MSAP film removing agent as well as preparation method and application thereof

Abstract

The invention discloses an mSAP film removing agent as well as a preparation method and application thereof, and relates to the technical field of mSAP special for fine circuits. The mSAP film removing agent comprises the following components in parts by weight: 1-5 parts of an organic solvent; 10-30 parts of an inorganic base; 0.1 to 0.5 part of an inorganic corrosion inhibitor; 0.1 to 0.5 part of a non-ionic surface active agent; 1-10 parts of a penetrant; and the balance of deionized water. The nonionic surfactant is prepared from at least two of fatty alcohol-polyoxyethylene ether, nonylphenol polyoxyethylene ether, polyoxyethylene fatty acid ester and lauric acid monoethanolamide. The mSAP film removing agent has excellent IDE film removing capacity and efficient cleaning performance, the ammonia nitrogen content can be greatly reduced, and the efficient and environment-friendly film removing process is achieved.

Description

Technical Field

[0001] The invention relates to the technical field of mSAP dedicated to fine circuits, and in particular to an mSAP film remover and a preparation method and application thereof. Background Art

[0002] With the continuous miniaturization and functional diversification of electronic products, the manufacturing technology of printed circuit boards (PCBs) is also constantly improving to meet the growing demand for high-precision and high-density wiring. mSAP obtains high-precision conductor patterns by laminating thin copper foil or copper-clad laminate on the substrate, performing chemical copper plating, graphic electroplating and etching. Compared with the traditional subtractive method, mSAP can achieve smaller line width and line spacing, meeting the needs of higher-precision circuit boards. The film removal process is to remove the anti-corrosion dry film material on the circuit to expose the copper circuit. In production, it is necessary to pay attention to whether the film removal is clean, otherwise there will be dry film residues remaining in the subsequent process, resulting in bubbles in the later lamination process.

[0003] Existing film removers have many shortcomings, which restrict their effective application in fine circuit processing.

[0004] In terms of reagents: 1. Inorganic alkaline film removers are often difficult to completely remove dry films during use, resulting in unsatisfactory cleaning effects. Secondly, inorganic alkaline film removers have large amounts of micro-etching on copper, and the copper surface is seriously discolored due to oxidation. At the same time, they are not easy to decompose, have slow diffusion speed, and are unevenly distributed. 2. Although organic alkaline film removers perform well in film removal, the environmental pollution caused by their high ammonia nitrogen content is difficult to ignore and fails to meet current environmental protection requirements. In addition, due to their strong alkalinity, although they can ensure the ability to remove dry films, they are very easy to corrode metal materials, dielectrics, and substrate materials, resulting in damage to the optoelectronic performance of chips or even scrapping, which seriously limits the improvement of production yield. 3. In terms of cleaning process: Although spray cleaning can improve cleaning efficiency, the process is complicated and the operation is difficult; while the immersion cleaning method is relatively simple, due to incomplete cleaning, it is easy to have low film stripping rate and dry film residue, which will cause problems such as unclean etching and short circuit, seriously affecting the yield of PCB. Summary of the invention

[0005] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a mSAP film remover and its preparation method and application. The mSAP film remover of the present invention has excellent IDE film removal ability and high-efficiency cleaning performance, and can also significantly reduce the ammonia nitrogen content, thereby achieving an efficient and environmentally friendly film removal process.

[0006] To achieve the above object, the technical solution adopted by the present invention is:

[0007] In a first aspect, the present invention provides an mSAP film remover, comprising the following components in parts by weight:

[0008] 1-5 parts of organic solvent; 10-30 parts of inorganic base; 0.1-0.5 parts of inorganic corrosion inhibitor; 0.1-0.5 parts of nonionic surfactant; 1-10 parts of penetrant; the balance is deionized water;

[0009] The nonionic surfactant includes at least two of fatty alcohol polyoxyethylene ether, nonylphenol polyoxyethylene ether, fatty acid polyoxyethylene ester and lauric acid monoethanolamide.

[0010] The present invention is beneficial to improving the film removal effect of the mSAP film remover by compounding with two or more non-ionic surfactants. On the one hand, the non-ionic surfactant is not ionized in the aqueous solution, and its hydrophilic group is mainly composed of a certain number of oxygen-containing groups (generally ether groups and hydroxyl groups), so it has high stability and is not easily affected by the presence of strong electrolyte inorganic salts, nor is it easily affected by pH value. In addition, compounding with two or more non-ionic surfactants is beneficial to improving the stability of the mSAP film remover; on the other hand, the compounded non-ionic surfactant has a strong emulsifying ability and can better clean the film layer on the fine circuit, thereby improving the film removal effect of the mSAP film remover.

[0011] The film remover of the present invention can significantly reduce the ammonia nitrogen content while ensuring the film removal ability, thereby realizing an efficient and environmentally friendly film removal process; through a simple immersion cleaning method, a high film stripping rate can also be achieved, the operation process is simplified, and the cleaning effect is guaranteed; and the film remover of the present invention has a small loss and extremely low consumption, which can significantly reduce production costs and improve economic efficiency; at the same time, it also has efficient cleaning performance, and can accurately clean dry films with a minimum line spacing of 18 microns, meeting the needs of fine circuit processing.

[0012] Preferably, the nonionic surfactant comprises fatty alcohol polyoxyethylene ether and nonylphenol polyoxyethylene ether, and the weight ratio of the fatty alcohol polyoxyethylene ether to nonylphenol polyoxyethylene ether is (0.8-1.2): (0.8-1.2).

[0013] Preferably, the nonionic surfactant comprises fatty alcohol polyoxyethylene ether and fatty acid polyoxyethylene ester, and the weight ratio of the fatty alcohol polyoxyethylene ether to the fatty acid polyoxyethylene ester is (0.8-1.2): (0.8-1.2).

[0014] Preferably, the nonionic surfactant comprises fatty alcohol polyoxyethylene ether and lauric acid monoethanolamide, and the weight ratio of the fatty alcohol polyoxyethylene ether to lauric acid monoethanolamide is (0.8-1.2): (0.8-1.2).

[0015] Preferably, the nonionic surfactant comprises nonylphenol polyoxyethylene ether and fatty acid polyoxyethylene ester, and the weight ratio of the nonylphenol polyoxyethylene ether to the fatty acid polyoxyethylene ester is (0.8-1.2): (0.8-1.2).

[0016] Preferably, the nonionic surfactant comprises nonylphenol polyoxyethylene ether and lauric acid monoethanolamide, and the weight ratio of the nonylphenol polyoxyethylene ether to lauric acid monoethanolamide is (0.8-1.2): (0.8-1.2).

[0017] Preferably, the nonionic surfactant comprises fatty acid polyoxyethylene ester and lauric acid monoethanolamide, and the weight ratio of fatty acid polyoxyethylene ester to lauric acid monoethanolamide is (0.8-1.2): (0.8-1.2).

[0018] Preferably, the organic solvent includes at least one of triethanolamine, dimethylacetamide, diethylenetriamine, hydroxyethylethylenediamine, triethylenetetramine, and N-hexyl-2-pyrrolidone.

[0019] Preferably, the inorganic base includes at least one of potassium hydroxide, sodium hydroxide, calcium hydroxide, ammonium hydroxide, barium hydroxide, sodium carbonate and sodium fluoride.

[0020] Preferably, the inorganic corrosion inhibitor includes at least one of nitrite, sodium nitrite, sodium dithionite, potassium dichromate, sodium nitrate, sodium polyphosphate, sodium polyphosphate, cupric chloride, copper sulfate pentahydrate, cupric chloride dihydrate, and sodium phosphate.

[0021] Preferably, the penetrant includes at least one of n-octanol, triethylene glycol, propylene glycol or glycerol.

[0022] In a second aspect, the present invention further provides a method for preparing a mSAP film remover, comprising the following steps:

[0023] The organic solvent, inorganic base, inorganic corrosion inhibitor, nonionic surfactant, penetrant and deionized water are uniformly mixed to obtain the mSAP film remover.

[0024] In a third aspect, the present invention also provides a use of an mSAP remover in fine circuits.

[0025] The mSAP film remover of the present invention has a film removing effect on a fine circuit film removing plate with a line width / line spacing of 18 μm, which has a higher improvement in the film removing effect.

[0026] Compared with the prior art, the present invention has the following beneficial effects:

[0027] (1) The present invention provides a composite mSAP film remover, which ensures the film removal ability while significantly reducing the ammonia nitrogen content, thereby achieving an efficient and environmentally friendly film removal process.

[0028] (2) The mSAP film remover of the present invention can provide efficient cleaning performance and can accurately clean dry films with a minimum line width / line spacing of 18 microns, meeting the needs of fine circuit processing. Through simple immersion cleaning, a high film stripping rate can also be achieved, simplifying the operation process while ensuring the cleaning effect. The present invention does not require a spray device, and can clean dry films of more precise circuits by soaking for 3-10 minutes and combining ultrasound within 60 seconds.

[0029] (3) The present invention adds an effective copper surface corrosion inhibitor, which can protect the copper surface from being attacked, so that the copper surface will not be oxidized, corroded, discolored, etc. This is because the added inorganic corrosion inhibitor can have a slow-release effect on copper.

[0030] (4) The film remover of the present invention has good wettability and permeability, so that the agent can fully wet the surface of the dry film and penetrate into the interior of the dry film to achieve a rapid film removal effect, and can also have a good removal effect on the film sandwich. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 This is a picture showing the effect of the film removal test board of Example 1 after being immersed in the film removal at a temperature of 45°C for 5 minutes.

[0032] Figure 2 This is a picture of the film removal effect of the film removal test board of Example 2 after being immersed in the film removal at a temperature of 45°C for 5 minutes.

[0033] Figure 3 This is a picture showing the effect of the de-filming test board of Example 3 after being immersed in the de-filming process at 45°C for 5 minutes.

[0034] Figure 4 This is a picture showing the effect of the de-filming test board of Example 4 after being immersed in the de-filming process at 45°C for 5 minutes.

[0035] Figure 5 This is a picture showing the effect of the de-filming test board of Example 5 after being immersed in the de-filming process at 45°C for 5 minutes.

[0036] Figure 6 This is a diagram showing the effect of the de-filming test board of Example 6 after being immersed in the de-filming process at 45°C for 5 minutes.

[0037] Figure 7 This is a picture of the effect of the de-filming test board of comparative example 1 after soaking and de-filming at 45°C for 5 minutes.

[0038] Figure 8This is a picture of the effect of the de-filming test board of comparative example 2 after being immersed in the de-filming at a temperature of 45°C for 5 minutes.

[0039] Fig. 9 This is a picture of the effect of the de-filming test board of comparative example 3 after being immersed in the de-filming at a temperature of 45°C for 5 minutes.

[0040] Fig.10 This is a picture showing the effect of the de-filming test board of comparative example 4 after being immersed in the de-filming process at 45°C for 5 minutes.

[0041] Fig.11 This is a picture of the effect of the de-filming test board of comparative example 5 after soaking and de-filming at 45°C for 5 minutes.

[0042] Fig.12 This is a picture of the effect of the de-filming test board of comparative example 6 after soaking and de-filming at 45°C for 5 minutes.

[0043] Fig.13 This is a picture of the effect of the de-filming test board of comparative example 7 after soaking and de-filming at 45°C for 5 minutes.

[0044] Fig.14 This is a picture of the effect of the de-filming test board of comparative example 8 after soaking and de-filming at a temperature of 45°C for 5 minutes.

[0045] Fig.15 This is a picture of the effect of the de-filming test board of comparative example 9 after soaking and de-filming at 45°C for 5 minutes. DETAILED DESCRIPTION

[0046] In order to better illustrate the purpose, technical solutions and advantages of the present invention, the present invention will be further described below in conjunction with specific embodiments, but the protection scope and implementation methods of the present invention are not limited thereto.

[0047] Unless otherwise specified, the materials and reagents used in the following examples are commercially available.

[0048] Example 1

[0049] A mSAP film remover, comprising the following components in parts by weight, based on 100 parts by weight of the mSAP film remover:

[0050] 2 parts of organic solvent; 10 parts of inorganic base; 0.1 parts of inorganic corrosion inhibitor; 0.1 parts of nonionic surfactant; 1 part of penetrant; the balance is deionized water.

[0051] In this embodiment, the organic solvent is triethanolamine, the inorganic base is sodium hydroxide, the inorganic corrosion inhibitor is sodium nitrite, the penetrant is n-octanol, and the nonionic surfactant includes fatty alcohol polyoxyethylene ether and nonylphenol polyoxyethylene ether, and the weight ratio of fatty alcohol polyoxyethylene ether to nonylphenol polyoxyethylene ether is 1:1.

[0052] A method for preparing an mSAP film remover comprises the following steps:

[0053] The components are mixed evenly according to the proportion to obtain the mSAP film remover.

[0054] Example 2

[0055] A mSAP film remover, comprising the following components in parts by weight, based on 100 parts by weight of the mSAP film remover:

[0056] 3 parts of organic solvent; 20 parts of inorganic base; 0.2 parts of inorganic corrosion inhibitor; 0.2 parts of non-ionic surfactant; 3 parts of penetrant; the balance is deionized water.

[0057] In this embodiment, the organic solvent is dimethylacetamide, the inorganic base is potassium hydroxide, the inorganic corrosion inhibitor is sodium dinitrite, the penetrant is triethylene glycol, and the non-ionic surfactant includes fatty alcohol polyoxyethylene ether and fatty acid polyoxyethylene ester, and the weight ratio of fatty alcohol polyoxyethylene ether and fatty acid polyoxyethylene ester is 1:1.

[0058] The preparation method of a mSAP film remover is the same as that in Example 1.

[0059] Example 3

[0060] A mSAP film remover, comprising the following components in parts by weight, based on 100 parts by weight of the mSAP film remover:

[0061] 3 parts of organic solvent; 20 parts of inorganic base; 0.2 parts of inorganic corrosion inhibitor; 0.3 parts of nonionic surfactant; 5 parts of penetrant; the balance is deionized water.

[0062] In this embodiment, the organic solvent is diethylenetriamine, the inorganic base is sodium hydroxide, the inorganic corrosion inhibitor is potassium dichromate, the penetrant is propylene glycol, and the non-ionic surfactant includes fatty alcohol polyoxyethylene ether and lauric acid monoethanolamide, and the weight ratio of fatty alcohol polyoxyethylene ether to lauric acid monoethanolamide is 1:1.

[0063] The preparation method of a mSAP film remover is the same as that in Example 1.

[0064] Example 4

[0065] A mSAP film remover, comprising the following components in parts by weight, based on 100 parts by weight of the mSAP film remover:

[0066] 2 parts of organic solvent; 30 parts of inorganic base; 0.4 parts of inorganic corrosion inhibitor; 0.4 parts of nonionic surfactant; 7 parts of penetrant; the balance is deionized water.

[0067] In this embodiment, the organic solvent is hydroxyethylethylenediamine, the inorganic base is sodium carbonate, the inorganic corrosion inhibitor is cupric chloride, the penetrant is glycerol, and the nonionic surfactant includes nonylphenol polyoxyethylene ether and fatty acid polyoxyethylene ester, and the weight ratio of nonylphenol polyoxyethylene ether to fatty acid polyoxyethylene ester is 1:1.

[0068] The preparation method of a mSAP film remover is the same as that in Example 1.

[0069] Example 5

[0070] A mSAP film remover, comprising the following components in parts by weight, based on 100 parts by weight of the mSAP film remover:

[0071] 3 parts of organic solvent; 20 parts of inorganic base; 0.3 parts of inorganic corrosion inhibitor; 0.4 parts of nonionic surfactant; 9 parts of penetrant; the balance is deionized water.

[0072] In this embodiment, the organic solvent is triethylenetetramine, the inorganic base is sodium fluoride, the inorganic corrosion inhibitor is copper sulfate pentahydrate, the penetrant is n-octanol, and the nonionic surfactant includes nonylphenol polyoxyethylene ether and lauric acid monoethanolamide, and the weight ratio of nonylphenol polyoxyethylene ether to lauric acid monoethanolamide is 1:1.

[0073] The preparation method of a mSAP film remover is the same as that in Example 1.

[0074] Example 6

[0075] A mSAP film remover, comprising the following components in parts by weight, based on 100 parts by weight of the mSAP film remover:

[0076] 5 parts of organic solvent; 20 parts of inorganic base; 0.4 parts of inorganic corrosion inhibitor; 0.5 parts of nonionic surfactant; 10 parts of penetrant; the balance is deionized water.

[0077] In this embodiment, the organic solvent is N-hexyl-2-pyrrolidone, the inorganic base is sodium hydroxide, the inorganic corrosion inhibitor is cupric chloride dihydrate, the penetrant is propylene glycol, and the non-ionic surfactant includes fatty acid polyoxyethylene ester and lauric acid monoethanolamide, and the weight ratio of fatty acid polyoxyethylene ester and lauric acid monoethanolamide is 1:1.

[0078] The preparation method of a mSAP film remover is the same as that in Example 1.

[0079] Comparative Example 1

[0080] A mSAP film remover, which is different from Example 1 in that no nonionic surfactant is added.

[0081] Comparative Example 2

[0082] A mSAP film remover, which is different from Example 1 in that the nonionic surfactant only includes fatty alcohol polyoxyethylene ether.

[0083] Comparative Example 3

[0084] A mSAP film remover, which is different from Example 1 in that the nonionic surfactant only includes nonylphenol polyoxyethylene ether.

[0085] Comparative Example 4

[0086] A mSAP film remover is different from Example 1 in that an equal amount of anionic surfactant N-lauroyl sarcosine is used to replace fatty alcohol polyoxyethylene ether.

[0087] Comparative Example 5

[0088] A mSAP film remover is different from Example 1 in that an equal mass of cationic surfactant-dodecyltrimethylammonium bromide is used to replace fatty alcohol polyoxyethylene ether.

[0089] Comparative Example 6

[0090] An mSAP film remover, which is different from Example 1 in that it comprises the following components in parts by weight:

[0091] 0.5 parts of organic solvent; 32 parts of inorganic base; 0.6 parts of inorganic corrosion inhibitor; 0.05 parts of nonionic surfactant; 0.5 parts of penetrant; the balance is deionized water.

[0092] Comparative Example 7

[0093] An mSAP film remover, which is different from Example 1 in that it comprises the following components in parts by weight:

[0094] 6 parts of organic solvent; 8 parts of inorganic base; 0.05 parts of inorganic corrosion inhibitor; 1 part of nonionic surfactant; 15 parts of penetrant; the balance is deionized water.

[0095] Comparative Example 8

[0096] A mSAP film remover, which is different from Example 1 in that the nonionic surfactant includes fatty alcohol polyoxyethylene ether and alkylphenol polyoxyethylene ether.

[0097] Comparative Example 9

[0098] A mSAP film remover is different from Example 1 in that the nonionic surfactant includes alkylphenol polyoxyethylene ether and nonylphenol polyoxyethylene ether.

[0099] Test Case

[0100] The mSAP film removal agents of Examples 1-6 and Comparative Examples 1-9 were used to test and evaluate the film removal effects.

[0101] Test method: dilute the above mSAP remover according to the starting concentration of 1 alkali equivalent to prepare a solution, and then soak the test plates (size 3×3cm) in 45-55℃ solution for 5 minutes. After rinsing with hot water, blow dry with a hair dryer (room temperature), and then put them in a sealed bag with A4 paper. Wear gloves throughout the process to ensure that the gloves are not contaminated. Put the washed plates in the refrigerator and finally check them on the board table. Use a metallographic microscope (100 times) to observe and record the removal effect. Figure 1-15 This is a metallographic microscope (100x) observation picture (partial) of the test board after it was immersed in 45℃ for 5 minutes and the film was removed.

[0102] Evaluation of film removal effect: Observe the appearance through an electron microscope, and calculate the film residue residual rate from the area of ​​the part with the same appearance as before cleaning (the area with film attached) and the area that can be cleaned. The film residue residual rate is calculated by the following formula: Residue rate = number of film residues remaining after cleaning / area of ​​spraying area.

[0103] The test results are shown in Table 1 below.

[0104] Table 1 Residual rate of film remover after soaking for 5 minutes

[0105]

[0106] According to Table 1, the mSAP film removers prepared in Examples 1-6 can effectively remove the film on the fine circuit. Figure 1-6 shown.

[0107] According to the comparison between Comparative Examples 1-3 and Example 1, when no nonionic surfactant is added, a large amount of film residue remains on the surface of the test board. When the nonionic surfactant is compounded with two nonionic surfactants, no film residue remains after the film removal test, while when only one nonionic surfactant is used, film residue remains on the surface of the test board, and the film removal of the product is unqualified. The film removal effect of Comparative Examples 1-3 is as follows: Figure 7-9 shown.

[0108] According to the comparison of Comparative Examples 4-5 with Example 1, when anionic surfactants or cationic surfactants are compounded with nonionic surfactants, film residues also remain on the surface of the test board, and the film removal effect is not as good as that of Example 1. The film removal effect of Comparative Examples 4-5 is as good as that of Example 1. Figure 10-11 shown.

[0109] According to the comparison between Comparative Examples 6-7 and Example 1, if the dosage of organic solvent, inorganic alkali, inorganic corrosion inhibitor, nonionic surfactant and penetrant is not within the scope protected by the present invention, film residue will remain on the surface of the test board, indicating that only by controlling the dosage of each component in the mSAP film remover within the scope defined by the present invention can the mSAP film remover have a higher film removal ability. Figure 12-13 shown.

[0110] According to the comparison between Comparative Examples 8-9 and Example 1, if the type of anionic surfactant used is not compounded within the scope of the present invention, film residues will remain on the surface of the test board. The film removal effect of Comparative Examples 8-9 is as follows: Figure 14-15 shown.

[0111] The present invention also measured ammonia nitrogen in the mSAP film remover described in Examples 1-6, and the measurement was based on HJ535-2009 "Determination of ammonia nitrogen in water quality - Nessler's reagent spectrophotometry". The results showed that no ammonia nitrogen was detected in Examples 1-6, indicating that the present invention can significantly reduce the ammonia nitrogen content and achieve an efficient and environmentally friendly film removal process.

[0112] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention rather than to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the present invention.

Claims

1. A mSAP film remover, characterized in that: The composition comprises the following components in parts by weight: 1-5 parts of organic solvent; 10-30 parts of inorganic base; 0.1-0.5 parts of inorganic corrosion inhibitor; 0.1-0.5 parts of nonionic surfactant; 1-10 parts of penetrant; the balance is deionized water; The nonionic surfactant includes at least two of fatty alcohol polyoxyethylene ether, nonylphenol polyoxyethylene ether, fatty acid polyoxyethylene ester, and lauric acid monoethanolamide.

2. The mSAP film remover according to claim 1, characterized in that The nonionic surfactants include fatty alcohol polyoxyethylene ether and nonylphenol polyoxyethylene ether.

3. The mSAP film remover according to claim 2, characterized in that: The weight ratio of the fatty alcohol polyoxyethylene ether to the nonylphenol polyoxyethylene ether is (0.8-1.2): (0.8-1.2).

4. The mSAP film remover according to claim 1, characterized in that The nonionic surfactant comprises fatty acid polyoxyethylene ester and lauric acid monoethanolamide, and the weight ratio of the fatty acid polyoxyethylene ester to the lauric acid monoethanolamide is (0.8-1.2): (0.8-1.2).

5. The mSAP film remover according to claim 1, characterized in that The organic solvent includes at least one of triethanolamine, dimethylacetamide, diethylenetriamine, hydroxyethylethylenediamine, triethylenetetramine, and N-hexyl-2-pyrrolidone.

6. The mSAP film remover according to claim 1, characterized in that: The inorganic base includes at least one of potassium hydroxide, sodium hydroxide, calcium hydroxide, ammonium hydroxide, barium hydroxide, sodium carbonate and sodium fluoride.

7. The mSAP film remover according to claim 1, characterized in that: The inorganic corrosion inhibitor includes at least one of nitrite, sodium nitrite, sodium dithionite, potassium dichromate, sodium nitrate, sodium polyphosphate, sodium polyphosphate, cupric chloride, copper sulfate pentahydrate, cupric chloride dihydrate, and sodium phosphate.

8. The mSAP film remover according to claim 1, characterized in that The penetrant includes at least one of n-octanol, triethylene glycol, propylene glycol or glycerol.

9. The method for preparing the mSAP film remover according to any one of claims 1 to 8, characterized in that: The following steps are involved: The organic solvent, inorganic base, inorganic corrosion inhibitor, nonionic surfactant, penetrant and deionized water are uniformly mixed to obtain the mSAP film remover.

10. Use of the mSAP remover according to any one of claims 1 to 8 in fine circuits.

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