Semiconductor processing device
By designing a semiconductor processing device, the pins of the semiconductor component are pre-pressed and corrected by using the pressure-integrated driving mechanism, the problem of pins being raised after the ribs is solved, ensuring the smooth progress of subsequent assembly and the improvement of chip performance.
CN119681144AActive Publication Date: 2025-03-25ASTATINE DEMAN SEMICON (SHENZHEN) CO LTD
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Patent Information
- Application Number
- CN202411805221.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2044-12-10
AI Technical Summary
Technical Problem
After the rib cutting process of semiconductor components, the pins may rise due to friction, affecting subsequent assembly and chip performance.
Method used
A semiconductor processing device is designed, including a base, component sliding groove, pin placement groove and a press-fit driving mechanism. The pressure drive mechanism prepresses and corrects the pins through the cylinder and floating seat drive pressure and the entire seat and the entire press to ensure that the pins are in the correct assembly form.
Benefits of technology
By pre-pressing and correcting the pins of semiconductor components, the problem of pin upturn is solved, ensuring the smooth progress of subsequent assembly and improving the performance and reliability of the chip.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention discloses a semiconductor processing device, and relates to the technical field of semiconductor processing, the semiconductor processing device comprises a base, the top surface of the base is provided with an element sliding groove and a pin placing groove, the element sliding groove is matched with the pin placing groove for use and is used for placing a semiconductor element, and the lower surfaces of pins at two sides of the semiconductor element abut against the surface of the pin placing groove; the pressing and trimming driving mechanism is arranged on one side of the base, the output end of the pressing and trimming driving mechanism is in driving connection with a pressing and trimming seat, pressing and trimming blocks extending downwards are fixedly connected to the two sides of the pressing and trimming seat respectively, the two pressing and trimming blocks correspond to pins on the two sides of a semiconductor element respectively, and an avoiding space is defined by the bottom of the pressing and trimming seat and the two pressing and trimming blocks; and the avoiding space is used for the semiconductor element to freely pass through. According to the invention, the pressing and trimming seat is driven by the pressing and trimming driving mechanism to move downwards, so that the pressing and trimming block generates pressure on the pins of the semiconductor elements placed in the element placing groove, and under the action of the pressure, the upwarp phenomenon of the pins can be improved, thereby facilitating subsequent processes such as assembly.
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