Alumina ceramic heating ring and processing method
By setting up a multi-layer ring groove structure and thermal conductive coating in the alumina ceramic heating ring, the problem of insufficient thermal conductivity and heating efficiency of the traditional heating ring is solved, and more uniform heat conduction and higher heating efficiency are achieved, while ensuring the precision and cleanliness of the product.
Patent Information
- Application Number
- CN202411714807.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-27
- Publication Date
- 2025-03-25
AI Technical Summary
Traditional alumina ceramic heating rings have shortcomings in heating efficiency and thermal conductivity, and it is difficult to meet the requirements of semiconductor etching equipment for high-precision ceramic components.
By setting the first and second-level sinking ring grooves in the alumina ceramic heating ring, and setting the thermally conductive aluminum coating in the second-level sinking ring groove, and setting the alumina coating in the first-level sinking ring groove to cover the thermally conductive aluminum coating to improve the heat conduction efficiency.
The thermal conductivity and heating efficiency of the alumina ceramic heating ring are improved, making the heat conduction more uniform, and at the same time ensuring the flatness, parallelism and cleanliness of the product.