Driving circuit board heat conduction structure of water pump
By attaching the first functional sheet on the drive circuit board of the electronic water pump and exchanging heat with the main hot plate parts, the problem of insufficient heat dissipation performance of the driving circuit board is solved, and a more efficient heat dissipation effect is achieved, providing more possibilities for the circuit design of the electronic water pump.
CN119697864APending Publication Date: 2025-03-25广东深鹏科技股份有限公司
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Patent Information
- Application Number
- CN202411744216.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-30
- Publication Date
- 2025-03-25
AI Technical Summary
Technical Problem
In the prior art, the driving circuit board of the electronic water pump is insufficient in heat dissipation performance, resulting in overheating problems.
Method used
Using a thermally conductive structure including a driving circuit board and a main thermal plate, a first functional sheet is attached to the driving circuit board, and the first functional sheet and the main thermal plate are heat exchanged, and heat is exported through a thermally conductive medium.
Benefits of technology
It improves the heat dissipation performance of the driver circuit board, reduces performance limitations, and provides more possibilities for the circuit design of electronic water pumps.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention discloses a driving circuit board heat conduction structure of a water pump, and relates to the technical field of electronic water pumps and parts thereof. A first functional piece is attached to the other face, opposite to the high-heating component, of the driving circuit board, and when the direction perpendicular to the driving circuit board serves as the projection direction, the projection of the first functional piece and the projection of the high-heating component are overlapped. The first functional sheet can exchange heat with at least one part of high-heating components through the driving circuit board; and the first functional sheet of the driving circuit board can exchange heat with the main heat conduction plate. The invention mainly solves the problem of how to provide a more efficient heat dissipation structure for the driving circuit board of the electronic water pump. The first functional piece is used for conducting heat, so that the driving circuit board can obtain better heat dissipation performance, and the first functional piece is selectively used as a current channel of the driving circuit board to bear larger current and shunt for a printed circuit of the driving circuit board.
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