Micro-contact silver-plated ceramic chip conduction detection device and system

Abstract

The invention relates to the technical field of ceramic chip detection, in particular to a micro-contact silver-plated ceramic chip conduction detection device which comprises a base, a clamp and a probe fixing piece, a detection part for placing a silver-plated ceramic chip to be detected and a fixing part for fixing the clamp are formed on the base, the detection part is provided with a first probe and a second probe, and the first probe and the second probe are arranged on the base. A third probe and a fourth probe are arranged on one side of the probe fixing piece, the other side of the probe fixing piece is fixed to the clamping end of the clamp through a bolt, and the clamping end of the clamp is located above the detection part; according to the device, the four probes in the device can be connected with a low-resistance measuring instrument by adopting a Kelvin four-wire method so as to detect the conduction performance of the silver-plated ceramic chip, so that the good conduction performance between the front surface and the back surface of the silver-plated ceramic chip can be detected, and the problems existing in the silver plating process can be reflected in time.

Description

Technical Field

[0001] The invention relates to the technical field of ceramic sheet detection, and in particular to a micro-contact silver-plated ceramic sheet conduction detection device and system. Background Art

[0002] With the continuous advancement of silver plating technology, its application scope has far exceeded the traditional field of surface protection and decoration, and has focused on its functional performance in many key fields such as the electronics industry, military technology, aerospace, etc., such as wear resistance, excellent conductivity, high-efficiency reflectivity, and excellent corrosion resistance. In particular, when silver plating technology is applied to ceramic materials, this innovation not only greatly expands the application scope of ceramic materials, but also spawns a large number of in-depth studies on the silver plating process and its subsequent quality inspection technology.

[0003] However, it is worth noting that although many scientific researchers have made significant progress in optimizing the silver plating process in recent years, the research on the detection technology of silver-plated ceramic sheets is relatively lagging behind. For example, the patent application with publication number CN208818732U in the prior art mainly focuses on the conductivity performance test of piezoelectric ceramics, and does not propose an effective conductivity detection method or device for the special needs of silver-plated ceramic sheets.

[0004] In addition, the current process standards have clear requirements for key parameters such as the thickness and hardness of single-layer silver plating. In the process of silver plating of ceramic sheets, especially when the contact area of ​​the silver plating is small, the coating is prone to quality problems such as incomplete coverage and silver plating breakage. These subtle defects, due to the limitation of the contact area, make the existing detection methods face challenges in detecting the conductivity between the two layers of silver plating on micro-contact silver-plated ceramic sheets, and it is difficult to accurately capture possible problems in the silver plating process. Summary of the invention

[0005] Based on this, it is necessary to provide a micro-contact silver-plated ceramic sheet conduction detection device and system to address the current problem that the conduction performance of the micro-contact silver-plated ceramic sheet cannot be detected.

[0006] In the first aspect, the present application provides a micro-contact silver-plated ceramic sheet conduction detection device. The device includes a base, a fixture and a probe fixture, the base is formed with a detection part for placing the silver-plated ceramic sheet to be tested and a fixing part for fixing the fixture, the detection part is provided with a first probe and a second probe, one side of the probe fixture is provided with a third probe and a fourth probe, the other side of the probe fixture is fixed to the clamping end of the fixture by bolts, and the clamping end of the fixture is located above the detection part.

[0007] Furthermore, the detection portion is provided with a groove, and the groove is provided with a first probe mounting hole and a second probe mounting hole.

[0008] Furthermore, the detection part is provided with a step for supporting the silver-plated ceramic sheet to be tested.

[0009] Furthermore, the detection portion is provided with openings in both the horizontal direction and the vertical direction.

[0010] Further, the first probe, the second probe, the third probe and the fourth probe are all telescopic probes.

[0011] Furthermore, the clamp is a double-head vertical quick clamp.

[0012] Furthermore, the probe fixing member is a PCB fixing plate.

[0013] Furthermore, the fixing portion includes a plurality of fixing holes for fixing the clamp.

[0014] Furthermore, the base is made of polytetrafluoroethylene.

[0015] In a second aspect, the present application provides a micro-contact silver-plated ceramic sheet conduction detection system. The system comprises the micro-contact silver-plated ceramic sheet conduction detection device and a low resistance measuring instrument as described in the first aspect, wherein four probes in the micro-contact silver-plated ceramic sheet conduction detection device are connected to the low resistance measuring instrument.

[0016] The above-mentioned micro-contact silver-plated ceramic sheet conduction detection device and system are provided with a first probe and a second probe on the detection part of the base, and a third probe and a fourth probe are fixed at the clamping end of the fixture through a probe fixing piece. When the silver-plated ceramic sheet to be tested is placed on the detection part, the first probe and the second probe can contact one side of the silver-plated ceramic sheet to be tested, and then by moving the fixture, the third probe and the fourth probe can contact the other side of the silver-plated ceramic sheet to be tested, and then the Kelvin four-wire method is used to connect the four probes to the low resistance measuring instrument to realize the detection of the conduction performance of the silver-plated ceramic sheet; the device can detect the goodness of the conduction between the front and back sides of the silver-plated ceramic sheet, so as to timely reflect the problems existing in the silver plating process. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the structure of a micro-contact silver-plated ceramic sheet conduction detection device in one embodiment;

[0018] Figure 2 is a top view of a base structure in one embodiment;

[0019] Figure 3 A side view of a micro-contact silver-plated ceramic sheet conduction detection device in an embodiment during actual measurement;

[0020] Figure 4is a schematic diagram of the base size in one embodiment;

[0021] Figure 5 It is a front view of a silver-plated ceramic sheet to be tested in an embodiment, which is placed on the left side of a groove in a micro-contact silver-plated ceramic sheet conduction detection device;

[0022] Figure 6 It is a front view of a silver-plated ceramic sheet to be tested in an embodiment, which is placed on the right side of a groove in a micro-contact silver-plated ceramic sheet conduction detection device;

[0023] Figure 7 A schematic diagram of the structure of a micro-contact silver-plated ceramic sheet conduction detection system in one embodiment;

[0024] Description of Figure Numbers:

[0025] Base 1; fixture 2; probe fixing part 3; first probe 4; second probe 5; third probe 6; fourth probe 7; silver-plated ceramic piece to be tested 8; detection part 11; fixing part 12; groove 111; first probe mounting hole 112; second probe mounting hole 113; step 114; opening 115; fixing hole 121. DETAILED DESCRIPTION

[0026] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.

[0027] Example 1

[0028] See also Figures 1 to 3 , Figure 1 A schematic structural diagram of a micro-contact silver-plated ceramic sheet conduction detection device in one embodiment of the present invention is shown, including a base, a fixture and a probe fixing member, the base is formed with a detection portion for placing the silver-plated ceramic sheet to be tested and a fixing portion for fixing the fixture, the detection portion is provided with a first probe and a second probe, a third probe and a fourth probe are provided on one side of the probe fixing member, and the other side of the probe fixing member is fixed to the clamping end of the fixture by bolts, and the clamping end of the fixture is located above the detection portion.

[0029] Among them, the base is made of polytetrafluoroethylene material, which has good insulation, high temperature resistance, low temperature resistance and chemical corrosion resistance. Figure 2 A top view of the base is shown, as Figure 2 As shown, the base is formed with a detection portion for placing the silver-plated ceramic sheet and a fixing portion for fixing the fixture.

[0030] In particular, the first probe and the second probe can be telescopic probes, and a groove is designed in the detection part to cooperate with the telescopic probe, so that only a part of the telescopic probe is exposed above the head. When the telescopic probe is contacted, a part of it will be retracted back, thereby ensuring good contact. Specifically, a first probe mounting hole and a second probe mounting hole are provided in the groove, which are used to install the first probe and the second probe, respectively. Furthermore, the detection part is also provided with a step, and the design of the step serves to support and fix the silver-plated ceramic sheet to be tested. In addition, the detection part is also provided with openings in the vertical and horizontal directions for facilitating the picking up and moving of the silver-plated ceramic sheet.

[0031] The clamp is a double-head vertical quick clamp, which is fixed to the base through a plurality of fixing holes arranged on the fixing part, and the clamping end of the clamp is located above the detection part.

[0032] Preferably, the probe fixing member is a PCB fixing plate, the third probe and the fourth probe can be directly welded to the side of the PCB fixing plate facing the detection part, and the other side of the PCB fixing plate away from the detection part can be fixed to the clamping end of the fixture by bolts or other fasteners, so as to fix the third probe and the fourth probe to the clamping end of the fixture, ensuring stability and reliability during the detection process. Furthermore, the third probe and the fourth probe can both be telescopic probes.

[0033] The positions of the third probe and the fourth probe on the PCB fixing plate can be changed. When the silver-plated position of one side of the silver-plated ceramic sheet to be tested changes, the conduction detection of the silver-plated ceramic sheet to be tested can also be achieved by changing the positions of the third probe and the fourth probe on the PCB fixing plate. In addition, the probe fixing member can not only be a PCB fixing plate, but also can be made of the same polytetrafluoroethylene material or other insulating materials as the base.

[0034] During the test, the wrench on the fixture can be moved. When the wrench is in a vertical position, such as Figure 3 As shown, the first probe and the second probe can contact one side of the silver-plated ceramic sheet to be tested, and the third probe and the fourth probe can contact the other side of the silver-plated ceramic sheet to be tested. After the low resistance measuring instrument is connected to the first probe, the second probe, the third probe and the fourth probe, the resistance value of the silver plating between the upper and lower layers of the ceramic sheet can be measured. After the measurement is completed, the wrench is pulled away from the probe, and the third probe and the fourth probe can be disconnected from the silver-plated ceramic sheet to be tested.

[0035] The micro-contact silver-plated ceramic sheet conduction detection device of this embodiment is provided with a first probe and a second probe on the detection part of the base, and a third probe and a fourth probe are fixed to the clamping end of the fixture through a probe fixing piece. When the silver-plated ceramic sheet to be tested is placed on the detection part, the first probe and the second probe can contact one side of the silver-plated ceramic sheet to be tested, and then by moving the fixture, the third probe and the fourth probe can contact the other side of the silver-plated ceramic sheet to be tested, and then the four probes are connected to the low resistance measuring instrument using the Kelvin four-wire method to realize the detection of the conduction performance of the silver-plated ceramic sheet; the device can detect the goodness of conduction between the front and back sides of the silver-plated ceramic sheet, so as to timely reflect the problems existing in the silver plating process.

[0036] Example 2

[0037] Figure 4 The schematic diagram of the dimensions of the base in one embodiment of the present invention is shown in detail. Figure 4 As shown, the overall size of the base is 140mm long and 100mm wide, and the opening on the base is set to be 10mm wide. The first probe hole mounting hole and the second probe mounting hole are arranged close to each other, and the centers of the two mounting holes are located on the center line of the horizontal opening of the base and are 42.5mm away from the edge of the base. The vertical projections of the centers of the third probe and the fourth probe on the base groove are located on the center line along the length direction of the base, and are 17mm apart from the centers of the first probe and the second probe. At the same time, the radius of the vertical projection from the side of the step close to the inside of the groove is 20.7mm, and the radius from the side of the step away from the inside of the groove is 23.7mm. The fixing part of the base includes four fixing holes, and the four fixing holes are in a rectangular array. The distance between the two fixing holes in the horizontal direction is 34mm, and the distance between the two fixing holes in the vertical direction is 24mm. Among them, the radius of the fixing hole is 4mm and the diameter is 8mm.

[0038] The base can simultaneously measure the conductivity of the silver plating at two locations of the silver-plated ceramic sheet to be tested. Specifically, the silver-plated ceramic sheet to be tested can be moved horizontally in the detection part of the base to change the detection position. For example, when the silver-plated ceramic sheet to be tested is placed in a Figure 5 When the silver-plated ceramic piece to be tested is placed in the position shown in Figure 6 When the silver-plated ceramic sheet is at another position shown, the resistance of the silver-plated ceramic sheet between the upper and lower layers at another position can also be measured. Thus, the silver-plated conductivity at two locations of the silver-plated ceramic sheet to be tested is measured by translating the silver-plated ceramic sheet to be tested, further improving the reliability of the test results. In addition, when the silver-plated ceramic sheet to be tested is of different shapes, those skilled in the art can change the groove size and the position of the probe mounting hole according to the shape of the silver-plated ceramic sheet to be tested to ensure the test effect.

[0039] Example 3

[0040] See also Figure 7 , Figure 7 The schematic diagram of the structure of a micro-contact silver-plated ceramic sheet conduction detection system in one embodiment of the present invention is shown. The system includes a micro-contact silver-plated ceramic sheet conduction detection device and a low resistance measuring instrument.

[0041] Specifically, the low resistance meter adopts the Kelvin four-wire connection method, and measures the resistance between the front and back sides of the ceramic sheet by connecting the four probes in the micro-contact silver-plated ceramic sheet conduction detection device. Among them, the Kelvin four-wire method measures the resistance through line contact, which can prevent poor contact. In actual operation, after the silver-plated ceramic sheet to be tested is placed in the detection part on the base, the wrench on the fixture is pulled. When the contacts of the four probes contact the silver-plated ceramic sheet to be tested at the same time, the low resistance meter will obtain the resistance between the silver-plated positions. By comparing and analyzing the measured resistance values, it is possible to accurately judge whether the conduction performance of the silver-plated layer is good. Generally speaking, the higher the conductivity of the silver plating, the smaller the resistance and the stronger the current conduction ability.

[0042] The micro-contact silver-plated ceramic sheet conductivity detection system of this embodiment uses a low resistance measuring instrument to connect four probes in the micro-contact silver-plated ceramic sheet conductivity detection device to perform conductivity detection on the silver-plated ceramic sheet, which can avoid poor contact and thus improve the efficiency and reliability of detection.

[0043] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0044] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A micro-contact silver-plated ceramic sheet conduction detection device, characterized in that: The device includes a base, a fixture and a probe fixing part. The base is formed with a detection part for placing the silver-plated ceramic piece to be tested and a fixing part for fixing the fixture. The detection part is provided with a first probe and a second probe. One side of the probe fixing part is provided with a third probe and a fourth probe. The other side of the probe fixing part is fixed to the clamping end of the fixture by bolts. The clamping end of the fixture is located above the detection part.

2. The micro-contact silver-plated ceramic sheet conduction detection device according to claim 1, characterized in that: The detection part is provided with a groove, and the groove is provided with a first probe installation hole and a second probe installation hole.

3. The micro-contact silver-plated ceramic sheet conduction detection device according to claim 2, characterized in that: The detection part is provided with a step for supporting the silver-plated ceramic sheet to be tested.

4. The micro-contact silver-plated ceramic sheet conduction detection device according to claim 3, characterized in that: The detection portion is provided with openings in both the horizontal direction and the vertical direction.

5. The micro-contact silver-plated ceramic sheet conduction detection device according to claim 1, characterized in that: The first probe, the second probe, the third probe and the fourth probe are all telescopic probes.

6. The micro-contact silver-plated ceramic sheet conduction detection device according to claim 1, characterized in that: The clamp is a double-head vertical quick clamp.

7. The micro-contact silver-plated ceramic sheet conduction detection device according to claim 1, characterized in that: The probe fixing member is a PCB fixing plate.

8. The micro-contact silver-plated ceramic sheet conduction detection device according to claim 1, characterized in that: The fixing portion includes a plurality of fixing holes for fixing the clamp.

9. The micro-contact silver-plated ceramic sheet conduction detection device according to claim 1, characterized in that: The material of the base is polytetrafluoroethylene.

10. A micro-contact silver-plated ceramic sheet conduction detection system, characterized in that: It comprises a micro-contact silver-plated ceramic sheet conduction detection device and a low resistance measuring instrument as described in any one of claims 1 to 9, wherein four probes in the micro-contact silver-plated ceramic sheet conduction detection device are connected to the low resistance measuring instrument.

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