Semiconductor packaging lead frame stamping equipment

By designing a semiconductor package lead frame stamping equipment including frame, cross plate, semi-finished upper template, bend upper module, lifting drive mechanism and multiple bend lower modules, the problem of the inability to bend the connection part of the existing equipment is solved, and the efficient production of a new semiconductor package lead frame is achieved.

CN119702848AInactive Publication Date: 2025-03-28ZHUHAI FILLGOLD TECH CO LTD
0 Cites 0 Cited by

Patent Information

Application Number
CN202411847955.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-16
Publication Date
2025-03-28
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Existing stamping equipment cannot bend the connection part of the semiconductor package lead frame, resulting in the inability to be suitable for the production of new semiconductor package lead frames.

Method used

A semiconductor package lead frame stamping equipment is designed, including a frame, a horizontal plate, a semi-finished upper template, a bend upper module, a lifting drive mechanism and a plurality of bend lower modules. Through the coordinated work of the rotating frame and the lifting drive mechanism, the bend of the connection part is achieved.

Benefits of technology

Effectively bend the connection part of the semiconductor package lead frame, improving production efficiency and making the equipment suitable for the production of new semiconductor package lead frames.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The invention relates to the technical field of stamping equipment, and discloses semiconductor packaging lead frame stamping equipment which comprises a semi-finished product upper template, a semi-finished product lower template, a bending upper module, a lifting driving mechanism, a rotatable rotating frame and a plurality of bending lower modules, each bending lower module comprises a bending female die, and a lower inclined plane is arranged on each bending female die; the semi-finished product upper template is matched with the semi-finished product lower template so as to punch a semi-finished product of the semiconductor packaging lead frame on the metal sheet; the bending upper module comprises a bending punch, an upper inclined plane is arranged on the bending punch, and the upper inclined plane and the lower inclined plane are matched to bend a connecting part; any two bending lower die sets are located below the semi-finished product discharging hole and the bending upper die set correspondingly. The lifting driving mechanism is used for driving the semi-finished product upper die plate and the bending punch to synchronously ascend and descend, the semi-finished product upper die plate and the bending punch descend at the same time at a time, machining of one semi-finished product and bending of the connecting portion of the other semi-finished product can be completed, a finished product is obtained, and the production speed is high.
Need to check novelty before this filing date? Find Prior Art