Modularized PCB convenient for rapid expansion
By designing a modular PCB board structure including a base bracket, multiple PCB substrates, pressing plates, rotating rods and limiting parts, the problem of pressing and wrinkling in the PCB board in the prior art is solved, and the tight fit between multiple PCB substrates is achieved and the electrical performance improvement is improved.
Patent Information
- Application Number
- CN202411792694.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-07
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2044-12-07
AI Technical Summary
Existing modular PCB boards are prone to compression and wrinkles during high-temperature and high-pressure overlapping, and are difficult to operate, making it difficult to ensure the tight fit and electrical performance of multi-layer PCB boards.
A modular PCB board structure including a bottom bracket, a plurality of PCB substrates, a pressing plate, a rotating rod and a limiting member is designed. By continuously rotating the rotating rod, the extruder presses the movable rod, so that the multiple rotating rods move downwards one by one and rotate the bonding plate, so that the multiple PCB substrates from bottom to top are closely fitted one by one.
It achieves a tight fit between multiple PCB substrates, avoids compression and wrinkle phenomenon, is simple to operate and low cost, is suitable for the needs of multi-layer circuit boards with fast installation and compact structure and excellent electrical performance, and supports the installation, disassembly, replacement and reuse of PCB substrates.