Cooling water pipe fine adjustment device
By providing a driving mechanism of rack and gear on the support table of the cooling water spraying device, convenient adjustment and precise fine-tuning of the cooling water spraying device are achieved, and the problems of inconvenient adjustment and insufficient accuracy in the prior art are solved.
CN119694931APending Publication Date: 2025-03-25SHANGHAI SEMICON WAFER TECH CO LTD
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Patent Information
- Application Number
- CN202411764352.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-04
- Publication Date
- 2025-03-25
AI Technical Summary
Technical Problem
The existing cooling water spray device needs to frequently disassemble and assemble the screws when switching sizes, which is inconvenient to adjust and cannot achieve precise fine adjustment.
Method used
A cooling water pipe fine-tuning device is designed, and by providing a driving mechanism, including racks and gears, the cooling water spraying device reciprocatingly moves along the support table direction, avoiding screw disassembly and assembled.
Benefits of technology
It realizes convenient adjustment and precise fine adjustment of the position of the cooling water spray device, which is suitable for cooling and cleaning of silicon wafers of different sizes, and expands the scope of application.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to the technical field of silicon wafer cleaning, in particular to a cooling water pipe fine adjustment device which comprises a supporting table extending in one direction, and a cooling water spraying device is arranged on the supporting table. A driving mechanism is arranged between the supporting table and the cooling water spraying device and can drive the cooling water spraying device to reciprocate on the supporting table in the extending direction of the supporting table. According to the cooling water spraying device, when the position of the cooling water spraying device needs to be adjusted, only the driving mechanism needs to be operated, tedious screw disassembly and assembly can be well avoided, and the position of the cooling water spraying device is more convenient to adjust; thus, the cooling water spraying device arranged on the supporting table can be suitable for cooling and cleaning silicon wafers of different sizes, and the application range is wider.
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