327 results about "Micro electrical mechanical systems" patented technology

A micro-electrical-mechanical-system (MEMS) switching device including a first MEMS switch having a first and second terminal, and a second MEMS switch having a third and fourth terminal. The device also includes first and second input conductors, and first and second output conductors. The first input conductor electrically connects the second terminal to the third terminal. The second input conductor electrically connects an input port to the first input conductor. The first output conductor electrically connects a first output port to the first terminal. The second output conductor electrically connects a second output port to the fourth terminal. A first path from the input port to the first output port, and a second path from the input port to the second output port, have substantially identical electrical characteristics.

The invention relates to aluminum borosilicate glass with low dielectric constant and low dielectric loss and a preparation method and application thereof, and relates to the field of aluminum borosilicate glass manufacturing, the aluminum borosilicate glass comprises the following main components by molar percentage: 60%-85% of SiO2, 0-10% of Al2O3, 2%-30% of B2O3, 0-20% of alkaline earth oxide, 0-10% of alkali metal oxide, 0-10% of ZnO, 0-1% of P2O5 and 0-2% of TiO2 and / or ZrO2; during preparation, the raw materials are melted, clarified and homogenized according to the corresponding dosage, and then are annealed for 3-8 hours at the temperature of 600-650 DEG C. The obtained aluminum borosilicate glass can reduce transmission loss during high-frequency signal transmission, has dielectric constant stability which does not exceed + / -0.5 change under a 1-30 GHz signal test, and can be applied to preparation of integrated antennas, electronic packaging and micro electro mechanical system packaging.

The present invention provides a low-cost, non-invasive device (100) for measuring flow and leakage detection of fluids within closed conduits. The invention utilizes affordable a Micro-Electro Mechanical System (MEMS) based Inertial Measurement Units (IMUs) sensor (102) in the device to non-invasively measure fluid flow and leakage of fluids which exhibit turbulence or flow-induced-vibrations within a conduit. This device fin directly estimates flow rate or velocity based on the concept of Reynolds number in fluid dynamics. Further, this device is easy to install on pipes of all dimensions, requires minimal calibration, has no moving parts in contact with the fluid, can be integrated with Geographic Information System (GIS) software, and possesses advanced metering infrastructure to support remote reading and automated bill generation.

The invention provides a symmetrical clamped micro-beam electric power sensing device based on MEMS resonators, and belongs to the technical field of MEMS sensing. The sensing device comprises a sensing assembly. The sensing assembly comprises a vibration beam, an excitation electrode, a tuning electrode and an auxiliary electrode. The two ends of the vibration beam in the axial direction of the vibration beam are connected with the auxiliary electrodes, and the exciting electrodes and the tuning electrodes are arranged at intervals in the length direction of the vibration beam and arranged on the same side of the vibration beam. Excitation voltage is applied to the excitation electrode so that the excitation electrode can excite the vibration beam to generate resonance. Tuning voltage is applied to the tuning electrode so that the tuning electrode can adjust the rigidity of the vibration beam according to the environment temperature, and the thermal power corresponding to the heat source can be inverted. The two sensing assemblies are arranged in a central symmetry mode, so that interference of electrostatic fields generated by the excitation electrodes and the tuning electrodes corresponding to different vibration beams can be weakened mutually. According to the invention, high-precision power inversion in a wide temperature range can be realized.

The invention relates to a micromirror element (200) as it can be used in micro-electro-mechanical systems (100), in particular for use in equipment (1) for semiconductor technology, and to a corresponding micro-electro-mechanical system (100) with at least one micromirror element (200). The micromirror element (200) comprises a mirror substrate (210) and a reflective coating (220) applied to the mirror surface (215) of the mirror substrate (210) which is intended to reflect, wherein at least one intermediate layer (230) is provided between the mirror substrate (210) and the reflective coating (220), wherein the at least one intermediate layer (230) is designed such that the at least one intermediate layer (230) together with the reflective coating (220) can be regarded as a combined layer (240) in relation to the mirror substrate (210) and the combined coefficient of thermal expansion of the reflective coating (220) and the at least one intermediate layer (230) corresponds essentially to the coefficient of thermal expansion of the mirror substrate (210) at least for a predetermined temperature.

The invention relates to a high-conductivity low-temperature cured carbon nanotube enhanced conductive silver adhesive and a preparation method thereof. The conductive silver adhesive comprises 75%-80% of silver powder, 15%-20% of epoxy resin, 3%-5% of a curing agent, 0.1%-1% of carbon nanotubes, 0.5%-1% of a coupling agent and 1%-3% of a diluent. Through a special preparation process, the conductive silver adhesive has remarkable advantages. In the aspect of conductivity, the high-content silver powder is matched with the carbon nanotubes to form an efficient conductive network, so that high conductivity and low resistance stability are achieved; in the aspect of mechanical properties, the epoxy resin and the coupling agent ensure strong binding power, and the carbon nanotubes enhance the mechanical stability; and in terms of processing property, low-temperature curing can be realized, and good flowability and coating property are achieved. The conductive silver adhesive can effectively solve the problems of conductive connection of high-precision electronic devices, packaging of temperature-sensitive devices, reliability of electronic equipment in a complex environment and the like, and can be widely applied to the fields of integrated circuit chips, micro electro mechanical systems, aerospace and the like.

The invention relates to a method for producing at least one micromirror element (200) as it can be used in micro-electro-mechanical systems (100), in particular for use in semiconductor technology equipment (1), and to a micro-electro-mechanical system (100) comprising corresponding micromirror elements (200). The process includes the following steps: - Providing a flat, two-sided mirror substrate (210); - Incorporating a predetermined shape at least on the side (215) of the provided mirror substrate (210) intended to be reflective; and - Applying a reflective coating (220) at least to the side (215) of the provided mirror substrate (210) intended to be reflective.

The invention relates to an element (100) for use in a micro-electro-mechanical system (200), in particular for use in semiconductor technology equipment, and to a micro-electro-mechanical system (200) comprising such an element (100). The element (100) comprises a MEMS structure (101) and at least one coating (140) applied over a large area to designated partial surfaces (135, 155) of the MEMS structure (101) from one side of the element (100), wherein the MEMS structure (100) has at least one otherwise non-functional special shape (160) with which at least a continuous parasitic coating (145) is avoided for certain areas away from the designated partial surfaces (135, 155).

The invention relates to a micro-electro-mechanically movable element (103) for use in a micro-electro-mechanical system (100) and a corresponding micro-electro-mechanical system (100), in particular for use in semiconductor technology equipment. The micro-electro-mechanically movable element (103) comprises a base plate (104) on the side of which facing away from the base structure (101) a mirror plate (105) with a curvature geometry is arranged, wherein the mirror plate (105) is connected to the base plate (104) via a pedestal (106), wherein the geometry of the contact points (107, 108) between pedestal (106) and mirror plate (105) as well as between pedestal (106) and base plate (104) are different. The micro-electro-mechanical system (100) comprises an element (103) that is micro-electro-mechanically movable at least in at least one degree of freedom relative to a basic structure (101) by at least one actuator (102), wherein the micro-electro-mechanically movable element (103) is designed according to the invention.

The invention discloses a standing wave micro motor stator structure, a design method, a preparation method and a micro motor, and belongs to the field of micro electro mechanical systems. The standing wave micro motor stator structure comprises a substrate, driving teeth, balancing teeth and a piezoelectric layer; the driving teeth, the balance teeth and the piezoelectric layer are all arranged on the substrate; the driving teeth make contact with the rotor and drive the rotor to rotate through friction force. The balance teeth are used for counteracting mass eccentricity caused by the driving teeth; the piezoelectric layer is used for converting electric energy into mechanical energy and driving the stator structure to vibrate according to a working mode; a locking structure is further manufactured on the base plate and used for locking the shape of the working mode of the stator structure, so that the driving teeth are located on the slope of the vibration shape of the working mode, the driving teeth move obliquely, it is guaranteed that the wave crest of the clockwise working mode and the locking structure are in the same direction, and it is guaranteed that the pitch diameter of the anticlockwise working mode and the locking structure are in the same direction. The complexity of the micro motor driving circuit can be simplified, the power consumption is reduced, and the preparation process cost is reduced.

The provided is a design method for all-fused-silica capacitive planarized micro electro-mechanical systems (MEMS) gyroscope, including: determining a configuration of the MEMS gyroscope, including a substrate and a structural layer, the structural layer being a planar structure; forming a recess at one side of the substrate, and providing a boss in a center of the recess; on the structural layer, integrally forming a central anchor point, a support beam, a resonant ring, fixed electrodes, and a peripheral anchor point region in sequence from the center outward; forming a capacitive gap having a high-steepness structural sidewall and a high-aspect ratio between the resonant ring and each of the fixed electrodes; when the substrate and the structural layer are assembled, fixing the boss to the central anchor point, fixing a recess periphery to the peripheral anchor point region, and suspending the support beam and the resonant ring on the recess.

The invention discloses an equivalent verification method for frequency response characteristics of a force balance loop of a micromechanical gyroscope, and belongs to the technical field of micro electro mechanical systems. According to the invention, the low-frequency test signal is injected into the orthogonal suppression electrode, and the hardware symmetry of the I and Q paths is utilized, and the equivalent verification of the angular velocity detection main path is realized through the calibrated mapping relation. According to the method, the dependence of a traditional method on a high-cost angular vibration table is innovatively avoided, convenient and accurate testing of the frequency response characteristic can be directly achieved on the chip or module level, and the method has important significance on improvement of gyroscope performance testing efficiency and reduction of design cost.

The invention belongs to the technical field of micro-electro-mechanical systems (MEMS) and the technical field of electric field / magnetic field detection, and particularly provides an electric field-magnetic field composite integrated resonant MEMS sensor which is used for solving the problem that a traditional resonant MEMS sensor can only sense a single environment parameter. According to the electric field-magnetic field composite integrated resonant MEMS sensor provided by the invention, accurate measurement of a direct-current electric field in a space thickness direction (Z axis) is realized by using an out-of-plane flapping mode of a disc resonant sensing unit fixed by four T-shaped anchor points; the measurement of an out-plane Z-axis magnetic field and an in-plane X-axis magnetic field is realized through the effect of Lorentz force on a metal wire loop which is arranged on the surface of the disc resonance sensing unit and is charged with alternating current in the magnetic field; therefore, the composite integrated sensing of two parameters of an electric field and a magnetic field by the same device is realized, and the number of required sensors and the occupied area of a chip are reduced.

The invention belongs to the technical field of MEMS (Micro Electro Mechanical System) manufacturing, and particularly relates to a deep corrosion method for a back cavity of an MEMS pressure sensor. Comprising the following steps: constructing a'preset reference-gradient rough corrosion-real-time correction-precise fine corrosion 'closed-loop control system: firstly, establishing a precise temperature-corrosion rate corresponding relation through a QC wafer experiment; according to the target depth of the back cavity, multiple rounds of gradient rate coarse corrosion processes are planned, the corrosion depths of all rounds are distributed according to the proportion from large to small, and the corrosion rate is decreased progressively along with the rounds through temperature regulation and control to rapidly approach 80%-95% of the target depth; the depth is detected immediately after each round of corrosion, and targeted correction of'parameter fine adjustment 'or'deviation compensation' is realized based on a double-threshold criterion; and finally, turning to multiple rounds of low-rate fine corrosion, continuing a gradient rate and a real-time correction strategy, and precisely closing a loop to a target depth. According to the invention, submicron level control of the depth of the back cavity is realized, the process stability and adaptability are high, and the performance consistency and the large-scale production yield of the MEMS pressure sensor are effectively improved.

The application relates to the technical field of photographic light source control, and discloses a soft light control method and a mobile terminal, wherein the soft light control method comprises the following steps: constructing a four-dimensional light field harmonic model, decomposing a target light effect into a time-space harmonic combination; decomposing the target light effect into a time-space mapping sequence to form light field microstructure control parameters; combining a micro-electro-mechanical system programmable reflection array and a liquid crystal spatial light modulator, cooperating with a multi-channel LED array to realize sub-millimeter light distribution control and microsecond light field dynamic reconstruction; establishing an accurate synchronization mechanism of a shooting device shutter and light effect change; providing a light effect animation programming interface based on key frames, supporting the definition of a dynamic change sequence of light trajectory, intensity and form; and through the fusion of microstructure light field control and time-space harmonic analysis, four-dimensional dynamic light sculpture is realized, and the technical problem that a traditional soft light control method can only adjust overall brightness and color temperature is solved.

The invention discloses a nonlinear acoustic transducer control method and system based on an Aubry-Mather set, and belongs to the technical field of acoustic transducers. The method comprises the following steps: firstly, based on an Aubry-Mather set theory, constructing a nonlinear vibration model used for describing nonlinear vibration of a transducer diaphragm; secondly, based on a nonlinear vibration model, regional piezoelectric driving and dynamic phase regulation are carried out to simulate a quasi-periodic fluctuation mode; then, on the basis of fluctuation characteristics disclosed by the nonlinear vibration model, a multi-diaphragm collaborative vibration system is constructed, and quasi-periodic superposition of sound waves is realized by optimizing diaphragm space layout; and finally, based on stiffness parameters in the nonlinear vibration model, integrating a micro electro mechanical system (MEMS) process and a nonlinear material, and realizing equivalent nonlinear stiffness on a physical device through gradient polarization design. The dynamic adaptability, the energy transfer efficiency and the high-frequency output performance of the transducer in a broadband range are effectively improved, and the transducer is particularly suitable for ultrasonic imaging and other high-frequency acoustic application scenes.

The embodiment of the present application provides a coil chip and a method for preparing the same, a detection chip and a lubricating oil sensor. The coil chip based on the micro-electromechanical system includes a substrate having a first surface and a second surface arranged opposite to each other, and at least two sensing areas are provided on the substrate; the substrate is provided with a first insulating layer and a second insulating layer on the first surface and the second surface in each sensing area, respectively, and the first insulating layer is provided with at least one induction coil layer on the surface away from the second insulating layer, and the inner circle position of the induction coil layer is provided with a detection through hole that runs through the entire coil chip for the passage of lubricating oil, so that an induction coil structure unit is formed in each sensing area. The embodiment of the present application provides a coil chip and a method for preparing the same, a detection chip and a lubricating oil sensor, which can improve the detection sensitivity of the lubricating oil sensor.

A micro electro mechanical system (MEMS) includes a circuit substrate comprising electronic circuitry, a support substrate having a recess, a bonding layer disposed between the circuit substrate and the support substrate, through holes passing through the circuit substrate to the recess, a first conductive layer disposed on a front side of the circuit substrate, and a second conductive layer disposed on an inner wall of the recess. The first conductive layer extends into the through holes and the second conductive layer extends into the through holes and coupled to the first conductive layer.

The invention discloses a high-Q-value resonator based on boundary stiffness modulation, and belongs to the technical field of micro electro mechanical systems, the high-Q-value resonator comprises a resonator, a first stiffness adjusting mechanism and a second stiffness adjusting mechanism, the first stiffness adjusting mechanism and the second stiffness adjusting mechanism are connected with the two ends of the resonator, and the stiffness adjusting mechanisms achieve initial stiffness adjustment of bending, torsion and stretching through structural design and electrostatic trimming; fine rigidity trimming is achieved through static electricity; the rigidity adjusting mechanism changes the boundary clamping condition of the resonator, so that the Q value, the inherent frequency, the static pull-in voltage and the nonlinearity of the resonator can be adjusted; the frequency stability, the sensitivity and the non-linear rigidity of the resonator can be effectively adjusted, and the resonator has the advantages of being large in adjusting range and controllable in adjusting parameter.

Disclosed are a MEMS sensor and a preparation method therefor. The sensor comprises a device and a cap, wherein the device comprises a grounding electrode; and a functional layer, wherein the functional layer is electrically connected to the grounding electrode. The cap comprises: a second substrate; a second dielectric layer, which is located on a first surface of the second substrate; and a third conductive layer, which is located on the surface of the second dielectric layer that is away from the second substrate, wherein at least part of the third conductive layer penetrates the second dielectric layer to be electrically connected to the second substrate; and the surface of the third conductive layer that is away from the second dielectric layer is bonded with the functional layer, and the second substrate is electrically connected to the grounding electrode by means of the third conductive layer and the functional layer. By means of the MEMS sensor and the preparation method therefor in the present invention, batch grounding of the MEMS sensor is realized.

The present disclosure provides a kind of overhanging island micro-electro-mechanical system thermoelectric performance testing device and preparation method, which can be applied to the technical field of semiconductor device, the thermoelectric performance testing device includes: substrate;Overhanging island structure includes first overhanging island, center overhanging island, third overhanging island, first overhanging island and second overhanging island are symmetrically suspended on the substrate;A plurality of first metal components are arranged on the first overhanging island, the center overhanging island and the second overhanging island;Wherein, in the case where the target to be measured is placed between the first overhanging island and the center overhanging island, the first signal is obtained by the first metal component corresponding to the first overhanging island, the second signal is obtained by the second metal component corresponding to the second overhanging island, the first signal and the second signal are differentially calculated, and the thermoelectric performance test result of the target to be measured is determined based on the result of differential calculation.

The invention relates to the technical field of MEMS (Micro Electro Mechanical System) sensors, and discloses a cap cilia MEMS vector hydrophone, which comprises cap cilia used for sensing sound to generate vibration for transmission; the center mass block is arranged at the bottom of the cap-shaped cilium, the cap-shaped cilium is located in the center of the top of the center mass block, and the center mass block is used for receiving vibration transmitted by the cap-shaped cilium and diffusing the vibration; the four cantilever beams are fixedly connected to the front face, the rear face, the left face and the right face of the center mass block respectively and used for receiving vibration transmitted by the center mass block and generating deformation. And the square frame is arranged outside the four cantilever beams. The cap-shaped cilia has a larger sound wave receiving area than the traditional cilia, the cap-shaped structure can generate larger on-beam stress on the cantilever beam when receiving sound pressure signals with the same size, so that the piezoresistor generates larger resistance change, the hydrophone is simple and mature in manufacturing process, the cap-shaped cilia does not need secondary integration, and the cost is low. And the consistency of the hydrophone is ensured.

The embodiment of the present application provides a projection device and method, the projection device comprises: a pixel array arranged on a substrate, the pixel array has a light emitting characteristic; a cantilever beam arranged on the substrate, used for fixing a micro-electro-mechanical system (MEMS) mirror piece, the cantilever beam is arranged outside the pixel array, the MEMS mirror piece is used for scanning the pixel array, the cantilever beam and the MEMS mirror piece constitute a MEMS mirror; a driver in communication with the pixel array and the MEMS mirror piece, used for driving the pixel array with the light emitting characteristic to develop color; the driver is also used for controlling the MEMS mirror piece to rotate on the cantilever beam to scan the pixel array to obtain a projection image. The present application can make a small volume projection device provide a projection image with higher resolution, and realize the purpose of optimizing volume and improving resolution.

The present disclosure discloses a Micro-Electro-Mechanical System (MEMS) microphone including a substrate including a back cavity; a capacitive system arranged on the substrate, the capacitive system including a back plate and a diaphragm opposite to the back plate, the diaphragm located on a side of the back plate close to the substrate; a support member located between the diaphragm and the back plate; a blocking portion arranged on a side of the back plate facing the diaphragm; wherein the diaphragm includes a vibration portion and a fixing portion surrounding the vibration portion and fixed to the substrate, the vibration portion and the back plate are fixedly connected by the support member, a projection of the blocking portion along a vibration direction of the diaphragm is located within the vibration portion of the diaphragm. Compared with the related art, MEMS microphone disclosed by the present disclosure has a high signal-to-noise ratio.

The invention relates to the technical field of metal materials, and discloses a shape memory alloy film and a preparation method and application thereof. The shape memory alloy film comprises the following components: 50-55 at.% of Ni, 40-45 at.% of Ti, 3-5 at.% of Cu and 2-4 at.% of M, and M is selected from one or more of Zr, Hf and Nb. The shape memory alloy film has remarkable superelasticity, the recoverable strain of the shape memory alloy film can reach 8% or above, meanwhile, the compressive yield stress exceeds 1.5 GPa, and the shape memory alloy film shows excellent cycle stability. The preparation method is simple in process and high in controllability, a new scheme is provided for solving the problem of unstable performance of an existing NiTi-based film, and the preparation method is particularly suitable for high-performance micro devices such as a micro electro mechanical system.

The application relates to the technical field of micro electro mechanical system (MEMS), and particularly relates to a MEMS switch and a preparation method thereof, wherein the MEMS switch comprises a support structure layer and an encapsulation structure; a cavity is released on the support structure layer, and a matching thin film and a static area are formed; the encapsulation structure and the support structure layer jointly form an airtight chamber; a piezoelectric actuator comprises a piezoelectric driving electrode and at least one layer of piezoelectric thin film; an electric contact structure comprises a dynamic contact electrode and a static contact electrode arranged in the airtight chamber; the dynamic contact electrode is arranged on the piezoelectric actuator, and the static contact electrode is arranged towards the dynamic contact electrode and fixedly arranged. The piezoelectric actuator and the dynamic contact electrode are directly prepared on a wafer base, and the static contact electrode opposite to the dynamic contact electrode is fixedly arranged in the encapsulation structure; by applying a forward voltage difference or a reverse voltage difference to the piezoelectric actuator, the on-off of the electric contact structure is realized, and the overall structure is simple and controllable.

The invention provides a touch sensing device based on a micro electro mechanical system and a robot, and the touch sensing device comprises a housing which is provided with a recessed part; the circuit board is arranged in the concave part of the shell, and the shape of the circuit board is matched with that of the concave part; the plurality of MEMS pressure sensors are arrayed on the circuit board; and the flexible material is filled in the concave part and the pressure sensing hole of the MEMS pressure sensor, and covers the circuit board and the MEMS pressure sensor. According to the touch sensing device based on the micro electro mechanical system and the robot provided by the invention, precise response can be made to fine change of force.

The application belongs to the technical field of micro electro mechanical system sensors, and discloses an acceleration sensor chip with a DLC optimized structure and a preparation method thereof; in the piezoresistive acceleration sensor chip, an SOI substrate is bonded to boron glass through a substrate frame, and a center mass is connected to the substrate frame through four embedded micro-beams arranged in a cross shape; four piezoresistance strips are arranged on the four embedded micro-beams, and the four piezoresistance strips are connected into a Wheatstone full bridge through surface metal leads deposited on the SOI substrate and connected with pads deposited on the SOI substrate; wherein, a DLC film is deposited on the SOI substrate, and the DLC film covers the surface metal leads, the four piezoresistance strips and the area of the SOI substrate except the pads. The application can improve the sensitivity of the sensor while ensuring the strength of the sensitive structure; the protection of the piezoresistance strips is realized, and the reliability of the sensor can be improved.

A drive circuit includes an amplifier configured to amplify an input signal, and supply the amplified input signal as a drive signal to a piezoelectric element of a MEMS (Miro-Electro-Mechanical Systems) speaker driven by a piezoelectric element; and an offset generator configured to generate an offset such that a minimum absolute value of a voltage of the drive signal is greater than or equal to a positive predetermined voltage.

The invention relates to the technical field of micro electro mechanical system devices, and discloses a low-threshold MEMS inertial switch. A low threshold MEMS inertial switch includes an anchor region, a mass, a holding contact, a switch contact, a drive-support beam. The anchor areas are oppositely arranged at intervals in the x direction; the mass block is arranged between the anchor areas and is spaced from the anchor areas; the holding contact is arranged in the mass block; the switch contact is arranged in the mass block and is separated from the holding contact in the y direction; the driving-supporting beams are distributed on the two opposite sides of the mass block and connected with the anchor area so as to support and drive the mass block to move in the y direction. The switch provided by the invention has the advantages of low threshold triggering, low power consumption, high sensitivity, high switching speed, reliable structure and miniaturization.