Semiconductor package
By using multi-channel membrane to connect chip pads in semiconductor packages, the problem of increased channel impedance in semiconductor chip stacks is solved, and more efficient electrical connections and lower inductance are achieved, improving data processing performance.
Patent Information
- Application Number
- CN202411334294.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-09-26
- Filing Date
- 2024-09-24
- Publication Date
- 2025-03-28
AI Technical Summary
With the increase in the number of semiconductor chip stacks and pads, the channel impedance caused by the inter-chip connection structure increases, limiting the ability to process large-capacity data at high speed.
Using a multi-channel film, including a flexible insulating film, a plurality of conductors and anisotropic conductive film, a plurality of channels are formed to improve the reliability of the electrical connection by connecting the chip pads in the stacking direction and electrically connecting to the substrate pads.
The inductance caused by bonding wiring is significantly reduced, the input/output performance of sending and receiving large amounts of data at high speed is improved, and the spacing of chip pads can be further reduced.