Pressure sensitive adhesive and reseparatable self-adhesive product comprising same

By using hydrogenated polyvinyl aromatic compound-polydiene block copolymer and other components in the adhesive, the problem that existing adhesives are difficult to meet both high initial flow capacity and residual reseparability is solved, and an adhesive with high thermal shear strength and long-term stability is achieved.

CN119709065APending Publication Date: 2025-03-28TESA SE
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Patent Information

Application Number
CN202411350136.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-09-27
Filing Date
2024-09-26
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

Existing adhesives are difficult to meet both high initial flow capacity and residual reseparability, especially when bonding high thermal shear strength materials such as PP/EPDM.

Method used

At least 28% to 60% by weight of the elastomer component, which comprises a hydrogenated polyvinyl aromatic compound-polydiene block copolymer, combined with the tackifier resin component and the reinforcement component, the composition of the adhesive is optimized to improve flowability and adhesive properties.

Benefits of technology

Improved initial flow capacity and viscous properties are achieved while maintaining high long-term and temperature stability, ensuring reseparability of the adhesive and high thermal shear strength.

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Abstract

A pressure sensitive adhesive comprising: a) at least 28 wt% and at most 60 wt% of an elastomeric component; b) a tackifier resin component; c) optionally a plasticizer component; d) optionally at least 2.5% to 22% by weight, preferably at least 4% to up to 18% by weight, of a reinforcing component, said reinforcing component being at least one resin having an MMAP value of between-10 DEG C and + 30 DEG C, preferably between 0 DEG C and + 20 DEG C, and a softening point of at least 140 DEG C; e) optionally a further adjuvant, the fraction of the elastomeric component being based on the total weight of the pressure sensitive adhesive.
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