 in a unit volume of the first encapsulation portion 41.

[0131] Please see Figure 12 In the fourth embodiment of this application:

[0132] To avoid redundancy, the fourth embodiment of this application will describe the parts that differ from the first embodiment of this application.

[0133] The fourth embodiment of this application differs from the first embodiment in that:

[0134] Optionally, the thickness of the first encapsulation layer 30 is equal to the thickness of the light-emitting device 20. The side of the light-emitting device 20 away from the substrate 10 is flush with the side of the first encapsulation layer 30 away from the substrate 10. The second encapsulation layer 40 covers the first encapsulation layer 30 and the side of the plurality of light-emitting devices 20 away from the substrate 10.

[0135] Compared to the third embodiment, the fourth embodiment improves the flatness of the upper surface of the first encapsulation layer 30 by making the thickness of the first encapsulation layer 30 equal to the thickness of the light-emitting device 20. This reduces the step of preparing the first encapsulation part 41 to improve flatness, thereby improving the production efficiency of the display panel 100 and reducing the production cost.

[0136] Optional, please refer to Figure 13 The second encapsulation layer 40 is doped with a fourth scattering particle P4, which is used to scatter light. The number of fourth scattering particles P4 per unit volume of the second encapsulation layer 40 is less than or equal to the number of first scattering particles P1 per unit volume of the first encapsulation layer 30.

[0137] Optionally, the size of the fourth scattering particle P4 is in the range of 50 nanometers to 500 nanometers. The particle size of the fourth scattering particle P4 can be any one of the following values: 50 nm, 60 nm, 70 nm, 80 nm, 90 nm, 100 nm, 110 nm, 120 nm, 130 nm, 140 nm, 150 nm, 160 nm, 170 nm, 180 nm, 190 nm, 200 nm, 210 nm, 220 nm, 230 nm, 240 nm, 250 nm, 260 nm, 270 nm, 280 nm, 290 nm, 300 nm, 310 nm, 320 nm, 330 nm, 340 nm, 350 nm, 360 nm, 370 nm, 380 nm, 390 nm, 400 nm, 410 nm, 420 nm, 430 nm, 440 nm, 450 nm, 460 nm, 470 nm, 480 nm, 490 nm, or 500 nm.

[0138] In the fourth embodiment, the number of first scattering particles P1 per unit volume of the first encapsulation layer 30 is relatively large. The first scattering particles P1 not only scatter light but also reflect it. Increasing the number of first scattering particles P1 per unit volume of the first encapsulation layer 30 allows the first scattering particles P1 to reflect the light emitted from the light-emitting device 20 towards the substrate 10, enabling the reflected light to emit light in the forward direction, increasing the amount of forward emitted light, and thus improving the display effect.

[0139] In the fourth embodiment, the number of fourth scattering particles P4 per unit volume of the second encapsulation layer 40 is relatively small. Although the fourth scattering particles P4 can scatter total internal reflection light, since some of the fourth scattering particles P4 are located on the front side of the light-emitting device 20, an excessive number of fourth scattering particles P4 will weaken the forward light emission, affecting the display effect. To reduce the impact on the display effect, the number of fourth scattering particles P4 per unit volume of the second encapsulation layer 40 is relatively reduced, making it less than or equal to the number of first scattering particles P1 per unit volume of the first encapsulation layer 30. This balances the scattering effect of total internal reflection light emission with the improvement of forward light emission effect, reducing the amount of forward light emission absorbed or reflected by the fourth scattering particles P4, thereby improving the forward light emission efficiency and the display effect.

[0140] Optionally, corresponding to the fourth embodiment of this application, this application also proposes a method for manufacturing the display panel 100 according to the fourth embodiment, including the following steps:

[0141] Step S41: Provide a substrate 10.

[0142] Step S42: Transfer the plurality of light-emitting devices 20 to one side of the substrate 10 and bond the light-emitting devices 20 to the substrate 10.

[0143] Step S43: A first encapsulation layer 30 is formed on one side of the substrate 10 by spin coating or inkjet printing. The thickness of the first encapsulation layer 30 is equal to the thickness of the light-emitting device 20. The side of the light-emitting device 20 away from the substrate 10 is flush with the side of the first encapsulation layer 30 away from the substrate 10. The first encapsulation layer 30 is doped with first scattering particles P1.

[0144] Step S44: A second encapsulation layer 40 is formed on one side of the substrate 10 by spin coating or inkjet printing. The second encapsulation layer 40 covers the side of the first encapsulation layer 30 and multiple light-emitting devices 20 away from the substrate 10. The second encapsulation layer 40 is doped with fourth scattering particles P4. The number of fourth scattering particles P4 in a unit volume of the second encapsulation layer 40 is less than or equal to the number of first scattering particles P1 in a unit volume of the first encapsulation layer 30.

[0145] Please see Figure 14 In the fifth embodiment of this application:

[0146] To avoid redundancy, the fifth embodiment of this application will describe the parts that differ from the first embodiment of this application.

[0147] The fifth embodiment of this application differs from the fourth embodiment in that:

[0148] Optionally, the first encapsulation layer 30 and the second encapsulation layer 40 are integrally formed, and both the first encapsulation layer 30 and the second encapsulation layer 40 are doped with first scattering particles P1.

[0149] Compared to the fourth embodiment, the fifth embodiment integrates the first encapsulation layer 30 and the second encapsulation layer 40 into one piece, thereby reducing one process step. This improves the production efficiency of the display panel 100 and reduces production costs without affecting flatness.

[0150] Optionally, the sum of the thickness of the first encapsulation layer 30 and the thickness of the second encapsulation layer 40 is greater than the thickness of the light-emitting device 20.

[0151] Optionally, when the sum of the thickness of the first encapsulation layer 30 and the thickness of the second encapsulation layer 40 is greater than 1.5 times the thickness of the light-emitting device 20, the flatness of the film layer above the display panel 100 can be guaranteed.

[0152] Please see Figure 15After the light emitted by the light-emitting device 20 undergoes total internal reflection at the interface between the second encapsulation layer 40 and the air, some of the total internally reflected light enters the first encapsulation layer 30 or the second encapsulation layer 40. The first scattering particle P1 in the first encapsulation layer 30 or the second encapsulation layer 40 scatters the total internally reflected light, changes the light output direction of the total internally reflected light, thereby destroying the encapsulated total internally reflected light waveguide, improving the light output angle of the total internally reflected light, increasing the forward light output, and improving the forward light output efficiency.

[0153] To further investigate the effect of the first scattering particle P1 on the forward light extraction efficiency, Figure 4 The conventional display panel 100a shown is used as control group 1, and... Figure 15 The display panel 100 of the fifth embodiment of this application shown is used as experimental group 2. The difference between control group 1 and experimental group 2 is that the conventional display panel 100a of control group 1 includes multiple light-emitting devices 20a disposed on one side of substrate 10a and an encapsulation layer 30a covering the light-emitting devices 20a. The display panel 100 of experimental group 2 includes a first encapsulation layer 30 and a second encapsulation layer 40 stacked on one side of substrate 10, wherein both the first encapsulation layer 30 and the second encapsulation layer 40 are doped with first scattering particles P1. The same power voltage is input to experimental group 2 and control group 1, and the emitted light brightness at each viewing angle is normalized to obtain the following results: Figure 6 The graph showing the relationship between normalized brightness and viewing angle for control group 1 is shown below. Figure 16 The graph shown represents the relationship between normalized brightness and viewing angle for experimental group 2.

[0154] Please see Figure 6 and Figure 16 A comparison of the relationship between normalized brightness and viewing angle in control group 1 and experimental group 2 shows that after adding the first scattering particle P1 to the first encapsulation layer 30 and the second encapsulation layer 40, when the input power is constant, forward light emission can be improved and wide-viewing-angle light emission can be reduced, thereby improving the forward light emission efficiency.

[0155] A comparison of the normalized brightness and viewing angle relationship diagrams of experimental groups 1 and 2 shows that, with the addition of the first scattering particle P1 in the first encapsulation layer 30, the addition of the first scattering particle P1 in the second encapsulation layer 40 can further improve forward light emission and reduce wide-viewing-angle light emission when the input power is constant, thereby improving the forward light emission efficiency.

[0156] Optionally, for the fifth embodiment of this application, please refer to... Figure 17 This application also proposes a fifth method for manufacturing the display panel 100, comprising the following steps:

[0157] Please see Figure 18A Step S51: Provide a substrate 10.

[0158] Please see Figure 18B Step S52: Transfer the plurality of light-emitting devices 20 to one side of the substrate 10 and bond the light-emitting devices 20 to the substrate 10.

[0159] Please see Figure 18C Step S53: A first encapsulation layer 30 and a second encapsulation layer 40 are formed on one side of the substrate 10 by spin coating or inkjet printing. The first encapsulation layer 30 and the second encapsulation layer 40 are integrally formed. The first encapsulation layer 30 covers the periphery of a plurality of light-emitting devices 20. The second encapsulation layer 40 is disposed on the side of the first encapsulation layer 30 away from the substrate 10. The second encapsulation layer 40 covers a plurality of light-emitting devices 20. Both the first encapsulation layer 30 and the second encapsulation layer 40 are doped with first scattering particles P1.

[0160] Please see Figure 19 In the sixth embodiment of this application:

[0161] To avoid redundancy, the sixth embodiment of this application will describe the parts that differ from the first embodiment of this application.

[0162] The sixth embodiment of this application differs from the first embodiment of this application in that:

[0163] Optionally, the thickness of the first encapsulation layer 30 is greater than the thickness of the light-emitting device 20. The first encapsulation layer 30 covers multiple light-emitting devices 20. The second encapsulation layer 40 is disposed on the side of the first encapsulation layer 30 away from the light-emitting device 20. The second encapsulation layer 40 is doped with first scattering particles P1.

[0164] Please see Figure 20 A conventional display panel 100a includes a substrate 10a, a plurality of light-emitting devices 20a disposed on one side of the substrate 10a, and a first encapsulation layer 30a and a second encapsulation layer 40a covering the light-emitting devices 20a. The thickness of the first encapsulation layer 30a is greater than the thickness of the light-emitting devices 20a. However, there is a large difference in refractive index between the second encapsulation layer 40a and the air interface in the conventional display panel 100a. Some of the light emitted from the light-emitting devices 20a will undergo total internal reflection when it reaches the second encapsulation layer 40a and the air interface, forming an optical waveguide, which leads to a decrease in the amount of light emitted in the forward direction.

[0165] Please see Figure 21In the sixth embodiment of this application, the first encapsulation layer 30 covers a plurality of light-emitting devices 20, and the second encapsulation layer 40 is disposed on the side of the first encapsulation layer 30 away from the light-emitting devices 20. After the light emitted by the light-emitting devices 20 undergoes total internal reflection at the interface between the second encapsulation layer 40 and the air, part of the totally internally reflected light strikes the surface of the first scattering particles P1 in the second encapsulation layer 40. The first scattering particles P1 in the second encapsulation layer 40 scatter the totally internally reflected light, changing the exit direction of the totally internally reflected light, thereby disrupting the encapsulated totally internally reflected light waveguide, improving the exit angle of the totally internally reflected light, increasing forward light emission, and improving the forward light emission efficiency.

[0166] To further investigate the effect of the first scattering particle P1 on the forward light extraction efficiency, Figure 20 The conventional display panel 100a shown is used as control group 2, and... Figure 21 The display panel 100 of the sixth embodiment of this application shown is used as experimental group 3. The difference between experimental group 3 and control group 2 is that the conventional display panel 100a of control group 2 includes multiple light-emitting devices 20a disposed on one side of substrate 10a and a first encapsulation layer 30a and a second encapsulation layer 40a covering the light-emitting devices 20a. The thickness of the first encapsulation layer 30a is greater than the thickness of the light-emitting devices 20a. The display panel 100 of experimental group 3 includes a first encapsulation layer 30 and a second encapsulation layer 40 stacked on one side of substrate 10. The thickness of the first encapsulation layer 30 is greater than the thickness of the light-emitting devices 20a. The second encapsulation layer 40 is doped with first scattering particles P1. The same power voltage is input to experimental group 2 and control group 3, and the emitted light brightness at each viewing angle is normalized to obtain the following results: Figure 22 The normalized brightness versus viewing angle graph of control group 2 is shown below. Figure 23 The graph shown represents the relationship between normalized brightness and viewing angle for experimental group 3.

[0167] Please see Figure 22 and Figure 23 Comparing the normalized brightness and viewing angle relationship diagrams of control group 2 and experimental group 3, it can be seen that after adding the first scattering particle P1 to the second encapsulation layer 40, when the input power is constant, the forward light output can be improved and the large viewing angle light output can be reduced, thereby improving the forward light output efficiency.

[0168] Optionally, for the sixth embodiment of this application, please refer to... Figure 24 This application also proposes a sixth method for manufacturing the display panel 100, comprising the following steps:

[0169] Please see Figure 25A Step S61: Provide a substrate 10.

[0170] Please see Figure 25BStep S62: Transfer the plurality of light-emitting devices 20 to one side of the substrate 10 and bond the light-emitting devices 20 to the substrate 10.

[0171] Please see Figure 25C Step S63: A first encapsulation layer 30 is formed on one side of the substrate 10 by spin coating or inkjet printing. The thickness of the first encapsulation layer 30 is greater than the thickness of the light-emitting device 20. The first encapsulation layer 30 covers multiple light-emitting devices 20.

[0172] Please see Figure 25D Step S64: A second encapsulation layer 40 is formed on one side of the substrate 10 by spin coating or inkjet printing. The second encapsulation layer 40 is disposed on the side of the first encapsulation layer 30 away from the substrate 10. The second encapsulation layer 40 is doped with first scattering particles P1.

[0173] The specific embodiments of this application have been described in detail above. The embodiments disclosed above are merely preferred embodiments of this application. Those skilled in the art can make many modifications and improvements without departing from the concept of this application. All such modifications and improvements fall within the scope of protection defined by the claims of this application.

Claims

1. A display panel, characterized by, include: substrate; Multiple light-emitting devices are disposed on one side of the substrate; A first encapsulation layer is disposed on one side of the substrate and covers at least the periphery of a plurality of light-emitting devices, wherein the thickness of the first encapsulation layer is less than the thickness of the light-emitting devices; as well as A second encapsulation layer is disposed on the side of the first encapsulation layer away from the substrate and covers a plurality of light-emitting devices. The second encapsulation layer includes a plurality of first encapsulation portions and second encapsulation portions. The first encapsulation portions are disposed between two adjacent light-emitting devices, and the second encapsulation portions are disposed on the side of the plurality of first encapsulation portions away from the substrate. The first encapsulation layer is doped with first scattering particles, which are used to scatter and reflect light. The first encapsulation part is doped with second scattering particles, which are used to scatter light. The number of second scattering particles per unit volume of the first encapsulation part is less than the number of first scattering particles per unit volume of the first encapsulation layer. The particle size of the second scattering particles is smaller than the particle size of the first scattering particles.

2. The display panel as described in claim 1, characterized in that, The first encapsulation portion is located on the side of the first encapsulation layer away from the substrate, the first encapsulation portion is connected to the first encapsulation layer, and the side of the first encapsulation portion away from the substrate is flush with the side of the light-emitting device away from the substrate; The second encapsulation portion is connected to a plurality of the first encapsulation portions, and the second encapsulation portion covers the side of the plurality of light-emitting devices away from the substrate.

3. The display panel of claim 2, wherein, The second encapsulation portion is doped with a third scattering particle, which is used to scatter light. The number of the third scattering particles in the second encapsulation portion per unit volume is less than or equal to the number of the second scattering particles in the first encapsulation portion per unit volume. The scattering particles doped in the second encapsulation layer also include the third scattering particles.

4. The display panel of claim 3, wherein, The particle size of the third scattering particle is less than or equal to the particle size of the first scattering particle.

5. The display panel of any one of claims 1-4, wherein, The display panel further includes a light extraction structure, which is disposed on the side of the second encapsulation layer away from the substrate, and each light extraction structure corresponds to at least one light-emitting device.

6. The display panel of claim 5, wherein, The light-emitting devices include red light-emitting devices, blue light-emitting devices, and green light-emitting devices; One light extraction structure corresponds to three light-emitting devices of different colors; In a light extraction structure, the orthographic projections of the red light-emitting device, the green light-emitting device, and the blue light-emitting device on the substrate are all located within the range of the orthographic projection of the corresponding light extraction structure on the substrate. The red light-emitting device is located between the blue light-emitting device and the green light-emitting device.

7. A display device, characterized in that, Includes the display panel as described in any one of claims 1-6.

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