Micro-needle application packaged by liquid metal
Through the liquid metal-encapsulated microneedle patch, combined with the design of pressing parts, bonding parts and flexible film, the problem of existing microneedle patches being difficult to firmly fit with the skin is solved, and the stable fixation of microneedles and effective repair of wounds is achieved.
Patent Information
- Application Number
- CN202510216888.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-26
- Publication Date
- 2025-03-28
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing micro-needle patches are difficult to firmly fit with the skin due to the inclined structure of the needle tip, which makes it difficult to overcome skin tension or fix the skin around the wound, which can easily lead to secondary cracking of the wound.
A micro-needle patch using liquid metal encapsulation is provided in the micro-needle patch, and the coupling between the pressing member and the bonding member is used to push the micro-needle to slide out of the bonding member obliquely and pierce into the skin through the slide. At the same time, a barbed structure is formed using a flexible membrane and a limiting member to fix the micro-needle.
The fit strength of the microneedle patch with the skin is improved, ensuring that the microneedle is stable and fixed on the skin, avoiding the microneedle shaking slightly during the treatment process, and enhancing the repair effect of drugs and electrotherapy on the wound.