High-precision temperature compensation type oscillator

By making the IC chip in a temperature-complement type oscillator directly in contact with the quartz wafer and connecting it using ultrasonic welding process, the problem of insufficient stability and reliability of the oscillator in the prior art is solved, and higher temperature measurement accuracy and more stable frequency output are achieved.

CN119727612APending Publication Date: 2025-03-28HEFEI JINGWEITE ELECTRONICS CO LTD
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Patent Information

Application Number
CN202411793497.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-09
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

The stability and reliability of existing temperature-compensation oscillators are insufficient, mainly because the quartz wafer is not directly connected to the temperature-compensation chip, resulting in insufficient temperature measurement accuracy, which in turn causes temperature compensation deviation and frequency deviation.

Method used

By making the IC chip in a temperature-complement oscillator directly contact with the quartz chip and connecting it using ultrasonic welding process, the stable connection between the quartz chip and the connection point and the IC chip is ensured.

Benefits of technology

The temperature measurement accuracy is improved, from ±0.5 to ±0.15, which enhances the accuracy of temperature perception, reduces frequency deviation caused by temperature changes, and improves the stability and reliability of the oscillator.

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Abstract

The invention discloses a high-precision temperature compensation type oscillator which comprises a base, corner positions are connected to the four corners of the lower surface of the base respectively, an IC chip is connected to the middle of the upper surface of the base, a quartz wafer is arranged in the middle of the upper portion of the base and makes contact with the upper surface of the IC chip, and a frame is integrally connected to the upper portion of the base. The temperature change can be sensed more accurately by enabling the IC chip and the quartz wafer to be in direct contact together, so that the overall temperature measurement precision is improved, the temperature measurement precision is changed from original + / -0.5 to + / -0.15, high-precision temperature sensing is crucial to the performance of a temperature compensation type oscillator, because stable oscillation frequency output needs to be realized in a wide temperature range, and the temperature compensation type oscillator is very important to the temperature compensation type oscillator. And meanwhile, the temperature measurement is more accurate, the oscillation frequency can be more accurately adjusted to adapt to changes in different temperature environments, frequency deviation caused by temperature changes can be reduced, and the stability and the reliability of the oscillator are improved.
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