394 results about "Micro electrical mechanical systems" patented technology

An apparatus and method for providing image acquisition and/or image display in a limited region of interest (ROI). The apparatus comprises a micro electro-mechanical system (MEMS), preferably integrating a light source, a cantilever, a lens, an actuator, a light detector, and a position sensor. The light source provides light for illuminating the ROI, displaying an image, providing a therapy, and/or performing other functions. The cantilever comprises a resin waveguide with a fixed end attached to a substrate that supports many or all other components. A free end of the cantilever is released from the substrate during fabrication and includes the lens. The actuator scans the free end in orthogonal directions to illuminate the ROI or display an image. The position sensors detect the position of the free end for control. The light detector receives light backscattered from the ROI separate from, or at the fixed end the cantilever.

A method and composition for removing silicon-containing sacrificial layers from Micro Electro Mechanical System (MEMS) substrates having such sacrificial layers is described. The etching compositions include a supercritical fluid, an etchant species, a co-solvent, and optionally a surfactant. Such etching compositions overcome the intrinsic deficiency of SCFs as cleaning reagents, viz., the non-polar character of SCFs and their associated inability to solubilize polar species that must be removed from the semiconductor substrate. The resultant etched MEMS substrates experience lower incidents of stiction relative to MEMS substrates etched using conventional wet etching techniques.

A semiconductor package includes a semiconductor structure having a plurality of electrodes for external connection which are provided on a semiconductor substrate, an insulation layer provided on the semiconductor structure, an upper wiring having connection pad portions and provided on the insulation layer such that at least parts of the upper wiring are connected to the electrodes for external connection of the semiconductor structure, a micro electric mechanical system electrically connected to parts of the connection pad portions of the upper wiring, pole electrodes provided so as to be electrically connected to other connection pad portions of the upper wiring, and an upper insulation film covering the vicinities of the pole electrodes and at least the vicinity of the micro electric mechanical system.

Active mixing by magnetic stirring is demonstrated inside a picoliter-size liquid droplet. Magnetic microspheres are added to the droplet, which form aligned chains under the influence of a homogeneous magnetic field. When the magnetic field is rotated, the chains also rotate synchronously. Viscous interaction between the particle-chains and the liquid induces advective motion inside the droplet thereby enhancing mixing which is otherwise diffusion-limited. The concept can be effectively used to create a lab-in-a-droplet for MEMS (Micro-Electrical-Mechanical Systems) and Bio-MEMS applications.

This disclosure describes a capacitive interface circuit for a low power system. The capacitive interface circuit is configured to achieve very low noise sensing of capacitance-based transducers, such as a micro-electro-mechanical system (MEMS)-based sensor, with high resolution and low power. The capacitive interface circuit uses a differential amplifier and correlated triple sampling (CTS) to substantially eliminate, or at least reduce, kT/C noise, as well as amplifier offset and flicker (1/f) noise, from the output of the amplifier. The capacitive interface circuit may further include an output stage that reduces glitching, i.e., clock transients, in the output signal by allowing transients in the amplifier output to settle. In this manner, the circuit can be used in a low power system to produce a stable, low-noise output.

Micro-electrical-mechanical systems are fabricated in a substrate having a sacrificial layer sandwiched between two semiconductor layers. The semiconductor layers are selectively etched to create non-etched frames and etched microstructures immobilized within the frames by the sacrificial layer. An adhesive sheet is attached to one surface of the substrate, and the substrate is diced into chips, each including one frame and one immobilized microstructure. The sacrificial layer is then selectively etched to free a movable member in each microstructure. Finally, the chips are detached from the adhesive sheet, each chip becoming a micro-electrical-mechanical system. This fabrication method provides a simple and inexpensive way to avoid damage to the microstructure during the dicing process.

The invention discloses a novel nano generator constructed by arrays of semiconductor nanorods, nanowires or nanobelts of ZnO, Ga2O3 or SnO2 and the like with inverse piezoelectric characteristic and electric polarization characteristic. The system comprises two nano arrays A and B, the end parts of the nano arrays are mutually contacted and oppositely placed, the nano array A consists of semiconductor nanowires with inverse piezoelectric characteristic and electric polarization characteristic; and the nano array B consists of metal nanowires which have a Schottky contact characteristic when the metal nanowires are contacted with the nano array A or semiconductor nanowires coated with metal films. The nanowires in the nano arrays generate inverse piezoelectric and electric polarization phenomenon by utilizing various high-frequency alternating electromagnetic signals and electromagnetic microwave radiation signals in the space, and certain positive and negative charge accumulation is formed on the surfaces of the nanowires so as to directly convert the various high-frequency alternating electromagnetic signals and electromagnetic microwave radiation signals in the space into electrical energy to be output in a form of electron flow to drive or control the loads such as an external nanodevice or a micro-electro-mechanical system and the like.

A micro-electro-mechanical system (MEMS) current sensor for sensing a magnetic field produced by an electrical current flowing in a conductor includes a first fixed element and a moving element. The moving element is spaced away from the first fixed element and is movable relative to the fixed element responsive to a magnetic field produced by an electrical current flowing in a conductor for providing a mechanical indication of a strength of the magnetic field. The sensor also includes a tunneling current generator for generating a tunneling current between the first fixed element and the moving element and a tunneling current monitor for monitoring a change in the tunneling current responsive to the mechanical indication to provide an indication of a value of the electrical current in the conductor.

A system is provided for sensing and monitoring pressure conditions and variations over an actual or represented surface area of a workpiece in a process chamber. The system includes a substrate and a plurality of micro-electrical-mechanical-systems (MEMS) pressure sensors fixed to the substrate.

The invention relates to methods for preparing as-deposited, low-stress and low resistivity polycrystalline silicon-germanium layers and semiconductor devices utilizing the silicon-germanium layers. These layers can be used in Micro Electro-Mechanical Systems (MEMS) devices or micro-machined structures.

A method and composition for removing silicon-containing sacrificial layers from Micro Electro Mechanical System (MEMS) and other semiconductor substrates having such sacrificial layers is described. The etching compositions include a supercritical fluid (SCF), an etchant species, a co-solvent, and optionally a surfactant. Such etching compositions overcome the intrinsic deficiency of SCFs as cleaning reagents, viz., the non-polar character of SCFs and their associated inability to solubilize polar species that must be removed from the semiconductor substrate. The resultant etched substrates experience lower incidents of stiction relative to substrates etched using conventional wet etching techniques.

A space safety apparatus monitoring a volume of space encompassing a field of view (FOV) for detecting an intrusion including a gas or vapor, and includes a micro-electro-mechanical system (MEMS) having mirror elements in a mirror array for reflecting infra-red (IR) energy beam collected from the FOV and an IR energy detector for detecting the IR energy reflected by the MEMS array and converting the IR energy to an output signal. A processor adjusts an angle of an element of the MEMS mirror array by varying a control signal, or by switching from one to another focusing element. The method includes detection in a volume of space by positioning a MEMS mirror array to reflect IR signal with respect to active elements of an IR detector; and collecting IR energy from an i^th portion of the FOV.

A micro electrical-mechanical systems (MEMS) device INCLUDES a MEMS substrate and at least one MEMS structure on the MEMS substrate. In addition, there is at least one battery cell on the MEMS substrate coupled to the at least one MEMS structure. The at least one battery cell includes a support fin extending vertically upward from the MEMS substrate and a first electrode layer on the support fin. In addition, there is an electrolyte layer on the cathode layer, and a second electrode layer on the electrolyte layer. The support fin may have a height greater than a width. The first electrode layer may have a processing temperature associated therewith that exceeds a stability temperature associated with the second electrode layer.

The invention discloses a subminiature electronic device with a hermetic cavity and method of manufacturing the same. It particularly relates to a chip type or chip scale packaged electronic device produced in substrate level. Firstly, a sacrificial layer is coated onto each of the identical microstructures disposed on a large substrate. A protective layer containing glass powders is then applied to encapsulate the sacrificial layer. Afterwards, the sacrificial layer is removed so as to form a cavity between the microstructure and the protective layer. The whole protective layer is then melted at elevated temperature to seal the cavity in an environment of specific gas. Finally, the large substrate is diced into a plurality of individual devices with a hermetic cavity over the microstructure. The applicable fields include micro-electronic circuits, micro-vibration systems, micro electrical-mechanical systems (MEMS), and gas discharge apparatuses.

Provided are a multilayer copper/titanium composite board and a preparation method thereof. The multilayer copper/titanium composite board is composed of two types of 7-126 metal layers equal in thickness, wherein the metal layers are titanium or copper layers, the thickness is 12-333 microns, the tensile strength is 355-355 MPa, the yield strength is 295-325 MPa, and the elongation percentage is 16-31%. The preparation method comprises the steps that pure copper and pure titanium boards are subjected to rolling pretreatment; one-pass synchronous composite rolling is performed to form a multilayer copper/titanium composite board finished product after cross stacking, or repeated cutting, stacking and rolling are performed, and annealing is performed between every two adjacent times of rolling. By the adoption of the preparation method, a high-plasticity multilayer copper/titanium laminated composite material of a uniformly distributed diphase structure can be obtained and has the important value on rapidly developing micro components and devices, micro electro mechanical systems, biological materials and development of the high and new technology fields including nuclear industry and the like.

The invention discloses a gyroscope of a single-shaft micro electro mechanical system. The gyroscope comprises a twist mass block, anchor points, and capacitor groups, wherein each capacitor group is arranged between a twist mass block and the corresponding anchor point; fixed comb teeth and movable comb teeth of the capacitor groups are fixed with a height difference along the z-axis direction; fixed comb teeth of driving capacitor groups are fixed on a base through the anchor points as driving electrodes; movable comb teeth of the driving capacitor groups are respectively connected with the twist mass block; fixed comb teeth of detection capacitor groups are fixed on the base through detection anchor points; movable comb teeth of the detection capacitor groups are connected with the twist mass block; a pair of detection electrodes composed of the detection anchor points are used for feeding back capacitance change signals to the pair of driving electrodes; fixed comb teeth of sensing capacitor groups are fixed on the base through sensing anchor points; movable comb teeth of the sensing capacitor groups are connected with the twist mass block through a periphery elastic beam; a central anchor point in the central part of the twist mass block is connected with the twist mass block through a middle elastic beam. The gyroscope disclosed by the invention has the characteristics that the structure is simple, and the error is smaller compared with that in angular velocity measurement result in the single movement.