Sintered silver colloid material and preparation method thereof
By preparing sintered silver glue materials containing components A and B, and sintering under low temperature and pressure-free conditions, the problem of difficult pressure-free silver glue forming a dense sintered structure is solved, and the high mechanical properties and stability of sintered silver glue materials are achieved.
Patent Information
- Application Number
- CN202411911151.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-03-21
AI Technical Summary
Pressure-free silver glue is difficult to form a dense sintered structure, which affects its mechanical properties, resulting in easy interface layering after aging test or impact test, resulting in failure of bonding and electrical connections.
By preparing sintered silver glue material including components A and components B, component A consists of silver powder filler, resin, modified PVB and diluent, component B consists of aromatic amine curing agent and accelerator, sintered under low temperature and pressure-free conditions to ensure the mechanical properties of the silver glue after sintering.
The sintered silver glue material sintered under low temperature and pressure-free conditions has good mechanical properties, high shear strength, low volume resistivity, and remains stable after aging and impact tests.