Negative phenolic resin composition as well as preparation method and application thereof

By designing a modified phenolic resin with a specific structure and combining it with an initiator and an organic solvent, a negative phenolic resin composition is formed, which solves the shortcomings of the existing resin composition in terms of high-temperature curing, film uniformity and chemical resistance, and achieves low-temperature curing and high-performance film formation effects.

CN119717393APending Publication Date: 2025-03-28FUJIAN HONGGUANG SEMICON MATERIALS CO LTD
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Patent Information

Application Number
CN202411911828.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-24
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

The existing resin compositions have problems such as high curing temperature, poor uniformity in the film thickness surface and poor chemical solvent resistance in the photolithography materials and semiconductor packaging materials, resulting in poor photolithography pattern formation and reduced protective effect of semiconductor components.

Method used

A modified phenolic resin with a specific structure was designed and synthesized, the branching ratio of its olefin double bond was regulated, and combined with an initiator and an organic solvent to form a negative phenolic resin composition. The composition has good curing properties at low temperatures and maintains good in-film thickness uniformity and chemical solvent resistance after film formation.

Benefits of technology

Low-temperature curing is achieved, uniformity in the film thickness surface and chemical solvent resistance are improved, and the formation effect of photolithography patterns and the protection ability of semiconductor components are enhanced.

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Abstract

The invention belongs to the field of semiconductor packaging materials and photoetching materials, and particularly relates to a negative phenolic resin composition as well as a preparation method and application thereof. The negative phenolic resin composition contains modified phenolic resin with a structure as shown in a formula (1), an initiator and an optional organic solvent I. The key point of the invention lies in that the modified phenolic resin with a specific structure is designed and synthesized, the grafting ratio of olefinic double bonds in the modified phenolic resin is regulated and controlled, and the negative phenolic resin composition obtained by compounding the modified phenolic resin, the initiator and the optional organic solvent has low-temperature curing performance; and the film thickness in-plane uniformity after film forming is good, a cured relief pattern with a good shape can be obtained when the film is used as a photoetching material, and when the film is used as a semiconductor packaging material, possible damage to a semiconductor element is reduced, and the protection effect of a film forming resin layer on the semiconductor element is improved. # imgabs0 #
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