Printing process of flexible circuit board

By using conductive ink made of dispersed connecting materials composed of multiple components on the flexible circuit board, the problem of flexible circuit board being susceptible to sweat, cosmetics and frictional fallout in smart wearable devices is solved, and the effects of high conductivity, adhesion stability and wear resistance are achieved, which significantly improves the reliability and service life of the equipment.

CN119730057AActive Publication Date: 2025-03-28DONGGUAN ZHONGJIA PRINTING CO LTD
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Patent Information

Application Number
CN202411875752.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-19
Publication Date
2025-03-28
Estimated Expiration
2044-12-19

AI Technical Summary

Technical Problem

Existing flexible circuit boards are susceptible to sweat, cosmetics erosion and frictional fallout in smart wearable devices, resulting in circuit patterns falling off or performance degraded, affecting reliability and service life.

Method used

A conductive ink composed of conductive filler and dispersed connecting material is used to print on the surface of the substrate by inkjet to form a conductive pattern. The dispersed connecting material is composed of boron-modified phenolic resin, active toughened monomer, modified polyester acrylate and other components to ensure the conductivity, adhesion stability and wear resistance of the ink.

Benefits of technology

It significantly improves the conductivity, adhesion stability and wear resistance of the flexible circuit board, effectively resists the erosion of sweat and cosmetics, avoids the circuit pattern falling off or the performance degradation, and greatly improves the reliability and service life of the flexible circuit board.

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Abstract

The invention relates to the field of printing of circuit boards, in particular to a printing process of a flexible circuit board. The printed flexible circuit board is prepared by the following steps of: printing conductive ink on the surface of a base material through ink jet, curing, and forming a conductive pattern on the surface of the base material to obtain a printed flexible circuit board; the conductive ink is composed of a conductive filler and a dispersed binder in a weight ratio of 1: (1-5); dispersing a binder: weighing boron modified phenolic resin, an active toughening monomer, modified polyester acrylate, a polyethylene oxide-polypropylene oxide-polyethylene oxide segmented copolymer, modified rosin resin, N-aminoethyl-3-aminopropyl methyl dimethoxy silane, an active diluent, an initiator, a solvent and a processing aid, and uniformly mixing; the dispersed binder is obtained. The conductive ink has better comprehensive performance, and can avoid the possibility of falling, corrosion, abrasion and the like of the circuit pattern of the flexible circuit board.
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