Welding equipment and welding method for solid state disk packaging

By adopting dual-drive control mechanical jaws and welding guns in solid-state hard disk welding equipment, combined with rotating mechanism and control module, the efficiency and accuracy problems of existing equipment during multi-angle welding and different chip arrangement methods are solved, and efficient and accurate welding effects are achieved.

CN119703544AInactive Publication Date: 2025-03-28CHINASOL TECH SHENZHEN CO LTD
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Patent Information

Application Number
CN202510179206.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-02-18
Publication Date
2025-03-28
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Existing solid-state hard disk welding equipment cannot maintain high efficiency and high precision welding during packaging, especially when multi-angle welding and different chip arrangement methods, it is difficult for the equipment to achieve rapid and accurate welding.

Method used

A welding equipment for solid-state hard disk packaging is designed, using a dual-drive control method of mechanical jaws and welding guns. Multi-angle welding is achieved through rotary mechanisms, and the operation of each drive mechanism is coordinated through the control module to ensure the efficiency and accuracy of the welding process.

Benefits of technology

It improves the flexibility and accuracy of welding operations, reduces manual intervention, ensures the smooth and efficient welding process, adapts to the packaging needs of different types of solid-state hard disk chips, and improves the versatility of the equipment.

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Abstract

The invention discloses welding equipment and a welding method for solid state disk packaging, and the welding equipment comprises a rack which is provided with a jig platform and a welding support; the welding assembly comprises a mechanical clamping jaw, a welding gun and a driving assembly. The driving assembly comprises a first driving mechanism and a second driving mechanism. The rotating mechanism is arranged in the rack and comprises a third driving mechanism and a rotating shaft; the control module is connected with the welding assembly and the rotating mechanism, and when the control module controls the first driving mechanism to drive the mechanical clamping jaw to clamp the chip and move to the position above the jig platform, the control module controls the second driving mechanism to drive the welding gun to move to the position above the chip for welding operation; when the control module controls the third driving mechanism to drive the rotating shaft to rotate, the jig platform is driven to rotate, so that multi-angle welding of the solid state disk chip is achieved. By adjusting the rotation angle and accurately controlling the position of the clamping jaw, the packaging requirements of different types of solid state disk chips can be met, and the universality of the equipment is greatly improved.
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