Power supply device and power supply system

By optimizing the module layout and connection paths in the power supply device, the balance problem between miniaturization and high power density of existing power supply devices is solved, and higher space utilization, better signal transmission paths and lower power loss are achieved.

CN119696307AInactive Publication Date: 2025-03-25DELTA ELECTRONICS (THAILAND) PUBLIC CO LTD
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Patent Information

Application Number
CN202411764050.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-03
Publication Date
2025-03-25
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

With limited sizes, existing power supply devices have low space utilization, long signal transmission paths, and large power loss, making it difficult to find a balance between miniaturization and high power density.

Method used

By setting the rectifier module between the input and output module and the capacitor module, the first inductor module and the resonant module are arranged near the power semiconductor device module, the circuit connection path is shortened, and a vertical bus connection board is set on the main board, and a capacitor module is set to reduce PCB material.

Benefits of technology

The space utilization rate of the power supply device is improved, the signal transmission path is optimized, the power loss is reduced, and the overall efficiency is effectively improved.

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Abstract

The invention relates to a power supply device and a power supply system, the power supply device comprises a plurality of modules arranged on a main circuit board, the main circuit board comprises a first side, a second side, a third side and a fourth side, the first side and the second side are oppositely arranged and extend along a first direction, and the third side and the fourth side are oppositely arranged and extend along a second direction; the input / output module is arranged on the main circuit board and is adjacent to the fourth side; the capacitor module is adjacent to the third side; the rectifier module is arranged on the main circuit board, is positioned between the input / output module and the capacitor module, and is adjacent to the input / output module; the EMI module, the first inductor module, the resonance module and the power semiconductor device module are all arranged on the main circuit board and located between the capacitor module and the rectifier module.
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