Metal honeycomb ice holding processing equipment for semiconductor refrigeration
By adopting semiconductor refrigeration technology in metal honeycomb processing equipment, efficient ice holding and rapid melting of honeycomb workpieces is solved, and the processing efficiency and yield of thin-walled honeycomb components in traditional processing methods are improved.
CN119658430AActive Publication Date: 2025-03-21SHENYANG LIGONG UNIV
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Patent Information
- Application Number
- CN202510098908.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-22
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2045-01-22
AI Technical Summary
Technical Problem
Traditional metal honeycomb material processing methods are prone to problems such as extrusion deformation, insufficient cutting, and burr residue when processing thin-wall honeycomb components, resulting in reduced manufacturing accuracy and low yield.
Method used
Metal honeycomb ice holding processing equipment that adopts semiconductor refrigeration, and efficient ice holding and rapid melting of honeycomb workpieces is achieved by setting a water holder, semiconductor refrigeration sheet, agitator and heating components in the fixture.
Benefits of technology
It improves the holding capacity and processing accuracy of honeycomb materials, reduces processing defects, such as crimping and welding, and improves yield and processing efficiency.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention belongs to the technical field of thin-wall metal cutting machining, and particularly relates to metal honeycomb ice holding machining equipment for semiconductor refrigeration. The invention provides metal honeycomb ice holding processing equipment for semiconductor refrigeration. The device comprises a clamp body 1.1, and is characterized in that a water container 1.3 is arranged in the clamp body 1.1, a temperature thermocouple 1.6 and a stirrer 2.1 are arranged on the side wall of the water container 1.3, a heating part 3.9 is arranged on the bottom surface of the water container 1.3, and semiconductor chilling plates 1.5 are arranged on the side wall of the water container 1.3 and the bottom surface of the water container 1.3; a water inlet 1.8 is formed in one side of the lower end of the clamp body 1.1, and a water outlet 1.9 is formed in the other side of the lower end of the clamp body 1.1; and cooling water cavities 1.7 are reserved between the inner wall of the clamp body 1.1 and the outer wall of the water container 1.3 and between the inner bottom surface of the clamp body 1.1 and the outer bottom surface of the water container.
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