Plating apparatus and plating method

By designing an adjustable anode mask in the plating device, the problem of uneven distribution of plating film thickness on the polygonal substrate is solved, and a more uniform distribution of plating film thickness is achieved, improving the plating effect.

CN119710872APending Publication Date: 2025-03-28EBARA CORP
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Patent Information

Application Number
CN202411838702.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2022-06-27
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

When plating on a polygonal substrate, due to the low symmetry of the substrate, the coating film thickness distribution tends to be different near the corners and the center of the edges, and special points of film thickness distribution are prone to occur. Especially when the terminal effect is large, the coating film thickness becomes smaller in the corner area, affecting the in-plane uniformity of the film.

Method used

A plating device is designed including a plating tank, a substrate holder, anode and anode mask. The anode mask has first and second masking members, respectively, a projection protruding towards the center of the opening is delineated at the edge center of the polygonal substrate, and the distance between the two can be adjusted to adjust the opening shape of the anode mask.

Benefits of technology

By adjusting the opening shape of the anode mask, the in-plane uniformity of the film plated on the polygonal substrate can be effectively improved, and the influence of the terminal effect on the film thickness distribution can be reduced.

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Abstract

The purpose of the present invention is to improve in-plane uniformity of a film plated on a polygonal substrate. A plating device is provided with: a plating tank; a substrate holder configured to hold the polygonal substrate; an anode disposed in the plating bath so as to face the substrate held by the substrate holder; and an anode mask defining an opening corresponding to the outer shape of the polygonal substrate. The anode mask is provided with: a first mask member that defines a first protrusion protruding toward the center of the opening at the center of a first opening side corresponding to the first side of the polygonal substrate in the opening; and a second mask member defining a second protruding portion protruding toward the center of the opening at a central portion of a second opening side corresponding to a second side of the polygonal substrate in the opening, the anode mask being configured so that a distance between the first mask member and the second mask member can be adjusted.
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