Method for printing three-dimensional structures with reduced processing costs
By using the adhesive layer as the contact surface between the support structure and the target structure in 3D printing, the high cost and inefficiency of the supporting structure separation process in complex structure manufacturing is solved, efficient, residue-free separation and material reuse are achieved, and surface quality is improved.
Patent Information
- Application Number
- CN202380057959.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-08-25
- Filing Date
- 2023-06-28
- Publication Date
- 2025-03-18
AI Technical Summary
The existing 3D printing technology faces high material consumption and post-treatment costs of supporting structures when manufacturing complex structures, and it is difficult to achieve efficient surface quality and material reuse during separation.
During the 3D printing process, an adhesive layer is used as the contact surface between the support structure and the target structure to quickly and without residues after printing, reducing equipment costs and post-processing complexity.
Through the design of the adhesive layer, rapid, residue-free and efficient separation of the support structure is achieved, manufacturing cost and post-processing time is reduced, the surface quality of the target structure is improved, and the reuse of the support structure is allowed.