Transformer substation inspection method and device, terminal equipment and storage medium

Abstract

The invention discloses a substation inspection method and device, terminal equipment and a storage medium. The method comprises the following steps: acquiring basic inspection data of a component; judging whether the component is an abnormal component or not according to the basic inspection data; if the component is an abnormal component, determining all possible fault types of the abnormal component according to the basic inspection data; according to all possible fault types, determining a depth inspection scheme of the abnormal part; according to the depth inspection scheme, performing depth inspection on the abnormal part to obtain depth inspection data; and judging whether the abnormal component is a fault component or not according to the depth inspection data, and if yes, determining and outputting the fault type of the fault component. According to the invention, the problem that only abnormal parts are thoroughly inspected is solved, the deep inspection operation on non-abnormal parts is omitted, and the inspection effect is improved on the basis of saving inspection resources.

Description

Technical Field

[0001] The present invention relates to the field of intelligent sensing inspection technology, and in particular to a substation inspection method, device, terminal equipment and storage medium. Background Art

[0002] Substations are an indispensable part of the power system. They transform voltage and current to boost the power required for power transportation and reduce the power required for power use. Substations have high voltages and inspection tasks are high-risk. Intelligent sensing inspection machines can reduce the chances of workers coming into contact with high-risk areas and ensure their safety.

[0003] The existing data analysis methods in the field of substation inspection are mainly divided into two types:

[0004] (1) Collect basic data of the inspected components, perform simple and rough data analysis on the basic data, and analyze the abnormal components to obtain abnormal analysis. This method does not make a specific collection plan for specific abnormal conditions, nor does it further analyze the potential possible faults involved in the abnormal components, making the abnormal detection not thorough enough and the inspection effect low.

[0005] (2) Collect detailed data of the inspected components as detailed as possible, perform detailed data analysis on the detailed data, and analyze all potential faults of all components in an attempt to complete detailed fault detection in one inspection. This method performs detailed inspections on all components, including those that may not have abnormalities, which unnecessarily increases the burden on the inspection machine and causes a waste of resources.

[0006] How to improve the inspection effect without wasting inspection resources and to perform thorough inspection on abnormal components as much as possible is a technical problem that the present invention attempts to solve. Summary of the invention

[0007] In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions in this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0008] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0009] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0010] The present invention provides a substation inspection method, device, terminal equipment and storage medium to solve the technical problems of the prior art that the inspection is either incomplete or the inspection efficiency is low.

[0011] In order to solve the above technical problems, the present invention provides a substation inspection method, comprising:

[0012] Obtain basic inspection data of components;

[0013] Determining whether the component is an abnormal component according to the basic inspection data;

[0014] If the component is an abnormal component, determining all possible fault types of the abnormal component according to the basic inspection data;

[0015] Determine an in-depth inspection plan for the abnormal component based on all possible fault types;

[0016] According to the deep inspection scheme, a deep inspection is performed on the abnormal component to obtain the deep inspection data;

[0017] According to the deep inspection data, it is determined whether the abnormal component is a faulty component, and if so, the fault type of the faulty component is determined and output.

[0018] As a preferred solution, the basic inspection data of the components is obtained, including:

[0019] Collecting image feature information of the component;

[0020] Determining type information of the component according to the image feature information;

[0021] Determine the basic inspection plan of the components according to the type information;

[0022] According to the basic inspection plan, a basic inspection is performed on the component to obtain the basic inspection data.

[0023] As a preferred solution, determining all possible fault types of the abnormal component according to the basic inspection data includes:

[0024] Analyze the basic data to determine all abnormal data in the basic data;

[0025] Determine, according to all the abnormal data, possible fault types corresponding to all the abnormal data as possible fault types of the abnormal component;

[0026] Determining the in-depth inspection scheme of the abnormal component according to all the possible fault types includes:

[0027] For each of the possible fault types, determining target data corresponding to the possible fault type;

[0028] According to each of the target data, determining a corresponding target acquisition position;

[0029] According to all target collection locations, the in-depth inspection plan is planned.

[0030] As a preferred solution, before obtaining the basic inspection data of the component, it also includes:

[0031] Get the inspection path;

[0032] According to the inspection path, the inspection operation is performed on each device to be inspected along the path in turn;

[0033] The inspection operation includes:

[0034] According to the preset component inspection sequence of the equipment to be inspected, basic inspection is performed on each component of the equipment to be inspected to obtain the basic inspection data.

[0035] As a preferred solution, the obtaining of the inspection path includes:

[0036] Obtaining location information, inspection cost information and environmental data of all inspection areas; wherein the environmental data includes: temperature range, current range and voltage range;

[0037] For each inspection area, if the environmental data is normal, the inspection area is determined to be a normal area, otherwise, the inspection area is determined to be an abnormal area;

[0038] According to the location information and inspection cost information of all abnormal areas, a genetic algorithm is used to obtain the inspection path of the abnormal area with the minimum inspection cost;

[0039] According to the location information and inspection cost information of all normal areas, a genetic algorithm is used to obtain the normal area inspection path with the minimum inspection cost;

[0040] Determine the shortest path between the end point of the abnormal area inspection path and the starting point of the normal area inspection path, and connect the abnormal area inspection path and the normal area inspection path according to the shortest path to obtain the inspection path; wherein the starting point of the inspection path is the starting point of the abnormal area inspection path.

[0041] As a preferred solution, the method for determining whether the environmental data is normal includes:

[0042] If the maximum value of the temperature interval of the environmental data does not exceed the preset standard temperature maximum value, the current interval falls within the preset standard current area, and the voltage interval falls within the preset standard voltage interval, the environmental data is determined to be normal, otherwise the environmental data is determined to be abnormal.

[0043] As a preferred solution, the method for setting the equipment to be inspected includes:

[0044] Obtain the number of connection lines for all devices, the area of ​​the affected power supply area, and the historical failure rate;

[0045] For each device, if the number of connection lines of the device is greater than or equal to the preset number of connection lines of the standard device, and the area of ​​the power supply area affected by the device is greater than or equal to the preset area of ​​the power supply area of ​​the standard device, then the device is a critical device; if the historical failure rate of the device is greater than or equal to the preset standard device failure rate, then the device is a prone to failure device;

[0046] Set all key equipment and the equipment that is prone to failure as equipment to be inspected.

[0047] Based on the above embodiment, another embodiment of the present invention provides a substation inspection device, including: a data acquisition module, an abnormal component determination module, a deep inspection plan formulation and execution module and a fault component determination module;

[0048] The data acquisition module is used to acquire basic inspection data of components;

[0049] The abnormal component determination module is used to determine whether the component is an abnormal component based on the basic inspection data;

[0050] The deep inspection plan formulation and execution module is used to determine all possible fault types of the abnormal component according to the basic inspection data when the component is an abnormal component; determine the deep inspection plan of the abnormal component according to all the possible fault types; perform a deep inspection on the abnormal component according to the deep inspection plan to obtain the deep inspection data;

[0051] The fault component determination module is used to determine whether the abnormal component is a faulty component based on the deep inspection data, and if so, determine and output the fault type of the faulty component.

[0052] Based on the above embodiments, another embodiment of the present invention provides a terminal device, which includes a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, and when the processor executes the computer program, the inspection data processing method described in the above embodiments of the invention is implemented.

[0053] Based on the above embodiment, another embodiment of the present invention provides a storage medium, which includes a stored computer program, wherein when the computer program is running, the device where the storage medium is located is controlled to execute the inspection data processing method described in the above invention embodiment.

[0054] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0055] Based on determining the abnormal components through basic inspection data, the present invention further performs in-depth inspections on possible fault types of the abnormal components and obtains in-depth inspection data to further determine whether the abnormal components are faulty. This solves the problem of only conducting thorough inspections on abnormal components and omits in-depth inspection operations on non-abnormal components, thereby improving the inspection effect while saving inspection resources. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] Figure 1 It is a flowchart of a substation inspection method provided by an embodiment of the present invention;

[0057] Figure 2 The present invention is a schematic structural diagram of a substation inspection device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0058] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0059] Embodiment 1

[0060] Please refer to Figure 1 , is a flow chart of a substation inspection method provided by an embodiment of the present invention, comprising:

[0061] S1. Obtain basic inspection data of components.

[0062] It should be noted that basic inspection data refers to equipment failure phenomenon data, which is used to characterize whether the equipment has failed, such as the temperature data of the circuit breaker, the color data of the respirator, and the decibel data of the transformer. Basic inspection data is data that can be directly used to determine whether the equipment has a failure phenomenon.

[0063] In a preferred embodiment, the obtaining of basic inspection data of components includes:

[0064] Collecting image feature information of the component;

[0065] Determining type information of the component according to the image feature information;

[0066] Determine the basic inspection plan of the components according to the type information;

[0067] According to the basic inspection plan, a basic inspection is performed on the component to obtain the basic inspection data.

[0068] In this embodiment, image feature information of components is collected, and the image feature information is analyzed to obtain component type information, and then a basic inspection plan corresponding to the component type is obtained from a database, a basic inspection is performed on the component, and basic inspection information of the component is collected.

[0069] An image acquisition device is provided on the inspection machine, and the inspection machine acquires the image of the component and obtains image feature information from the image of the component. If the image feature information of the component matches the image feature information of a certain type of component in the database, it indicates that the type of the component is the type in the database, thereby obtaining the type information of the component, and further obtaining the basic inspection plan of the component from the database according to the type information of the component.

[0070] The basic inspection plan includes the type of collection equipment used by the component, the data to be collected, the location of the collected data, and the movement plan of the inspection machine. The movement plan of the inspection machine mainly includes the movement direction and movement speed of the inspection machine.

[0071] The inspection machine selects the collection device according to the sensor collection device corresponding to the data to be collected, and collects the sensor values ​​of the components. For example, when inspecting a circuit breaker, if it is necessary to collect temperature data, then select a temperature sensor collection device; when inspecting a respirator, if it is necessary to collect color data, then select a color sensor collection device; when inspecting a transformer, if it is necessary to collect decibel data, then select a decibel sensor collection device.

[0072] S2. Determine whether the component is an abnormal component based on the basic inspection data.

[0073] In step S2, the basic inspection data is analyzed. The basic inspection data mainly includes sensor values ​​of components. If the sensor data is equal to the value of the sensor data interval when abnormal, it indicates that the component is an abnormal component.

[0074] S3. If the component is an abnormal component, determine all possible fault types of the abnormal component according to the basic inspection data.

[0075] It should be noted that the type of abnormal component failure may have multiple abnormal causes. For example, a circuit breaker failure may be caused by low oil level, oil leakage or loose terminal.

[0076] S4. Determine an in-depth inspection plan for the abnormal component based on all the possible fault types.

[0077] In a preferred embodiment, determining all possible fault types of the abnormal component according to the basic inspection data includes:

[0078] Analyze the basic data to determine all abnormal data in the basic data;

[0079] Determine, according to all the abnormal data, possible fault types corresponding to all the abnormal data as possible fault types of the abnormal component;

[0080] Determining the in-depth inspection scheme of the abnormal component according to all the possible fault types includes:

[0081] For each of the possible fault types, determining target data corresponding to the possible fault type;

[0082] According to each of the target data, determining a corresponding target acquisition position;

[0083] According to all target collection locations, the in-depth inspection plan is planned.

[0084] In this embodiment, based on the basic inspection data of the abnormal component, that is, the sensor value, various possible types of faults corresponding to the sensor value of the abnormal component are obtained from the database, that is, the possible fault types of the abnormal component.

[0085] According to all possible fault types of abnormal components, the data required for each possible fault type, i.e., target data, is obtained; according to the target data of each possible fault type, the target acquisition position and acquisition device of each possible fault are obtained; according to the component type, target acquisition position and acquisition device of the abnormal component, the acquisition plan of each possible fault is obtained as the deep inspection plan. The deep inspection plan includes the type of acquisition equipment used by the abnormal component, target data, target acquisition position and the mobile plan of the inspection machine.

[0086] S5. According to the deep inspection scheme, perform a deep inspection on the abnormal component to obtain the deep inspection data.

[0087] It should be noted that deep inspection data refers to fault cause data, which is used to troubleshoot the cause of equipment failure. For example, if the basic inspection information of the circuit breaker detects abnormal temperature, it is necessary to further obtain oil level data as deep inspection data to determine the cause of the fault.

[0088] The in-depth inspection data includes possible fault data of each possible abnormal type of the abnormal component.

[0089] S6. Determine whether the abnormal component is a faulty component based on the deep inspection data, and if so, determine and output the fault type of the faulty component.

[0090] In step S6, if the possible fault data of a possible fault type of an abnormal component is equal to the actual fault data in the database, the abnormal component has a fault, and the possible fault type is the fault, the abnormal component is recorded as a faulty component, and the location and fault type of the faulty component are prompted to the staff. If the abnormal component does not have a fault, the abnormal component is recorded as a hidden danger component, and the location of the hidden danger component is prompted to the staff.

[0091] It should be noted that the hidden danger components do not affect the operation of the substation, but there are abnormalities and need to be maintained and repaired. Faulty components need to be repaired in time. The location and fault type of the faulty components prompted by the system can improve maintenance efficiency and reduce maintenance risks.

[0092] In a preferred embodiment, before obtaining the basic inspection data of the component, the method further includes:

[0093] Get the inspection path;

[0094] According to the inspection path, the inspection operation is performed on each device to be inspected along the path in turn;

[0095] The inspection operation includes:

[0096] According to the preset component inspection sequence of the equipment to be inspected, basic inspection is performed on each component of the equipment to be inspected to obtain the basic inspection data.

[0097] In a preferred embodiment, the obtaining of the inspection path includes:

[0098] Obtaining location information, inspection cost information and environmental data of all inspection areas; wherein the environmental data includes: temperature range, current range and voltage range;

[0099] For each inspection area, if the environmental data is normal, the inspection area is determined to be a normal area, otherwise, the inspection area is determined to be an abnormal area;

[0100] According to the location information and inspection cost information of all abnormal areas, a genetic algorithm is used to obtain the inspection path of the abnormal area with the minimum inspection cost;

[0101] According to the location information and inspection cost information of all normal areas, a genetic algorithm is used to obtain the normal area inspection path with the minimum inspection cost;

[0102] Determine the shortest path between the end point of the abnormal area inspection path and the starting point of the normal area inspection path, and connect the abnormal area inspection path and the normal area inspection path according to the shortest path to obtain the inspection path; wherein the starting point of the inspection path is the starting point of the abnormal area inspection path.

[0103] In this embodiment, environmental information of each inspection area is obtained, a temperature sensor is arranged in each inspection area, a current collector and a voltage collector are arranged at each wire line transfer point, and temperature data of each inspection area is collected by multiple temperature sensors to obtain the temperature range of each inspection area. The current range and voltage range of each inspection area are obtained by summarizing the values ​​of multiple current collectors and voltage collectors.

[0104] Analyze environmental information to determine normal and abnormal areas.

[0105] The location information and inspection cost of each abnormal area are extracted from the database, and the inspection path of the abnormal area with the minimum inspection cost is obtained by using a genetic algorithm. The location information and inspection cost of each normal area are extracted from the database, and the inspection path of the normal area with the minimum inspection cost is obtained by using a genetic algorithm.

[0106] The inspection machine first inspects according to the abnormal area inspection path, then moves from the end point of the abnormal area inspection path to the starting point of the normal area inspection path, and then inspects according to the normal area inspection path, using this as the inspection path.

[0107] In a preferred embodiment, the method for determining whether the environmental data is normal includes:

[0108] If the maximum value of the temperature interval of the environmental data does not exceed the preset standard temperature maximum value, the current interval falls within the preset standard current area, and the voltage interval falls within the preset standard voltage interval, the environmental data is determined to be normal, otherwise the environmental data is determined to be abnormal.

[0109] In this embodiment, the environmental information is analyzed. If the maximum temperature of a certain inspection area is less than or equal to the preset maximum temperature of the standard area and the voltage range and current range of the inspection area are consistent with the voltage range and current range of the standard area, then it indicates that the inspection area is a normal area; otherwise, it indicates that the inspection area is an abnormal area.

[0110] In a preferred embodiment, the method for setting the equipment to be inspected includes:

[0111] Obtain the number of connection lines for all devices, the area of ​​the affected power supply area, and the historical failure rate;

[0112] For each device, if the number of connection lines of the device is greater than or equal to the preset number of connection lines of the standard device, and the area of ​​the power supply area affected by the device is greater than or equal to the preset area of ​​the power supply area of ​​the standard device, then the device is a critical device; if the historical failure rate of the device is greater than or equal to the preset standard device failure rate, then the device is a prone to failure device;

[0113] Set all key equipment and the equipment that is prone to failure as equipment to be inspected.

[0114] In this embodiment, the number of connection lines and the area of ​​power supply affected by all devices are obtained from the database. If the number of connection lines of a device is greater than or equal to the preset number of connection lines of a standard device, and the area of ​​power supply affected by the device is greater than or equal to the preset area of ​​power supply of the standard device, it indicates that the device is a key device, and each key device is obtained in this way.

[0115] The historical failure rates of all devices are obtained from the database. If the historical failure rate of a device is greater than or equal to the preset standard device failure rate, the device is a failure-prone device.

[0116] It should be noted that the database is used to store the inspection cost of each inspection area, the temperature historical data of each inspection point, the current historical data of each inspection point, the voltage historical data of each inspection point, the image feature information of each type of component, the basic inspection plan for each type of component, the in-depth inspection plan for each type of fault, the image feature information of each type of abnormal component, the value range of the sensor of each abnormal component, the collection method of each abnormal component, and the actual fault data of each fault of each abnormal component.

[0117] Embodiment 2

[0118] Please refer to Figure 2 , is a schematic diagram of the structure of a substation inspection device provided by an embodiment of the present invention, comprising: a data acquisition module, an abnormal component determination module, a deep inspection plan formulation and execution module and a fault component determination module;

[0119] The data acquisition module is used to acquire basic inspection data of components;

[0120] The abnormal component determination module is used to determine whether the component is an abnormal component based on the basic inspection data;

[0121] The deep inspection plan formulation and execution module is used to determine all possible fault types of the abnormal component according to the basic inspection data when the component is an abnormal component; determine the deep inspection plan of the abnormal component according to all the possible fault types; perform a deep inspection on the abnormal component according to the deep inspection plan to obtain the deep inspection data;

[0122] The fault component determination module is used to determine whether the abnormal component is a faulty component based on the deep inspection data, and if so, determine and output the fault type of the faulty component.

[0123] Embodiment 3

[0124] Accordingly, an embodiment of the present invention provides a terminal device, which includes a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, and when the processor executes the computer program, it implements the inspection data processing method described in the above embodiment of the invention.

[0125] Embodiment 4

[0126] Accordingly, an embodiment of the present invention provides a storage medium, which includes a stored computer program, wherein when the computer program is running, the device where the storage medium is located is controlled to execute the inspection data processing method described in the above embodiment of the invention.

[0127] It should be noted that the device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. In addition, in the accompanying drawings of the device embodiments provided by the present invention, the connection relationship between the modules indicates that there is a communication connection between them, which may be specifically implemented as one or more communication buses or signal lines. A person of ordinary skill in the art may understand and implement it without paying any creative effort.

[0128] Those skilled in the art can clearly understand that for the sake of convenience and brevity, the specific working process of the device described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0129] The device may be a computing device such as a desktop computer, a notebook, a PDA, a cloud server, etc. The device may include, but is not limited to, a processor and a memory.

[0130] The processor may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc. The processor is the control center of the device, and various interfaces and lines are used to connect various parts of the entire device.

[0131] The memory can be used to store the computer program, and the processor realizes various functions of the device by running or executing the computer program stored in the memory and calling the data stored in the memory. The memory can mainly include a program storage area and a data storage area, wherein the program storage area can store an operating system, at least one application required for a function, etc.; the data storage area can store data created according to the use of the mobile phone, etc. In addition, the memory can include a high-speed random access memory, and can also include a non-volatile memory, such as a hard disk, a memory, a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (FlashCard), at least one disk storage device, a flash memory device, or other volatile solid-state storage devices.

[0132] The storage medium is a storage medium, and the computer program is stored in the storage medium. When the computer program is executed by the processor, the steps of each method embodiment described above can be implemented. Among them, the computer program includes computer program code, and the computer program code can be in source code form, object code form, executable file or some intermediate form, etc. The computer readable medium may include: any entity or device capable of carrying the computer program code, recording medium, USB flash drive, mobile hard disk, disk, optical disk, computer memory, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), electric carrier signal, telecommunication signal and software distribution medium, etc. It should be noted that the content contained in the computer readable medium can be appropriately increased or decreased according to the requirements of legislation and patent practice in the jurisdiction. For example, in some jurisdictions, according to legislation and patent practice, computer readable media do not include electric carrier signals and telecommunication signals.

[0133] The above is a preferred embodiment of the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A substation inspection method, characterized in that: include: Obtain basic inspection data of components; Determining whether the component is an abnormal component according to the basic inspection data; If the component is an abnormal component, determining all possible fault types of the abnormal component according to the basic inspection data; Determine an in-depth inspection plan for the abnormal component based on all possible fault types; According to the deep inspection scheme, a deep inspection is performed on the abnormal component to obtain the deep inspection data; According to the deep inspection data, it is determined whether the abnormal component is a faulty component, and if so, the fault type of the faulty component is determined and output.

2. The substation inspection method according to claim 1, characterized in that: The basic inspection data of the components is obtained, including: Collecting image feature information of the component; Determining type information of the component according to the image feature information; Determine the basic inspection plan of the components according to the type information; According to the basic inspection plan, a basic inspection is performed on the component to obtain the basic inspection data.

3. The substation inspection method according to claim 1, characterized in that: Determining all possible fault types of the abnormal component according to the basic inspection data includes: Analyze the basic data to determine all abnormal data in the basic data; Determine, according to all the abnormal data, possible fault types corresponding to all the abnormal data as possible fault types of the abnormal component; Determining the in-depth inspection scheme of the abnormal component according to all the possible fault types includes: For each of the possible fault types, determining target data corresponding to the possible fault type; According to each of the target data, determining a corresponding target acquisition position; According to all target collection locations, the in-depth inspection plan is planned.

4. The substation inspection method according to claim 1, characterized in that: Before obtaining the basic inspection data of the components, it also includes: Get the inspection path; According to the inspection path, the inspection operation is performed on each device to be inspected along the path in turn; The inspection operation includes: According to the preset component inspection sequence of the equipment to be inspected, basic inspection is performed on each component of the equipment to be inspected to obtain the basic inspection data.

5. The substation inspection method according to claim 4, characterized in that: The obtaining of the inspection path comprises: Obtaining location information, inspection cost information and environmental data of all inspection areas; wherein the environmental data includes: temperature range, current range and voltage range; For each inspection area, if the environmental data is normal, the inspection area is determined to be a normal area, otherwise, the inspection area is determined to be an abnormal area; According to the location information and inspection cost information of all abnormal areas, a genetic algorithm is used to obtain the inspection path of the abnormal area with the minimum inspection cost; According to the location information and inspection cost information of all normal areas, a genetic algorithm is used to obtain the normal area inspection path with the minimum inspection cost; Determine the shortest path between the end point of the abnormal area inspection path and the starting point of the normal area inspection path, and connect the abnormal area inspection path and the normal area inspection path according to the shortest path to obtain the inspection path; wherein the starting point of the inspection path is the starting point of the abnormal area inspection path.

6. The substation inspection method according to claim 5, characterized in that: The method for determining whether the environmental data is normal includes: If the maximum value of the temperature interval of the environmental data does not exceed the preset standard temperature maximum value, the current interval falls within the preset standard current area, and the voltage interval falls within the preset standard voltage interval, the environmental data is determined to be normal, otherwise the environmental data is determined to be abnormal.

7. The substation inspection method according to claim 4, characterized in that: The method for setting the equipment to be inspected includes: Obtain the number of connection lines for all devices, the area of ​​the affected power supply area, and the historical failure rate; For each device, if the number of connection lines of the device is greater than or equal to the preset number of connection lines of the standard device, and the area of ​​the power supply area affected by the device is greater than or equal to the preset area of ​​the power supply area of ​​the standard device, then the device is a critical device; if the historical failure rate of the device is greater than or equal to the preset standard device failure rate, then the device is a prone to failure device; Set all key equipment and the equipment that is prone to failure as equipment to be inspected.

8. A substation inspection device, characterized in that: include: Data acquisition module, abnormal component determination module, in-depth inspection plan formulation and execution module and fault component determination module; The data acquisition module is used to acquire basic inspection data of components; The abnormal component determination module is used to determine whether the component is an abnormal component based on the basic inspection data; The in-depth inspection plan formulation and execution module is used to determine all possible fault types of the abnormal component according to the basic inspection data when the component is an abnormal component; and determine the in-depth inspection plan of the abnormal component according to all the possible fault types; According to the deep inspection scheme, a deep inspection is performed on the abnormal component to obtain the deep inspection data; The fault component determination module is used to determine whether the abnormal component is a faulty component based on the deep inspection data, and if so, determine and output the fault type of the faulty component.

9. A terminal device, characterized in that: The method comprises a processor, a memory, and a computer program stored in the memory and configured to be executed by the processor, wherein the processor implements the substation inspection method according to any one of claims 1 to 7 when executing the computer program.

10. A storage medium, characterized in that: The storage medium includes a stored computer program, wherein when the computer program is executed, the device where the storage medium is located is controlled to execute the substation inspection method according to any one of claims 1 to 7.

Images