Method of forming conductive block, semiconductor package, and method of forming semiconductor package
By forming multiple sets of conductive pads and solder bumps on the semiconductor packaging substrate, and horizontally aligning the top surface of the conductive block by using the pressing step, the problems of complex process and low yield in the prior art are solved, and process simplification and yield improvement are achieved.
CN119725220APending Publication Date: 2025-03-28JCET STATS CHIPPAC KOREA LTD
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Patent Information
- Application Number
- CN202311264312.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-27
- Publication Date
- 2025-03-28
AI Technical Summary
Technical Problem
The process of forming high interconnect structures in existing semiconductor packages is complex and not cost-effective, affecting yield and reliability.
Method used
By forming multiple sets of conductive pads on the package substrate and depositing the solder material into solder bumps, the top surface of the conductive block is horizontally aligned to form a uniform solder bump.
Benefits of technology
The process flow is simplified, the yield is improved, and the structural uniformity and reliability of the conductive block are enhanced through a uniform solder bump structure.
✦ Generated by Eureka AI based on patent content.
Abstract
A method of forming a conductive block on a package substrate, a semiconductor package, and a method of forming the semiconductor package are provided. The method for forming the conductive blocks on the package substrate comprises the following steps: providing the package substrate on which a plurality of groups of conductive pads are formed; depositing a solder material onto the package substrate to form solder bumps on the plurality of sets of conductive pads; attaching a plurality of conductive blocks to the package substrate, wherein each conductive block of the plurality of conductive blocks is aligned with a set of conductive pads of the plurality of sets of conductive pads; loading the package substrate on a bottom mold, wherein the plurality of conductive blocks face upwards; and pressing the conductive blocks against the bottom mold with a top mold to reshape the solder bumps and to horizontally align top surfaces of the plurality of conductive blocks to each other.
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