Sandwich structure for micro-electro-mechanical system micromirror

Abstract

The invention relates to a sandwich structure for a micro-electro-mechanical system micromirror. A micro-electro-mechanical system (MEMS) mirror device includes: a frame defining a frame cavity; a suspension assembly; and a mirror body coupled to the frame by a suspension assembly such that the mirror body is suspended above the frame cavity. The mirror body includes a sandwich structure including a front plate, a back plate, and a hollow core assembly disposed between the front plate and the back plate. The front plate and the back plate define a thickness dimension of the mirror body. The hollow core assembly includes a plurality of support structures extending between the front plate and the rear plate and defining a plurality of cavities between the front plate and the rear plate.

Description

Background Art

[0001] The scanning system can use two-dimensional scanning to scan one or more light beams within a field of view (FOV) according to a scanning pattern. The scanning system can use two scanning axes, including a first scanning axis and a second scanning axis, the first scanning axis being configured to steer the one or more light beams in a first direction at a first scanning frequency, and the second scanning axis being configured to steer the one or more light beams in a second direction at a second scanning frequency. The second scanning axis is typically perpendicular to the first scanning axis. Different scanning patterns can be obtained by using different fixed frequency ratios between the first scanning frequency and the second scanning frequency. Synchronizing the first scanning frequency with the second scanning frequency to maintain the fixed frequency ratio is important for maintaining a specific scanning pattern during the scanning operation. Summary of the invention

[0002] In some embodiments, a microelectromechanical system (MEMS) mirror device includes: a frame defining a frame cavity; a suspension assembly; and a mirror body coupled to the frame via the suspension assembly so that the mirror body is suspended above the frame cavity, wherein the mirror body includes a sandwich structure, the sandwich structure includes a front plate, a back plate, and a hollow core assembly arranged between the front plate and the back plate, wherein the front plate and the back plate define a thickness dimension of the mirror body, and wherein the hollow core assembly includes a plurality of support structures extending between the front plate and the back plate and defining a plurality of cavities between the front plate and the back plate.

[0003] In some embodiments, an oscillator device includes: a frame defining a frame cavity; a suspension component; and an oscillator body coupled to the frame via the suspension component so that the oscillator body is suspended above the frame cavity, wherein the oscillator body is configured to oscillate around one or more rotation axes, wherein the oscillator body includes a sandwich structure, the sandwich structure includes a front plate, a back plate arranged opposite to the front plate, and a hollow core component arranged between the front plate and the back plate, wherein the hollow core component includes a plurality of support structures extending between the front plate and the back plate and defining a plurality of cavities between the front plate and the back plate, and wherein the hollow core component is configured to reduce dynamic deformation of the oscillator body during oscillation of the oscillator body around the one or more rotation axes, and enable the oscillator body to oscillate at a resonant frequency greater than 10 kHz. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] Implementations are described herein with reference to the accompanying drawings.

[0005] Figure 1A is a schematic block diagram of a two-dimensional (2D) scanning system according to one or more implementations.

[0006] Figure 1Bis a schematic block diagram of a 2D scanning system according to one or more implementations.

[0007] Figure 2A The front side and back side of a MEMS mirror device are shown according to one or more implementations.

[0008] Figure 2B A cross section of a MEMS mirror device is shown in accordance with one or more implementations.

[0009] Figure 3A A plan view (top view) of a first hollow core component of a MEMS mirror device is shown in accordance with one or more implementations.

[0010] Figure 3B A plan view (top view) of a second hollow core component of a MEMS mirror device is shown in accordance with one or more implementations.

[0011] Figure 3C A plan view (top view) of a third hollow core assembly of a MEMS mirror device is shown in accordance with one or more implementations.

[0012] Figure 3D A plan view (top view) of a fourth hollow core assembly of a MEMS mirror device is shown in accordance with one or more implementations.

[0013] Figure 4A A cross section of a MEMS mirror device is shown in accordance with one or more implementations.

[0014] Figure 4B A cross section of a MEMS mirror device is shown in accordance with one or more implementations.

[0015] Figure 4C A cross section of a MEMS mirror device is shown in accordance with one or more implementations.

[0016] Figure 4D A cross section of a MEMS mirror device is shown in accordance with one or more implementations.

[0017] FIG. 5A to FIG. 5D A process flow involving a method of manufacturing a MEMS mirror device according to one or more implementations is shown.

[0018] Fig. 6A and Figure 6B A process flow involving a method of manufacturing a MEMS mirror device according to one or more implementations is shown. DETAILED DESCRIPTION

[0019] Below, details are set forth to provide a more thorough description of example implementations. However, it should be clear to those skilled in the art that these implementations can be practiced without these specific details. In other examples, in order to avoid confusing the implementations, well-known structures and devices are shown in block diagram form or in schematic diagrams rather than in detail. In addition, the features of the different implementations described below can be combined with each other unless otherwise specifically noted.

[0020] In addition, in the following description, equivalent or similar elements or elements having equivalent or similar functions are indicated by equivalent or similar reference numerals. Since identical or functionally equivalent elements are given the same reference numerals in the drawings, repeated descriptions of the elements provided with the same reference numerals may be omitted. Therefore, the descriptions provided for the elements having the same or similar reference numerals are mutually interchangeable.

[0021] Each of the illustrated x-axis, y-axis, and z-axis is substantially perpendicular to the other two axes. In other words, the x-axis is substantially perpendicular to the y-axis and the z-axis, the y-axis is substantially perpendicular to the x-axis and the z-axis, and the z-axis is substantially perpendicular to the x-axis and the y-axis. In some cases, a single reference numeral is shown to refer to a surface, or nearly all instances of a component may be labeled with all surfaces of the component. All instances of a component may include associated surfaces of the component, although not every surface is labeled.

[0022] The orientation of various elements in the figure is shown as an example, and the illustrated example can be rotated relative to the depicted orientation. The description provided herein and the subsequent claims relate to any structure with the described relationship between various features, regardless of whether the structure is in the specific orientation of the figure, or rotated relative to such an orientation. Similarly, for the convenience of description, spatially relative terms (such as, "top", "bottom", "below", "below", "below", "above", "above", "middle", "left" and "right") are used in this article to describe the relationship between an element and one or more other elements as illustrated in the figure. Spatially relative terms are intended to cover different orientations of elements, structures and / or components in use or operation in addition to the orientation depicted in the figure. Structure and / or components can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used in this article can be interpreted accordingly. In addition, in order to simplify the figure, the cross-sectional view in the figure only shows the features in the cross-sectional plane, and the material behind the cross-sectional plane is not shown, unless otherwise indicated.

[0023] It should be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or there can be intervening elements. Conversely, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.).

[0024] In the implementations described herein or shown in the figures, any direct electrical connection or coupling (e.g., any connection or coupling without additional intermediate elements) may also be implemented by an indirect connection or coupling (e.g., a connection or coupling with one or more additional intermediate elements, or vice versa), as long as the general purpose of the connection or coupling (e.g., for transmitting a certain type of signal or transmitting a certain type of information) is substantially maintained. Features in different implementations may be combined to form further implementations. For example, changes or modifications described with respect to one of the implementations may also apply to other implementations unless otherwise indicated.

[0025] As used herein, the terms "substantially" and "approximately" mean "within reasonable tolerances of manufacturing and measurement." For example, without departing from aspects of the implementations described herein, the terms "substantially" and "approximately" may be used herein to illustrate small manufacturing tolerances or other factors (e.g., within 5%) that are considered acceptable in the industry. For example, a resistor having an approximate resistance value may actually have a resistance within 5% of the approximate resistance value. As another example, a signal having an approximate signal value may actually have a signal value within 5% of the approximate signal value.

[0026] In the present disclosure, words including ordinal numbers (such as "first", "second", etc.) can modify various elements. However, such elements are not limited by such words. For example, such words do not limit the sequence and / or importance of elements. Instead, these words are used only for the purpose of distinguishing an element from other elements. For example, a first box and a second box indicate different boxes, although both are boxes. For other examples, without departing from the scope of the present disclosure, a first element may be referred to as a second element, and similarly, a second element may also be referred to as a first element.

[0027] A microelectromechanical system (MEMS) mirror can be driven around two or more scanning axes to be used as a scanning device. Alternatively, two MEMS mirrors driven around respective scanning axes can be optically coupled to form a scanning system. A beam scanner based on a MEMS mirror is a way to implement image projection technology and object detection technology such as light detection and ranging (LIDAR). These technologies can rely on a two-dimensional (2D) scanning pattern such as a Lissajous scanning pattern that relies on accurately synchronized scanning axes driven at a scanning frequency with a fixed frequency ratio.

[0028] Scanning speed and optical resolution are key performance criteria for display applications and image projection technology. Resonant MEMS micromirrors for high-definition display applications need to operate at high frequencies (e.g., frequencies greater than 10kHz, greater than 15kHz, or even greater than 20kHz). In addition, the resonant MEMS micromirrors may need to achieve a maximum tilt amplitude greater than 10° in order to obtain the desired projection range or field of view.

[0029] Depending on the mass of the mirror plate of the resonant MEMS micromirror, driving the resonant MEMS micromirror at a high frequency greater than 10 kHz and a maximum tilt amplitude greater than 10° may be difficult to achieve. In other words, the higher the mass, the more difficult it may be to achieve a resonant frequency greater than 10 kHz with a maximum tilt amplitude greater than 10°. Therefore, the mirror plate should be made as light as possible to reduce the inertia of the mirror plate during resonance so as to enable a resonant frequency greater than 10 kHz and a maximum tilt amplitude greater than 10°. However, the stiffness or rigidity of a lighter mirror plate is generally less than that of a heavier mirror plate. As a result, a lighter mirror plate may be more easily dynamically deformed than a heavier mirror plate. Therefore, it may be difficult to achieve a desired optical resolution by driving a combination of a resonant MEMS micromirror at a high frequency greater than 10 kHz and a maximum tilt amplitude greater than 10°. For example, a combination of driving a resonant MEMS micromirror at a high frequency greater than 10 kHz and a maximum tilt amplitude greater than 10° may result in a high acceleration load on the mirror plate. In this case, high acceleration loads can cause significant deformation of the mirror plate (dynamic deformation), which can have a negative impact on the optical resolution. Therefore, the mirror plate should be rigid enough to prevent dynamic deformation to achieve the desired optical resolution, but lightweight enough to enable a resonant frequency greater than 10 kHz at a maximum tilt amplitude greater than 10°.

[0030] Some implementations disclosed herein relate to a MEMS micromirror having a mirror body, which is constructed as a sandwich structure including a hollow core assembly between two panels. Such a construction forms a lightweight and rigid mirror body, which in turn enables the mirror body to operate at high frequencies due to the reduced mass of the mirror body. In addition, the sandwich structure prevents or reduces deformation (e.g., caused by dynamic deformation) that may otherwise occur due to high oscillation speeds and / or large maximum tilt angles. Therefore, the MEMS micromirror can operate at high frequencies without being damaged by dynamic deformation. As a result, higher optical resolution can be achieved with the MEMS micromirror. For example, the hollow core assembly can enable the mirror body to oscillate at a resonant frequency greater than 10 kHz, with reduced inertia and reduced dynamic deformation. In addition, the hollow core assembly can enable the mirror body to oscillate a maximum tilt amplitude greater than 10°.

[0031] Figure 1A 1 is a schematic block diagram of a 2D scanning system 100A according to one or more implementations. In particular, the 2D scanning system 100A includes a MEMS mirror 102 implemented as a single scanning structure, the MEMS mirror being configured to steer or otherwise deflect a light beam according to a 2D scanning pattern. The 2D scanning system 100A also includes a MEMS driver system 104, a system controller 106, and an optical transmitter 108.

[0032] exist Figure 1A In the example shown in , the MEMS mirror 102 is a mechanically movable mirror (e.g., a MEMS micromirror) integrated on a semiconductor chip (not shown). The MEMS mirror 102 is configured to rotate or oscillate via rotation around two scanning axes (e.g., two rotation axes) that are generally orthogonal to each other. For example, the two scanning axes may include a first scanning axis 110 and a second scanning axis 112, the first scanning axis enabling the MEMS mirror 102 to manipulate light in a first scanning direction (e.g., the x-direction), and the second scanning axis enabling the MEMS mirror 102 to manipulate light in a second scanning direction (e.g., the y-direction). Therefore, the MEMS mirror 102 can guide a light beam in two dimensions according to a 2D scanning pattern and can be referred to as a 2D MEMS mirror.

[0033] Scanning can be performed to illuminate an area referred to as a field of view. Scanning (such as an oscillating horizontal scan (e.g., from left to right and from right to left of the field of view), an oscillating vertical scan (e.g., from bottom to top and from top to bottom of the field of view), or a combination thereof (e.g., a Lissajous scan or a raster scan) can illuminate the field of view in a continuous scanning manner. In some implementations, the 2D scanning system 100A can be configured to transmit a continuous light beam (e.g., as a continuous light pulse) in different scanning directions to scan the field of view. In some implementations, the 2D scanning system 100A can be configured to transmit a continuous light beam (e.g., as a frequency modulated continuous wave (FMCW)) in different scanning directions to scan the field of view. In other words, the field of view can be illuminated by a scanning operation. In general, the entire field of view represents a scanning area defined by the entire range of motion of the MEMS mirror 102. Therefore, the entire field of view is outlined by a left edge, a right edge, a bottom edge, and a top edge. The entire field of view can also be referred to as an illumination field or a projection area in a projection plane onto which an image is projected.

[0034] The MEMS mirror 102 can direct the transmitted light beam to a desired 2D coordinate (e.g., xy coordinate) in the field of view. In some implementations (such as LIDAR implementations), the MEMS mirror 102 can be arranged to receive a light beam transmitted from the optical transmitter 108 and manipulate (scan) the transmitted light beam into the field of view to perform an environmental scan. The transmitted light beam can be backscattered by one or more objects toward the 2D scanning system 100A as a reflected light beam, where the reflected light beam is detected by a sensor. For example, the sensor can be an array of photodetectors. The sensor can convert each reflected light beam into an electrical signal (e.g., a current signal or a voltage signal), which can be further processed by the 2D scanning system 100A to generate object data or an image. In such an implementation, the desired 2D coordinate can correspond to a specific transmission direction in the field of view, and the transmitted light beam is aimed at the specific transmission direction for object detection, where different 2D coordinates correspond to different transmission directions.

[0035] Alternatively, in some implementations (such as an image projection system), the desired 2D coordinates may correspond to image pixels of a projected image, where different 2D coordinates correspond to different image pixels of the projected image. In some implementations, the image projection system may include wearable augmented reality goggles, and the MEMS mirror 102 may be arranged to receive the transmitted light beam and steer (scan) the transmitted light beam onto the retina of the human eye to render an image thereon. In some implementations, the image projection system may include a head-up display (HUD), and the MEMS mirror 102 may be arranged to receive the transmitted light beam and steer (scan) the transmitted light beam onto a display screen.

[0036] Therefore, multiple light beams or a continuous light beam transmitted at different transmission times can be steered to different 2D coordinates of the field of view according to a 2D scanning pattern by the MEMS mirror 102. By changing the deflection angle of the MEMS mirror 102 on each of the first scanning axis 110 and the second scanning axis 112, the MEMS mirror 102 can be used to scan the field of view in both scanning directions.

[0037] The rotation of the MEMS mirror 102 around the first scan axis 110 can be performed between two predetermined extreme deflection angles (e.g., + / -5 degrees, + / -15 degrees, etc.). Similarly, the rotation of the MEMS mirror 102 around the second scan axis 112 can be performed between two predetermined extreme deflection angles (e.g., + / -5 degrees, + / -15 degrees, etc.). In some implementations, depending on the 2D scan pattern, the two predetermined extreme deflection angles for the first scan axis 110 can be the same as the two predetermined extreme deflection angles for the second scan axis 112. In some implementations, depending on the 2D scan pattern, the two predetermined extreme deflection angles for the first scan axis 110 can be different from the two predetermined extreme deflection angles for the second scan axis 112.

[0038] In some implementations, the MEMS mirror 102 may be a resonator (e.g., a resonant MEMS mirror) configured to oscillate left-right around the first scan axis 110 at a first frequency (e.g., a first resonant frequency) and configured to oscillate up-and-down around the second scan axis 112 at a second frequency (e.g., a second resonant frequency). Thus, the MEMS mirror 102 may be continuously driven around the first scan axis 110 and the second scan axis 112 to perform a continuous scanning operation. As a result, the light beam reflected by the MEMS mirror 102 is scanned into the field of view according to a 2D scanning pattern.

[0039] Different frequencies or the same frequency can be used for the first scanning axis 110 and the second scanning axis 112 to define a 2D scanning pattern. For example, a raster scanning pattern or a Lissajous scanning pattern can be implemented by using different frequencies for the first frequency and the second frequency. Raster scanning and Lissajous scanning are two types of scanning that can be implemented in display applications, light scanning applications, and light manipulation applications (to name a few). As an example, Lissajous scanning is usually performed using two resonant scanning axes that are driven at different constant scanning frequencies with a defined fixed frequency ratio between these frequencies that form a specific Lissajous pattern and frame rate. In order to correctly perform Lissajous scanning and raster scanning, synchronization of the two scanning axes is performed by the system controller 106 in conjunction with the transmission timing of the optical transmitter 108.

[0040] For each corresponding scanning axis (including the first scanning axis 110 and the second scanning axis 112), the MEMS mirror 102 includes an actuator structure for driving the MEMS mirror 102 around the corresponding scanning axis. Each actuator structure may include an interdigital electrode made of an interdigital mirror comb and a frame comb, and a driving voltage (e.g., an actuation signal or a drive signal) is applied to the interdigital electrode by the MEMS driver system 104. A potential difference is applied between the staggered mirror combs and the frame combs to form a driving force between the mirror combs and the frame combs, and the driving force forms a torque around the desired scanning axis on the mirror body of the MEMS mirror 102. The driving voltage can jump (toggle) between two voltages to obtain an oscillating driving force. The oscillating driving force causes the MEMS mirror 102 to oscillate back and forth on the corresponding scanning axis between two extremes. Depending on the configuration, the actuation can be adjusted or adjusted by adjusting the driving voltage off time, the voltage level of the driving voltage (e.g., a high voltage (HV) level), or the duty cycle.

[0041] In other examples, the MEMS mirror 102 can use other actuation methods to drive the MEMS mirror 102 around the corresponding scanning axis. For example, these other actuation methods can include electromagnetic actuation, piezoelectric actuators, or thermal actuators. In electromagnetic actuation, the MEMS mirror 102 can be immersed in a magnetic field, and an alternating current through a conductive path can form an oscillating torque around the scanning axis. A piezoelectric actuator can be integrated into a leaf spring of the MEMS mirror 102, or the leaf spring can be made of piezoelectric material to generate an alternating beam bending force in response to an electrical signal to generate an oscillating torque. Piezoelectricity is an electric charge accumulated in certain solid materials and generates an electric potential between opposing electrodes.

[0042] The MEMS driver system 104 is configured to generate a drive signal (e.g., an actuation signal) to drive the MEMS mirror 102 about a first scan axis 110 and a second scan axis 112. In particular, the MEMS driver system 104 is configured to apply the drive signal to an actuator structure of the MEMS mirror 102. In some implementations, the MEMS driver system 104 includes a first MEMS driver 114 configured to drive the MEMS mirror 102 about the first scan axis 110 and a second MEMS driver 116 configured to drive the MEMS mirror 102 about the second scan axis 112. In implementations where the MEMS mirror 102 is used as an oscillator, the first MEMS driver 114 is configured to drive the oscillation of the MEMS mirror 102 about the first scan axis 110 at a first frequency, and the second MEMS driver 116 is configured to drive the oscillation of the MEMS mirror 102 about the second scan axis 112 at a second frequency.

[0043] The first MEMS actuator 114 may be configured to sense a first rotational position of the MEMS mirror 102 about the first scanning axis 110 and provide first position information indicating the first rotational position (e.g., a tilt angle or a rotation degree about the first scanning axis 110) to the system controller 106. Similarly, the second MEMS actuator 116 may be configured to sense a second rotational position of the MEMS mirror 102 about the second scanning axis 112 and provide second position information indicating the second rotational position (e.g., a tilt angle or a rotation degree about the second scanning axis 112) to the system controller 106.

[0044] The system controller 106 may use the first position information and the second position information to trigger the light beam at the optical transmitter 108. For example, the system controller 106 may use the first position information and the second position information to set the transmission time of the optical transmitter 108 so as to aim at a specific 2D coordinate of the 2D scanning pattern. Therefore, the higher accuracy of the position sensing of the MEMS mirror 102 by the first MEMS actuator 114 and the second MEMS actuator 116 may result in the system controller 106 providing more accurate and precise control of other components of the 2D scanning system 100A.

[0045] As noted above, the first MEMS driver 114 and the second MEMS driver 116 can apply a drive voltage to the corresponding actuator structure of the MEMS mirror 102 as a drive signal for driving the MEMS mirror 102 to rotate (e.g., oscillate) around a corresponding scanning axis (e.g., the first scanning axis 110 or the second scanning axis 112). The drive voltage can switch or jump between an HV level and a low voltage (LV) level to obtain an oscillating driving force. In some implementations, the LV level can be zero (e.g., the drive voltage), but is not limited to this and can be a non-zero value. When the drive voltage jumps between the HV level and the LV level and the LV level is set to zero, it can be said that the drive voltage is jumped on and off (HV on / off). The oscillating driving force causes the MEMS mirror 102 to oscillate back and forth on the first scanning axis 110 or the second scanning axis 112 between two extreme values. The drive voltage may be a constant drive voltage, meaning that the drive voltage is the same voltage when actuated (e.g., jumped on), or one or both of the HV level or LV level of the drive voltage may be adjustable. However, it should be understood that the drive voltage is jumping between the HV level and the LV level in order to produce the mirror oscillation. Depending on the configuration, the actuation may be adjusted or regulated by the system controller 106 by adjusting the drive voltage off time, the voltage level of the drive voltage, or the duty cycle. As noted above, the frequency and phase of the drive voltage may also be regulated and adjusted.

[0046] In some implementations, the system controller 106 is configured to set the drive frequency of the MEMS mirror 102 for each scan axis and is capable of synchronizing the oscillations about the first scan axis 110 and the second scan axis 112. In particular, the system controller 106 can be configured to control the actuation of the MEMS mirror 102 about each scan axis by controlling the drive signal. The system controller 106 can control the frequency, phase, duty cycle, HV level, and / or LV level of the drive signal to control the actuation about the first scan axis 110 and the second scan axis 112. The actuation of the MEMS mirror 102 about a particular scan axis controls its range of motion and scan rate about that particular scan axis.

[0047] For example, in order to cause the Lissajous scan pattern to reproduce itself periodically at a frame rate frequency, the first frequency at which the MEMS mirror 102 is driven about the first scan axis 110 is different from the second frequency at which the MEMS mirror 102 is driven about the second scan axis 112. The difference between the first frequency and the second frequency is set by a fixed frequency ratio, which is used by the 2D scanning system 100A to form a repeatable Lissajous pattern (frame) at a frame rate. A new frame begins each time the Lissajous scan pattern restarts, which may occur when the phase difference between the mirror phase about the first scan axis 110 and the mirror phase about the second scan axis 112 is zero. The system controller 106 may set the fixed frequency ratio based on the first position information and the second position information received from the first MEMS actuator 114 and the second MEMS actuator 116, respectively, and synchronize the oscillations about the first scan axis 110 and the second scan axis 112 to ensure that the fixed frequency ratio is maintained.

[0048] The optical transmitter 108 may include one or more light sources (such as one or more laser diodes or one or more light emitting diodes) for generating one or more light beams. In some implementations, the optical transmitter 108 may be configured to sequentially transmit multiple light beams (e.g., light pulses) as the MEMS mirror 102 changes its transmission direction so as to target different 2D coordinates. Depending on the application of the 2D scanning system 100A, the multiple light beams may include visible light, infrared (IR) light, or other types of illumination signals. The transmission sequence of the multiple light beams and their timing may be implemented by the optical transmitter 108 according to a trigger signal received from the system controller 106. Alternatively, in some implementations, the optical transmitter 108 may be configured to transmit a continuous light beam as the MEMS mirror 102 changes its transmission direction so as to target different 2D coordinates. Depending on the application of the 2D scanning system 100A, the continuous light beam may include visible light, IR light, or another type of illumination signal.

[0049] The system controller 106 is configured to control the components of the 2D scanning system 100A. In some applications, the system controller 106 may also be configured to receive programming information relative to the 2D scanning pattern and control the timing of the plurality of light beams generated by the optical transmitter 108 based on the programming information. Thus, the system controller 106 may include a processing and control circuit device configured to generate control signals for controlling the optical transmitter 108, the first MEMS driver 114, and the second MEMS driver 116.

[0050] The system controller 106 is configured to set the driving frequency of the MEMS mirror 102 for the first scan axis 110 and the second scan axis 112, and is capable of synchronizing the oscillations about the first scan axis 110 and the second scan axis 112 to generate a 2D scan pattern. In some implementations using multiple beams, the system controller 106 can be configured to generate a trigger signal for triggering the optical transmitter 108 to generate the multiple beams. Using the trigger signal, the system controller 106 can control the transmission time of the multiple beams of the optical transmitter 108 to achieve a desired illumination pattern within the field of view. The desired illumination pattern is generated by a combination of the 2D scan pattern generated by the MEMS mirror 102 and the transmission time triggered by the system controller 106. In some implementations using a continuous beam, the system controller 106 can be configured to control the frequency modulation of the continuous beam via a control signal provided to the optical transmitter 108.

[0051] As indicated above, provide Figure 1A As an example. Other examples may differ from the Figure 1A In practice, without departing from the disclosure provided above, the 2D scanning system 100A may include Figure 1A The components shown in the figure may include additional components, fewer components, different components, or differently arranged components.

[0052] Figure 1B 1 is a schematic block diagram of a 2D scanning system 100B according to one or more implementations. In particular, the 2D scanning system 100B includes two MEMS mirrors (a first MEMS mirror 102a and a second MEMS mirror 102b) that are optically coupled in series to steer or otherwise deflect a light beam according to a 2D scanning pattern. The first MEMS mirror 102a and the second MEMS mirror 102b are similar to Figure 1A, except that the first MEMS mirror 102a and the second MEMS mirror 102b are each configured to rotate about a single scan axis instead of two scan axes. The first MEMS mirror 102a is configured to rotate about a first scan axis 110 to steer light in the x-direction, and the second MEMS mirror 102b is configured to rotate about a second scan axis 112 to steer light in the y-direction. Figure 1A 1. The MEMS mirrors 102 described in the drawings, the first MEMS mirror 102a and the second MEMS mirror 102b may be resonant MEMS mirrors configured to oscillate around the first scanning axis 110 and the second scanning axis 112, respectively.

[0053] Because each of the first MEMS mirror 102a and the second MEMS mirror 102b is configured to rotate around a single scanning axis, each of the first MEMS mirror 102a and the second MEMS mirror 102b is responsible for scanning light in one dimension. As a result, the first MEMS mirror 102a and the second MEMS mirror 102b can be referred to as one-dimensional (1D) MEMS mirrors. Figure 1B In the example shown in FIG. 1 , the first MEMS mirror 102a and the second MEMS mirror 102b are used together to steer the light beam in two dimensions. The first MEMS mirror 102a and the second MEMS mirror 102b are sequentially arranged along the transmission path of the light beam, so that one of the MEMS mirrors (e.g., the first MEMS mirror 102a) first receives the light beam and steers the light beam in the first dimension, and the other of the MEMS mirrors (e.g., the second MEMS mirror 102b) receives the light beam from the first MEMS mirror 102a and steers the light beam in the second dimension. Therefore, the first MEMS mirror 102a and the second MEMS mirror 102b operate together to steer the light beam generated by the optical transmitter 108 in two dimensions. In this way, the first MEMS mirror 102a and the second MEMS mirror 102b can guide the light beam to a desired 2D coordinate (e.g., xy coordinate) in the field of view. The plurality of light beams may be steered to different 2D coordinates of a 2D scanning pattern by the first MEMS mirror 102a and the second MEMS mirror 102b.

[0054] The MEMS driver system 104, the system controller 106, and the optical transmitter 108 are configured as described above with reference to Figure 1AThe first MEMS actuator 114 is electrically coupled to the first MEMS mirror 102a to drive the first MEMS mirror 102a around the first scanning axis 110, and senses the position of the first MEMS mirror 102a around the first scanning axis 110 to provide first position information to the system controller 106. Similarly, the second MEMS actuator 116 is electrically coupled to the second MEMS mirror 102b to drive the second MEMS mirror 102b around the second scanning axis 112, and senses the position of the second MEMS mirror 102b around the second scanning axis 112 to provide second position information to the system controller 106.

[0055] As indicated above, provide Figure 1B As an example. Other examples may differ from the Figure 1B In practice, without departing from the disclosure provided above, the 2D scanning system 100B may include Figure 1B The components shown in the figure may include additional components, fewer components, different components, or differently arranged components.

[0056] Figure 2A The front side and the back side of a MEMS mirror device 200 according to one or more implementations are shown. The MEMS mirror device 200 may include a frame 201 that is rotationally fixed. The frame 201 may be made of a semiconductor substrate. In addition, the frame 201 may be configured to define a frame cavity 202 or a frame recess, and the mirror body 203 is suspended above the frame cavity 202 or the frame recess by a suspension assembly. The suspension assembly is mechanically coupled to and between the frame 201 and the mirror body 203, and is configured to suspend the mirror body 203 above the frame cavity 202. Therefore, the mirror body 203 is connected to the frame 201 by the suspension assembly, so that the mirror body 203 is suspended above the frame cavity 202. Figure 2A In an example of the embodiment of the present invention, the suspension assembly includes a pair of torsion bars 204 or beams mechanically coupled to and between the frame 201 and the reflector body 203. The pair of torsion bars 204 may extend at least partially along one of the scanning axes 110 or 112. The reflector body 203 may be configured to oscillate by an actuation mechanism such as piezoelectric, electric, thermal, or electromagnetic. In addition, the reflector body may have a sandwich structure including a front plate, a back plate, and a hollow core assembly disposed between the front plate and the back plate.

[0057] As indicated above, provide Figure 2A As an example. Other examples may differ from the Figure 2A An example of description.

[0058] Figure 2BA cross section of a MEMS mirror device 200 is shown according to one or more implementations. The mirror body 203 has a sandwich structure including two panels, including a front plate 205 and a back plate 206, with a hollow core assembly between the front plate 205 and the back plate 206. The front plate 205 and the back plate 206 define a thickness dimension 209 of the mirror body 203. The hollow core assembly may include a plurality of support structures 207 (e.g., vertical struts or support beams extending between the two panels) that are spaced apart to define a plurality of cavities 208 between the front plate 205 and the back plate 206. The plurality of cavities 208 may be hollow interior regions disposed within the interior of the mirror body 203. In some implementations, the front plate 205, the back plate 206, and the hollow core assembly form a one-piece, unitary component.

[0059] When compared with a solid reflector body, the multiple cavities 208 enable the reflector body 203 to be manufactured with a reduced mass. At the same time, the multiple support structures 207 add stiffness and rigidity to the reflector body 203 to resist dynamic deformation. Therefore, the hollow core assembly enables the reflector body 203 to be both lightweight for high resonant frequencies greater than 10kHz and rigid enough to prevent dynamic deformation at high resonant frequencies. In other words, the hollow core assembly can enable the reflector body 203 to oscillate at a resonant frequency greater than 10kHz, with reduced inertia and reduced dynamic deformation. In some implementations, the multiple support structures 207 can be configured to reduce the dynamic deformation of the reflector body 203 during the oscillation of the reflector body 203 around one or more rotation axes. In addition, the multiple support structures can be configured so that the volume of the multiple cavities 208 enables the reflector body 203 to oscillate at a resonant frequency greater than 10kHz. For example, the plurality of support structures 207 may be configured such that the mass of the plurality of support structures 207 enables the mirror body 203 to oscillate at a resonant frequency greater than 10 kHz and a maximum amplitude greater than 10°.

[0060] In some implementations, the thickness dimension 209 of the reflector body 203 is between 50 μm-400 μm, and each of the plurality of support structures has a width dimension 210 between 5 μm-100 μm. In some implementations, the front plate and the back plate each have a respective thickness dimension 211, 212 between 1 μm-70 μm. In some implementations, each cavity 208 of the plurality of cavities has a width 213 between 2 μm-400 μm. The ratio of the width dimension 210 to the thickness dimension 214 of each support structure 207 is in the range of 1:8 to 1:200, and more preferably in the range of 1:10 to 1:20. The dimensions described above are important to ensure that the reflector body 203 is light enough to oscillate at a resonant frequency greater than 10 kHz and a maximum amplitude greater than 10°, while being rigid enough to prevent dynamic deformation or at least reduce dynamic deformation to within acceptable tolerances to achieve high optical resolution. Dimensions outside of those described above may result in the mirror body 203 being too heavy to achieve a resonant frequency greater than 10 kHz and / or a maximum amplitude greater than 10°, or being insufficiently rigid to prevent dynamic deformation or to reduce dynamic deformation to within acceptable tolerances to achieve high optical resolution.

[0061] In some implementations, plurality of support structures 207 can be interconnected to form a triangular pattern.Plurality of cavities 208 can be triangular cavities defined in areas between corresponding ones of plurality of support structures 207.

[0062] In some implementations, the plurality of support structures 207 can be interconnected to form a honeycomb pattern. The plurality of cavities 208 can be hexagonal cavities defined in areas between corresponding ones of the plurality of support structures 207 .

[0063] In some implementations, the plurality of support structures 207 may be interconnected to form a polygonal pattern. The plurality of cavities 208 may be polygonal cavities defined in areas between corresponding ones of the plurality of support structures 207 .

[0064] In some implementations, the plurality of support structures 207 may be vertical struts arranged to form a truss frame or lattice pattern integrated into the reflector body 203 .

[0065] In some implementations, the size of the cavities in the plurality of cavities 208 can be uniform throughout the hollow core assembly.

[0066] The reflector body 203 can be more susceptible to dynamic deformation in the central section than in the peripheral sections. Therefore, in some implementations, the plurality of cavities 208 include a first group of cavities arranged in the central section of the hollow core assembly, and the second group of cavities can be arranged in the peripheral sections of the hollow core assembly. The size of the cavities in the first group of cavities can be smaller than the cavities in the second group of cavities. As a result, the hollow core assembly provides greater stiffness or rigidity in the central section of the reflector body 203 than in the peripheral sections of the reflector body 203 to reduce or prevent dynamic deformation where dynamic deformation is most likely to occur.

[0067] In some implementations, the spacing of the plurality of support structures in the central region of the reflector body has a higher density compared to the relatively lower density in the peripheral regions of the reflector body. As a result, the hollow core assembly can provide greater stiffness or rigidity in the central region of the reflector body 203 compared to the stiffness or rigidity in the peripheral regions of the reflector body 203.

[0068] In some implementations, the hollow core assembly has a higher mass in a central region of the reflector body 203 compared to a relatively lower mass in a peripheral region of the reflector body 203. As a result, the hollow core assembly can provide greater stiffness or rigidity in a central section of the reflector body 203 compared to stiffness or rigidity in a peripheral section of the reflector body 203.

[0069] In some implementations, the cavities in the plurality of cavities arranged in the central region of the reflector body have a smaller volume relative to the volume of the cavities in the plurality of cavities arranged in the peripheral region of the reflector body. As a result, the hollow core assembly can provide greater stiffness or rigidity in the central section of the reflector body 203 than in the peripheral sections of the reflector body 203.

[0070] In some implementations, backplate 206 can be a perforated backplate having a plurality of perforations extending through backplate 206. Each of the plurality of perforations can be integrated with a corresponding cavity in plurality of cavities 208. Each of the plurality of cavities 208 is integrated with a corresponding perforation in the plurality of perforations. The perforations can be used to etch (e.g., form) each cavity and can reduce the mass of mirror body 203.

[0071] In some implementations, one or more reinforcing support structures may be provided. The one or more reinforcing support structures may be coupled to the backing plate 206 and may extend from the backing plate 206 into the frame cavity 202. The one or more reinforcing support structures may be configured to reduce dynamic deformation of the mirror body 203 during oscillating operation.

[0072] As indicated above, provide Figure 2B As an example. Other examples may differ from the Figure 2BAn example of description.

[0073] Figure 3A A plan view (top view) of a first hollow core assembly 300A of a MEMS mirror device according to one or more implementations is shown. The plurality of support structures 207 may have a grid pattern defining a plurality of cavities 208. For example, the plurality of support structures 207 may be interconnected in a triangular pattern. The plurality of cavities 208 may be triangular cavities defined in areas between corresponding ones of the plurality of support structures 207.

[0074] As indicated above, provide Figure 3A As an example. Other examples may differ from the Figure 3A An example of description.

[0075] Figure 3B A plan view (top view) of a second hollow core component 300B of a MEMS mirror device according to one or more implementations is shown. The plurality of support structures 207 may be interconnected to form a honeycomb pattern. The plurality of cavities 208 may be hexagonal cavities defined in regions between corresponding support structures in the plurality of support structures 207.

[0076] As indicated above, provide Figure 3B As an example. Other examples may differ from the Figure 3B An example of description.

[0077] Figure 3C A plan view (top view) of a third hollow core component 300C of a MEMS mirror device according to one or more implementations is shown. The plurality of support structures 207 may be vertical struts arranged to form a truss frame. Additionally, the size of the cavities in the plurality of cavities 208 may be substantially uniform throughout the third hollow core component 300C, except for those cavities arranged at the outer edges of the third hollow core component 300C.

[0078] As indicated above, provide Figure 3C As an example. Other examples may differ from the Figure 3C An example of description.

[0079] Figure 3DA plan view (top view) of a fourth hollow core assembly 300D of a MEMS mirror device according to one or more implementations is shown. A plurality of support structures 207 may be vertical struts arranged to form a truss frame. In addition, the size of the cavities in the plurality of cavities 208 may be substantially uniform throughout the fourth hollow core assembly 300D, except for those cavities arranged at the outer edges of the fourth hollow core assembly 300D. The plurality of cavities 208 include a first group of cavities 208a arranged in a central section 301 of the fourth hollow core assembly 300D, and a second group of cavities 208b may be arranged in a peripheral section 302 of the fourth hollow core assembly 300D. The size of the cavities in the first group of cavities 208a may be smaller than the cavities in the second group of cavities 208b. As a result, the fourth hollow core assembly 300D provides greater stiffness or rigidity in the central section of the mirror body 203 compared to the stiffness or rigidity in the peripheral section 302 of the mirror body 203 to reduce or prevent dynamic deformation where dynamic deformation is most likely to occur.

[0080] In some implementations, the spacing of the plurality of support structures 207 can have a higher density in the central section 301 of the fourth hollow core assembly 300D as compared to the relatively lower density in the peripheral section 302 of the fourth hollow core assembly 300D. As a result, the fourth hollow core assembly 300D can provide greater stiffness or rigidity in the central region of the reflector body 203 as compared to the stiffness or rigidity in the peripheral region of the reflector body 203.

[0081] In some implementations, the fourth hollow core assembly 300D can have a higher mass in the central section 301 of the fourth hollow core assembly 300D compared to a relatively lower mass in the peripheral sections 302 of the fourth hollow core assembly 300D. As a result, the fourth hollow core assembly 300D can provide greater stiffness or rigidity in the central section 301 of the reflector body 203 compared to the stiffness or rigidity in the peripheral sections 302 of the reflector body 203.

[0082] In some implementations, the cavity 208a of the plurality of cavities arranged in the central section 301 of the fourth hollow core component 300D can have a smaller volume relative to the volume of the cavity 208b of the plurality of cavities arranged in the peripheral section 302 of the fourth hollow core component 300D. As a result, the fourth hollow core component 300D can provide greater stiffness or rigidity in the central section 301 of the reflector body 203 compared to the stiffness or rigidity in the peripheral section 302 of the reflector body 203.

[0083] As indicated above, provide Figure 3D As an example. Other examples may differ from the Figure 3D An example of description.

[0084] Figure 4AA cross-section of a MEMS mirror device 400A is shown according to one or more implementations. The MEMS mirror device 400A may be similar to a device incorporating Figure 2A and Figure 2B The MEMS mirror device 200 described herein. Thus, the MEMS mirror device 400A includes a frame 201, a frame cavity 202, a mirror body 203, a suspension assembly including a torsion bar 204, a front plate 205, a back plate 206, and a hollow core assembly formed by a plurality of support structures 207 defining a plurality of cavities 208. The MEMS mirror device 400A may include a handle layer 401, a dielectric layer 402, and a device layer 403 arranged in a layer stack formation. The handle layer 401 may be a semiconductor material (e.g., a silicon substrate) that may be etched to form the frame cavity 202. The dielectric layer 402 may be used as a protective layer during the manufacture of the MEMS mirror device 400A, and may be any dielectric material (such as silicon oxide, silicon nitride, aluminum oxide, silicon carbide). The device layer 403 may also be a semiconductor material (e.g., silicon). The device layer 403 can be used to form the upper portion of the frame 201, the mirror body 203 and the suspension components (e.g., torsion bars 204). Therefore, the mirror body 203 and the suspension components can be made of silicon, wherein the mirror body 203 has a reflective layer (not shown) disposed on the front plate 205.

[0085] In some implementations, the mirror body 203 and the torsion bar 204 can have the same thickness (eg, the mirror body 203 and the suspension assembly have the same thickness).

[0086] As indicated above, provide Figure 4A As an example. Other examples may differ from the Figure 4A An example of description.

[0087] Figure 4B A cross-section of a MEMS mirror device 400B is shown according to one or more implementations. The MEMS mirror device 400B may be similar to a device incorporating Figure 4A The MEMS mirror device 40A is described except that the mirror body 203 and the torsion bar 204 have different thicknesses (eg, the mirror body 203 and the suspension assembly have different thicknesses). For example, the thickness of the torsion bar 204 may be less than the thickness of the mirror body 203 .

[0088] As indicated above, provide Figure 4B As an example. Other examples may differ from the Figure 4B An example of description.

[0089] Figure 4CA cross-section of a MEMS mirror device 400C is shown according to one or more implementations. The MEMS mirror device 400C may be similar to a device incorporating Figure 4A The MEMS mirror device 400A described above differs in that the back plate 206 is a perforated back plate. The back plate 206 includes a plurality of perforations 404 extending through the back plate 206. Each perforation 404 can be integrated with a corresponding cavity 208 of the hollow core assembly. The perforations 404 can be used to etch (e.g., form) each cavity 208 and can reduce the mass of the mirror body 203.

[0090] As indicated above, provide Figure 4C As an example. Other examples may differ from the Figure 4C An example of description.

[0091] Figure 4D A cross-section of a MEMS mirror device 400D is shown according to one or more implementations. The MEMS mirror device 400D may be similar to a device incorporating Figure 4A The MEMS mirror device 400A described above is different in that the MEMS mirror device 400D includes one or more reinforcing support structures 405. The one or more reinforcing support structures 405 can be coupled to the backing plate 206 and can extend from the backing plate 206 into the frame cavity 202. The one or more reinforcing support structures 405 can be formed from the disposal layer 410. The one or more reinforcing support structures 405 can include a ring structure or one or more rods or plates. The one or more reinforcing support structures 405 can be configured to reduce dynamic deformation of the mirror body 203 during oscillating operation.

[0092] The size of the one or more stiffening support structures 405 can allow for different tuning of the inertia of the mirror body 203 that occurs during oscillation. The inertia can affect the oscillation (resonance) frequency and the maximum tilt amplitude of the mirror body 203. Therefore, tuning of the inertia can result in tuning of the oscillation frequency and the maximum tilt amplitude of the mirror body 203.

[0093] As indicated above, provide Figure 4D As an example. Other examples may differ from the Figure 4D An example of description.

[0094] FIG. 5A to FIG. 5D A process flow involving a method of manufacturing a MEMS mirror device according to one or more implementations is shown. Figure 5AA first processing stage 500A is shown, which includes forming a layer stack including a disposal layer 401 (e.g., a silicon substrate), a dielectric layer 402, and a device layer 403. The device layer 403 may include a backplate 206 formed on the disposal layer 401, a hollow core assembly 501, and a front plate 205. The backplate 206 may be formed of one or more silicon layers and one or more protective layers (e.g., a dielectric layer). The backplate 206 may include a groove 502 filled with a protective layer. Portions of the silicon of the backplate 206 may be etched to form perforations through the backplate 206. The perforations may be used to form a cavity 208. The hollow core assembly 501 may include one or more silicon layers and a groove 503 filled with a protective layer. The front plate 205 may include one or more silicon layers.

[0095] Figure 5B A second processing stage 500B is shown and includes etching the handle layer 401 to form a frame cavity.

[0096] Figure 5C A third processing stage 500C is shown, which includes forming through-holes 404 through backing plate 406, forming a plurality of support structures 207, and forming cavity 208 within hollow core assembly 501. Cavity 208 may be formed by isotropically etching the silicon layers of backing plate 406 and hollow core assembly 501.

[0097] Figure 5D A fourth processing stage 500D is shown, which includes etching the suspension components (eg, to form torsion bars 204) in device layer 403. The etching may also define frame 201 and mirror body 203.

[0098] The sandwich structure of the hollow core assembly 501 can provide a high frequency MEMS micromirror with low dynamic deformation of the mirror body 203 during high frequency (resonant) operation, thereby providing better optical resolution of the scanning mirror (eg, for laser beam scanning displays).

[0099] As indicated above, provide FIG. 5A to FIG. 5D As an example. Other examples may differ from the FIG. 5A to FIG. 5D An example of description.

[0100] Fig. 6A and Figure 6B A process flow involving a method of manufacturing a MEMS mirror device according to one or more implementations is shown. Fig. 6AA first processing stage 600A is shown, which includes forming a layer stack including a disposal layer 401 (e.g., a silicon substrate), a dielectric layer 402, and a device layer 403. The device layer 403 may include a back plate 206 formed on the disposal layer 401, a hollow core assembly 601, and a front plate 205. The back plate 206 may be formed of one or more silicon layers. The hollow core assembly 601 may include two dielectric layers and one or more silicon layers disposed between the two dielectric layers. The hollow core assembly 601 may be preformed (e.g., via etching) with a plurality of support structures 207 defining a plurality of cavities. The front plate 205 may include one or more silicon layers.

[0101] Figure 6B A second processing stage 600B is shown, which includes forming the frame cavity 202 and suspension components (eg, torsion bars 204) by etching. The etching may also define the frame 201 and the mirror body 203.

[0102] The sandwich structure of the hollow core assembly 601 can provide a high frequency MEMS micromirror with low dynamic deformation of the mirror body 203 during high frequency (resonant) operation, thereby providing better optical resolution of the scanning mirror (eg, for laser beam scanning displays).

[0103] As indicated above, provide Fig. 6A and Figure 6B As an example. Other examples may differ from the Fig. 6A and Figure 6B An example of description.

[0104] The following provides an overview of some aspects of the disclosure:

[0105] Aspect 1: A MEMS mirror device, comprising: a frame, the frame defining a frame cavity; a suspension assembly; and a mirror body, the mirror body being coupled to the frame via the suspension assembly so that the mirror body is suspended above the frame cavity, wherein the mirror body comprises a sandwich structure, the sandwich structure comprising a front plate, a back plate, and a hollow core assembly arranged between the front plate and the back plate, wherein the front plate and the back plate define a thickness dimension of the mirror body, and wherein the hollow core assembly comprises a plurality of support structures, the plurality of support structures extending between the front plate and the back plate and defining a plurality of cavities between the front plate and the back plate.

[0106] Aspect 2: The MEMS mirror device according to aspect 1, wherein the plurality of support structures are interconnected to form a triangular pattern, and wherein the plurality of cavities are triangular cavities defined in areas between corresponding ones of the plurality of support structures.

[0107] Aspect 3: A MEMS mirror device according to any one of Aspects 1 to 2, wherein the plurality of support structures are interconnected to form a honeycomb pattern, and wherein the plurality of cavities are hexagonal cavities defined in regions between corresponding ones of the plurality of support structures.

[0108] Aspect 4: A MEMS mirror device according to any one of Aspects 1 to 3, wherein the plurality of support structures are interconnected to form a polygonal pattern, and wherein the plurality of cavities are polygonal cavities defined in regions between corresponding ones of the plurality of support structures.

[0109] Aspect 5: The MEMS mirror device according to any one of aspects 1 to 4, wherein the plurality of support structures are vertical struts arranged to form a truss frame or a grid pattern integrated into the mirror body.

[0110] Aspect 6: The MEMS mirror device according to any one of aspects 1 to 5, wherein the size of the cavities in the plurality of cavities is uniform throughout the hollow core assembly.

[0111] Aspect 7: A MEMS mirror device according to any one of Aspects 1 to 6, wherein the plurality of cavities include a first group of cavities arranged in a central section of the hollow core assembly and a second group of cavities arranged in a peripheral section of the hollow core assembly, wherein the size of the cavities in the first group of cavities is smaller than the size of the cavities in the second group of cavities.

[0112] Aspect 8: A MEMS mirror device according to any one of aspects 1 to 7, wherein the spacing of the plurality of support structures in a central region of the mirror body has a higher density compared to a relatively lower density in a peripheral region of the mirror body.

[0113] Aspect 9: A MEMS mirror device according to any one of aspects 1 to 8, wherein the hollow core component has a higher mass in a central region of the mirror body compared to a relatively lower mass in a peripheral region of the mirror body.

[0114] Aspect 10: A MEMS mirror device according to any one of Aspects 1 to 9, wherein a cavity among the plurality of cavities arranged in a central region of the mirror body has a smaller volume relative to a volume of a cavity among the plurality of cavities arranged in a peripheral region of the mirror body.

[0115] Aspect 11: A MEMS mirror device according to any one of Aspects 1 to 10, wherein the mirror body is configured to oscillate around one or more rotation axes, and wherein the plurality of support structures are configured to reduce dynamic deformation of the mirror body during oscillation of the mirror body around the one or more rotation axes.

[0116] Aspect 12: The MEMS mirror device according to aspect 11, wherein the plurality of support structures are configured such that the volume of the plurality of cavities enables the mirror body to oscillate at a resonant frequency greater than 10 kHz.

[0117] Aspect 13: The MEMS mirror device according to aspect 11, wherein the plurality of support structures are configured such that the mass of the plurality of support structures enables the mirror body to oscillate at a resonant frequency greater than 10 kHz and a maximum amplitude greater than 10°.

[0118] Aspect 14: A MEMS mirror device according to any one of aspects 1 to 13, wherein the hollow core assembly is configured to enable the mirror body to oscillate at a resonant frequency greater than 10 kHz with reduced inertia and reduced dynamic deformation.

[0119] Aspect 15: The MEMS mirror device according to aspect 14, wherein the thickness dimension of the mirror body is between 50 μm and 400 μm, and each of the plurality of support structures has a width dimension between 5 μm and 100 μm.

[0120] Aspect 16: The MEMS mirror device according to Aspect 14, wherein the front plate and the back plate each have a thickness dimension between 1 μm and 70 μm.

[0121] Aspect 17: The MEMS mirror device of aspect 14, wherein each cavity of the plurality of cavities has a width between 2 μm and 400 μm.

[0122] Aspect 18: A MEMS mirror device according to aspect claim 14, wherein each of the plurality of support structures has a thickness dimension extending between the front plate and the back plate and a width dimension perpendicular to the thickness dimension, and wherein the ratio of the width dimension to the thickness dimension of each support structure is in the range of 1:8 to 1:200.

[0123] Aspect 19: The MEMS mirror device according to any one of Aspects 1 to 18, wherein the backplate is a perforated backplate having a plurality of perforations extending through the backplate.

[0124] Aspect 20: The MEMS mirror device according to Aspect 19, wherein each through-hole of the plurality of through-holes is integrated with a corresponding cavity of the plurality of cavities.

[0125] Aspect 21: The MEMS mirror device of aspect 19, wherein each cavity of the plurality of cavities is integrated with a corresponding through-hole of the plurality of through-holes.

[0126] Aspect 22: The MEMS mirror device according to any one of Aspects 1 to 21 further includes: one or more reinforcing support structures, wherein the one or more reinforcing support structures are coupled to the back plate and extend from the back plate into the frame cavity, wherein the one or more reinforcing support structures are configured to reduce dynamic deformation of the mirror body during oscillation operation.

[0127] Aspect 23: The MEMS mirror device according to any one of aspects 1 to 22, wherein the front plate, the back plate and the hollow core assembly form a one-piece integral member.

[0128] Aspect 24: An oscillator device, comprising: a frame, the frame defining a frame cavity; a suspension component; and an oscillator body, the oscillator body being coupled to the frame via the suspension component so that the oscillator body is suspended above the frame cavity, wherein the oscillator body is configured to oscillate around one or more rotation axes, wherein the oscillator body comprises a sandwich structure, the sandwich structure comprising a front plate, a back plate arranged opposite to the front plate, and a hollow core component arranged between the front plate and the back plate, wherein the hollow core component comprises a plurality of support structures, the plurality of support structures extending between the front plate and the back plate and defining a plurality of cavities between the front plate and the back plate, and wherein the hollow core component is configured to reduce dynamic deformation of the oscillator body during oscillation of the oscillator body around the one or more rotation axes, and enable the oscillator body to oscillate at a resonant frequency greater than 10 kHz.

[0129] Aspect 25: A system configured to perform one or more operations described in one or more of aspects 1 to 24.

[0130] Aspect 26: An apparatus comprising means for performing one or more operations described in one or more of aspects 1 to 24.

[0131] The foregoing disclosure provides illustration and description, but is not intended to be exhaustive or to limit the implementations to the precise form disclosed.Modifications and variations may be made in light of the above disclosure or may be acquired from practice of the implementations.

[0132] For example, although the implementations described herein relate to MEMS devices with mirrors, it should be understood that other implementations may include optical devices in addition to MEMS mirror devices or other MEMS oscillating structures. In addition, although some aspects have been described in the context of an apparatus, it is clear that these aspects also represent descriptions of corresponding methods, where a box or device corresponds to a method step or a feature of a method step. Similarly, aspects described in the context of a method step also represent descriptions of items or features of a corresponding box or corresponding apparatus. Some or all of the method steps may be performed by (or using) a hardware device such as, for example, a microprocessor, a programmable computer, or an electronic circuit.

[0133] Some implementations may be described herein in conjunction with thresholds. As used herein, "satisfying" a threshold may refer to a value being greater than a threshold, more than a threshold, above a threshold, greater than or equal to a threshold, less than a threshold, less than a threshold, below a threshold, less than or equal to a threshold, equal to a threshold, etc.

[0134] As used herein, the term "component" is intended to be broadly interpreted as hardware, firmware, or a combination of hardware and software. It will be clear that the systems and / or methods described herein can be implemented in different forms of hardware, firmware, or a combination of hardware and software. The actual dedicated control hardware or software code used to implement these systems and / or methods does not limit the implementation. Therefore, the operation and behavior of the systems and / or methods are described herein without reference to specific software codes - it is to be understood that software and hardware can be designed to implement the systems and / or methods based on the description herein.

[0135] Any of the processing components may be implemented as a central processing unit (CPU) or other processor that reads and executes a software program from a non-transitory computer-readable recording medium (such as a hard disk or a semiconductor memory device). For example, instructions may be executed by one or more processors (such as one or more CPUs, digital signal processors (DSPs), general-purpose microprocessors, application-specific integrated circuits (ASICs), field programmable logic arrays (FPLAs), programmable logic controllers (PLCs), or other equivalent integrated or discrete logic circuits. Therefore, the term "processor" as used herein refers to any of the aforementioned structures or any other structures suitable for implementing the technology described herein. The software may be stored on a non-transitory computer-readable medium, such that the non-transitory computer-readable medium includes a program code or program algorithm stored thereon, which, when executed, causes the processor to perform the steps of the method via a computer program.

[0136] A controller including hardware may also perform one or more of the techniques of the present disclosure. A controller including one or more processors may use electrical signals and digital algorithms to perform its reception, analysis, and control functions, and may also include correction functions. Such hardware, software, and firmware may be implemented within the same device or within separate devices to support the various techniques described in the present disclosure.

[0137] Signal processing circuitry and / or signal conditioning circuitry may receive one or more signals (e.g., measurement signals) from one or more components in the form of raw measurement data, and may derive further information from the measurement signals. As used herein, signal conditioning refers to manipulating an analog signal so that the signal meets the requirements of further processing at the next stage. Signal conditioning may include conversion from analog to digital (e.g., via an analog-to-digital converter), amplification, filtering, conversion, biasing, range matching, isolation, and any other processing required to make the signal suitable for processing after conditioning.

[0138] Even if a specific combination of features is set forth in the claims and / or disclosed in the specification, these combinations are not intended to limit the disclosure of the implementation described herein. Some of these features can be combined in a manner that is not specifically set forth in the claims and / or not specifically disclosed in this specification. For example, the present disclosure includes a combination of each dependent claim in a claim set with each other individual claim in the claim set and each combination of multiple claims in the claim set. As used herein, the phrase "at least one" referring to a list of items refers to any combination of those items including a single member. For example, "at least one of a, b or c" is intended to cover a, b, c, a and b, a and c, b and c and a, b and c and any combination with multiple identical elements (e.g., a+a, a+a+a, a+a+b, a+a+c, a+b+b, a+c+c, b+b, b+b+b, b+b+c, c+c and c+c+c or any other ordering of a, b and c).

[0139] In addition, it should be understood that the disclosure of multiple actions or functions disclosed in the specification or claims may not be interpreted as being in a specific order. Therefore, the disclosure of multiple actions or functions will not limit these to a specific order unless such actions or functions are not interchangeable for technical reasons. In addition, in some implementations, a single action may include or may be divided into multiple sub-actions. Such sub-actions may be included and such sub-actions may be part of the disclosure of the single action unless explicitly excluded.

[0140] Elements, actions or instructions used herein should not be interpreted as being critical or necessary, unless so clearly described. In addition, as used herein, the articles "a" and "an" are intended to include one or more articles, and can be used interchangeably with "one or more". In addition, as used herein, the article "the" is intended to include one or more articles quoted in conjunction with the article "the", and can be used interchangeably with "one or more". In the case of only intending an article, phrases "only one", "single" or similar language are used. In addition, as used herein, the terms "has", "have", "having" etc. are intended to be open terms, and there is no restriction on the elements they modify (for example, "having" A elements can also have B). In addition, the phrase "based on" is intended to mean "based on at least in part", unless otherwise explicitly stated. As used herein, the term "multiple" can be replaced with "a plurality of", and vice versa. Additionally, as used herein, the term "or" when used consecutively is intended to be inclusive and may be used interchangeably with "and / or" unless expressly stated otherwise (eg, if used in combination with "any one of" or "only one of").

[0141] Further disclosure is included in the appendix. The appendix is ​​provided as an example only and is to be considered as part of the specification. The definitions, illustrations, or other descriptions in the appendix do not replace or cover similar information included in the specific embodiments or drawings. In addition, the definitions, illustrations, or other descriptions in the specific embodiments or drawings do not replace or cover similar information included in the appendix. In addition, the appendix is ​​not intended to limit the disclosure of possible implementations.

Claims

1. A micro-electromechanical system (MEMS) reflector device, comprising: a frame defining a frame cavity; Suspension components; as well as a reflector body, the reflector body being coupled to the frame through the suspension assembly so that the reflector body is suspended above the frame cavity, The reflector body comprises a sandwich structure, wherein the sandwich structure comprises a front plate, a back plate and a hollow core component arranged between the front plate and the back plate, wherein the front plate and the back plate define the thickness dimension of the reflector body, and The hollow core assembly includes a plurality of support structures extending between the front plate and the back plate and defining a plurality of cavities between the front plate and the back plate.

2. The MEMS mirror device according to claim 1, wherein the plurality of support structures are interconnected to form a triangular pattern, and Wherein the plurality of cavities are triangular cavities defined in areas between corresponding ones of the plurality of support structures.

3. The MEMS mirror device according to claim 1, wherein the plurality of support structures are interconnected to form a honeycomb pattern, and Wherein the plurality of cavities are hexagonal cavities defined in areas between corresponding ones of the plurality of support structures.

4. The MEMS mirror device according to claim 1, wherein the plurality of support structures are interconnected to form a polygonal pattern, and The plurality of cavities are polygonal cavities defined in regions between corresponding ones of the plurality of support structures.

5. The MEMS mirror device of claim 1, wherein the plurality of support structures are vertical struts arranged to form a truss frame or a grid pattern integrated into the mirror body. 6 . The MEMS mirror device of claim 1 , wherein the cavities in the plurality of cavities are uniform in size and extend throughout the hollow core component.

7. A MEMS mirror device according to claim 1, wherein the multiple cavities include a first group of cavities and a second group of cavities, the first group of cavities is arranged in a central section of the hollow core component, and the second group of cavities is arranged in a peripheral section of the hollow core component, wherein the size of the cavities in the first group of cavities is smaller than that of the cavities in the second group of cavities.

8. The MEMS mirror device of claim 1, wherein the plurality of support structures are spaced at a higher density in a central region of the mirror body than at a relatively lower density in a peripheral region of the mirror body.

9. The MEMS mirror device of claim 1, wherein the hollow core component has a higher mass in a central region of the mirror body compared to a relatively lower mass of the hollow core component in a peripheral region of the mirror body.

10. The MEMS mirror device of claim 1, wherein the cavities in the plurality of cavities arranged in the central region of the mirror body have a smaller volume than the volumes of the cavities in the plurality of cavities arranged in the peripheral region of the mirror body.

11. The MEMS mirror device of claim 1 , wherein the mirror body is configured to oscillate about one or more rotational axes, and Wherein the plurality of support structures are configured to reduce dynamic deformation of the reflector body during oscillation of the reflector body about the one or more rotation axes.

12. The MEMS mirror device of claim 11, wherein the plurality of support structures are configured such that: the volume of the plurality of cavities enables the mirror body to oscillate at a resonant frequency greater than 10 kHz.

13. The MEMS mirror device of claim 11, wherein the plurality of support structures are configured such that: the mass of the plurality of support structures enables the mirror body to oscillate at a resonant frequency greater than 10 kHz and a maximum amplitude greater than 10°.

14. The MEMS mirror device of claim 1, wherein the hollow core assembly is configured to enable the mirror body to oscillate at a resonant frequency greater than 10 kHz, with reduced inertia and reduced dynamic deformation.

15. The MEMS mirror device of claim 14, wherein the mirror body has a thickness dimension between 50 μm and 400 μm, and each of the plurality of support structures has a width dimension between 5 μm and 100 μm.

16. The MEMS mirror device of claim 14, wherein the front plate and the back plate each have a thickness dimension between 1 μm and 70 μm.

17. The MEMS mirror device of claim 14, wherein each cavity of the plurality of cavities has a width between 2 μm-400 μm.

18. The MEMS mirror device of claim 14, wherein each of the plurality of support structures has a thickness dimension extending between the front plate and the back plate and a width dimension perpendicular to the thickness dimension, and The ratio of the width dimension to the thickness dimension of each support structure is in the range of 1:8 to 1:

200.

19. The MEMS mirror device of claim 1, wherein the backplate is a perforated backplate having a plurality of perforations extending through the backplate.

20. The MEMS mirror device of claim 19, wherein each through-hole of the plurality of through-holes is integrated with a corresponding cavity of the plurality of cavities.

21. The MEMS mirror device of claim 19, wherein each cavity of the plurality of cavities is integrated with a corresponding through-hole of the plurality of through-holes.

22. The MEMS mirror device according to claim 1, further comprising: one or more reinforcing support structures coupled to the back plate and extending from the back plate into the frame cavity, Wherein the one or more reinforcing support structures are configured to reduce dynamic deformation of the mirror body during oscillating operation.

23. The MEMS mirror device of claim 1, wherein the front plate, the back plate, and the hollow core assembly form a one-piece unitary member.

24. An oscillator device comprising: a frame defining a frame cavity; Suspension components; as well as an oscillator body coupled to the frame via the suspension assembly such that the oscillator body is suspended above the frame cavity, wherein the oscillator body is configured to oscillate about one or more axes of rotation, wherein the oscillator body comprises a sandwich structure, the sandwich structure comprising a front plate, a back plate arranged opposite to the front plate, and a hollow core component arranged between the front plate and the back plate, wherein the hollow core assembly includes a plurality of support structures extending between the front plate and the rear plate and defining a plurality of cavities between the front plate and the rear plate, and Wherein the hollow core assembly is configured to reduce dynamic deformation of the oscillator body during oscillation of the oscillator body about the one or more rotational axes and enable the oscillator body to oscillate at a resonant frequency greater than 10 kHz.

Images