Wafer boat, film deposition device and film thickness control method
By setting a slot group on the carrier of the wafer boat, the relative position of the smooth surface and rough surface of the wafer is controlled, the problem of difference in wafer film thickness is solved, the film layer is unclear corrosion is reduced, and the accuracy of photolithography alignment is improved.
CN119710644APending Publication Date: 2025-03-28QINGDAO HKC MICROELECTRONICS CO LTD +2
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Patent Information
- Application Number
- CN202411726546.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-28
- Publication Date
- 2025-03-28
AI Technical Summary
Technical Problem
During wafer processing, the thickness of the rough surface deposited film layer of the wafer is usually higher than that of the smooth surface, resulting in unclear subsequent corrosion and affecting lithography alignment.
Method used
A crystal boat is designed, by setting a slot group on the carrier to ensure that the smooth and rough surfaces of the wafer are in farther and closer positions when the film layer is deposited, and the difference in film layer thickness is controlled.
Benefits of technology
It effectively reduces the situation when the rough surface of the wafer is thicker and the smooth surface of the film layer is thinner, reduces the risk of unclear corrosion of the film layer, and improves the accuracy of photolithography alignment.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention discloses a wafer boat, a film deposition device and a film thickness control method. The wafer boat comprises a bearing body, the bearing body is provided with a slot group, the slot group comprises a first slot and a second slot, the first slot and the second slot are arranged in parallel, and the depth direction of the first slot and the depth direction of the second slot are perpendicular to the length direction of the bearing body; the first slot and the second slot are respectively used for placing a wafer, the wafer is provided with a relatively smooth surface and a rough surface, and the rough surface of the wafer in the first slot and the rough surface of the wafer in the second slot are oppositely arranged, so that the deposition thickness of the smooth surface of the wafer is increased and the deposition thickness of the rough surface of the wafer is reduced during film deposition. According to the technical scheme provided by the invention, the conditions that the film layer of the rough surface is relatively thick and the film layer of the smooth surface is relatively thin when the wafer is subjected to film layer deposition can be effectively reduced, the conditions that the film layer of the rough surface is not thoroughly corroded are reduced, and the adverse effect on photoetching alignment is reduced.
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