Adaptive slice depth in slice and view workflows
By adaptively selecting the grinding depth and focused ion beam dose during the sample image acquisition process, the problem of long time and large investment in the sample three-dimensional image construction in the prior art is solved, and more efficient image acquisition and three-dimensional reconstruction are achieved.
CN119715634APending Publication Date: 2025-03-28FEI CO
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Patent Information
- Application Number
- CN202411355939.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-09-28
- Filing Date
- 2024-09-27
- Publication Date
- 2025-03-28
AI Technical Summary
Technical Problem
The prior art requires a lengthy processing time and a large amount of technician investment when obtaining multiple two-dimensional images to construct three-dimensional images, especially in the case of large sample sizes.
Method used
The acquisition rate of sample images is increased by selecting the grinding depth based on the sample size and selecting the section height and associated focused ion beam dose based on the image of the previously exposed cross-sectional surface.
Benefits of technology
This method can significantly reduce the total time and technician investment required to acquire sample images, and improve the efficiency of sample three-dimensional image construction.
✦ Generated by Eureka AI based on patent content.
Abstract
Adaptive slice depth in slice and view workflow. Abrasive depth is selected based on the sample size to increase the rate at which the sample image is acquired. A tangent plane height and an associated focused ion beam dose are selected based on an image of a previously acquired cross-sectional surface. Edges in the image may be identified, such as those corresponding to a sample stent or a coating applied to the sample, and used to determine the CPB dose. The tangent height may be based on a single or multiple previous cross-sectional surface images.
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