Structure of vertical three-dimensional combined packaging of micro electric mechanical system and manufacture method thereof

A micro-electromechanical system and manufacturing method technology, applied in micro-structure technology, micro-structure devices, processing micro-structure devices and other directions, can solve the problems of poor assembly accuracy, difficult monitoring, low yield and reliability, etc., to avoid design and The difficulty of production, the reduction of packaging costs, and the effect of simple process

Inactive Publication Date: 2009-09-09
上海新微科技集团有限公司
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Problems solved by technology

The traditional slotting combination method has high requirements on the machining accuracy of the slots. Although the slotting combination method is more convenient in pre-assembly, it is relatively difficult to monitor during assembly, the assembly accuracy is poor, and the yield and reliability are low. Relatively speaking, the bracket The combination method is relatively easy to realize, and the assembly accuracy and reliability are high

Method used

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  • Structure of vertical three-dimensional combined packaging of micro electric mechanical system and manufacture method thereof
  • Structure of vertical three-dimensional combined packaging of micro electric mechanical system and manufacture method thereof
  • Structure of vertical three-dimensional combined packaging of micro electric mechanical system and manufacture method thereof

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Embodiment Construction

[0041] In order to fully demonstrate the advantages and positive effects of the present invention, the substantive features and remarkable progress of the present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0042] exist figure 1 Among them, on the substrate 101, mount the MEMS acceleration sensor 103, for the transmission of electrical signals, the MEMS device has six metal pads 102 and three pads 104 for vertical module signal transmission on the substrate 101.

[0043] exist figure 2 , on the back surface 201 of the substrate, there are n×m pads 202 . (n and m are variable, depending on the number of external interfaces of the acceleration chip. If there are many signals to be connected, then n×m is large, and vice versa)

[0044] exist image 3 Among them, on a substrate 301, a MEMS sensor 303 is mounted. For the transmission of electrical signals, the MEMS device has six metal pads 302 and three pads 304 fo...

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Abstract

The invention relates to a structure of the vertical three-dimensional combined packaging of a micro electric mechanical system and a manufacture method thereof and is characterized by providing a novel structure of the triaxial accelerometer combined packaging and a manufacture method thereof, wherein the structure of the module combined packaging is formed by combining brackets, located by laser calibration and a triple prism and fixed by ultraviolet light cured adhesive and realizes the mutual electrical connection by lead bonding. The whole technical process is compatible with the traditional IC packaging technology and is simple. The structure provides another select for the three-dimensional acceleration measurement while reducing the cost of the packaging and simplifying the technology.

Description

technical field [0001] The invention relates to a structure and a manufacturing method of a three-dimensional vertical combination package of a micro-electromechanical system, more precisely, the present invention relates to a structure and a manufacturing method of a three-dimensional vertical combination package of a micro-electro-mechanical system (MEMS) device realized by means of bracket combination , belonging to the field of MEMS device packaging. Background technique [0002] MEMS (microelectromechanical system) refers to a system made of microfabrication technology, integrating microsensors, microcomponents, microactuators, signal processing, and control circuits. MEMS devices have very broad application prospects in many fields. During the flight of various vehicles and flight systems, it is necessary to monitor the flight attitude, running trajectory and vibration state. Among them, it is necessary to measure and control the acceleration of each latitude. At pr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C3/00B81B7/00
Inventor 阮祖刚徐高卫罗乐
Owner 上海新微科技集团有限公司
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