Anti-vulcanization power module
By adding ceramic adhesion between the copper clad zones on the ceramic substrate, the problem of short circuit caused by the reaction of hydrogen sulfide gas with copper foil to generate copper sulfide crystals is solved, and the long-term reliable operation of the module and more flexible chip arrangement are achieved.
CN119650520APending Publication Date: 2025-03-18MACMIC SCIENCE & TECHNOLOGY CO LTD
0 Cites 0 Cited by
Patent Information
- Application Number
- CN202510067300.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-16
- Publication Date
- 2025-03-18
AI Technical Summary
Technical Problem
In harsh environments, IGBT modules are prone to react with hydrogen sulfide gas and copper foil to form copper sulfide crystals, resulting in short circuits and module failure.
Method used
Adhesive ceramics are added between the copper clad zones on the ceramic substrate to prevent the copper foil from reacting with the hydrogen sulfide gas to form copper sulfide crystals.
Benefits of technology
It effectively prevents the generation of copper sulfide crystals, avoids module failure, and increases the creepage spacing of copper foil, providing a more flexible arrangement space for the chip.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention belongs to the technical field of power modules, and particularly relates to an anti-vulcanization power module. The anti-vulcanization power module includes: a heat dissipation substrate; the ceramic substrate is arranged on the heat dissipation substrate; the first copper-clad region and the second copper-clad region are arranged on the ceramic substrate, and a groove is formed between the adjacent ends of the first copper-clad region and the second copper-clad region; a first power terminal is arranged on the first copper-clad area, and a chip and a second power terminal are arranged on the second copper-clad area; and the attachment ceramic is arranged between the adjacent ends of the first copper-clad region and the second copper-clad region. In other words, by means of the scheme design that the attachment ceramic is additionally arranged between the adjacent ends of the two adjacent copper-clad areas of the pressurized potential, the phenomenon that in the environment where voltage is applied, copper foil reacts with hydrogen sulfide gas to generate copper sulfide crystals to cause short circuit, and consequently module failure is caused can be prevented.
Need to check novelty before this filing date? Find Prior Art