Photosensitive resin composition and pattern forming method

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By using a photosensitive resin composition containing a silicone resin and a photoradical generator, the problem in the prior art that it is difficult to form a cured film with high chemical resistance and copper migration resistance when cold cured below 150°C is solved, and the effect of forming a high-performance cured film under low temperature conditions is achieved.

CN119689781APending Publication Date: 2025-03-25SHIN ETSU CHEMICAL CO LTD

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Patent Information

Application Number: CN202411331128.6
Authority / Receiving Office: CN · China
Patent Type: Applications(China)
Current Assignee / Owner
Priority Date: 2023-09-25
Filing Date: 2024-09-24
Publication Date: 2025-03-25

Application Information

Patent Timeline

25 Sep 2023

Priority

24 Sep 2024

Application

CN202411331128.6

25 Mar 2025

Publication

CN119689781A

IPC: G03F7/004; G03F7/038; G03F7/075; G03F7/16; G03F7/20; G03F7/26; H05K3/28; C08G59/20; C08G77/52

CPC: G03F7/0757; G03F7/0388; G03F7/027; G03F7/325; G03F7/075; G03F7/20; G03F7/30; C08G77/52

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Application Domain

Semiconductor/solid-state device manufacturing Photomechanical coating apparatus

Technology Topics

Polymer science Meth-

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AI Technical Summary

Technical Problem

When the conventional photosensitive resin composition is cooled at 150° C. or less, it is difficult to form a cured film with high chemical resistance and high copper migration resistance.

Method used

A photosensitive resin composition comprising a silicone resin and a photoradical generator is used, wherein the silicone resin has a silenide structure, a polysiloxane structure and a fluorene structure in the main chain and an acryloyl group or a methacryloyl group in the side chain.

Benefits of technology

Even when the curing is cold at 150°C or below, fine-sized patterns can be formed and have high chemical resistance or copper migration resistance.

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Abstract

The photosensitive resin composition includes: (A) a silicone resin having a silicon phenylene structure, a polysiloxane structure, and a fluorene structure in a main chain and having an acryloyl group or a methacryloyl group in a side chain; and (B) a photoradical generator.

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