Voltage regulator partitioning on stacked die

By partitioning voltage regulators on multiple dies, using different technologies on different dies, the power delivery and thermal management challenges of existing voltage regulators when improving computational density and power density are solved, achieving a more efficient and economical voltage regulation effect.

CN119696299APending Publication Date: 2025-03-25INTEL CORP
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Patent Information

Application Number
CN202411164305.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-09-25
Filing Date
2024-08-23
Publication Date
2025-03-25

AI Technical Summary

Technical Problem

Existing voltage regulators face challenges in power delivery and thermal management while increasing their computational density and power density, resulting in efficiency and cost issues.

Method used

By partitioning voltage regulators on multiple dies, using different transistor technologies and passive technologies on different dies, more efficient voltage regulation is achieved. The specific method includes placing an active device with high voltage blocking capability on the first die, placing an active device with low voltage blocking capability on the second die, and coupling the two through a conductive point.

Benefits of technology

This partitioning method improves the efficiency and current density of the voltage regulator, reduces heat and heat spots, reduces overall power consumption, and improves overall performance and reduces costs by optimizing process nodes and passive technologies.

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Abstract

The invention relates to voltage regulator partitions on stacked dies. Embodiments herein relate to a voltage regulator (VR) formed of dies stacked on a package substrate layer. The VR may include a first portion on a first die and a second portion on a second die, the different portions selected based on characteristics of the respective dies, such as their voltage domains or techniques. In a capacitor-based VR, an input capacitor and a switch that withstand a relatively high input voltage may be provided in a first die, and a fly capacitor, an output capacitor, and a switch that withstand a relatively low output voltage may be provided in a second die. In an inductor-based VR, an inductor and one or more switches that withstand a relatively high input voltage may be provided in a first die, while an output capacitor that withstand a relatively low output voltage may be provided in a second die.
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