This invention relates to the field of heat dissipation, and discloses a computing
system and
electronic equipment, including: a housing with at least two enclosures inside, each
enclosure containing an immersion medium; electrical connectors on the
enclosure walls and electrical components immersed in the immersion medium inside the enclosures, the electrical components being electrically connected to the electrical connectors; a power supply module located outside the enclosures and electrically connected to the electrical connectors of each
enclosure, the power supply module supplying power to the electrical components; and a
fluid supply / return component located outside the enclosures and detachably connected to the enclosures, used to provide the immersion medium to the enclosures or to return the immersion medium, the power supply module and the
fluid supply / return component being in thermally conductive contact. By separating the electrical components into multiple enclosures, independent maintenance is achieved without draining the fluid; the externally located power supply module and thermally coupled
fluid supply / return component avoid heat accumulation, improve heat dissipation accuracy, eliminate the need for additional heat dissipation structures, simplify design, reduce costs, and enable independent operation and maintenance of the power supply and computing units, thereby improving maintenance efficiency.