Chip quality evaluation system and method based on data analysis
Through a chip quality evaluation system based on data analysis, the characteristics of chip packages in different detections are analyzed, and the problem of unintelligent detection in the existing technology is solved, more efficient chip quality evaluation and screening is achieved, and yield rate is improved.
CN119702509AActive Publication Date: 2025-03-28JIANGSU MANWANG SEMICON TECH CO LTD
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Patent Information
- Application Number
- CN202510214697.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-26
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2045-02-26
AI Technical Summary
Technical Problem
The existing chip detection technology fails to effectively consider the deviation and repairability of the two types of detection corresponding to the chip package in the pre-shipment inspection process, resulting in the inability to intelligent detection and may reduce the yield rate.
Method used
Using a chip quality evaluation system based on data analysis, intelligent evaluation and screening of chip quality is achieved by analyzing the identifiable characteristics of the chip package in physical detection and electrical performance detection.
Benefits of technology
This system can avoid judgment deviations in the finale, reduce chip detection workload, improve efficiency, enhance yield, and effectively analyze recoverable chip packages.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to the field of chip quality evaluation, in particular to a chip quality evaluation system and method based on data analysis, and the system comprises a target chip packaging body marking module, a chip detection result recording module, a packaging body classification module, a result judgment module and a quality evaluation processing module. The target chip packaging body marking module is used for marking a packaging body with qualified printing information as a target chip packaging body after packaging of the chip is completed; a chip detection result recording module obtains an output result of chip detection of the target chip packaging body; the packaging body classification module is used for marking a target chip packaging body with abnormal physical detection as a first packaging body and marking a target chip packaging body with abnormal electrical performance detection as a second packaging body; the result judgment module judges whether each output result of a plurality of chip detections recorded by the target chip packaging bodies with the same printing information is that the first packaging body is the same as the second packaging body or not; and the quality evaluation processing module outputs a result to perform quality evaluation processing.
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