Electronic device

By using piezoelectric heat dissipation components in electronic devices to suck external gas in and drive the airflow to circulate, the problem of poor waterproofing effect of electronic devices is solved, achieving higher waterproofing levels and more efficient heat dissipation effects.

CN119730182APending Publication Date: 2025-03-28VIVO MOBILE COMM CO LTD
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Patent Information

Application Number
CN202411928912.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-25
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

The waterproofing effect of electronic equipment is poor, mainly because the air inlet needs to have a certain circulation area to meet the airflow circulation requirements.

Method used

An electronic device is designed to use piezoelectric heat dissipation components to suck external gas into the interior through the intake gap, dissipate heat to the processor module, and discharge it through the first air outlet to realize airflow circulation, while reducing the circulation area of ​​the intake gap to improve waterproofing effect.

Benefits of technology

The piezoelectric heat dissipation component drives the airflow into the interior of the equipment, achieving higher wind pressure and smaller flow area of ​​the intake gap, improving the overall waterproofing level of electronic equipment, and reducing the space occupation of the heat dissipation equipment.

✦ Generated by Eureka AI based on patent content.
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Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a frame body, a cover assembly, a processor module and a piezoelectric heat dissipation assembly. The frame body is provided with a first air outlet; the cover assembly covers the frame body and is provided with an air inlet gap; the processor module is arranged in the frame body; the piezoelectric heat dissipation assembly is arranged between the processor module and the cover assembly, external gas can be sucked into the electronic equipment through the gas inlet gap, heat dissipation is conducted on the processor module, and then the gas is discharged out of the electronic equipment through the first gas outlet.
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