263 results about "Micro electrical mechanical systems" patented technology

The invention provides a symmetrical clamped micro-beam electric power sensing device based on MEMS resonators, and belongs to the technical field of MEMS sensing. The sensing device comprises a sensing assembly. The sensing assembly comprises a vibration beam, an excitation electrode, a tuning electrode and an auxiliary electrode. The two ends of the vibration beam in the axial direction of the vibration beam are connected with the auxiliary electrodes, and the exciting electrodes and the tuning electrodes are arranged at intervals in the length direction of the vibration beam and arranged on the same side of the vibration beam. Excitation voltage is applied to the excitation electrode so that the excitation electrode can excite the vibration beam to generate resonance. Tuning voltage is applied to the tuning electrode so that the tuning electrode can adjust the rigidity of the vibration beam according to the environment temperature, and the thermal power corresponding to the heat source can be inverted. The two sensing assemblies are arranged in a central symmetry mode, so that interference of electrostatic fields generated by the excitation electrodes and the tuning electrodes corresponding to different vibration beams can be weakened mutually. According to the invention, high-precision power inversion in a wide temperature range can be realized.

The invention relates to a micromirror element (200) as it can be used in micro-electro-mechanical systems (100), in particular for use in equipment (1) for semiconductor technology, and to a corresponding micro-electro-mechanical system (100) with at least one micromirror element (200). The micromirror element (200) comprises a mirror substrate (210) and a reflective coating (220) applied to the mirror surface (215) of the mirror substrate (210) which is intended to reflect, wherein at least one intermediate layer (230) is provided between the mirror substrate (210) and the reflective coating (220), wherein the at least one intermediate layer (230) is designed such that the at least one intermediate layer (230) together with the reflective coating (220) can be regarded as a combined layer (240) in relation to the mirror substrate (210) and the combined coefficient of thermal expansion of the reflective coating (220) and the at least one intermediate layer (230) corresponds essentially to the coefficient of thermal expansion of the mirror substrate (210) at least for a predetermined temperature.

The invention relates to a method for producing at least one micromirror element (200) as it can be used in micro-electro-mechanical systems (100), in particular for use in semiconductor technology equipment (1), and to a micro-electro-mechanical system (100) comprising corresponding micromirror elements (200). The process includes the following steps: - Providing a flat, two-sided mirror substrate (210); - Incorporating a predetermined shape at least on the side (215) of the provided mirror substrate (210) intended to be reflective; and - Applying a reflective coating (220) at least to the side (215) of the provided mirror substrate (210) intended to be reflective.

The invention relates to an element (100) for use in a micro-electro-mechanical system (200), in particular for use in semiconductor technology equipment, and to a micro-electro-mechanical system (200) comprising such an element (100). The element (100) comprises a MEMS structure (101) and at least one coating (140) applied over a large area to designated partial surfaces (135, 155) of the MEMS structure (101) from one side of the element (100), wherein the MEMS structure (100) has at least one otherwise non-functional special shape (160) with which at least a continuous parasitic coating (145) is avoided for certain areas away from the designated partial surfaces (135, 155).

The invention relates to a micro-electro-mechanically movable element (103) for use in a micro-electro-mechanical system (100) and a corresponding micro-electro-mechanical system (100), in particular for use in semiconductor technology equipment. The micro-electro-mechanically movable element (103) comprises a base plate (104) on the side of which facing away from the base structure (101) a mirror plate (105) with a curvature geometry is arranged, wherein the mirror plate (105) is connected to the base plate (104) via a pedestal (106), wherein the geometry of the contact points (107, 108) between pedestal (106) and mirror plate (105) as well as between pedestal (106) and base plate (104) are different. The micro-electro-mechanical system (100) comprises an element (103) that is micro-electro-mechanically movable at least in at least one degree of freedom relative to a basic structure (101) by at least one actuator (102), wherein the micro-electro-mechanically movable element (103) is designed according to the invention.

The provided is a design method for all-fused-silica capacitive planarized micro electro-mechanical systems (MEMS) gyroscope, including: determining a configuration of the MEMS gyroscope, including a substrate and a structural layer, the structural layer being a planar structure; forming a recess at one side of the substrate, and providing a boss in a center of the recess; on the structural layer, integrally forming a central anchor point, a support beam, a resonant ring, fixed electrodes, and a peripheral anchor point region in sequence from the center outward; forming a capacitive gap having a high-steepness structural sidewall and a high-aspect ratio between the resonant ring and each of the fixed electrodes; when the substrate and the structural layer are assembled, fixing the boss to the central anchor point, fixing a recess periphery to the peripheral anchor point region, and suspending the support beam and the resonant ring on the recess.

The invention discloses an equivalent verification method for frequency response characteristics of a force balance loop of a micromechanical gyroscope, and belongs to the technical field of micro electro mechanical systems. According to the invention, the low-frequency test signal is injected into the orthogonal suppression electrode, and the hardware symmetry of the I and Q paths is utilized, and the equivalent verification of the angular velocity detection main path is realized through the calibrated mapping relation. According to the method, the dependence of a traditional method on a high-cost angular vibration table is innovatively avoided, convenient and accurate testing of the frequency response characteristic can be directly achieved on the chip or module level, and the method has important significance on improvement of gyroscope performance testing efficiency and reduction of design cost.

The invention belongs to the technical field of MEMS (Micro Electro Mechanical System) manufacturing, and particularly relates to a deep corrosion method for a back cavity of an MEMS pressure sensor. Comprising the following steps: constructing a'preset reference-gradient rough corrosion-real-time correction-precise fine corrosion 'closed-loop control system: firstly, establishing a precise temperature-corrosion rate corresponding relation through a QC wafer experiment; according to the target depth of the back cavity, multiple rounds of gradient rate coarse corrosion processes are planned, the corrosion depths of all rounds are distributed according to the proportion from large to small, and the corrosion rate is decreased progressively along with the rounds through temperature regulation and control to rapidly approach 80%-95% of the target depth; the depth is detected immediately after each round of corrosion, and targeted correction of'parameter fine adjustment 'or'deviation compensation' is realized based on a double-threshold criterion; and finally, turning to multiple rounds of low-rate fine corrosion, continuing a gradient rate and a real-time correction strategy, and precisely closing a loop to a target depth. According to the invention, submicron level control of the depth of the back cavity is realized, the process stability and adaptability are high, and the performance consistency and the large-scale production yield of the MEMS pressure sensor are effectively improved.

The application relates to the technical field of photographic light source control, and discloses a soft light control method and a mobile terminal, wherein the soft light control method comprises the following steps: constructing a four-dimensional light field harmonic model, decomposing a target light effect into a time-space harmonic combination; decomposing the target light effect into a time-space mapping sequence to form light field microstructure control parameters; combining a micro-electro-mechanical system programmable reflection array and a liquid crystal spatial light modulator, cooperating with a multi-channel LED array to realize sub-millimeter light distribution control and microsecond light field dynamic reconstruction; establishing an accurate synchronization mechanism of a shooting device shutter and light effect change; providing a light effect animation programming interface based on key frames, supporting the definition of a dynamic change sequence of light trajectory, intensity and form; and through the fusion of microstructure light field control and time-space harmonic analysis, four-dimensional dynamic light sculpture is realized, and the technical problem that a traditional soft light control method can only adjust overall brightness and color temperature is solved.

The invention discloses a nonlinear acoustic transducer control method and system based on an Aubry-Mather set, and belongs to the technical field of acoustic transducers. The method comprises the following steps: firstly, based on an Aubry-Mather set theory, constructing a nonlinear vibration model used for describing nonlinear vibration of a transducer diaphragm; secondly, based on a nonlinear vibration model, regional piezoelectric driving and dynamic phase regulation are carried out to simulate a quasi-periodic fluctuation mode; then, on the basis of fluctuation characteristics disclosed by the nonlinear vibration model, a multi-diaphragm collaborative vibration system is constructed, and quasi-periodic superposition of sound waves is realized by optimizing diaphragm space layout; and finally, based on stiffness parameters in the nonlinear vibration model, integrating a micro electro mechanical system (MEMS) process and a nonlinear material, and realizing equivalent nonlinear stiffness on a physical device through gradient polarization design. The dynamic adaptability, the energy transfer efficiency and the high-frequency output performance of the transducer in a broadband range are effectively improved, and the transducer is particularly suitable for ultrasonic imaging and other high-frequency acoustic application scenes.

A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.

The invention discloses a high-Q-value resonator based on boundary stiffness modulation, and belongs to the technical field of micro electro mechanical systems, the high-Q-value resonator comprises a resonator, a first stiffness adjusting mechanism and a second stiffness adjusting mechanism, the first stiffness adjusting mechanism and the second stiffness adjusting mechanism are connected with the two ends of the resonator, and the stiffness adjusting mechanisms achieve initial stiffness adjustment of bending, torsion and stretching through structural design and electrostatic trimming; fine rigidity trimming is achieved through static electricity; the rigidity adjusting mechanism changes the boundary clamping condition of the resonator, so that the Q value, the inherent frequency, the static pull-in voltage and the nonlinearity of the resonator can be adjusted; the frequency stability, the sensitivity and the non-linear rigidity of the resonator can be effectively adjusted, and the resonator has the advantages of being large in adjusting range and controllable in adjusting parameter.

Disclosed are a MEMS sensor and a preparation method therefor. The sensor comprises a device and a cap, wherein the device comprises a grounding electrode; and a functional layer, wherein the functional layer is electrically connected to the grounding electrode. The cap comprises: a second substrate; a second dielectric layer, which is located on a first surface of the second substrate; and a third conductive layer, which is located on the surface of the second dielectric layer that is away from the second substrate, wherein at least part of the third conductive layer penetrates the second dielectric layer to be electrically connected to the second substrate; and the surface of the third conductive layer that is away from the second dielectric layer is bonded with the functional layer, and the second substrate is electrically connected to the grounding electrode by means of the third conductive layer and the functional layer. By means of the MEMS sensor and the preparation method therefor in the present invention, batch grounding of the MEMS sensor is realized.

The present disclosure provides a kind of overhanging island micro-electro-mechanical system thermoelectric performance testing device and preparation method, which can be applied to the technical field of semiconductor device, the thermoelectric performance testing device includes: substrate;Overhanging island structure includes first overhanging island, center overhanging island, third overhanging island, first overhanging island and second overhanging island are symmetrically suspended on the substrate;A plurality of first metal components are arranged on the first overhanging island, the center overhanging island and the second overhanging island;Wherein, in the case where the target to be measured is placed between the first overhanging island and the center overhanging island, the first signal is obtained by the first metal component corresponding to the first overhanging island, the second signal is obtained by the second metal component corresponding to the second overhanging island, the first signal and the second signal are differentially calculated, and the thermoelectric performance test result of the target to be measured is determined based on the result of differential calculation.

The invention relates to the technical field of MEMS (Micro Electro Mechanical System) sensors, and discloses a cap cilia MEMS vector hydrophone, which comprises cap cilia used for sensing sound to generate vibration for transmission; the center mass block is arranged at the bottom of the cap-shaped cilium, the cap-shaped cilium is located in the center of the top of the center mass block, and the center mass block is used for receiving vibration transmitted by the cap-shaped cilium and diffusing the vibration; the four cantilever beams are fixedly connected to the front face, the rear face, the left face and the right face of the center mass block respectively and used for receiving vibration transmitted by the center mass block and generating deformation. And the square frame is arranged outside the four cantilever beams. The cap-shaped cilia has a larger sound wave receiving area than the traditional cilia, the cap-shaped structure can generate larger on-beam stress on the cantilever beam when receiving sound pressure signals with the same size, so that the piezoresistor generates larger resistance change, the hydrophone is simple and mature in manufacturing process, the cap-shaped cilia does not need secondary integration, and the cost is low. And the consistency of the hydrophone is ensured.

The embodiment of the present application provides a projection device and method, the projection device comprises: a pixel array arranged on a substrate, the pixel array has a light emitting characteristic; a cantilever beam arranged on the substrate, used for fixing a micro-electro-mechanical system (MEMS) mirror piece, the cantilever beam is arranged outside the pixel array, the MEMS mirror piece is used for scanning the pixel array, the cantilever beam and the MEMS mirror piece constitute a MEMS mirror; a driver in communication with the pixel array and the MEMS mirror piece, used for driving the pixel array with the light emitting characteristic to develop color; the driver is also used for controlling the MEMS mirror piece to rotate on the cantilever beam to scan the pixel array to obtain a projection image. The present application can make a small volume projection device provide a projection image with higher resolution, and realize the purpose of optimizing volume and improving resolution.

The invention relates to the technical field of metal materials, and discloses a shape memory alloy film and a preparation method and application thereof. The shape memory alloy film comprises the following components: 50-55 at.% of Ni, 40-45 at.% of Ti, 3-5 at.% of Cu and 2-4 at.% of M, and M is selected from one or more of Zr, Hf and Nb. The shape memory alloy film has remarkable superelasticity, the recoverable strain of the shape memory alloy film can reach 8% or above, meanwhile, the compressive yield stress exceeds 1.5 GPa, and the shape memory alloy film shows excellent cycle stability. The preparation method is simple in process and high in controllability, a new scheme is provided for solving the problem of unstable performance of an existing NiTi-based film, and the preparation method is particularly suitable for high-performance micro devices such as a micro electro mechanical system.

The application relates to the technical field of micro electro mechanical system (MEMS), and particularly relates to a MEMS switch and a preparation method thereof, wherein the MEMS switch comprises a support structure layer and an encapsulation structure; a cavity is released on the support structure layer, and a matching thin film and a static area are formed; the encapsulation structure and the support structure layer jointly form an airtight chamber; a piezoelectric actuator comprises a piezoelectric driving electrode and at least one layer of piezoelectric thin film; an electric contact structure comprises a dynamic contact electrode and a static contact electrode arranged in the airtight chamber; the dynamic contact electrode is arranged on the piezoelectric actuator, and the static contact electrode is arranged towards the dynamic contact electrode and fixedly arranged. The piezoelectric actuator and the dynamic contact electrode are directly prepared on a wafer base, and the static contact electrode opposite to the dynamic contact electrode is fixedly arranged in the encapsulation structure; by applying a forward voltage difference or a reverse voltage difference to the piezoelectric actuator, the on-off of the electric contact structure is realized, and the overall structure is simple and controllable.

The application belongs to the technical field of micro electro mechanical system sensors, and discloses an acceleration sensor chip with a DLC optimized structure and a preparation method thereof; in the piezoresistive acceleration sensor chip, an SOI substrate is bonded to boron glass through a substrate frame, and a center mass is connected to the substrate frame through four embedded micro-beams arranged in a cross shape; four piezoresistance strips are arranged on the four embedded micro-beams, and the four piezoresistance strips are connected into a Wheatstone full bridge through surface metal leads deposited on the SOI substrate and connected with pads deposited on the SOI substrate; wherein, a DLC film is deposited on the SOI substrate, and the DLC film covers the surface metal leads, the four piezoresistance strips and the area of the SOI substrate except the pads. The application can improve the sensitivity of the sensor while ensuring the strength of the sensitive structure; the protection of the piezoresistance strips is realized, and the reliability of the sensor can be improved.

A drive circuit includes an amplifier configured to amplify an input signal, and supply the amplified input signal as a drive signal to a piezoelectric element of a MEMS (Miro-Electro-Mechanical Systems) speaker driven by a piezoelectric element; and an offset generator configured to generate an offset such that a minimum absolute value of a voltage of the drive signal is greater than or equal to a positive predetermined voltage.

The invention relates to the technical field of micro electro mechanical system devices, and discloses a low-threshold MEMS inertial switch. A low threshold MEMS inertial switch includes an anchor region, a mass, a holding contact, a switch contact, a drive-support beam. The anchor areas are oppositely arranged at intervals in the x direction; the mass block is arranged between the anchor areas and is spaced from the anchor areas; the holding contact is arranged in the mass block; the switch contact is arranged in the mass block and is separated from the holding contact in the y direction; the driving-supporting beams are distributed on the two opposite sides of the mass block and connected with the anchor area so as to support and drive the mass block to move in the y direction. The switch provided by the invention has the advantages of low threshold triggering, low power consumption, high sensitivity, high switching speed, reliable structure and miniaturization.

The invention discloses a method for processing the surface of a cavity on a silicon substrate, which belongs to the technical field of semiconductor manufacturing and micro electro mechanical systems, and comprises the following steps of: forming a central hole distribution area and an edge hole-free area on the surface of a silicon wafer by using a hard mask and an etching process; placing the isolation pad between the edge non-hole areas of the two silicon wafers, and aligning the central hole distribution areas of the two silicon wafers to form a silicon wafer-isolation pad-silicon wafer stacked structure; the isolation pad does not shield the central hole flow channel; and placing the stacked silicon wafers and the isolation pad in a hydrogen atmosphere for annealing treatment to form a uniform cavity. According to the invention, the defects of many surface defects, high roughness and poor process stability of the silicon substrate cavity caused by the edge effect of the hydrogen flow field in the existing SON process are overcome, the optimized hydrogen flow channel is formed through wafer stacking, the hydrogen density distribution is improved, the reaction probability of oxygen atoms and silicon atoms is reduced, and the stable preparation of the high-quality and high-consistency cavity is realized.

The application claims a MEMS frequency accurate tracking and locking method based on a resonant phase-locked loop (R-PLL). The application relates to the technical field of MEMS (micro-electro-mechanical system) resonator control and frequency tracking, and the method takes the output of a voltage-controlled oscillator as an interference signal, takes the physical response (such as weak electromagnetic leakage or acoustic radiation) of a disturbed MEMS device as a feedback signal, compares the phase difference between the feedback signal and a reference signal through a phase detector, adjusts the interference frequency, and forms a closed-loop locking system. The application adjusts the interference source frequency through a phase detector and a filter, can track the target resonant frequency drift caused by factors such as temperature change in real time, makes the MEMS resonator keep in a phase-locked state with the target resonant frequency, and ensures that the interference energy is always efficiently coupled.

The invention belongs to the technical field of micro electro mechanical systems and micro sensors / actuators, and discloses an electrostatic self-excitation cantilever beam device which comprises a potential floating insulation base, a conductive cantilever beam fixed on the potential floating insulation base, parallel electrodes located on the two sides of a free end and an electric brush adjacent to the free end. And self-excited vibration of the conductive cantilever beam under the action of electrostatic force and elastic restoring force is realized. The electrostatic self-excitation micro-beam device based on the new oscillation starting principle is provided aiming at the oscillation starting principle defect of an existing device, and compared with an original oscillation starting principle and device, the electrostatic self-excitation micro-beam device is lower in oscillation starting voltage, avoids interference of micro-beam suspension potential in the oscillation starting stage, and is high in vibration starting efficiency. And during working, the output of mechanical work or electronic signals is more stable, and the practical value is better.

The application provides airtight packaging structure of a cavity device, which comprises a semiconductor substrate, a first semi-open cavity is arranged on the front surface of the semiconductor substrate; a micro-electro-mechanical system layer is arranged above the front surface of the semiconductor substrate, a first region of the micro-electro-mechanical system layer and the first semi-open cavity form a first closed cavity; a displacement sensor is arranged in the first closed cavity; a cover plate is arranged above the micro-electro-mechanical system layer, a second semi-open cavity is arranged on the front surface of the cover plate at the position opposite to the first region of the micro-electro-mechanical system layer, and the second semi-open cavity and the first region of the micro-electro-mechanical system layer form a second closed cavity; and a bonding layer is arranged between the micro-electro-mechanical system layer and the cover plate, which is used for bonding the micro-electro-mechanical system layer and the cover plate together and sealing the second closed cavity. Compared with the prior art, the application can identify abnormal air leakage and air release of the cavity in the MEMS manufacturing process, provide basis for the improvement of the MEMS performance, improve the yield and reduce the cost.

The invention discloses a high-overload gyroscope impact resistance design method based on a multi-section trial function energy method, and belongs to the technical field of micro electro mechanical system structure design. Comprising the following steps: constructing a physical model; establishing a trial function; calculating out-of-plane bending flexibility of the novel structural beam; introducing a torsion correction term and an outer frame equivalent flexibility; the flexibility is accumulated, and the reciprocal is taken to obtain the out-of-plane total rigidity; and the out-of-plane rigidity is applied to construction of an impact kinetic equation. A traditional Euler-Bernoulli beam theory cannot effectively consider the influence of rigidity coupling and torsional deformation of multiple sections of beams and the rigidity of an outer frame on the overall rigidity of a structure. According to the method, the out-of-plane equivalent stiffness of the novel structural beam and outer frame combined structure can be quickly estimated and obtained, the obtained stiffness parameter is applied to dynamic characteristic analysis of the gyroscope, and effective theoretical support is provided for design and engineering application of the novel structural beam structure of the high-overload gyroscope in the out-of-plane direction.

A micro-electro-mechanical system (MEMS) device includes a supporting substrate, a cavity disposed in the supporting substrate, a stopper, and a MEMS structure. The stopper is disposed between the supporting substrate and the cavity, and an inner sidewall of the stopper is in contact with the cavity. The stopper includes a filling material surrounding a periphery of the cavity, and a liner wrapping around the filling material. The MEMS structure is disposed over the cavity and attached on the stopper and the supporting substrate.

The application relates to a tunable vertical cavity surface emitting laser structure, which comprises a vertical cavity surface emitting laser unit, a micro-electro-mechanical system device bonded with the vertical cavity surface emitting laser unit, an independently controllable piezoelectric material structure arranged between the vertical cavity surface emitting laser unit and the micro-electro-mechanical system device, and a control unit connected with the vertical cavity surface emitting laser unit and the micro-electro-mechanical system device, wherein the control unit adjusts the displacement and angle between the vertical cavity surface emitting laser unit and the micro-electro-mechanical system device by controlling the voltage applied to the piezoelectric material structure. The tunable vertical cavity surface emitting laser structure is distinguished from the prior art in function in that coaxial parallel control and bidirectional driving are provided, and the biggest feature of the structure is that a plurality of independently controllable piezoelectric material structures are introduced in the bonding area, so that the preliminary adjustment of the air gap and the coaxial effect of the overall light source device are realized.

Disclosed is a heterojunction semiconductor flexible substrate in which an epitaxial oxide thin film layer is hetero-bonded to a thinned silicon substrate using a metal layer, a manufacturing method thereof, and the heterojunction semiconductor flexible substrate can be applied to sensor, actuator, transducer, or micro electro mechanical systems (MEMS) device using high functionality of the epitaxial oxide thin film layer of high quality as well as an electronic and / or optical device.

The power relay has an actuator comprising a micro-electromechanical system stator assembly and a plunger assembly that moves along a central longitudinal axis between a first position and a second position, the plunger assembly comprising a plunger including a pair of ferromagnetic plates between which a magnet is located, the first of the pair of ferromagnetic plates being located between a first ferromagnetic layer and a second ferromagnetic layer of the stator assembly, and the second of the pair of ferromagnetic plates being located between a second ferromagnetic layer and a third ferromagnetic layer of the stator assembly. The contacts formed by the ferromagnetic plates and ferromagnetic layers may include an array of micro-machined bends or stabilized liquid-solid electrical contacts.