Compound, resin composition, prepreg, resin film, metal-clad laminate, printed wiring board, and semiconductor package
By using inden ring, vinyl benzyl and aromatic ring group-containing compounds, the formed resin composition can suppress deterioration of dielectric properties caused by hygroscopy, solve the problem of poor dielectric properties stability in the prior art, and achieve a resin material with low dielectric constant and low dielectric loss tangent.
Patent Information
- Application Number
- CN202480003768.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-06-16
- Filing Date
- 2024-04-22
- Publication Date
- 2025-03-25
AI Technical Summary
It is difficult to develop resins with low dielectric constant and low dielectric loss tangents, especially when substrate materials with large transmission losses in high-frequency regions, dielectric characteristics are prone to deterioration due to moisture absorption.
By directly bonding these groups to the indene ring, vinyl benzyl group, and aromatic ring-containing groups with 6 or more carbon atoms, the resin composition formed can inhibit deterioration of dielectric properties caused by hygroscopy.
It realizes a substrate material with small transmission loss in the high-frequency region, and the dielectric characteristics of the resin are stable, and it is not easy to deteriorate due to moisture absorption. It is suitable for electronic communication equipment for high-speed data processing.