Packaging structure and method of integrated circuit chip
By setting the interactive connection pin components and sealing structure in the modular chip body, the problems of highly integrated chip signal connection interference and size expansion are solved, and chip miniaturization and connection strength are achieved.
CN119695016AActive Publication Date: 2025-03-25SHENZHEN WANLIANXIN TECH CO LTD
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Patent Information
- Application Number
- CN202510200703.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-24
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2045-02-24
AI Technical Summary
Technical Problem
The prior art is not applicable on highly integrated chips, resulting in the inability to shrink the chip size and the risk of signal connection interference.
Method used
The modular chip body is adopted, consisting of a solder layer, a substrate layer, a conductive layer and a plastic sealing layer. By setting an interactive connection pin assembly between adjacent chips, signal connection is achieved, and locking is achieved through the sealing of the plastic sealing layer and the substrate layer.
Benefits of technology
It effectively avoids chip area occupation, ensures the miniaturization of modular chips, reduces the risk of signal connection interference, and improves the connection strength between chips.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention discloses a packaging structure and method of an integrated circuit chip, and belongs to the technical field of chip packaging, the packaging structure comprises a modular chip main body, the modular chip main body is composed of a welding layer, a base material layer, a conductive layer and a plastic packaging layer, and chip contact protrusions are densely arranged at the bottom of the welding layer; the conductive layer is divided into an upper conductive layer, a middle insulating layer and a lower conductive layer from top to bottom, the plastic packaging layer and the base material layer are connected through a four-corner positioning packaging piece, and interactive connection pin assemblies are arranged on the side walls of the two opposite sides of the base material layer. According to the invention, a plurality of modular chips forming the integrated chip are designed, the interactive connection pin assemblies are arranged between the adjacent modular chips, so that the adjacent modular chips can be positioned and installed, and the pins arranged at the two sides of the chips are used for completing signal connection in the plastic packaging process, so that the reliability of the integrated chip is improved. And the occupation of the chip area can be effectively avoided, and the miniaturization of the modular chip is ensured.
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